CUSTOMER SUPPORT
Loomis Industries is known for providing a superior level of customer
support. Application and technical advisors are ready to solve your
scribing and cleaving challenges, and technicians are available
to provide prompt, on-site service.
SALES OPTIONS
Please contact Loomis Industries if you’d like to have a sample
processed, schedule a demonstration or discuss various sales
options. Sales options may include leasing and trade in of existing
Loomis Equipment toward the purchase of LSD-155 (one trade in per
one LSD-155). Contact us to discuss possible lease and trade options.
©2012 Loomis Industries, Inc.
All rights reserved.
1204 Church Street
St. Helena CA 94574
p 707.963.4111
f 707.963.3753
[email protected]
www.loomisinc.com
SPECIFICATIONS
LSD Chassis
Computer
Widescreen Monitor
Pressure Requirement
Operating Temperature
Operating Altitude
Humidity
Power Requirements
Scribe and Break Speed
Peck (<800µm scribe) Speed
Cleave Speed
28.0” H x 39.0” W x 27.0” D (71.1 x 99.0 x 68.6)cm 147 lbs (68.2 kg)
16.5” H x 7.5” W x 17.0” D (41.9, 19.1, 43.2)cm 30.1 lbs (13.7 kg)
12” H x 17.5” W x 2.5” D (30.5 x 44.5 x 6.5)cm 8 lbs (3.6 kg) 1440 X 900 resolution
Cutting Edge automated III-V
Laser Diode and Wafer Processing
75 PSI (517kPa) Air, Nitrogen or CO2 (clean, dry)
5–40°C
2000m max
80% @ 31°C, 50% @ 40°C maximum, non-condensing
150 Watts, 100–277 VAC, 50–60 HZ
100mm/sec maximum
1–2 pecks/s (depending on substrate properties)
1 cleave/2 sec
Optical magnification
Mitutoyo 5X objective standard (1300µm field of view)
10X and 20X objective lenses are available options
Positioning Accuracy
1 micron utilizing pattern recognition
Certifications
CE and Semi S2 Approved
Key Features
• Loomis diamond tool-holder with precise force, positioning, ultra-low inertia and high
speed operation capability that produces unparalleled scribe quality
• Limited-contact cleaving options
• Ring pair, saw frame and Loomis square frame compatibility
• Smooth, accurate, air-bearing control in X and Y axis
• Fully automated alignment and processing
• High-resolution digital camera with autofocus and interchangeable Mitutoyo
Objective Lenses
• Advanced machine vision algorithms for pattern recognition, channel and
angle alignment
• Modular construction and design that minimizes and simplifies maintenance
• Password protected access for operator, technician and maintenance level personnel
• Full 360 Degree hands-off material rotation for processing material on multiple axis
Substrate Compatibility
• Material: GaAs, InP, thin Silicon (for any other materials, contact Loomis for details)
• Size: configurable up to 6” (150mm)
• Thickness: 40µm–500µm (dependent on material and die size)
• Laser bar arrays, partial wafers, square wafers and round wafers
LOOMIS LSD-155
Speed, product quality and yield speak for themselves.
Contact Loomis Industries for information or a demonstration.
INTELLIGENT
40 YEARS OF
The Loomis Industries LSD-155 introduces many new technical
features, but more importantly, it sets the standard for
automation, productivity and flexibility. Combining these
essential attributes with accuracy and ease-of-use, make it the
product of choice for processing your laser diodes and wafers.
KEY ADVANTAGES
Integration of the scribing and cleaving processes
give key advantages:
OPERATOR PRODUCTIVITY:
Fewer transfer, alignment and
process monitoring operations are necessary resulting
in your operators performing other essential tasks.
Automation
The LSD-155 is a production-level tool that:
REDUCED TRANSFER OPERATIONS:
Minimal material
handling means fewer alignment processes and
higher levels of throughput.
