ATP Readies 3D NAND SSDs For Embedded Applications
Wafer Packaged NAND Flash Storage Solutions Provide Added Supply Flexibility and Product Differentiation
Taipei, Taiwan (February 13, 2017) – ATP Electronics Inc., the leading manufacturer of embedded Flash and
ruggedized SSD and DRAM modules, announces its next generation of storage solutions utilizing the
latest 3D NAND flash technologies. Combined with ATP’s wafer packaging and testing capabilities, these new
lines of 3D NAND based SSDs including M.2, mSATA, SlimSATA, 2.5” SSD, eUSB and memory cards, provides a
new level of product differentiation targeting the industrial and embedded markets. ATP will showcase these
new solutions and related products from March 14th to 16th at Embedded World 2017 in Nuremberg,
Germany. ATP booth will be located at # 1-655.
3D NAND technology is a transformational shift from the traditional SLC/MLC/TLC planar NAND technologies.
It has become the new flash storage technology of choice, primarily focusing on both the client and
enterprise SSD markets today. Inevitably the 3D NAND usage will propagate to the embedded markets such
as industrial, IoT, medical, automotive and telecom. To be at the forefront of this technology shift, ATP has
taken the initiative to adopt 3D NAND for its next
generation embedded SSDs, in order to gain early
understanding on the ins&outs of 3D NAND under
extreme conditions, in order to better provide the
solutions suitable for these niche markets where
traditionally SLC/MLC technologies were deployed. In
addition, by taking 3D NAND wafers to package its own
BGAs and TSOPs and testing to specifications, ATP is
able to provide a multitude of various chip densities
using DDP, QDP and even ODP die-stacking while using
the same wafer stock. This provides not only the
flexibility in supply chain, but also enables ATP to ramp
multiple product densities quickly. These new ATP 3D NAND solutions benefit the embedded customers with
the high reliable, high available yet cost-effective storage solutions while mitigating supply risks in this
volatile market.
For more details about the latest 3D NAND based products and solutions, please contact your local ATP
representatives, or email [email protected] .
About ATP
ATP is a leading manufacturer of high performance, high quality and durable NAND flash memory solutions
as well as DRAM memory modules. With over twenty years of experience in the design, manufacturing and
support of memory products, ATP continues to focus on business critical applications such as industrial
automation, telecom, medical, enterprise computing and automotive where high levels of technical support,
performance consistency and wide operating temperature ranges are required. For more information on
ATP, please contact us at [email protected] or visit www.atpinc.com.
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Media Contact:
Ming-Chia Tsai
ATP Electronics Inc.
Tel: 886-2-2659-6368 #217
Email: [email protected]