IX-6655
IX-6655
Laser Lift-Off System
Laser Lift-Off System
System Specification
Frame and Enclosure Fully enclosed Class 1 laser system, heavy duty weldment frame with integrated beam delivery
system and control electronics in a 1.7 m x 2 m footprint with an externally mounted laser
(included in foot print).
Beam Delivery System All Granite Beam Delivery Support Structure; Vibration isolating mounting platform for wafer stages
and beam delivery optics; Siffness and large thermal mass of granite structure prevent changes in
beam delivery system alignment over time; Pnuematic, 2 position laser beam stop; Precision optic
mounts for stability and ease of adjustment; select grade UV Homogenizer optics.
Motion Control Electronics Up to 12-axes of Servo or Step Motor Control, integrated into a single interface for all motorized
components as well as the laser fire mechanism
Part Handling
X-Y Stage Specifications Travel: Up to 200 mm diameter processing area
Optional Stages: Compatible up to 300mm wafer processing
Resolution: 0.1 µm
Accuracy: <3 µm over 125 mm x 125 mm area
Repeatability: <1 µm (bidirectional)
Z-axis Specifications Travel: 10 mm
Resolution: 0.25 µm
Accuracy: 5.0 µm
Repeatability: 1.5 µm (bidirectional)
System Features
Optimized for high
throughput LLO (Laser
Lift-Off) applications.
Dual Magnification, vision
system with sub-micron
part alignment
Homogenous beam
size adjustable to
500 x 500µm.
High accuracy: linear air
bearing stages provide
accuracies to <3µm
248nm or 193nm laser
options available
LLO Benefits
Die-size independent
Reduced Cost Of Ownership
Increased Process Window Fully Auotmated Options
IX-6655 Laser Lift-Off System
with Automation
Theta-axis Specifications Travel: ±175 °
Resolution: 3.6 µrad
Accuracy: 300 µrad overall. 25 µrad/per °
Repeatabiility: ±5.0 µrad
Programmable Rectangular
Variable Aperture
Enabling continuously adjustable size of rectangular shaped beam. Standard Openining: 0-15mm
Vision System and Alignment
Dual Camera MicroTech Vision System with 8.3 and 0.12 µm/pixel process and inspection cameras
Programmable Illumination Programmable lighting intensity control for automated optimization of imaging and alignment
Optional Features
Optional Equipment Automated Cassette Load/Unload System
Wafer Pre-aligner Features Vision System
Database Connectivity Software
Laser Calibration Power Meter/Beam Stop
Debris Management System
Sapphire Picker
Dual Beam Profilometry
On-Target Power Meter
Pulse Energy Monitor
Motorized Mask Changer
Lathe Stage
The IX-6655 is optimized for high repetition rate Laser Lift-Off (LLO) process that is independent of die size, with additional capability for multi-purpose UV laser micromachining. The
system combines a Class-1 workstation with an externally mounted laser, select grade homogenizer optics to provide uniform beam size adjustable to 500 x 500µm, dual beam profilometry, pulse-to-pulse energy monitor with data logging and wafer map.
The IX-6655 is optimized for demanding 24/7 high volume production applications.
Featuring optional automation with cassette load/unload ports, robotics, wafer pre-aligner,
and machine vision the system is capable of multiple wafer sizes up to 200mm. The laser
system provides high throughput with the lowest Cost Of Ownership (COO) resulting from
extended lifetimes and cleaning intervals.
+1 (603) 518-3200
[email protected]
+1 (603) 518-3200
[email protected]
Legal notices: All product information is believed to be accurate and is subject to change without notice. Information contained
herein shall legally bind IPG only if it is specifically incorporated into the terms and conditions of a sales agreement. Some specific
combinations of options may not be available. The user assumes all risks and liability whatsoever in connection with use of a
product or its application. IPG, IPG Photonics, The Power to Transform and IPG Photonics’ logo are trademarks of IPG Photonics
Corporation. © 2014 IPG Photonics Corporation. All rights reserved.
Legal notices: All product information is believed to be accurate and is subject to change without notice. Information contained
herein shall legally bind IPG only if it is specifically incorporated into the terms and conditions of a sales agreement. Some specific
combinations of options may not be available. The user assumes all risks and liability whatsoever in connection with use of a
product or its application. IPG, IPG Photonics, The Power to Transform and IPG Photonics’ logo are trademarks of IPG Photonics
Corporation. © 2014 IPG Photonics Corporation. All rights reserved.
www.ipgphotonics.com
www.ipgphotonics.com
The IX-6655 LLO Workstation
IX-6655
Laser Lift-Off System
System Achitecture:
Automation Options:
• All granite beam delivery and stage support structure
for vibration isolation
• Front door with laser-safe viewing window
• Single system control software with ergo-arm
mounted user interface
• Externally mounted laser for easy access.
• Fully automated with dual load/unload ports for
unattended operation
• Programmable Illumination
• Automated Part Aligner
• IAP with Dual End-Effectors and load/unload ports
• Sapphire Picker for automated removal from the
epi wafer
User Interface:
Laser Type:
•
•
•
•
•
Externally Mounted MicroX Laser
Available in 193nm or 248nm configurations
Pulse rate from 1 Hz to 1,000 Hz
Pulse length typically 10 ns
Footprint with MicroX Laser 1.7m x 2m
IX-6655 Laser Lift-Off System with
Externally Mounted MicroX
and Chiller
Cost of Ownership
for MicroX vs. Traditional Excimer laser:
• MicroX tube life time >2x
• MicroX optics life time >3x
• Fewer optics (½) cleaning with MicroX
• Gas fills happen every 2.5x pulses with MicroX
compared with traditional excimer
• Fully-integrated laser and system control with
single user interface
• Vision system for easy and automated part
alignment and process inspection
• IPG project management software and intuitive
macro building utility for fast programming
• DXF and CSV file interface for complex pattern
input
Metrology Options:
• Dual Beam Profilometer: Mask and OnTarget viewing of beam energy profile for
easy alignment
IX-6655 Internal Configuration:
BDS, Cameras, Stages Built around
Granite Support Structure
• Pulse-to-Pulse Energy Monitor: Captures
real-time data of pulse energy
• On-Targe Power Meter