TND310
TND310
ON
ONSemiconductor
Semiconductor
Device
DeviceNomenclature
Nomenclature
Prepared
Prepared
by: by:
Steve
Steve
West
West
ON ON
Semiconductor
Semiconductor
www.onsemi.com
http://onsemi.com
http://onsemi.com
REFERENCE
REFERENCE
MANUAL
MANUAL
convention.
They
They
consist
consist
of of
many
many
industry
industry
standard
standard
Whenever
Whenever
possible,
possible,
ON ON
Semiconductor
usesuses
the following
the following
This
document
contains
theSemiconductor
device nomenclature
breakdownconvention.
The ESD/TVS,
small
signal
diode
and
transistor,
and thyristor
nomenclatures,
along
with
several
several
market
market
targeted
targeted
naming
naming They
numbering
numbering
systems
systems
the
in part
naming
the naming
of their
ofdecoder,
their
products.
products.
(also
referred
to
asinthe
number
product namingnomenclatures,
portfolios along
have
no with
single
standard
naming
convention.
conventions.
Formany
For
anyany
questions,
questions,
please
please
contact
contact
youryour
locallocal
TheThe
ESD/TVS,
ESD/TVS,
small
signal
signal
diode
diode
and
and
transistor,
transistor,
andand conventions.
convention,
or partsmall
naming
convention)
for
ON Semiconductor
consist of
industry
standard
nomenclatures,
along with
Semiconductor
Semiconductor
sales
representative.
representative.
thyristor
thyristor
portfolios
portfolios
havehave
nopossible,
no
single
single
standard
standard
naming
naming
orderable
devices.
Whenever
ON Semiconductor
usesONON
several
market sales
targeted
naming conventions. For any questions,
these numbering systems in the naming of their products.
please contact your local ON Semiconductor sales representative.
Historical
Historical
Nomenclature
Nomenclature
Notes
Notes
Historical Nomenclature Notes
Current
Current
Nomenclature
Nomenclature
Notes
Notes
Current Nomenclatures
During
During
its history,
its history,
ONON
Semiconductor
Semiconductor
has has
beenbeen
partpart
of of Analog
Analog
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2. . 2
During
itscompany,
history,
ONand
Semiconductor
hasother
beenother
part
of
anotherand
company,
Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
another
another
company,
and
has has
acquired
acquired
companies
companies
and
CMOS
Logic
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3. . 3
and has acquired other companies and product lines. In order to maintainCMOS
CMOS Logic
Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3
product
product
lines.
lines.
In In
order
order
to to
maintain
maintain
consistency
consistency
for for
consistency for customers, part numbers have not changed, whereverAnalog
Analog
Switch
Switch
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
3
.
.
3
Analog
Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3
customers,
customers,
part
numbers
numbers
have
not not
changed,
changed,
wherever
wherever
possible.
The part
following
prefixeshave
may
indicate
the
original
manufacturer:
Clock
and
Data
Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4
possible.
possible.
TheThe
following
following
prefixes
prefixes
maymay
indicate
indicate
the the
original
original Clock
Clock
andand
DataData
Management
Management
. . . . . . . . . . . . . . . . . . . . . . .4. 4
Ax
–
Aptina
Imaging
Corporation
Integrated
Solutions
6
manufacturer:
manufacturer:
Integrated
Integrated
Solutions
Solutions
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . 6. . 6
MOS
Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7
AX
–
Axsem
AG
ADxADx− Analog
− Analog
Devices,
Devices,
Inc.Inc.
MOS
MOS
Power
Power
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7. . 7
Power MOSFETs − SO−8 (MiniMOS),
AMIS
AMIS
–– AMI
– AMI
Semiconductor
Semiconductor
ADx
Analog
Devices,
Inc.
Power
Power
MOSFETs
MOSFETs
− SO−8
−and
SO−8
(MiniMOS
(MiniMOS
), ),
Micro8,
SOT−223,
TSOP−6
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8
ASM
ASM
–
PulseCore
–
PulseCore
Micro8
Micro8
,
SOT−223,
,
SOT−223,
and
and
TSOP−6
TSOP−6
.
.
.
. . . . . . . . . . . . . . .8. 8
AMIS – AMI Semiconductor
Bipolar Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
CAT
CAT
––PulseCore
Catalyst
– Catalyst
Semiconductor
Semiconductor
Bipolar
Bipolar
Power
Power
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9. . 9
Rectifiers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11
ASM
CS CS – Cherry
– Cherry
Semiconductor
Semiconductor
Rectifiers
Rectifiers
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11. . 11
FMO Bump . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12
CAT – Catalyst Semiconductor
LED/Lighting
12
MCMC– Motorola
– Motorola
FMO
FMO
Bump
Bump
. . . . Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
. . 12
CS – Cherry Semiconductor
Memory
Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13
Ambient
Ambient
Light
Light
Sensors
Sensors
. . . . . . . . . . . . . . . . . . . . . . . . . .12
. 12
KxxKxx– Truesense
– Truesense
Imaging,
Imaging,
Inc.Inc.
Low Drop Out (LDO) Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Kxx – Truesense Imaging, Inc.
Contact
Contact
Image
Image
Sensors
Sensors
& Modules
& Modules
. . . . . . . . . . . . . . . . .13
. 13
Supervisor Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
MC –Motorola
Photo
Photo
Diode
Diode
Arrays
Arrays
. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
. . 14
Charge Pumps, LED Drivers and I/O Bus Products . . . . . . . . . . . . . . . 17
NOI – Cypress Semiconductor
LED/Lighting
LED/Lighting
Products
Products
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
14
.
. 14
Digitally Programmable Potentiometer and
2
2
Supervisor
with Memory
17
C Serial
EEPROMs
EEPROMs
. . . . .Products . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . 15
. . 15
I C ISerial
ASIC
Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
18
SPISPI
Serial
Serial
EEPROMs
EEPROMs
. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
. . 15
Ambient Light Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Microwire
Microwire
Serial
Serial
EEPROMs
EEPROMs
. . . . . . . . . . . . . . . . . . . . . .16
. 16
Photo Diode Arrays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
LowLow
Drop
Drop
OutOut
(LDO)
(LDO)
Products
Products
. . . . . . . . . . . . . . . . . . . .16
. 16
Contact Image Sensors & Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Supervisor
Supervisor
Products
Products
. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
. . 17
Image Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
21
Charge
Charge
Pumps,
Pumps,
LEDLED
Drivers
Drivers
andand
I/O I/O
BusBus
Products
Products
. . .17
. 17
Hearing
Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
26
AudioProgrammable
Products
(BelaSigna) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
27
Digitally
Digitally
Programmable
Potentiometer
Potentiometer
andand
Passive
Tunable
Integrated
Circuits
(PTIC) . . . . . . . . . . . . . . . . . . . . .
28
Supervisor
Supervisor
withwith
Memory
Memory
Products
Products
. . . . . . . . . . . . . . .18
. 18
Power
Mangament
ICs
(PMIC)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
29
ASIC
ASIC
Devices
Devices
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
. . 19
RF Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Image
Image
Sensors
Sensors
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
. . 20
IPM, DS and iPS Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
© Semiconduct
Components
Industries
© Semiconductor
© Semiconductor
Components
Components
Industries,
Industries,
LLC, LLC,
2014
LLC, 2011
2014
Apr,
2017
– –Rev.
August,
August,
2014
2014
– Rev.
Rev.
122112
1
1 1
Publication
Order
Number:
Publication
Publication
Order
Order
Number:
Number:
TND310/D
TND310/D
TND310/D
TND310
TND310
Naming Convention for Analog Devices
ROOT
N C
Product Class
• N = Standard
• S = Special/Custom
• X = Pilot Production
• P = Engineering Prototypes
Product Group
• C = Analog Integrated Circuits
Product Family/Performance Index
• L = Lighting
• N = Advanced Interface
• P = Power Management
• S = Signal
• T = Thermal Management
• V = Vehicular (Automotive)
P
1
2 3
4 A D 3
Stem Number
Assigned by
Marketing
(2 to 6 alpha/
numeric digits)
Temp Range/Output Type
Designator Assigned by Marketing
Ex:
• A = Enhanced
• X = Extended
http://onsemi.com
www.onsemi.com
2
0
R G
Pb−Free Designator
• G = Lead−Free
Options
Voltage,
frequency, etc.
Free form in
pick list
Tape/Reel Designator
Package Designator
• C = CHIP
• D = SOIC Narrow Body
• DA = TSSOP with 0.5 mm lead pitch
• DB = TSSOP with 0.65 mm lead pitch
• DM = Micro
• DS = D2PAK
• DT = DPAK
• DW = SOIC Wide Body
• F = PowerFLEX
• FB = TQFP
• FC = bump Flip−Chip
• FN = PLCC
• FT = LQFT
• H = Flip−Chip
• MN = QFN/DFN/LLGA >0.8 mm thick
• MT = QFN/DFN/LLGA 0.6 to 0.8 mm thick
• MU = QFN/DFN/LLGA <0.6 mm thick
• P = DIP−8, −14, −16, etc.
• PD = Thermally enhanced with exposed
PAD SOIC Narrow Body
• PL = DIP−8, −14, −16, GullWing, etc.
• PP = PSOP
• PW = Thermally enhanced with exposed
PAD SOIC Wide Body
• SA = SON (pkg code 7040)
• SL = Leadless
• SN = SC59 Multi−Lead, SOT23, and
TSOP−4, −5, −6
• SQ = SC70−4/5/6, SC82AB Package
• SP = SPAK
• ST = SOT223
• T = TO220−3, −5, −7 − Straight Lead
• TH = TO220 Horizontal Lead Form
• TV = TO220 Vertical Lead Form
• W = Wafer
TND310
TND310
Naming Convention for CMOS Logic Family Devices
MC 74 VHCT XX 244A DW R2 G
Circuit Identifier
• MC = Motorola
• NL = ON Semiconductor
Pb−Free Designator
• G = Lead−Free
Tape/Reel Designator
Family Type
• 74 = 74 Series (−55 to +125°C)
• AS = Analog Switches
• SF = Special Function
• 17 = Single Gate
• 27 = Dual Gate
• 37 = Triple Gate
CMOS Specification Identifier
• AC = Advance CMOS
• ACT = Advance CMOS TTL
Compatible
• HC = Buffered High Speed CMOS
• HCT = High Speed CMOS TTL
Compatible
• HCU = Unbuffered High Speed CMOS
• LCX = Low Voltage CMOS
• LVX = Low Voltage CMOS
• VCX = High Speed, Low Voltage
CMOS
• VHC = Advance High Speed CMOS
• VHCT = VHC TTL Compatible
• SV = Ultra Low Voltage Single Gate
(VCX)
• SZ = Single Gate LCX
• WZ = Double/Triple Gate LCX
Function Type
• 00
• 04
• 244
Special Feature
• Blank = No Specific Feature
• H = Bus Hold
• 1G = Single Gate
• 1GT = Single Gate TTL
Compatible
Package Type
• P or N for PDIP
• D for 150 mil SOIC
• DF for SOT
• DT for TSSOP
• DW for 300 mil Plastic SOIC
• M or F for 200 mil EIAJ
SOIC
• MN for QFN/DFN/LLGA
>0.8 mm thick
• MT for QFN/DFN/LLGA 0.6
to 0.8 mm thick
• MU for QFN/DFN/LLGA
<0.6 mm thick
• FCT for Flip−Chip
Naming Convention for Analog Switch Devices
NLAS 5 2 2 3 0
Application Type
• 5 = Audio
• 7 = Multimedia/USB/Data
• 9 = General Purpose
Flexible
(Could be used for bandwidth
or other parameters) Will not be
present unless needed.
