MIL-STD-883H
METHOD 2013.1
INTERNAL VISUAL INSPECTION FOR DPA
1. PURPOSE. This is an internal visual inspection for use in destructive physical analysis (DPA) procedures. The
purpose of this destructive test is to examine devices opened for post test evaluation to verify that there is no evidence
of defects or damage resulting from prior testing.
2. APPARATUS. The apparatus required for the performance of this test shall include binocular normal-incident
illumination microscopes capable of 30X to 60X and 75X to 150X magnification with both light and dark field illumination,
and any visual or mechanical standards to be used for measurements or comparison.
3. PROCEDURE. The device shall be opened using a technique which does not damage or contaminate the internal
structure or in any way impair the ability to observe defects in the devices or the effects of preceding test exposures.
The device(s) shall be examined microscopically at 30X to 60X for particles other than those produced by opening. After
examination for particles is complete, the opened device(s) shall be blown off with a nominal gas blow (approximately 20
psig) to remove unattached material from the delidding process. The device shall then be microscopically examined to
determine the existence of other visual defects as described in 3.1 and 3.2.
3.1 Low magnification defects (30X to 60X). No device shall be acceptable that exhibits the following defects:
a.
Improper substrate or bonding post plating material.
b.
Improper bond wire material or size.
c.
Metallic contamination or foreign material (see method 2010).
d.
Lifted or broken wires.
e.
Lifted, cracked, or broken die/substrate.
f.
Improper die mounting (see method 2010).
g.
Excessive lead wire loop or sag (see method 2010).
h.
Improper bond technique and size (see method 2010).
i.
Improper assembly die location and orientation as compared to the applicable assembly drawing.
j.
Particles (see method 2010) other than those introduced during opening.
3.2 High magnification defects (75X to 150X). No device shall be acceptable that exhibits the following defects:
a.
Metallization voids, corrosion, peeling, lifting, blistering, or scratches (see method 2010).
b.
Bond intermetallics extending radially more than 0.1 mil beyond the bond periphery in any direction.
c.
Improper die or substrate metallization design layout topography or identification.
d.
Die cracks (see method 2010).
METHOD 2013.1
16 May 1979
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C h e c k t h e s o u r c e to v e r i f y t h a t this is t h e c u r r e n t v e r s i o n b e f o r e u s e .