PQFN 3.3X3.3
RoHS Compliance Document
Contents:
1. Composition
2. Solder Reflow
3. Tin Whisker Report
The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims
any and all liability, including but not limited to consequential or indirect damages.
Dec. 2014
PQFN 3.3X3.3
Component
Material
Name
Material
Mass (g)
Chip
Silicon
0.00145
Encapsulant
Epoxy
Resin
0.01427
Lead Frame
Copper
0.01318
Die Attach
Silver
Epoxy
0.00050
Wire Bond
Lead Finish
Copper
Matte Tin*
0.00030
0.00012
Element
Name
Composition
Si
SiO2
Epoxy Resin
Cu
Fe
Ag
Epoxy Resin
Cu
Sn
Total Weight
(g)
CAS #
Substance
Mass (g)
7440-21-3
7631-86-9
90598-46-2
7440-50-8
7439-89-6
7440-22-4
90598-46-2
7440-50-8
7440-31-5
0.00145
0.00928
0.00499
0.01278
0.00040
0.00043
0.00007
0.00030
0.00012
Material
Analysis
Weight
(%)
100%
65%
35%
97%
3%
86%
14%
100%
100%
% of Total
Weight
5.8%
30.6%
16.5%
42.1%
1.3%
1.7%
0.3%
1.2%
0.5%
0.02982
*Tin whisker mitigation strategy is 150 °C, 1 hour anneal within 24 hours of tin plating.
This
part is compliant with EU Directive 2011/65/EU (RoHS Directive) and does not contain lead,
mercury, cadmium (0.01%), hexavalent chromium, PBB or PBDE in concentrations greater than 0.1%,
except as permitted by Annex III. Further part complies with 3 reflow cycles per JEDEC J-STD-020
The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically
disclaims any and all liability, including but not limited to consequential or indirect damages.
1
Dec. 2014
PQFN 3.3X3.3 Copper Clip
Component
Material
Name
Material
Mass (g)
Chip
Silicon
0.00145
Encapsulant
Epoxy
Resin
0.01427
Lead Frame
Copper
0.01318
Die Attach
Soft Solder
0.00050
Wire Bond
Copper Clip
Lead Finish
Gold
Copper
Matte Tin*
0.00030
0.00423
0.00012
Element
Name
Composition
Si
SiO2
Epoxy Resin
Cu
Fe
Pb
Sn
Ag
Au
Cu
Sn
Total Weight
(g)
CAS #
Substance
Mass (g)
7440-21-3
7631-86-9
90598-46-2
7440-50-8
7439-89-6
7439-92-1
7440-31-5
7440-22-4
7440-57-5
7440-50-8
7440-31-5
0.00145
0.00928
0.00499
0.01278
0.00040
0.00046
0.00003
0.00001
0.00030
0.00423
0.00012
Material
Analysis
Weight
(%)
100%
65%
35%
97%
3%
92.5%
5%
2.5%
100%
100%
100%
% of Total
Weight
4.3%
27.3%
14.7%
37.5%
1.2%
1.4%
0.1%
0.0%
0.9%
12.4%
0.4%
0.03405
*Tin whisker mitigation strategy is 150 °C, 1 hour anneal within 24 hours of tin plating.
This
part is compliant with EU Directive 2011/65/EU (RoHS Directive) and does not contain lead,
mercury, cadmium (0.01%), hexavalent chromium, PBB or PBDE in concentrations greater than 0.1%,
except as permitted by Annex III. Further part complies with 3 reflow cycles per JEDEC J-STD-020
The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically
disclaims any and all liability, including but not limited to consequential or indirect damages.
2
Dec. 2014
PQFN 3.3X3.3
Test Definition
Room
Temperature
Humidity
Temperature
Humidity
Unbiase
Temperature
Cycling
Test Conditions
Inspection
Total
Interval Class
Duration
1 and 2
Class 1 and 2
Products
Products
Maximum
Whisker
Length
(µm)
30± 2°C/60± 3% RH
1000 hours
4000 hours
20
55± 3°C/85± 3% RH
1000 hours
4000 hours
20
500 cycles
1500 cycles
45
-40 to 55°C to 80 to 95°C,
air to air, 10 min soak,
approx 3
Tin Whisker testing per JESD201, Environmental Acceptance Requirements for
Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finish
Tin Whisker Results (number of failing whiskers)
Test
Room Temperature
Humidity Storage
Temperature
Humidity
Test
Temperature Cycling
1000 Hours
2000 Hours
3000 Hours
4000 Hours
0/24
0/24
0/24
0/24
0/24
0/24
0/24
0/24
500 Cycles
1000 Cycles
1500 Cycles
0/24
0/24
0/24
The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically
disclaims any and all liability, including but not limited to consequential or indirect damages.
3
July 2014