F-217
SEAM–20–02.0–S–10–2–A–K–TR
SEAM–30–02.0–S–08–2–A–K–TR
SEAM–30–03.5–S–04–2–A–K–TR
(1.27 mm) .050"
SEAM SERIES
HIGH-SPEED/HIGH-DENSITY OPEN-PIN-FIELD
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?SEAM
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Operating Temp Range:
-55 °C to +125 °C
Current Rating
(7 mm stack height):
1.8 A per pin
(10 adjacent pins powered)
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Contact Resistance:
5.5 mW
Working Voltage: 240 VAC
RoHS Compliant: Yes
Lead-Free Solderable: Yes
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
Mates with:
SEAF, SEAFP
Standoffs:
JSO
Up to 500
Pins
HIGH-SPEED CHANNEL PERFORMANCE
SEAM/SEAF @ 10 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact [email protected]
• 100 GbE
• Fibre Channel
• Rapid I/O
• PCI Express®
• SATA
• InfiniBand™
–10, –15, – 20,
– 30, –40, –50
Specify
LEAD
STYLE
from
chart
NO. OF
ROWS
–04
–05, –06
–08
–10
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
G b p s
LEAD
STYLE
(–10 only available in 04 row)
(-15 is only available in 4 Row
with -02.0 lead style and 10
row with any lead style)
10 YEAR MFG
WITH 30 µ" GOLD
34
NO. PINS
PER ROW
SEAM
STANDARDS
PROTOCOLS
PLATING
OPTION
NO. OF
ROWS
– 04
–S
B
(9.60) .378
(12.14) .478
8 mm 8.5 mm
–02.0 7 mm
9 mm 9.5 mm
–03.0 8 mm
–03.5 8.5 mm 9.5 mm 10 mm
–06.5 11.5 mm 12.5 mm 13 mm
–07.0 12 mm 13 mm 13.5 mm
–09.0 14 mm 15 mm 15.5 mm
–11.0 16 mm 17 mm 17.5 mm
Notes:
Patented
IPC-A-610F and
IPC J-STD-001F Class 3
solder joint.
Some sizes, styles and
options are non-standard,
non-returnable.
A
= Tin/Lead Alloy
Solder Charge
– 05
= Lead-Free
Solder Charge
–2
–K
= Polyimide film
Pick & Place Pad
– TR
=Tape & Reel
=Six Rows
(–06.5 not
available)
– 08
(1.27)
.050
=Eight Rows
B
DIFFERENTIAL
(1.27) .050
ARRAY
(1.27)
.050
– 10
=Ten Rows
08
No. of positions x (1.27) .050 + (4.98) .196
(1.02)
.040
(1.27)
.050 A
(1.02)
.040
(0.86)
(1.12)
(1.27)
.034
.044
.050
DIA
DIA
No. of positions x (1.27) .050 + (3.58) .141
(0.10)
.004
LEAD
STYLE
A
–02.0
(4.60) .181
–03.0
(5.59) .220
–03.5
(6.10) .240
–06.5
(9.14) .360
–07.0
(9.60) .378
–09.0 (11.60) .457
–11.0 (13.60) .535
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
TR
= Alignment Pins
(Required. Arrays
will not self-center
on solder pads)
– 06
(14.68) .578
K
–A
–1
=Four Rows
(–06.5 not
available)
=Five Rows
(–06.5 not
available)
= 30 µ"
(0.76 µm)
Gold on
contact area,
Matte Tin on
solder tail
(7.06) .278
SOLDER
TYPE
–L
= 10 µ"
(0.25 µm)
Gold on
contact area,
Matte Tin on
solder tail
01
MATED HEIGHTS
SEAM SEAF LEAD STYLE
LEAD
STYLE –05.0 –06.0 –06.5
Solder
charges
Low
insertion/
extraction
forces
FILE NO. E111594
• PISMO 2
• VITA 47
• VITA 57.1
5, 8 and 10 row footprint
compatible with SamArray®.
Samples recommended.
(1.15 mm)
.045"
NOMINAL
WIPE
PAIR
ARRAY
COUNT
125
50x10
100
50x8
100
40x10
40x8
40x6
30x10
30x8
30x6
20x10
20x8
20x5
PAIR
COUNT
80
60
75
60
45
50
40
25
ALSO AVAILABLE
(MOQ Required)
• Up to 560 pins
Contact Samtec.