AUTOMATICALLY PROCESSES LARGE "GRIDS" OF LASER BARS FOR
DICING, CLEAVING HIGH QUALITY MIRROR FACETS AND DICING WAFERS.
UTILIZES ADVANCES AUTOMATION FEATURES THAT ALLOW THE HIGH
RESOLUTION VISION SYSTEM TO PROCESS YOUR MATERIAL WITH
MICRON LEVEL ACCURACY.
FEATURES A TUNED, LOW-INERTIA SCRIBING MODULE THAT ENABLES
FAST PECK* SPEEDS WHILE MAINTAINING OPTIMAL PECK QUALITY.
MULTIPLE CLEAVING OPTIONS ALLOW THE LSD-155 TO BE CONFIGURED
TO OPTIMIZE CLEAVE QUALITY & SPEED.
*A peck is a short, controlled length scribe
YIELD
Loomis Customers consistently experience
industry-leading yields with clean, efficient
and debris-free die. These results are the
culmination of:
PRECISION MADE SCRIBE TOOLS
MANUFACTURED BY LOOMIS INDUSTRIES
USING PROPRIETARY POLISHING TECHNOLOGY.
THE RESULT IS A SCRIBE THAT CLEAVES
OPTIMALLY, LEAVING THE RESULTANT EDGES
WITH BOTH INTEGRITY AND STRENGTH.
PRECISION TOOLHOLDER DESIGN TO PROPERLY
HOLD AND ACCURATELY APPLY THE SCRIBE
TOOL TO YOUR SPECIFIC MATERIAL AT THE
OPTIMUM ANGLE, FORCE AND SPEED.
CONTROLLED STRAIN CLEAVING CONFIGURED
TO MEET YOUR APPLICATION NEEDS.
PROCESSES DEVELOPED TO MEET YOUR
UNIQUE APPLICATION NEEDS.
FLEXIBILITY
The LSD-155 can be configured to function with your existing
equipment and process requirement by utilizing common wafer
holding media. These include 6" and 7" ring pairs, saw frames,
vacuum chuck and the Loomis square frame. A variety of scribe
tools, objective lenses and mandrels and cleaving options are
available to optimize the process to your specific application.
REDUCED REDUNDANCY REQUIREMENTS:
2 Loomis
LSD-155s provide full process redundancy.
Equipment limited to scribe only/break only require
the purchase 4 machines for full redundancy.
PROCESS MONITORING:
The LSD-155 integrated scribe and
cleave processing allows for tighter process monitoring.
Stand alone scribe then cleave operations suffer from
large scale material loss when their scribing process
fails and is only detected after large quantities
of material have been ineffectively scribed.
The hardware behind the LSD-155 is key
to its speed, precision and accuracy.
HIGH-RESOLUTION SERVO MOTORS CONTROL
SMOOTH, ACCURATE MULTI-AXIS MOTION
ON AN AIR-BEARING PLATFORM.
QUALITY MITUTOYO OPTICS ENSURE
AN OPTICALLY CORRECT FIELD OF VIEW THAT
CAN BE CUSTOMIZED WITH INTERCHANGEABLE
OBJECTIVE LENSES FOR APPLICATIONS
REQUIRING VERY HIGH MAGNIFICATION.
ULTRA-HIGH RESOLUTION MICROMETER
HEADS ENSURE THAT SCRIBE TOOL ALIGNMENT
IS SIMPLE AND YOUR SCRIBE PLACEMENT
IS PERFECT.
EASE OF OPERATION
The LSD-155 Software control package was
developed with extensive customer input and
has the features for processing your material
efficiently. Straight-forward menu structures,
intuitive operation and simple recipe setups
allow easy setup for automated processing.
Once a recipe has been developed, an operator
only needs to load the material and press
“Start”, allowing the machine operator to
perform other tasks without monitoring the
process. The LSD-155 uses highly refined vision
algorithms to find, align and process your
material with minimal operator supervision.