Channel Number
• 1, 2, 3, 4, 8...
Function Number
• 1 = SPST
• 2 = SPDT
• 3 = DPDT
• 4 = 4:1 Multiplexer
• 8 = 8:1 Multiplexer
http://onsemi.com
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3
Ron Range
• 0: Ron<1001000 • 1: Ron<10100 • 2: Ron<110 • 3: Ron<10.5 TND310
Naming Convention for Clock and Data Management Devices
N B X Y 123456 V D R2 G
Product Class
• N = Standard
• S = Special/Custom
• X = Pilot Production
• P = Engineering Prototypes
• M = HFPD spinoff from existing ECL families
123456 =
• Part Number
Code
• (Up to 6
Numbers)
Product Group
• B = Clock Management
• BA = Automotive
X = Performance Index Code
• 3 = CMOS
• 4 = M5 Performance (3 GHz buffer, 800 MHz
synthesizer, 1.3 GHz counter)
• 6 = Slowed down SiGe or M5 Special
Performance (6 GHz buffer fmax)
• 7 = SiGe Performance (12 GHz buffer fmax)
Y = Lowest Nominal VCC Code
• U = 1.2 – 1.5 V Core
• V = 1.8 V Core
• L = 2.5 V Core
• N = 3.3 V Core
• R = 5.0 V Core
• F = 2.5 V Core, 1.5 V Output
• H = 2.5 V Core, 1.8 V Output
• W = 3.3 V Core, 1.0 V Output
• G = 3.3 V Core, 1.8 V Output
• M = 3.3 V Core, 2.5 V Output
Pb−Free Designator
• G = Lead−Free
Tape/Reel Designator
Package Suffix
• D = SOIC 8/14/16
• DW = Wide Body SOIC 16/20/24
• DT = TSSOP 8/14/16/20/24/28
• M/F = SOIC EIAJ 8/14/16/20
• FA = LQFP 32/52/64
• FN = PLCC 20/28
• MN = QFN/DFN/LLGA
8/16/20/24/28/32/48/52 >0.8 mm thick
• MT = QFN/DFN/LLGA
8/16/20/24/28/32/48/52 0.6 to 0.8 mm
thick
• MU = QFN/DFN/LLGA
8/16/20/24/28/32/48/52 <0.6 mm thick
• BA = FCBGA 16/49
• P = Plastic DIP 8/14/16/20/24
• L = Ceramic DIP 8/14/16/20/24
V = Output Type Code
No letter is ECL
• A = OLD
• C = CMOS
• G = Multi Standard
• H = HSTL
• K = HCSL
• L = Low Power HSCL
• M = CML
• R = Reduced Swing ECL
• S = LVDS
• V = Variable Swing
Possible Device Prefixes
MC
MCH
MCK
MCW (Prescaler & Wafer Sales)
MCWh
MCWK
NBC
NBSG
SB
SC
NBSX (Mixed Signal)
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4
TND310
Naming Convention for Crystal Oscillator Devices
N BY Y Z Z
XXX LN 1TA G
ON Designator
Pb−Free Designator
• G = Lead−Free
Family Designator
• BX = XO
• BV = VCXO
• BT = TCXO
Tape/Reel Designator
Package Code
• CLCC−6 Ceramic Module
Number of Frequency
• H or S = Single
• T = Triple
• D = Dual
• Q = Quad
Device Function
(Root Part Number)
Supply Voltage / Output Signal
• A = 3.3 V / CMOS
• B = 3.3 V / LVPECL
• C = 3.3 V / LVDS
• D = 3.3 V / CML
• E = 3.3 V / HCSL
• F = 2.5 V / CMOS
• G = 2.5 V / LVPECL
• H = 2.5 V / LVDS
• J = 2.5 V / CML
• K = 2.5 V / HCSL
• M = 1.8 V / CMOS
• N = 1.8 V / CML
• P = 2.5 V/3.3 V / LVDS
Frequency Stability
• A = 50 ppm
• B = 20 ppm
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5
TND310
TND310
Naming Convention for Integrated Solutions Devices
N U D
3
1 3 4 X6 T1 G
Pb−Free Designator
• G = Lead−Free
Product Class
• N = Standard
• S = Special/Custom
• X = Pilot Production
• P = Engineering Prototypes
Tape/Reel Designator
Package Designator
• V = 24 Pin MLF
• H = ChipFET
• B = D2PAK
• C = DPAK
• − Die T & R
• FC = Flip−Chip
• K = Micro8
• U = MicroLeadless
• QP = PLLP
• SN = POWERMITE®
• MN = QFN/DFN: >0.8 mm thick
• MT = QFN/DFN: 0.6 to 0.8 mm thick
• MU = QFN/DFN: <0.6 mm thick
• P5 = SOT953
• P6 = SOT963
• WT = SC70
• T = SC75/SC89
• W1 = SC88
• W5 = SC88A
• A = SMA
• S = SMC
• D = SOIC
• Z = SOT223
• L = SOT23
• XV5 = SOT553
• XV6 = SOT563
• E = SPAK
• M5 = TSOP5
• M = TSOP6/SC74
Product Group
• U = MicroIntegration
• I = Smart
Product Family
• D = Driver
• F = Filter
• P = Protection
• S = Special Function
Descriptor 1
Product Family Description
Symbol
Drivers
Legacy
3
LED
4
Filters
# of Filters
1−9
Protection # of Protected Lines
1−9
SpecFunct/Customer Special Part No 0−9
Descriptor 2
Product Family Description
Driver
Function Type
Filter
Part Number
Protection Line Type
Protection Line Type
SpecFunct/Customer Special Part No
Symbol
1
0−9
1
2
0−9
Symbol Definition
Relay
4 = Audio Filters
Data Line Only
Data and Power Line
‘D’ before pkg designator indicates dual.
‘1’ after pkg designator = latch off SMART
only.
‘2’ after pkg designator = auto−retry for S
products only.
Descriptor 3, 4
Product Family Description
Symbol
Driver
Part Number
0−9
Filter
Part Number
0−9
Protection Part Number
0−9
SpecFunct/Customer Special
0−9
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6
TND310
Naming Convention for MOS Power Devices
N G MS 1
3 001 N T1 G
Pb-Free/Halide Free Designator
• G = Pb-Free Plating/260c
• H = Halide Free Compound
Product Class
• N = Standard
• S = Special/Custom
• X = Pilot Production
• P = Engineering Prototypes
Packaging/Tape & Reel Designator
Polarity/Other
• A = Current Sense
• B = Bidirectional
• N = N Channel
• P = P Channel
• C = Complementary
• F = FETKY®
• K = Temperature Sense
• L = Low Logic Level
Product Group
• G = IGBT
• M = Micro Integration
• T = Power MOSFETs
• V = Automotive MOSFETs
Package Designator(s)
• A = SC-75
• B = D2PAK
Part Number
• C = Chip Sales
• (000 - 999) Sequential
• D = DPAK
• E = SC-89
Technology
• F = SOT-223 (Low Voltage)
• 0 = HD Plus
•
• F = TO-220FP (High Voltage)
• 1 = Trench 1
•
• G = TSOP
• 2 = Standard IGBT
•
• H = ChipFET™
• 3 = Smart IGBT
•
• J = SC-88
• 4 = HD3E
•
• K = SOT-723
• 5 = Raised Poly
•
• L = QFN/DFN/WDFN
• 6 = TMOS 7
•
• M = SOIC-8
• 7 = FastMOS
•
• N = SOT-1123/SOT-553/XDFN/ULLGA
• 8 = Trench 2
•
• P = TO-220
• 9 = Trench 3
•
• Q = 8 mm x 8 mm (Low Voltage)
• A = Trench 4
•
• Q = TSSOP (High Voltage)
• B = Trench 5
•
• R = SOT-23
• C = Trench 6
• S = SC-70
• T = Micro8™ (Low Voltage)
Voltage Rating
• T = SOT-223 (High Voltage)
• 1 = <1 to 8 V
• 6 =
• U = SOT-953
• 2 = 9 to 12 V
• 7 =
• V = FlipChip
• 3 = 13 to 20 V
• 8 =
• W = TO-247
• 4 = 21 to 30 V
• 9 =
• Y = TO-264
• 5 = 31 to 60 V
• Z = SOT-563
• AT = ATPAK
• M3 = MCPH3
• BA = TO-263 FA Forming
• M5 = MCPH5
• BD = TO-263 FD Forming
• M6 = MCPH6
• CR = Dicing Ring Packing
• PC = PCP
• CT = Wafer Tray Packing
• SC = SCH6
• CW = Wafer Packing
• FW = SOIC8
• DP = TP
• VE = VEC8
• FP = TO-220F-3FS/3SG
• ‘D’ = After Package Designator = Dual
• PL = TO-220-3L
• ‘L’ = After Package Designator = Leadless
• TL = TO-3P
• ‘S’ = After Package Designator = Single Config
• UL = TO-3PF
• ‘F’ = After Package Designator = Flat Lead (or Legacy FULLPAK™)
• WL = TO-247-3L
• ‘G’ = After Package Designator = >0.80 mm Thick
• P3 = CP
• ‘J’ = After Package Designator = 0.60 to 0.80 mm Thick
• P4 = CP4
• ‘Q’ = After Package Designator = Quad
• C3 = CPH3
• ‘U’ = After Package Designator = <0.60 mm Thick
• C5 = CPH5
Battery Protection Products
• C6 = CPH6
• EC = ECH8
• EFC = EFCP (CSP)
• EF = EFCP
• EMH = EMH8
• EM = EMH8
• ECH = ECH8
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7
• U = Low Gate Drive
(Under 2.5 V)
• S = SenseFET
• T = TVS
• W = Wafer Pack
• Z = ESD
• E = Enhanced
D
E
F
G
H
J
L
P
R
U
U1
U2
=
=
=
=
=
=
=
=
=
=
=
=
Superjunction 2
SSG Trench 4
SSG Trench 5
GaN
Trench 8
Trench 7
Trench 10
SSG HVFET
RF MOSFET
UH4
Superjunction Gen 1
Superjunction Gen 2
61 to 124 V
125 to 250 V
251 to 499 V
500 V +
TND310
TND310
Naming Convention for SO−8 (MiniMOS), Micro8, SOT−223, and TSOP−6 Power MOSFETs
PREVIOUS FORMAT 1
M
M
SF
4
P
01
HD R1
Circuit Identifier
Tape/Reel Designator
TMOS®
• M = Miniature
Optional Suffix
• E = Energy Rated
• HD = High Cell Density
• L = Logic Level
• V = TMOS V (Five)
• Z = ESD
Package Type
• DF = Dual FET (SO−8)
• SF = Single FET (SO−8)
