MST-I Application Information
45° Peeling Tests on Leads of Surface Mounted Devices
45° peeling tests can be carried out on QFP and other gullwing leads. This test is applicable to
not only conventional soldered joints, but also to the evaluation of lead-free solder, which is
increasingly being used recently.
Applicable standards: JIS Z3198-6
IEC (The International Electrotechnical Commission) and JEITA (Japan
Electronics and Information Technology Industries Association) are also
intending to issue standards
Load cell
Printed
circuit board
Test piece
fixing jig
Peeling jig
XY stage
Test force [N]
Point of
peeling
Test speed: 1mm/min
Peeling strength: 13.1 N
Displacement [mm]
Optional jigs
1. 45° peeling test jig
2. XY stage
3. Stereomicroscope (useful when the test piece is difficult to see visually)
Test Standard Summary
JIS Z3198-6 Test methods for lead-free solders -- Part 6: Method for 45 pull test of solder
joints on QFP lead
Test for evaluating the strength of soldered connections of leads.
Measurement conditions
- Measurement accuracy of test force not specified
- Test speed
10 mm/min or less
Measurement item
- Maximum test force
Hooking
PCB
Testing
試験の状態
Example
of Jig Shape
治具形状例
IEC/JEITA Standard
(Provisional title) Method for testing the peeling strength of soldered connections of
gullwing surface mounted devices using lead-free solder
Peeling strengths before and after the severe temperature change test (cyclic) are compared to
evaluate the durability of the connection.
+125°C
Pretreatment
Peeling strength test
(initial measurement)
Severe temperature
change test (500 cycles)
Peeling strength test
(intermediate measurement)
Severe temperature
change test
(1000 cycles)
Peeling strength test
(final measurement)
Test Flow
-40°C
30min
30min
Temperature Cycle
The Peeling strength test jigs and test status are the same as those of the JIS standard.
Test conditions
- Test force measurement accuracy
- Test speed
Measurement item
- Maximum test force
≤ +/-1% of indicated value
0.5 mm/min or less