LSD-155
INTELLIGENT
40 YEARS OF
The Loomis Industries LSD-155 introduces many new technical
features, but more importantly, it sets the standard for
automation, productivity and flexibility. Combining these
essential attributes with accuracy and ease-of-use, make it the
product of choice for processing your laser diodes and wafers.
KEY ADVANTAGES
Integration of the scribing and cleaving processes
give key advantages:
OPERATOR PRODUCTIVITY:
Fewer transfer, alignment and
process monitoring operations are necessary resulting
in your operators performing other essential tasks.
Automation
The LSD-155 is a production-level tool that:
REDUCED TRANSFER OPERATIONS:
Minimal material
handling means fewer alignment processes and
higher levels of throughput.
AUTOMATICALLY PROCESSES LARGE "GRIDS" OF LASER BARS FOR
DICING, CLEAVING HIGH QUALITY MIRROR FACETS AND DICING WAFERS.
UTILIZES ADVANCES AUTOMATION FEATURES THAT ALLOW THE HIGH
RESOLUTION VISION SYSTEM TO PROCESS YOUR MATERIAL WITH
MICRON LEVEL ACCURACY.
FEATURES A TUNED, LOW-INERTIA SCRIBING MODULE THAT ENABLES
FAST PECK* SPEEDS WHILE MAINTAINING OPTIMAL PECK QUALITY.
MULTIPLE CLEAVING OPTIONS ALLOW THE LSD-155 TO BE CONFIGURED
TO OPTIMIZE CLEAVE QUALITY & SPEED.
*A peck is a short, controlled length scribe
YIELD
Loomis Customers consistently experience
industry-leading yields with clean, efficient
and debris-free die. These results are the
culmination of:
PRECISION MADE SCRIBE TOOLS
MANUFACTURED BY LOOMIS INDUSTRIES
USING PROPRIETARY POLISHING TECHNOLOGY.
THE RESULT IS A SCRIBE THAT CLEAVES
OPTIMALLY, LEAVING THE RESULTANT EDGES
WITH BOTH INTEGRITY AND STRENGTH.
PRECISION TOOLHOLDER DESIGN TO PROPERLY
HOLD AND ACCURATELY APPLY THE SCRIBE
TOOL TO YOUR SPECIFIC MATERIAL AT THE
OPTIMUM ANGLE, FORCE AND SPEED.
CONTROLLED STRAIN CLEAVING CONFIGURED
TO MEET YOUR APPLICATION NEEDS.
PROCESSES DEVELOPED TO MEET YOUR
UNIQUE APPLICATION NEEDS.
FLEXIBILITY
The LSD-155 can be configured to function with your existing
equipment and process requirement by utilizing common wafer
holding media. These include 6" and 7" ring pairs, saw frames,
vacuum chuck and the Loomis square frame. A variety of scribe
tools, objective lenses and mandrels and cleaving options are
available to optimize the process to your specific application.
REDUCED REDUNDANCY REQUIREMENTS:
2 Loomis
LSD-155s provide full process redundancy.
Equipment limited to scribe only/break only require
the purchase 4 machines for full redundancy.
PROCESS MONITORING:
The LSD-155 integrated scribe and
cleave processing allows for tighter process monitoring.
Stand alone scribe then cleave operations suffer from
large scale material loss when their scribing process
fails and is only detected after large quantities
of material have been ineffectively scribed.
The hardware behind the LSD-155 is key
to its speed, precision and accuracy.
HIGH-RESOLUTION SERVO MOTORS CONTROL
SMOOTH, ACCURATE MULTI-AXIS MOTION
ON AN AIR-BEARING PLATFORM.
QUALITY MITUTOYO OPTICS ENSURE
AN OPTICALLY CORRECT FIELD OF VIEW THAT
CAN BE CUSTOMIZED WITH INTERCHANGEABLE
OBJECTIVE LENSES FOR APPLICATIONS
REQUIRING VERY HIGH MAGNIFICATION.