• FT = FET Transistor (SOT−223)
• MTSF = Single FET (Micro8)
• MTDF = Dual FET (Micro8)
• MGSF = TSOP−6, SOT−23
Voltage Rating
(Divided by 10)
Channel Polarity
• N or P
• C = Complementary
Current
PREVIOUS FORMAT 2
M
T
P
75
N
06
HD
Optional Suffix
• L = Logic Level
• E = Energy Rated
• T4 = Tape & Reel (DPAK/D2PAK)
• RL = Tape & Reel (DPAK)
• HD = High Cell Density
• V = TMOS V (Five)
Circuit Identifier
• X = Engineering Samples
TMOS®
• T = TMOS
• L = SMARTDISCRETES
• G = IGBT (Except MGSF)
Voltage Rating
(Divided by 10)
Package Type
• P = Plastic TO−220
• D = DPAK
• A = TO−220 Isolated
• W = TO−247
• B = D2PAK
• Y = TO−264
PREVIOUS FORMAT 3
Channel Polarity
• N or P
Current
M
M
SF
4
Circuit Identifier
2
05
Even = N Channel
Odd = P Channel
TMOS®
• M = Miniature
Voltage + 10
Package Type
• DF = Dual FET (SO−8)
• SF = Single FET (SO−8)
• FT = FET Transistor (SOT−223)
• MTSF = Single FET (Micro8)
• MTDF = Dual FET (Micro8)
• MGSF = TSOP−6, SOT−23
Technology
• 5 = Trench
• 4 = HD3e
• 3 = HD3
• 1 = HD1
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8
TND310
TND310
Naming Convention for Bipolar Power Devices
N
Product Class
• M, MM, N = Standard
• S = Special/Custom
PREFIX
J
T
1
STEM
2 3
4 5 WT T1 G
Device Identification Code
(2 to 5 digits/characters)
Pb−Free Designator
• G = Lead−Free
Tape/Reel Designator
Product Group
• J = Bipolar Power
Package Designator
• = TO−3
• B = D2PAK
• C = Bare Die
• D = DPAK
• E = TO−220 or Case 77
• EC = Bare Die
• F = TO−220 Full PAK
• H = TO−218
• L = TO−264
• T = SOT−223
• W = TO−247
Optional Suffix
(1 to 2 characters)
• A = Audio Grade
• D = Integrated Diode
• D2 = Built−in Antisaturation Network
• FP = Waffle Pack
• WP = Wafer Pack
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9
TND310
TND310
Naming Convention for Bipolar Power
PREFIX
PREVIOUS FORMAT 1
T
I
STEM
P
1
2
3
4 W T
G
Pb−Free Designator
• G = Lead−Free
Device Identification Code
(2 to 4 digits/characters)
C prefix denotes bare die
Optional Suffix
• WP = Wafer Pack
PREFIX
PREVIOUS FORMAT 2
B
J
STEM
T
1
2
3
4
5
T
Tape/Reel Designator
Package Designator
• D = Case 77, TO−218 or TO−220
• UC = Bare Die
• UD = DPAK
• UH = Case 77 or TO−220
• UL = TO−220 or TO−220 Full PAK
• UV = TO−220 or TO−3
• UX = TO−220
Optional Suffix
• Z = Built−in Zener Clamp
PREFIX
2
N
G
Pb−Free Designator
• G = Lead−Free
Device Identification Code
(3 to 4 digits/characters)
PREVIOUS FORMAT 3
T1
STEM
1
2
3
4
5
Device Identification Code
(2 to 5 digits/characters)
C prefix denotes bare die
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10
G
Pb−Free Designator
• G = Lead−Free
TND310
TND310
Naming Convention for Rectifier Devices
PART NUMBER KEY
XXX X
PREFIX
XX
IO
(TYPE DESIGNATOR)
F = FULLY ISOLATED
A = SURFACE MT (SMA)
S = SURFACE MT (SMB/SMC)
D = DPAK
B = D2PAK
H = MEGAHERTZ
M = POWERMITE
P = POWERTAP
I = IPAK
PREFIX KEY
SUFFIX KEY
EXAMPLE:
EXAMPLE:
MUR
MBR
MR
MSR
CT
PT
WT
SF
PF
=
=
=
=
=
=
=
=
=
XX
XX X
XX
G
Pb−Free Designator
VR
• G = Lead−Free
(X10 EXCEPT
SCHOTTKY)
Tape/Reel Designator
SUFFIX
R = REVERSE
L = LOW VF
E = ENERGY
(DUAL DESIGNATOR)
ULTRA FAST RECTIFIER
(SCHOTTKY) BARRIER RECTIFIER
STANDARD & FAST RECOVERY
ULTRASOFT
CENTER TAP (DUAL) TO−220, POWERTAP, DPAK, D2PAK
CENTER TAP (DUAL) TO−218 PACKAGE
CENTER TAP (DUAL) TO−247
SOD−123 FLAT LEAD
POWER FACTOR CORRECTION SPECIFIC
MUR
ULTRAFAST
MBR
SCHOTTKY
30
20
WT
30 AMP
200 V
CENTER TAP (DUAL) TO−247
30
45
WT
30 AMP
45 V
CENTER TAP (DUAL) TO−247
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11
11
TND310
TND310
Naming Convention for FMO Bump
F
A
Bump Location
• A = ASE−Kaoshiung
• F = Flip−Chip Int’l.
• M = Amkor
• S = Seremban
• I = ICI
1
5
1
0
0
X
0
5
E G.B
Stage of Completion
• BE = Bump Assy.
• DP = Die Probe
• DC = Die Conversion
5−Character Part ID
0000x−9999x
(Should correspond to FG
TND310
part number root.
Place Holder
Performance options may
Default alpha “A’’ or “C’’.
be included
in this field
Naming
Convention
forasPhoto Diode
well. All 5 characters should
(Note: This field was originally
be populated. “0’’ may be
used to indicate test location.
ROOT
PREFIX
used as a place holder.)
The field is no longer used.)
N O P
E
0256
Array Devices
CD R G
Wafer Fab/Foundry
• Z = Aizu
Product Class
• C = COM1
• N = ON Semiconductor
• I = ISMF
• T = Tower
Product Group
• X = XFAB
• O = Opto
• R = Roznov
• Y = Piestany
Product Family
• P = Photo Diode Array
Resolution
• 0256 = 256 pixels
• 0512 = 512 pixels
• 1024 = 1024 pixels
Bump Composition
• G = Lead−Free
• E = Eutectic
Fab/Foundry Site
• Z = Aizu
• E = Erfurt (XFAB)
• I = Israel (Tower)
L = Lubbock (XFAB)
Pb−Free•Designator
• P = Phoenix (COM1)
• G = Lead−Free
• S = Seremban (ISMF)
• R
= Roznov
Tape/Reel
Designator
• Y = Piestany
Package Designator
2−Character Mask
• CD = CerDIP
Revision
(Use leading “0’’ for
single−digit revision levels)
Naming Convention for Ambient Light Sensor Devices
PREFIX
ROOT
Naming
Products
N O
A Convention
1 2 01forVLED/Lighting
DC R G
NC L 3 0 0 0 0 A 0 0 X X X R2
Product Class
• N = ON Semiconductor
Pb−Free Designator
• G = Lead−Free
Tape/Reel Designator
Tape/Reel Designator
Product
Group
Circuit
Identifier
•
O
=
Opto
• N = ON Semiconductor
• C = Integrated Circuit
Product Family
• A = Ambient Light Sensor
Product Family
• L = Lighting/SSL
Function
• N = Advanced Interface
• 1 = Ambient Light Sensor
• P = Power Management
• 2 = Proximity Sensor
• S = Signal
• 3 = Multiple
• T = Thermal Management
• 4 = Hue/Color
• V = Vehicular
• Output
Y = Specials/Customs
Package Designator
• Package
1 to 3 Digits
Designator
• CU = CUDFN
• DC = CTSSOP
Numeric Attributes*
• W = Wafer
• Voltage or Frequency
Indicator
Temp Range/Quality Grade*
• V =Attributes*
Vehicular (Automotive)
Alpha
• A = Close Tolerance
• C = Commercial Temp Range
• Sequence
H = High Active or High True
• L = Low Active or Low True
• X = Extended Temp Range
* Optional
• 2 = Analog
Device
Identifier
• 3 = Digital
• 4 = Multiple
* Optional
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12
TND310
TND310
Naming Convention for I2C Serial EEPROMs
(Formerly Catalyst Semiconductor)
ROOT
CA T 24C AAA P
T − G TN
Tape & Reel Designator
T = Tape & Reel
N = Number of Thousands Pieces/Reel
Product Group
Product Class
T = Standard Product
V = Automotive Grade Product
Plating Finish
G = NiPdAu, RoHS Compatible
Blank = Matte−Tin, RoHS Compatible
Product Family
24C = I2C Serial EEPROM
Temperature Range
I = Industrial (−40°C to +85°C)
E = Extended (−40°C to +125°C)
Memory Density
01 = 1 Kb
02 = 2 Kb
04 = 4 Kb
08 = 8 Kb
16 = 16 Kb
32 = 32 Kb
64 = 64 Kb
128 = 128 Kb
256 = 256 Kb
512 = 512 Kb
(M) 01 = 1024 Kb
Package Designator
HU3 = UDFN, 2 x 3 x 0.5 mm
HU4 = UDFN, 2 x 3 mm, 0.5P, Extended Pad
HU5 = UDFN, COL, 2 x 3 mm
L = PDIP, 300 mils
TD = TSOT−23, 1.6 x 2.9 x 1.00 mm
VP2 = TDFN, 2 x 3 x 0.75 mm
W = SOIC
X = SOIC
Y = TSSOP, 4.4 mm
Z = MSOP, 3 x 3 mm
ZD2 = TDFN, 3 x 4.9 x 0.75 mm
Naming Convention for SPI Serial EEPROMs
(Formerly Catalyst Semiconductor)
ROOT
CA T
25 AAA P
T − G TN
Tape & Reel Designator
T = Tape & Reel
N = Number of Thousands Pieces/Reel
Product Group
Product Class
T = Standard Product
V = Automotive Grade Product
Plating Finish
G = NiPdAu, RoHS Compatible
Blank = Matte−Tin, RoHS Compatible
Product Family
25 = SPI Serial EEPROM
Temperature Range
I = Industrial (−40°C to +85°C)
E = Extended (−40°C to +125°C)
Memory Density
