Spansion NOR
Flash Memory
New Products
Spansion NOR Flash Memory
3.0V Spansion NOR AL-J Family
1.8V Spansion NOR AS-J Family
Spansion now offers the 3.0V Spansion獏 NOR AL-J family, enabling easy migration
from conventional products, and the 1.8V Spansion AS-J family, which is optimal for
portable applications requiring miniaturization, weight reduction, and lower power
consumption.
Overview
simplify migration.
Density types are 8Mb and 16Mb. In addition to the
conventional TSOP and BGA, 16Mb product has been added
as a fortified BGA package to the product line.
The AS-J family is an optimal solution for portable applications
requiring miniaturization, weight reduction, and lower power
consumption. It supports the 1.8V (1.65V to 1.95V) operation
voltage required in portable applications.
In addition to the TSOP and KGD/KGW package options
The 3.0V Spansion NOR AL-J and 1.8V AS-J families are
NOR Flash memories manufactured using 110nm floating
gate technology.
The AL-J family is the successor of the current 200nm AL-D
family offering improved performance and advanced functions
of the AL-D family. Maximum consideration has been given
to compatibility with prior generations of the AL family to
Figure 1 Expected Demands for Portable Applications
1200
1000
Disposable digital camera
800
Game, electronic dictionary, organizer
Digital camera
600
DECD/codeless
Personal media player
400
Bluetooth
200
0
2008
2009
2010
2011
2012
（Year）
Source: Web-Feet Research, January 2008
2008
No.3
FIND Vol.26
1
New Products
Spansion NOR
Flash Memory
from the current MBM29SL family, we have added WLCSP
(Wafer-L evel C hip-S cale Package), the smallest package for
￣ Flash
￣ memories
￣
￣ to the
￣ product line.
NOR
Figure 1 presents the expected demands for portable applications.
●
●
Sector protection
CFI (Common Flash Interface) compliant
■ Main features of the Spansion NOR AS-J Family
Density: 8Mb/16Mb
Package: 48-pin TSOP/WLCSP
,
Spansion s universal footprint with consistent packaging and
pinouts across product families, process technologies, and
densities
110nm floating gate technology
1.65V to 1.95V read/write operation appropriate for battery
operated applications
A secured silicon region may be programmed and locked at
the factory or by the customer
●
●
Target Applications
●
■ 3.0V Spansion NOR AL-J Family
The AL-J family offers extended temperature ranges and can
be used in various environments. It can be applied in a wide
range of applications, from DVD players to industrial and
automotive applications.
Figure 2 presents the target application examples of the AL-J
family.
●
●
●
■ 1.8V Spansion NOR AS-J Family
The AS-J family is suited for small and light portable
applications such as MP3 players,
GPS and Bluetooth applications, the
demands for which are expected to
Figure 2 AL-J Family Application Examples
grow rapidly in the future.
Figure 3 presents the target
application examples of the AS-J
family.
Product Features
■ Main features of the Spansion
NOR AL-J Family
Density: 8Mb/16Mb
Package: 48-pin TSOP/48-ball
FBGA/64-ball fortified
BGA (16Mb only)
,
Spansion s universal footprint with
consistent packaging and pinouts
across product families, process
technologies, and densities
110nm floating gate technology
Fastest access time in the industry:
55ns
3.0V read and write single power
supply operation
Sector architecture is compatible
with the AL-D family, a secured
silicon region may be programmed
and locked at the factory or by the
customer
DVD player
Optical disc player
Printer
Modem
●
●
●
●
MP3 player
Mobile device
LCD projector
Automotive (Car navigation)
Figure 3 AS-J Family Application Examples
●
●
●
Bluetooth headset
Headset
MP3 player
2008
GPS navigation
No.3
FIND Vol.26
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Spansion NOR
Flash Memory
New Products
Ultra-small Package WLCSP
Product Lineup
Spansion added WLCSP, the smallest package size for NOR
Flash memories, to the AS family. Since miniaturization
equivalent to die size is possible with WLCSP, it can satisfy the
strict board space requirements of small or slim applications
such as Bluetooth, GPS, and MP3 players.
Table 1 presents a comparison of package sizes (with our
conventional products).
Table 2
NOTES
* Spansion獏 , the Spansion logo, MirrorBit獏 , MirrorBit獏 EclipseTM,
ORNANDTM, ORNAND2TM, HD-SIMTM, Spansion獏 EcoRAMTM,
and combinations thereof, are trademarks of Spansion LLC in the
U.S. and other countries. Other names used are for informational
purposes only and may be trademarks of their respective owners.
Advantages of WLCSP
●
●
●
●
●
●
lists the product lineup of the AL-J/AS-J family and
✱
Figure 4 presents the migration to the AL-J/AS-J family.
Allows further design miniaturization
Potential board savings ― reduces board cost
Allows further flexibility in application design
Better moisture sensitivity ― no dry bake required
Directly solderable ― leverages existing SMT assembly
equipments
Same product quality grade as standard packages
Table 1 Comparison of Package Size (with our Conventional Products)
Package
Size (mm)
48-ball FBGA
Pitch (mm)
Ball diameter
(mm)
0.8
0.4
0.4
0.2
6.15×8.15×1.2
4.26×2.51×0.6（16Mb）
WLCSP
4.26×2.04×0.6（8Mb）
Table 2 AL-J/AS-J Product Lineup
Voltage
Product
Model No.
Access speed
01，02
70
Package
Production Date
S29AL008J
3.0V
S29AL016J
TSO048
VBK048
S29AL008J
R1，R2
55
01，02
70
LAE064
Now
S29AL016J
S29AS008J
1.8V
S29AS016J
TSO048
WLCSP
2008
No.3
FIND Vol.26
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Spansion NOR
Flash Memory
New Products
Floating gate Technology Spansion AL Family
Mid to Low density roadmap
Figure 4 Migration to AL-J/AS-J Family
64-bit
S29AL064J
S29AL032J
32-bit
S29AL032D
16-bit
S29AL016J
S29AL016D
8-bit
S29AL008J
S29AL008D
4-bit
S29AL004D
2007
2008
2009
Floating gate Technology
Spansion SL/AS Family
Mid to Low
density roadmap
＝First sample available
＝Committed production
＝EOL phase (this may change without prior notice)
AL-D ＝200nm
AL-J
16-bit
＝110nm
S29AS016J
8-bit
S29AS008J
MBM29SL800E
2007
2008
＝First sample available
＝Committed production
＝EOL phase (this may change without prior notice)
2009
AL-D ＝200nm
AL-J
＝110nm
Disclaimer:Information is provided“AS IS”and is subject to change without notice
2008
No.3
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