ULTRA-HIGH RESOLUTION MICROMETER
HEADS ENSURE THAT SCRIBE TOOL ALIGNMENT
IS SIMPLE AND YOUR SCRIBE PLACEMENT
IS PERFECT.
EASE OF OPERATION
The LSD-155 Software control package was
developed with extensive customer input and
has the features for processing your material
efficiently. Straight-forward menu structures,
intuitive operation and simple recipe setups
allow easy setup for automated processing.
Once a recipe has been developed, an operator
only needs to load the material and press
“Start”, allowing the machine operator to
perform other tasks without monitoring the
process. The LSD-155 uses highly refined vision
algorithms to find, align and process your
material with minimal operator supervision.
LSD-155
CUSTOMER SUPPORT
Loomis Industries is known for providing a superior level of customer
support. Application and technical advisors are ready to solve your
scribing and cleaving challenges, and technicians are available
to provide prompt, on-site service.
SALES OPTIONS
Please contact Loomis Industries if you’d like to have a sample
processed, schedule a demonstration or discuss various sales
options. Sales options may include leasing and trade in of existing
Loomis Equipment toward the purchase of LSD-155 (one trade in per
one LSD-155). Contact us to discuss possible lease and trade options.
©2012 Loomis Industries, Inc.
All rights reserved.
1204 Church Street
St. Helena CA 94574
p 707.963.4111
f 707.963.3753
[email protected]
www.loomisinc.com
SPECIFICATIONS
LSD Chassis
Computer
Widescreen Monitor
Pressure Requirement
Operating Temperature
Operating Altitude
Humidity
Power Requirements
Scribe and Break Speed
Peck (<800µm scribe) Speed
Cleave Speed
28.0” H x 39.0” W x 27.0” D (71.1 x 99.0 x 68.6)cm 147 lbs (68.2 kg)
16.5” H x 7.5” W x 17.0” D (41.9, 19.1, 43.2)cm 30.1 lbs (13.7 kg)
12” H x 17.5” W x 2.5” D (30.5 x 44.5 x 6.5)cm 8 lbs (3.6 kg) 1440 X 900 resolution
Cutting Edge automated III-V
Laser Diode and Wafer Processing
75 PSI (517kPa) Air, Nitrogen or CO2 (clean, dry)
5–40°C
2000m max
80% @ 31°C, 50% @ 40°C maximum, non-condensing
150 Watts, 100–277 VAC, 50–60 HZ
100mm/sec maximum
1–2 pecks/s (depending on substrate properties)
1 cleave/2 sec
Optical magnification
Mitutoyo 5X objective standard (1300µm field of view)
10X and 20X objective lenses are available options
Positioning Accuracy
1 micron utilizing pattern recognition
Certifications
CE and Semi S2 Approved
Key Features
• Loomis diamond tool-holder with precise force, positioning, ultra-low inertia and high
speed operation capability that produces unparalleled scribe quality
• Limited-contact cleaving options
• Ring pair, saw frame and Loomis square frame compatibility
• Smooth, accurate, air-bearing control in X and Y axis
• Fully automated alignment and processing
• High-resolution digital camera with autofocus and interchangeable Mitutoyo
Objective Lenses
• Advanced machine vision algorithms for pattern recognition, channel and
angle alignment
• Modular construction and design that minimizes and simplifies maintenance
• Password protected access for operator, technician and maintenance level personnel
• Full 360 Degree hands-off material rotation for processing material on multiple axis
Substrate Compatibility
• Material: GaAs, InP, thin Silicon (for any other materials, contact Loomis for details)
• Size: configurable up to 6” (150mm)
• Thickness: 40µm–500µm (dependent on material and die size)
• Laser bar arrays, partial wafers, square wafers and round wafers
LOOMIS LSD-155
Speed, product quality and yield speak for themselves.
Contact Loomis Industries for information or a demonstration.