010 = 1 Kb
020 = 2 Kb
040 = 4 Kb
080 = 8 Kb
160 = 16 Kb
320 = 32 Kb
640 = 64 Kb
128 = 128 Kb
256 = 256 Kb
512 = 512 Kb
(M) 01 = 1024 Kb
Package Designator
HU2 = UDFN, 2 x 2 x 0.5 mm
HU3 = UDFN, 2 x 3 x 0.5 mm
HU4 = UDFN, 2 x 3 mm, 0.5P, Extended Pad
L = PDIP, 300 mils
V = SOIC
VP2 = TDFN, 2 x 3 x 0.75 mm
X = SOIC
Y = TSSOP, 4.4 mm
Z = MSOP, 3 x 3 mm
ZD2 = TDFN, 3 x 4.9 x 0.75 mm
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13
TND310
TND310
Naming Convention for Microwire Serial EEPROMs
(Formerly Catalyst Semiconductor)
ROOT
CA T 93C AAA P
T − G TN
Tape & Reel Designator
T = Tape & Reel
N = Number of Thousands Pieces/Reel
Product Group
Product Class
T = Standard Product
V = Automotive Grade Product
Plating Finish
G = NiPdAu, RoHS Compatible
Blank = Matte−Tin, RoHS Compatible
Product Family
93C = Microwire Serial EEPROM
Temperature Range
I = Industrial (−40°C to +85°C)
E = Extended (−40°C to +125°C)
Memory Density
46 = 1 kb
46R = 1 kb
56 = 2 kb
57 = 2 kb
66 = 4 kb
76 = 8 kb
86 = 16 kb
Package Designator
L = PDIP, 300 mils
TB = SOT−143, 1.30 x 2.90 x 1.22 mm
V = SOIC
VP2 = TDFN, 2 x 3 x 0.75 mm
W = SOIC
X = SOIC
Y = TSSOP, 4.4 mm
ZD4 = TDFN, 3 x 3 x 0.75 mm
Naming
Convention
forDrop
EEPROM
Memory
Naming
Convention
for Low
Out (LDO)
Products
(Formerly Catalyst Semiconductor)
EROOT
A 2M - S WC 8 A 1 G
CA T 6xxx AAA −P G TN
Product Group
Product Class
T = Standard Product
Product Family
Low Drop Out (LDO)
Voltage Indicator
125
250
150
270
180
280
240
285
Tape & Reel Designator
TGreen
= Tape & Reel
N• =GNumber
of Thousands Pieces/Reel
= Green
Memory Type
• E = EEPROM
• L = Leaded
Plating Finish
G
= NiPdAu,
Die
RevisionRoHS Compatible
Blank = Matte−Tin, RoHS Compatible
• 1 = 1st Revision
Industry Designator
• A = Audiology
• I = Implantable
Package Designator
Carrier
Type1.25 x 2.0 x 1.1 mm
SD
= SC−70,
• A= SOT−143,
= Tape & Reel
TB
1.30 x 2.90 x 1.22 mm
• T= =
Trays
TD
TSOT−23,
1.60 x 2.9 x 1.00 mm
• U= ULLGA
= Tubes
UL
V = SOIC
ZNumber
= MSOP,
x 3 mm
of3Pins/Balls
Memory Size
• 2M = 2 Mb
300
330
ADJ
Interface
• I = I2C
• S = SPI
• 8 = 8 Pins/Balls
Package
•
•
•
•
•
A =
B =
BD =
D =
Q =
Hybrid
BGA
Bumped Die
DFN
QFN
•
•
•
•
S
UD
W
WC
=
=
=
=
System in Package (SiP)
Unbumped Die
WLCSP
WLCSP with Backside Coating
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16
14
TND310
Naming Convention for Memory Products
N 25 S 6 30 H A S2 2 I L T
Product Class
Carrier Type
• T = Tape & Reel
• N = ON Semiconductor
Density
•
•
•
•
64 =
25 =
01 =
02 =
64 kb
256 kb
1 Mb
2 Mb
Optional
• 04 = 4 Mb
• 08 = 8 Mb
• 09 = 9 Mb
• L = Low Power Sort
Temperature
• I = Industrial
• M = Medical
Type
• L = LP SRAM
• S = Serial RAM
• M = Medical
(May be used for customer ID)
• C = Combo
• I = SoC
• F = Flash
Speed – Based on Type
Type = L (C)
• 5 = 55 ns
• 7 = 70 ns
• 8 = 85 ns
• 9 = 90 ns
• 1 = 100 ns
IO
• 8 = x8
• 6 = x16
• 4 = x40
Voltage
• 12 = 1.2 V
• 18 = 1.8 V
• 20 = 2.0 V
Type = M, I (C)
Customer Specific
• W = Wafer
• D = Die
Type = L, M, I
• T = TSOP
• B = BGA
• N = sTSOP
• T2 = Green TSOP
• B2 = Green BGA
• N2 = Green sTSOP
Feature – Based on Type
Type = S
• H = Hold
Type = S
• 1 = 16 MHz
• 2 = 20 MHz
Package – Based on Type
• 22 = 2.2 V
• 30 = 3.0 V
• 33 = 3.3 V
Type = L
• 1 = One CE
• 2 = Dual CE
• 3 = OE Control
• E = Extended
Type = M, I
• 1 = Level 1
• 2 = Level 2
Type = C
• 1 = 16 MB
• 3 = 32 MB
• 6 = 64 MB
Chipset Revision
• A = Original
• B = 1st Revision
• C = 2nd Revision
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15
Type = S
• S2 = Green SOIC
• T2 = Green TSSOP
Type = C
• M = 66-BGA
• M2 = Green 66-BGA
• D = 3rd Revision
• E = 4th Revision
TND310
Naming Convention for Low Drop Out (LDO) Products
(Formerly Catalyst Semiconductor)
ROOT
CA T 6xxx AAA −P G TN
Tape & Reel Designator
T = Tape & Reel
N = Number of Thousands Pieces/Reel
Product Group
Product Class
T = Standard Product
Plating Finish
G = NiPdAu, RoHS Compatible
Blank = Matte−Tin, RoHS Compatible
Product Family
Low Drop Out (LDO)
Voltage Indicator
125
250
150
270
180
280
240
285
Package Designator
SD = SC−70, 1.25 x 2.0 x 1.1 mm
TB = SOT−143, 1.30 x 2.90 x 1.22 mm
TD = TSOT−23, 1.60 x 2.9 x 1.00 mm
UL = ULLGA
V = SOIC
Z = MSOP, 3 x 3 mm
300
330
ADJ
TND310
Naming Convention for Supervisor Products
(Formerly Catalyst Semiconductor)
ROOT
CA T 8xxxhttp://onsemi.com
A P T − G TN
16
Product Group
Product Class
T = Standard Product
Plating Finish
G = NiPdAu, RoHS Compatible
Blank = Matte−Tin, RoHS Compatible
Product Family
Supervisor
Voltage Indicator
A = 1.68 V
C = 2.40 V
F = 4.20 V
L = 4.63 V
H = 4.55 V
M = 4.38 V
J = 4.00 V
Tape & Reel Designator
T = Tape & Reel
N = Number of Thousands Pieces/Reel
Temperature Range
I = Industrial (−40°C to +85°C)
E = Extended (−40°C to +125°C)
T = 3.08 V
S = 2.93 V
R = 2.63 V
Z = 2.32 V
V = 1.60 V
W = 1.67 V
Package Designator
SD = SC−70, 1.25 x 2.0 x 1.1 mm
TB = SOT−143, 1.30 x 2.90 x 1.22 mm
TD = TSOT−23, 1.6 x 2.9 x 1.00 mm
UL = ULLGA
V = SOIC
Z = MSOP, 3 x 3 mm
Naming Convention for Charge Pumps, LED Drivers and I/O Bus Products
(Formerly Catalyst Semiconductor)
ROOT
CA T Xxxx P
Product Group
Product Class
T − G TN
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16
Tape & Reel Designator
T = Tape & Reel
N = Number of Thousands Pieces/Reel
TND310
Naming Convention for Charge Pumps, LED Drivers and I/O Bus Products
(Formerly Catalyst Semiconductor)
ROOT
CA T Xxxx P
T − G TN
Tape & Reel Designator
T = Tape & Reel
N = Number of Thousands Pieces/Reel
Product Group
Product Class
T = Standard Product
Plating Finish
G = NiPdAu, RoHS Compatible
Blank = Matte−Tin, RoHS Compatible
Product Family
3xxx = Non−inductive converters and
LED Driver Charge Pumps
4xxx = LED Drivers (Non−Charge pump type)
9xxx = I/O Bus Products
Temperature Range
I = Industrial (−40°C to +85°C)
E = Extended (−40°C to +125°C)
Package Designator
HU2 = UDFN, 2 x 2 x 0.5 mm
HV2 = TDFN, 3 x 3 x 0.75 mm
HV3 = TQFN, 3 x 3 x 0.75 mm
HV4 = TQFN, 4 x 4 x 0.75 mm
HV6 = TQFN, 4 x 4 x 0.75 mm
MT4 = TDFN, 2.0 x 2.0 (2 flags)
SD = SC−70, 1.25 x 2.0 x 1.1 mm
TD = TSOT−23, 1.6 x 2.9 x 1.0 mm
TV = TO−263
V = SOIC
VP2 = TDFN, 2 x 3 x 0.75 mm
VS = QSOP, 150 mils
W = SOIC
Y = TSSOP, 4.4 mm
Z = MSOP, 3 x 3 mm
ZD4 = TDFN, 3 x 3 x 0.75 mm
TND310
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Naming Convention for Digital
Programmable Potentiometers and
Supervisor with 17
Memory Products
(Formerly Catalyst Semiconductor)
ROOT
CA T Xxxx P
T −AA − G TN
Tape & Reel Designator
T = Tape & Reel
N = Number of Thousands Pieces/Reel
Product Group
Product Class
T = Standard Product
Plating Finish
G = NiPdAu, RoHS Compatible
Blank = Matte−Tin, RoHS Compatible
Product Family
1xxx = Supervisor with Memory Products
5xxx = Digital Programmable Potentiometers
Threshold Voltage Designator
25
42
28
45
30
Package Designator
L = PDIP, 300 mils
SD = SC−70, 1.25 x 2.0 x 1.1 mm
TD = TSOT−23, 1.6 x 2.9 x 1.00 mm
TB = SOT−143, 1.30 x 2.90 x 1.22 mm
TD = TSOT−23, 1.6 x 2.9 x 1.00 mm
V = SOIC
VP2 = TDFN, 2 x 3 x 0.75 mm
W = SOIC
Y = TSSOP, 4.4 mm
Z = MSOP, 3 x 3 mm
ZD2 = TDFN, 3 x 4.9 x 0.75 mm
ZD4 = TDFN, 3 x 3 x 0.75 mm
Temperature Range
I = Industrial (−40°C to +85°C)
E = Extended (−40°C to +125°C)
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TND310
TND310
Naming Convention and Ordering Information for
ASIC Devices
12345−123 − ABC
Device Number
5−3 Digit Alpha−Numeric
Notes:
1. Not all packing forms are available for each product.
2. Contact ON Semicondcutor Customer Service for more details.
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19
18
Packing Form Designator
XWF = Wafer Form
XSW = Sorted Wafer
XDW = Die in Wafer Form
XDI = Die
XDF = Die in File Frame
XDS = Die in Tape
XUD = Untested and Packaged
XUP = Untested and Packaged in Tape & Reel
XTD = Tested and Packaged in Trays or Tubes
XTP = Tested and Packaged in Tape & Reel
XPD = Photo Diode Array
XMD = Module
Revision
(Use leading “0’’ for
single−digit revision levels)
TND310
Naming Convention for Ambient Light Sensor Devices
PREFIX
N O A
1
ROOT
2 01 V
DC R G
Product Class
• N = ON Semiconductor
Pb−Free Designator
• G = Lead−Free
Product Group
• O = Opto
Tape/Reel Designator
Package Designator
• CU = CUDFN
• DC = CTSSOP
• W = Wafer
Product Family
• A = Ambient Light Sensor
Function
• 1 = Ambient Light Sensor
• 2 = Proximity Sensor
• 3 = Multiple
• 4 = Hue/Color
Temp Range/Quality Grade*
• V = Vehicular (Automotive)
Sequence
Output
• 2 = Analog
• 3 = Digital
• 4 = Multiple
* Optional
TND310
Naming Convention for Photo Diode Array Devices
PREFIX
N O P
ROOT
0256
CD R G
http://onsemi.com
12
Product Class
• N = ON Semiconductor
Pb−Free Designator
• G = Lead−Free
Product Group
• O = Opto
Tape/Reel Designator
Package Designator
• CD = CerDIP
Product Family
• P = Photo Diode Array
Resolution
• 0256 = 256 pixels
• 0512 = 512 pixels
• 1024 = 1024 pixels
Naming Convention for LED/Lighting Products
NC L
3 0 0 0 0
A
0 0 X X X R2
Tape/Reel Designator
Circuit Identifier
• N = ON Semiconductor
• C = Integrated Circuit
Product Family
• L = Lighting/SSL
• N = Advanced Interface
• P = Power Management
• S = Signal
• T = Thermal Management
• V = Vehicular
• Y = Specials/Customs
Device Identifier
Package Designator
• 1 to 3 Digits
Numeric Attributes*
• Voltage or Frequency
Indicator
www.onsemi.com
19
Alpha Attributes*
• A = Close Tolerance
• C = Commercial Temp Range
• H = High Active or High True
• L = Low Active or Low True
• X = Extended Temp Range
TND310
TND310
Naming Convention for Contact Image Sensor Devices
PREFIX
N O C
ROOT
02 2 01 U
Product Class
• N = ON Semiconductor
Product Group
• O = Opto
Package Designator
• U = Untested Wafer
• W = Wafer
Product Family
• C = Contact Image Sensor
Sequence
Resolution
• 02 = 200 dpi
• 03 = 300 dpi
• 04 = 400 dpi
• 06 = 600 dpi
• 12 = 1200 dpi
• 24 = 2400 dpi
Speed
• 5 = 5 MHz
• 6 = 6 MHz
• 8 = 8 MHz
• A = 10 MHz
Naming Convention for Contact Image Sensor Modules
PREFIX
N O M
ROOT
02 A2 − A R 01 G
Product Class
• N = ON Semiconductor
Pb−Free Designator
• G = Lead−Free
Product Group
• O = Opto
Misc & Special Option Number
LED
• R = Red
• B = Blue
• G = Green
• W = White
• U = Ultraviolet
Product Family
• M = Contact Image Sensor Module
Resolution
• 02 = 200 dpi
• 03 = 300 dpi
• 04 = 400 dpi
• 06 = 600 dpi
• 12 = 1200 dpi
• 24 = 2400 dpi
Size
• A2
• A3
• A4
• A6
•
•
•
•
Output
• A = Analog
• D = Digital
• M = Multiple
Dash
A7
A8
B4
AS
http://onsemi.com
www.onsemi.com
13
20
•
•
•
•
•
Y = Yellow
I = Infrared
C = RGB
M = Multiple
X = None
TND310
Naming Convention for Image Sensors
(Formerly Cypress Semiconductor)
N O I P1 S N 1300 A – Q D I
Temperature
• C = Commercial 0 to +70°C
• I = Industrial -40 to +85°C
Product Class
• N = ON Semiconductor
Glass
• A = AF45
• B = D263 AR/AR
• C = D263 AR/IR
• D = D263
• E = D263 AR
• H = BK7G18 AR
• J = N-BK7 AR/AR
Product Group
• O = Opto
Product Category
• A = Ambient Light Sensor
• C = Contact Image Sensor
• I = Image Sensor
• M = Image Sensor Module
• P = Photo Diode Array
Product Family
• CP = Custom Product
• H2 = HAS 2
• H3 = HAS 3
• I4 = IBIS 4
• I5 = IBIS 5
• L1 = LUPA
• L2 = LUPA 2
• P1 = PYTHON LVDS
• P2 = PYTHON CMOS
•
•
•
•
•
•
•
•
•
P3
M1
M2
S1
V1
V2
X1
X2
X3
=
=
=
=
=
=
=
=
=
K=
O=
S=
T=
Package
• F = QFN/QFP
• G = PGA/μPGA
• H = JLDCC
• L = LGA
• Q = LCC
• S = CSP
• W = Wafer Sales
• X = Bare Die
PYTHON LVDS OPTION
MANO LVDS
MANO CMOS
STAR
VITA LVDS
VITA CMOS
24 Port XGS
12 Port XGS
6 Port XGS
Additional Functionality
• A = Default
• B = Additional Features
• S = Space, Level 1
• T = Space, Level 2
• U = Space, Level 3
Process
• B = BSI
• F = NIR Enhanced
• S = Standard
Color
• C=
• E=
• F=
• G=
• M=
• N=
• P=
• R=
N-BK7 IR/AR
ABC
Sapphire
Protective Tape on
Default Glass Lid
• W = Windowless
•
•
•
•
Resolution
Color
Color Microlens
Color Microlens CRA Option 1
Color Microlens CRA Option 2
Monochrome
Mono Microlens
Mono Microlens CRA Option 1
Mono Microlens CRA Option 2
•
•
•
•
•
•
•
•
•
•
•
www.onsemi.com
21
0250
0300
0480
0500
1000
1300
1600
2000
3000
4000
5000
=
=
=
=
=
=
=
=
=
=
=
0.25 MP
0.3 MP
0.48 MP
0.5 MP
1.0 MP
1.3 MP
1.6 MP
2.0 MP
3.0 MP
4.0 MP
5.0 MP
•
•
•
•
•
•
•
•
•
•
•
6600 = 6.6 MP
8000 = 8.0 MP
9000 = 9.0 MP
9400 = 9.4 MP
9600 = 9.6 MP
010K = 10 MP
012K = 12 MP
014K = 14 MP
016K = 16 MP
025K = 25 MP
Custom Name
TND310
Naming Convention for Image Sensors
(Formerly Truesense Imaging, Inc.)
K AI - 290 50 - CXA - DD - AA
Product Grade
Product Line
• K = Image Sensors
•
•
•
•
•
Family Designation
• AF = Full Frame CCD
• AI = Interline CCD
• AE = Interline EMCCD
• LI = Linear CCD
• SC = Support Chip
• AC = CMOS
• AT = TDI CCD
0
1
2
3
A
=
=
=
=
=
• C =
• E =
Resolution (2 or 3 Digits)
Specified in units of 100 K pixels,
e.g. 290 = 29.0 Mega Pixels
• T =
Sequence (2 Digits)
Color Filter Array
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
A
B
C
D
E
F
G
H
J
L
M
N
P
Q
R
S
X
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
• M=
No CFA (Monochrome)
Pigment, Bayer CMY
Pigment, Bayer RGB
Pigment, Linear RGB
3G Stagger
Pigment, Bayer RGB, Gen 2
Striped RGRB
RB Checkerboard
Hybrid Dichroic
RBG and Mono
Mono with RB Surround
Pigment, Bayer RGB, Shorter Red Wavelength
Sparse CFA Pattern A
Sparse CFA Pattern A, Gen 2
Pigment, Linear RGB, Gen2
Mono with RB Surround, Gen2
Special
• X =
Testing Method
•
•
•
•
•
•
•
•
•
A
B
C
D
No microlenses
Telecentric microlenses
Cylindrical microlenses
None with spacer (Not for UV or bundle
attachment)
• X = Special
=
=
=
=
Product Revision
Package
•
•
•
•
•
•
•
•
•
A
B
C
D
E
F
G
H
J
=
=
=
=
=
=
=
=
=
Wafer Form (No Pkg)
Die Form (No Pkg)
Cerdip, Sidebrazed Pins
Cerdip, Sidebrazed Pins, CuW
Cerdip, Leadframe
CLCC
PLCC
Plastic DIP
PGA
•
•
•
•
•
•
•
•
•
K
L
M
N
P
Q
R
S
X
=
=
=
=
=
=
=
=
=
A
B
C
D
E
F
G
H
X
=
=
=
=
=
=
=
=
=
Standard
Standard with Defect Map
Non-Standard
Non-Standard with Defect Map
Low Temperature
Low Temperature with Defect Map
Customer Specific
Standard with Special Visual
Special
Cover Glass
Microlens
•
•
•
•
Highest Grade (Fewest Cosmetic Defects)
Cosmetic Specs Relaxed Relative to Grade 0
Cosmetic Specs Relaxed Relative to Grade 1
Cosmetic Specs Relaxed Relative to Grade 2
Standard Grade: Used when only one grade is available for a
given product.
Commercial Grade: Meets all specification criteria, but have not
been fully qualified. Intended for evaluation purposes only and
have NO warranty. Quantities are strictly limited and sold only
“as available”.
Engineering Grade: Electrically functional and meet most, but
not necessarily all, product performance specifications,
however there are no limitations on the number of or size of
cosmetic defects (points, clusters, columns, glass defects, etc.)
allowed. Intended for evaluation purposes only and have NO
warranty. Quantities are strictly limited and sold only “as
available”.
Test Sample: Closely resembles the performance of the final
product, however may not meet any of the specification criteria.
Intended for evaluation purposes only and have NO warranty.
Quantities are strictly limited and sold only “as available”.
Mechanical Sample: Meets all physical dimensions and
tolerances and likely does not image. Intended for evaluation
purposes only and have NO warranty. Quantities are strictly
limited and sold only “as available”.
Special
PGA, CuW Base
QFP
CSP
Bare Die, Reconstituted Wafer
Polyimide Substrate
Aluminum Nitride Substrate
pLLP
PGA, CuW Base, TEC Cooler
Special
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
A
B
C
D
E
F
G
H
J
K
L
P
Q
R
S
X
www.onsemi.com
22
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
No Glass
Clear, No Coatings
Clear, AR Coated 1 Side
Clear, AR Coated 2 Sides
Clear, AR Coated Side 1, IR Coated Side 2
Quartz, No Coatings
Plastic, No Coatings
IR Absorbing, AR Coated 2 Sides
Clear, AR Coated 2 Sides, with Light Shield
Quartz, AR Coated 2 Sides
Hermetic, AR Coated 2 Sides
Clear, No Coatings (Taped)
Clear, AR Coated 1 Side (Taped)
Clear, AR Coated 2 Sides (Taped)
Quartz, No Coatings (Taped)
Special
TND310
Naming Convention for Image Sensors
(Formerly Aptina Imaging Corporation)
Base Part Number
A S 05 4 0 HD 8 C 22 S H D2 0 - XX - YYYYY - E
Product Line
• A = Image Sensors
Sample and Demo Board Identifier
•
•
•
•
•
Product Type
• S = SOC
• G = Generic
• R = RAW Sensor • B = Bridge
• P = ISP
• D = Downgrade
• T = Test Chip
•
•
•
•
•
5
6
7
8
9
=
=
=
=
=
1/5”
1/6”
1/7”
1/8”
1/9”
•
•
•
•
•
A=
B=
C=
D=
N=
Customer specific attribute
Special Options
•
•
•
•
•
•
•
•
•
•
•
1/10”
1/11”
1/12”
1/13”
N/A
Major “Imager Customer” Revision
Defaulted to “S”, 2~9
S=
L=
A=
N=
D=
F=
Common
Logic
Color Array
Mono Array
RCCB
RYYB
0
D
H
D
G
A
B
C
F
L
J
=
=
=
=
=
=
=
=
=
=
=
• K = Dual Sensor (3D)
Headboard
• M = ALTM Only
• N = Different Package
Size
• P = Dual Sensor (3D)
Demo Kit
• W = Demo Module
• D3 = Demo Kit (Demo3)
• Q = Adapter/FBGA/
ASIC Board
Default, N/A
Demo Board
Head Board
High Speed
WLM Socketed Board
EMI Pad
Non-Coating
Without EMI Shielding
With Flash Stacked Die
Low Cost
Low Profile
Package Options
Marketing Descriptor
Provides marketing ability to add additional descriptive information
that may be helpful in positioning the part.
• CS = Default, CMOS Sensor • HS = High Speed
• NB = Notebook
• LC = Low Cost
• AI = Array Imager • CM = Camera
• HQ = Premium
• AT = Automotive
• SC = Scanning
• QP = Downgrade
• MB = Mobile
• CP = Clarity+
• HD = High Definition
• SR = Surveillance
• M0 = Module
• CM = Medical
•
•
•
•
•
•
Eng Identifier (AS/ES/QS)
Mechanical Sample
Demo Board
Demo Kit
Production Part
Customer Special
Unique Product Identifier (ID)
Must increment for a new product with the same resolution and
optical format (e.g., each new ¼” VGA part increments this by one).
Sequence 0, 1, 2…9, A, B,…Z .
Chromaticity
• C = RGB
• M = Monochrome
• Y = CMY
• R = RCCC
• G = RGBC
• B = RCBC
=
=
=
=
=
Mechanical Finish, Glass, Wafer
Thickness*
See definitions on following page
Resolution
• Y1 = 0.01 Megapixel
• Y2 = 0.02 Megapixel
• Y9 = 0.09 Megapixel
• X1 = 0.1 Megapixel
• X9 = 0.9 Megapixel
• 01 = 1 Megapixel
• 99 = 99 Megapixel
• B1 = Demo3 Base Board
• B2 = Demo3 Adapter - Old Style HB
• B3 = Demo2x Adapter - New Style HB
• B4 = ICP Adapter Board
• B5 = Stereo Receiver Board
Optical Format
• 0 = >1” or ISP
• 1 = 1”
• 2 = 1/2”
• 3 = 1/3”
• 4 = 1/4”
E
M
GEVB
GEVK
Blank
(OR) IP Control for ICP
• “0” – FD = 0, EDOF = 0
• “1” – FD = 1, EDOF = 1
• “2” – FD = 1, EDOF = 0
• “3” – FD = 0, EDOF = 1
CRA Degree
•
•
•
•
•
•
•
A
B
C
D
E
F
Z
=
=
=
=
=
=
=
Lead Free
Leaded
Halogen Free
7.5 x 7.5 Lead Free
9.5 x 9.5 Lead Free
5.5 x 5.5 Lead Free
BIB/HIB Option
(Different Bond Option)
Package Type
•
•
•
•
•
•
•
•
•
A
B
C
D
E
F
G
H
J
=
=
=
=
=
=
=
=
=
CLCC
PLCC
ILCC
Die Sales
IBGA
LBGA
VFBGA
CPGA
TPLCC
•
•
•
•
•
•
•
•
www.onsemi.com
23
K =
L =
M=
N =
P =
Q=
R =
W=
Y =
Interface Type
M
C
H
U
=
=
=
=
MIPI
CCP/CCP2
HISPI
MULTI
Operating Temp
“00” as N/A, otherwise will show
the actual degree shift
•
•
•
•
•
•
•
•
•
S
A
X
N
=
=
=
=
•
•
•
•
N
P
L
S
•
•
•
•
•
•
•
0
1
2
3
4
6
9
=
=
=
=
=
=
=
Module
100 μm Thickness
200 μm Thickness
305 μm Thickness
400 μm Thickness
675 μm Thickness
No-Grinding
CSP
WLC
CLGA
imBGA
tpBGA
iCBGA
mPLCC
Wafer Sales (EA)
Wafer Sales (WFR)
=
=
=
=
N/A
PARALLEL
LVDS
SLVS
Commercial
Automotive (–40 to +85°C)
Extended (–40 to +105°C)
N/A
TND310
Naming Convention for Image Sensors
(Formerly Aptina Imaging Corporation)
Packaged Parts
- D P BR
Mechanical Finish
Glass Type
• D = Dry Pack
• T = Tape & Reel
• C = Chiptray
• BR
= Double Side
BBAR Glass
• IR
= IR
• Blank = Standard Glass
Protective Film
• P = With Protective Film
• R = Without Protective Film
Wafer and Die Sales
- 200
Wafer Thickness
• 200 = Wafer Thickness
Demo Board Special
- S213A
Machanical Finish
• S213A = DSL213A
• S115 = SUNEX_DSL115
www.onsemi.com
24
TND310
Naming Convention for Legacy Image Sensors
(Formerly Aptina Imaging Corporation)
MT9 J 0 0 1 I12 ST C V xxxxxx ES
Special Processing
• AS = Alpha Sample
• ES = Engineering Sample
• MS = Mechanical Sample
• MC = Module Camera Demo System
• I
= Errata
• :X = DID Mark Designator
• Blank = Mass Production
Product Line
• MT9 = Image Sensors, Legacy
Product Size
• C = CIF
• V = VGA
• M = 1 Meg
• D = 2 Meg
• T = 3 Meg
• Q = 4 Meg
• P = 5 Meg
Product Type
• 0 = Sensor Only
• 1 = SOC
• 2 = “Open”
• 3 = DSP
•
•
•
•
•
•
•
E =
N =
J =
W=
F =
H =
S =
8 Meg
9 Meg
10 Meg
12 Meg
14 Meg
16 Meg
Special/Custom
Design ID and Probe/Test Level
Six characters will appear for Die/
Wafer Only
• 4 = High Speed
• 5 = Custom
• 6 = Others
Product Group
• 0 = Consumer Camera
• 1 = Mobile/PC
• 2 = Automotive/Industrial
• 3 = Surveillance
Unique Product Identifier (ID)
Must increment for a new product with the same resolution and
optical format (e.g., each new ¼” VGA part increments this by one).
Sequence 0, 1, 2…9, A, B,…Z .
PACKAGE CODE
Material/Construction
•
•
•
•
A
C
X
E
=
=
=
=
TSV-RDL
Ceramic
Xintec
Tessera
•
•
•
•
P
S
I
L
Plastic
Shellcase
Imager
Laminate
=
=
=
=
• T = Tiny
• Z = CWL CSP
• M = WLC
Form
Form 1: Form
• D = Singulated Die
• W = Die in Wafer Form
• M = Module
Package Type
•
•
•
•
•
•
•
0
1
2
3
4
5
6
=
=
=
=
=
=
=
CSP
LCC Pb-Free
ICSP
PGA
QFP
Custom
Bumped
•
•
•
•
•
•
•
7
8
9
A
B
C
D
=
=
=
=
=
=
=
• B = Demo Base Board
• R = Demo Received Board
• V = LVDS Adapter Board
BGA
CSP Pb-Free
ICSP Pb-Free
BGA Pb-Free
MVP
Non-Bumped TSV-RDL
Low Profile
Form 2 = 0
Leads/Bumps/Pins
•
•
•
•
•
•
•
•
0
1
2
3
4
5
6
7
=
=
=
=
=
=
=
=
32
28
48
64
144
208
280
52
•
•
•
•
•
•
•
•
8
9
A
B
C
D
E
F
=
=
=
=
=
=
=
=
30
44
35
13
84
137/169
16
38
•
•
•
•
•
•
•
G
H
J
K
L
M
N
=
=
=
=
=
=
=
Special Options
• A = Lens Head Board and Adapter Kit
• B = Non-Standard CRA
• C = Non-Standard CRA 27 Degrees
• D = Demo Board
• E = Recon (RDL)
• F = Frame Grabber
• G = WLM Socketed Headboard
• H = Head Board
• I = IR Glass
• J = JPEG Output
• K = Special Die Offset
• L = Lens Eval Kit
• M = MiPi
• N = No Lid
• P = CCP
• Q = Optical Quality
• LC = Low Cost
• R = Reference Camera
• S = High Speed
• T3 = Tier 3
• U = Parallel Interface
• V = Serial Interface
• W = NTUB
• X = No Micro Lens
• Y = Black Solder Mask
• Z = Non-Standard Micro Lens Shift
• PF = Protective Film
• 2 = 200 μm Wafer Thickness
• 3 = 305 μm Wafer Thickness
• 4 = 200 μm Thick Cover Glass
• 5 = 300 μm Thick Cover Glass
• 6 = 675 μm Wafer Thickness
• 7 = EMI Pad
• 8 = Non-Coating
Chromaticity
• C = RGB (Red, Green, Blue)
• M = Monochrome
• R = Red/Clear
• G = RGBC
• Y = CMY (Cyan, Magenta, Yellow)
• L = Logic - IP “00”
116
122
54
25
55
67
120
Operating Temp
• ST = Commercial
• AT = Automotive
• XT = Extended
Form 3 = 0
Note: If using Form 1, Form 2 (Package Type) and Form 3
(Leads/Bumps/Pins) will be “0”
www.onsemi.com
25
TND310
Naming Convention for Preconfigured Hearing Products
R 3 9 10 - C F A B - E1 T
Family Designation
Packing Format
• T = Tape & Reel
• W = Waffle Pack
• B = Bubble Pack
• A = AYRE
• R = RHYTHM
Platform Gerenation
• 3 = Wolverine
JESD97 Indetification
• E1 = SnAgCu
• E6 = Contains Bi
Feature Set
•
•
•
•
•
1
3
5
7
9
=
=
=
=
=
Basic
Low
Mid
High
Premium
Package Revision
• A = Original
• B = 1st Revision
• C = 2nd Revision
Configuration
Package
Chipset Revision
•
•
•
•
• 10 = 1st Configuration
• 20 = 2nd Configuration
•
•
•
•
A
B
C
D
=
=
=
=
Original
First Revision
Second Revision
Third Revision
A
B
C
D
=
=
=
=
Hybrid
Die
Wafer
Printed Substrate
•
•
•
•
E
F
G
H
=
=
=
=
SMT PCB
SMT Flex
Submodule
Assembly
Memory
•
•
•
•
A
B
C
D
=
=
=
=
No Memory • E = 512 kb
• F = 1 Mb
OTP
• G = 2 Mb
64 kb
256 kb
Naming Convention for Open-Programmable Hearing Products
E 71 10 - 1 01 WD 33 - A G
Family Designation
Green
• G = Green
• L = Leaded
• E = EZAIRO
Feature Set
•
•
•
•
59 =
62 =
71 =
88 =
Carrier Type
Ezairo
Ezairo Plus
Ezairo “NP5”
Ezairo “NP6”
• A (7100) = Tape & Reel; MOQ 5,000
• A (7110) = Tape & Reel; MOQ 500
• B (7110) = Tape & Reel; MOQ 500
Configuration
• T = Trays
• U = Tubes
• W = Wafer Box
Number of Pins/Balls
• 10 = 1st Configuration
• 20 = 2nd Configuration
Numeric Value
Package
Chip Version
•
•
•
•
•
• 1 = First
• 2 = Second
Chipset Revision (Major)
• 00 = Original
• 01 = 1st Revision
• 02 2nd Revision
www.onsemi.com
26
A =
B =
BD =
H =
Q =
Hybrid
BGA
Bumped Die
Assembly
WFN
•
•
•
•
•
S =
UD =
WD =
W =
WC =
System in Package (SiP)
Unbumped Die
Wafer in Die Quantity
WLCSP
WLCSP with Backside
Coating
TND310
Naming Convention for Custom Hearing Products
C XX 01 - C F A B - E1 T
Custom Designation
Packing Format
• T = Tape & Reel
• W = Waffle Pack
• B = Bubble Pack
• C = Custom
Customer Code
• XX = Two Digit Customer Code
JESD97 Indetification
• E1 = SnAgCu
• E6 = Contains Bi
Configuration/Product
• 01 = 1st Configuration
• 02 = 2nd Configuration
Package Revision
• A = Original
• B = 1st Revision
• C = 2nd Revision
Chipset Revision
•
•
•
•
A
B
C
D
=
=
=
=
Original
First Revision
Second Revision
Third Revision
Package
•
•
•
•
Memory
•
•
•
•
A
B
C
D
=
=
=
=
No Memory • E = 512 kb
OTP
• F = 1 Mb
64 kb
• G = 2 Mb
256 kb
A
B
C
D
=
=
=
=
Hybrid
Die
Wafer
Printed Substrate
•
•
•
•
Naming Convention for BelaSigna Products
BR 300 W 35 A 1 02 XY G
Product Family
Green
• G = Green
• L = Leaded
• B = BelaSigna
• BR = BelaSigna R Series
Software Code
Product Series
• 250 = 250 Series
• 261 = 261 Series
• 300 = 300 Series
•
•
•
•
Package Type
•
•
•
•
B =
D =
Q=
W=
E1 =
R1 =
XX =
XY =
ExAudio BSE
ROM-Based BSE
No Software Included
No Software Included
Chipset Revision
BGA
DFN
QFN
WLCSP
• 01 = 1st Revision
• 02 = 2nd Revision
MPQ Variant ID
• 1 =?
Number of Pins/Balls
• 35 = 35 Pins
Carrier Type
• A = Tape & Reel
• T = Trays
• U = Tubes
www.onsemi.com
27
E
F
G
H
=
=
=
=
SMT PCB
SMT Flex
Submodule
Assembly
TND310
Naming Convention for Passive Tunable Integrated Circuits (PTIC)
TCP S - 50 47 N A - D T
Packing
• T = Tape & Reel
Product Line
• TCP = Tunable Components
Package
• D = WLCSP
• Q = QFN
Process Status
• X = Pilot production
• S = Special/Custom
• P = Prototype
• “Blank” = Production
Linearity
• A = High
• B = Normal
• C = Low
Process Generation
• 41 = Gen 4.1
• 50 = Gen 5.0
• 60 = Gen 6.0
Capacitor Value
• 10 = 1.0 pF
• 12 = 1.2 pF
• 18 = 1.8 pF
• 27 = 2.7 pF
• 33 = 3.3 pF
•
•
•
•
•
39
47
56
68
82
Tuning
=
=
=
=
=
• U = < 2.7 GHz
• X = > 2.7 GHz
3.9 pF
4.7 pF
5.6 pF
6.8 pF
8.2 pF
Naming Convention for Passive Tunable Integrated Circuit (PTIC) Controllers
TCC S - 30 3 A - D T
Packing
Product Line
• TCC = PTIC Controller
• T = Tape & Reel
Process Status
• X = Pilot production
• S = Special/Custom
• P = Prototype
• “Blank” = Production
•
•
•
•
•
Process Generation
• 10 = Gen 1.0
• 20 = Gen 2.0
• 21 = Gen 2.1
• 30 = Gen 3.0
MIPI ID
Package/Format
•
•
•
•
Number of Outputs
• 3 = 3 Outputs
• 4 = 4 Outputs
• 5 = 5 Outputs
• 6 = 6 Outputs
www.onsemi.com
28
P
R
O
S
D
A
B
C
D
=
=
=
=
=
=
=
=
=
Peripheral Bump
RDL
Interposer
SSOP16
Bare Die
00
01
10
11
TND310
Naming Convention for Dual PTIC RF Tuner IC
TCP - 50 1 x - D T
Packing
Product Line
• TCP = Tunable Components
• T = Tape & Reel
Process Generation
• 50 = Gen 5.0
• 60 = Gen 6.1
• D = WLCSP
Package
Optional Suffix
Product Variant
• 1 = 8.2 pF PTIC + 2.7 pF PTIC
• ‘Blank’ = Standard Part
Naming Convention for Power Management ICs
HPM 10 01 - BD C C A - E1 T
Product Class
Packing Format
• T = Tape & Reel
• W = Waffle Pack
• B = Bubble Pack
• HPM = Hearing Aid Power Management
Product Generation
• 10 = Contact-Based Version
20 Wireless Version
JESD97 Indetification
• E1 = SnAgCu
• E6 = Contains Bi
Configuration/Product
• 01 = 1st Configuration
• 02 = 2nd Configuration
Package
•
•
•
•
•
A =
B =
BD =
D =
Q =
Hybrid
BGA
Bumped Die
DFN
WFN
•
•
•
•
S =
U =
W =
WC =
Package Revision
System in Package (SiP)
Umbumped Die
WLCSP
WLCSP with Backside Coating
Memory
•
•
•
•
A
B
C
D
=
=
=
=
No Memory • E = 512 kb
OTP
• F = 1 Mb
64 kb
• G = 2 Mb
256 kb
www.onsemi.com
29
• A = Original
• B = 1st Revision
• C = 2nd Revision
Package
•
•
•
•
A
B
C
D
=
=
=
=
Hybrid
Die
Wafer
Printed Substrate
•
•
•
•
E
F
G
H
=
=
=
=
SMT PCB
SMT Flex
Submodule
Assembly
TND310
TND310
Naming Convention for Bluetooth® Low Energy RF ICs
NCH - RSL 10 - x 1 01 WC 51 - A B G
Product Class
Package
• NCH-RSL = Consumer/Healthcare
• MD-RSL = Life Critical Devices
• G = Green
• L = Leaded
Qualification
Product Generation
• A = Medical – Life Threatening
• B = Medical – Non-Life Threatening
• C = Consumer
• 10 = Bluetooth 5.0
Special/Custom*
• ‘Blank’ = Standard
* Reserved for Special or Custom Designator
Chip Version
• 1 = 1st Version
• 2 = 2nd Version
Carrier Type
• A = Tape & Reel
• T = Trays
• U = Tubes
Package Pins
• 51 = 51 Pins
Chip Revision (Major)
• 01 = 1st Revision
• 02 = 2nd Revision
Package
• A = Hybrid
• B = BGA
• BD = Bumped Die
• D = DFN
• Q = QFN
• S = System in Package (SiP)
• U = Unbumped Die
• W = WLCSP
• WC = WLCSP with Backside Coating
MicroLeadless, POWERTAP, and FULLPAK are trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States
and/or other countries. ChipFET is a trademark of Vishay Siliconix. FETKY is a registered trademark of International Rectifier Corporation. Micro8 is a
trademark of International Rectifier. PowerFLEX is a trademark of Texas Instruments Incorporated. POWERMITE is a registered trademark of and used under
a license from Microsemi Corporation. All other brand names and product names appearing in this document are registered trademarks or trademarks of their
respective holders.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC
owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at
www.onsemi.com/site/pdf/Patent-Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or
guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all
applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
www.onsemi.com
30
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
TND310/D
TND310
Naming Convention for Standard RF ICs
(Formerly Axsem)
AX 5 0
4
3 - 1 - TW 30
Orderable Quantity
• 1 =1
• 05 = 500
• 20 = 2,000
• 30 = 3,000
Product Group
Family
• 2 = LCD Driver
• 5 = Sub 1 GHz Radio
• 6 = 2.4 GHz Radio
Packing
• TW = T: Tape & Reel
W: Die Orientation
• WD = Wafer Sell in Die Qty
• BA = Bag
Package Type
• 0 = QFN or Die
• 1 = TSSOP
• 2 = Other QFN Option
Version
Function
• 3 = Transmitter Only
• 4 = Narrow Band Capable Transceiver
• 5 = General Purpose Transceiver
• 6 = Other
Type
• 1 = Type 1
• 2 = Type 2
• 3 = Type 3
Naming Convention for RF Microcontrollers
(Formerly Axsem)
AX 8052 F 1
4
3 - 2 - TB 05
Orderable Quantity
• 1 =1
• 05 = 500
• 30 = 3,000
Product Group
Microcontroller
Packing
• TB = T: Tape & Reel
B: Die Orientation
• WD = Wafer Sell in Die Qty
• BA = Bag
Memory Type
• F = Flash
• R = ROM
• X = RAM
Memory Size
• 1 = 64 K Flash
• 2 = 32 K Flash
• 3 = 16 K Flash
Version
Type
• 1 = Type 1
• 2 = Type 2
• 3 = Type 3
Function
• 3 = Transmitter Only
• 4 = Narrow Band Capable Transceiver
• 5 = General Purpose Transceiver
www.onsemi.com
31
TND310
Naming Convention for RF Microcontrollers with Radio Standards
(Formerly Axsem)
AX - SFEU - API - 1 - 01 - TB 05
Orderable Quantity
• 1 =1
• 05 = 500
• 30 = 3,000
Product Group
Radio Standard
• SFEU = SIGFOX EU
• SFUS = SIGFOX US
• EOEU = ENOCEAN EU
• EOUS = ENOCEAN US
=
• AT
Packing
• TX = T: Tape & Reel
X: Die Orientation
• D = Wafer Sell in Die Qty
Software Option
• Empty = Default
• API
= API
Firware Version
Hardware Version
Naming Convention for RF Modules
(Formerly Axsem)
AX - AT10 - MINI21 - 868 - B 1
Orderable Quantity
• 1 =1
• 05 = 500
• 30 = 3,000
Product Group
Radio Standard
• AT10 = AXSEM AT
• SF10 = SIGFOX
• EO10 = ENOCEAN
• WM10 = Wireless M-Bus
Packing
• B = Bag
Hardware Type & Version
• MINI21 = MINI-STAMP
• ANT21 = ANT-STAMP
• USB21 = USB Stick
Carrier Frequency
www.onsemi.com
32
TND310
Naming Convention for IPM Devices
STK 1 2
3
-
4
5 0 A B - E
Circuit Identifier
• STK = Standard
• Other = Custom
Special Division
• E = Pb-Free
• H = Halogen Free
Product Group
• 1 = Small Signal (> 10 MHz)
• 2 = Audio Power
• 3 = Small Signal (< 100 kHz)
• 4 = Audio Power (AB Class)
• 5 = Inverter (New), PFC*
• 6 = Actuator Driver, Inverter (Old)
• 7 = Switching Mode
• 9 = Automotive
Optional Suffix
• One ot two digits
• Version change, testing change,
forming change, etc.
Lead Forming
• See Table
Function Division or Forming Change
• 0 = Standard
• 1 = 1st Change
• 2 = 2nd Change
• 3 = 3rd Change
Package Type
• See Table
Function
• See Table
Maximum Rated Current
• See Table
UL Standard Certification
• – = Normal Products
• U = UL Standard Certified Products
Maximum Rated Voltage
• See Table
2
3
4
5
Designator
Package Type
Function
Maximum Rated Voltage
Maximum
Rated Current
(Blank)
—
—
—
—
A
Lead Forming
Straight
1
Smart
3-Phase Inverter; Built-In 1 Shunt R
Up to 150 V; Active High
1 A or Lower
—
2
Smart 2nd
3-Phase Inverter; For External 1 Shunt R
Up to 599 V; Active High
Up to 2 A
—
3
SIP04
3-Phase Inverter; Built-In 3 Shunt Rs
600 V; Active High
Up to 3 A
—
4
SOP1
3-Phase Inverter; For External 3 Shunt Rs
600 V; Active High
Up to 5 A
—
5
SIP1A
Single-Phase Inverter; Built-In 1 Shunt R
600 V; Active High
Up to 8 A
—
6
SIP2
Single-Phase Inverter; For External 1
Shunt R
Up to 1200 V; Active High
Up to 10 A
—
7
SIP2A
Induction Heating; 1 Burner
1700 V; Active High
Up to 10 A
—
8
SIP3
induction Heating; 2 Burners
—
Up to 12 A
—
9
SIP2 Case Type
PFC + 3-Phase Inverter
—
Up to 15 A
—
0
SIP3 Case Type
PFC + 3-Phase Inverter
—
Up to 15 A
A
DIP30
PFC; No Bridge
Up to 150 V; Active Low
Up to 20 A
SL Zigzag (From case to first clipping point = 2.5 mm)
B
DIP42
PFC; With Bridge
Up to 599 V; Active Low
Up to 25 A
SL Zigzag (From case to first clipping point = 5.35 mm)
C
DIPS
PFC; Bridge Free
600 V; Active Low
Up to 30 A
One Side Zigzag (Lead length 6.8 mm version)
D
DIP05
PFC; Interleave
600 V; Active Low
Up to 40 A
SL Bent
E
DIP2
PFC; Bridge Free Interleave
600 V; Active Low
Up to 50 A
One Side Zigzag (With insert plate)
F
DIP4
PFC + 3-Phase Inverter; No Bridge
Up to 1200 V; Active Low
Up to 60 A
L Bent
G
DIP5
PFC + 4-Phase Inverter; With Bridge
1700 V; Active Low
Up to 75 A
SL Bent + Stopper
H
Tenmen Case Screw
PFC + 5-Phase Inverter; Bridge Free
—
75 A or Larger
—
—
J
Tenmen Case Terminal
PFC + 6-Phase Inverter; Interleave
—
Up to 1 kW / 5 A
DIPS Bent (One side SL/One side SL Chidori; Lead
length 5.5 mm version above case)
K
SIP2B
Power Conditioner; Converter
—
Up to 2 kW / 10 A
One Side Zigzag (Lead length 9 mm version)
L
DIPS2
Power Conditioner; Inverter
600 V
Up to 3 kW / 15 A
L-Zigzag (Smart 1st)
M
SIP3B
Power Conditioner; Converter + Inverter
600 V; Built-In 1 Shunt R
Up to 4 kW / 20 A
Both Side Chidori (Smart 2nd bent)
N
New Package
Power Conditioner; Others
600 V; Built-In HVIC
Up to 5 kW / 25 A
DIPS Bent (One side SL/One side SL Chidori; Lead
length 9.7 mm version above case)
P
SIP3A
—
600 V; Built-In HVIC + Shunt R
Up to 6 kW / 30 A
—
Q
DIPS3
3-Phase Inverter + Break; Built-In a
Shunt R
1200 V
Up to 8 kW / 40 A
—
DIPS3.5
3-Phase Inverter + Break; For External
3 Shunt Rs
1200 V; Built-In 1 Shunt R
Up to 10 kW
—
R
S
PQFN
CIB; Built-In a Shunt R
1200 V; Built-In HVIC
10 kW or Larger
—
T
SIP3A
CIB; For External 3 Shunt Rs
1200 V; Built-In HVIC + Shunt R
Up to 100 A
—
U
DIP-C2
—
—
Up to 150 A
—
V
DIP-C3
—
—
Up to 200 A
—
www.onsemi.com
33
Naming Convention for DS and iPS Devices
PRODUCT NAME
LC 1 2 3 4 5 6 7 8 9 A B - XXX
Product Class
• L = Power Supply (Regulator)
• LA = Bipolar Linear
• LB = Bipolar Digital
• LC = CMOS
• LE = Memory
• LV = Bi-CMOS
Device Identification Code
Includes all or some of
the following items
Packing Name
• E = Pb-Free
• G = Pb-Free (Legacy)
• H = Halide Free
Part Code
Number and alpha characters
Quantity Level
• U = Automotive
Revision Code
• N = Rev 1
• A = Rev 2
• B = Rev 3
• Y = Rev 4
• S = Rev 5
Package Designator
Price Code
• L = Price Change First Time
• LL = Second Time
• LM = Third Time
Hotsukyo Code
• Z = Hotsukyo
Bluetooth is a registered trademark of Bluetooth SIG. MicroLeadless and FULLPAK are trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other
countries. ChipFET is a trademark of Vishay Siliconix. FETKY is a registered trademark of International Rectifier Corporation. PowerFLEX is a trademark of Texas Instruments Incorporated. POWERMITE is a
registered trademark of and used under a license from Microsemi Corporation. All other brand names and product names appearing in this document are registered trademarks or trademarks of their respective
holders.
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of
patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves
the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor
assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical”
parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized
for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless
against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges
that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale
in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada
Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada
Email: [email protected]
PDF
N. American Technical Support: 800-282-9855 Toll Free
USA/Canada.
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81-3-5817-1050
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
TND310/D