PQFN 3.3X3.3
RoHS Compliance Document
Contents:
1. Composition
2. Solder Reflow
2. Tin Whisker Report
http://www.irf.com/ehs
April 2016
PQFN 3.3X3.3 BOM 1
Component
Chip
Encapsulant
Lead Frame
Die Attach
Wire bond
Lead Finish
Material
Name
Material
Mass (g)
Silicon
Epoxy
Resin
0.00145
Copper
0.01318
Silver
Epoxy
Copper
Matte Tin
0.01427
0.00050
0.00030
0.00012
Element
Name
Composition
Si
SiO2
Epoxy Resin
Cu
Fe
Ag
Ag
Epoxy Resin
Cu
Sn
Total Weight
(g)
CAS #
Substance
Mass (g)
7440-21-3
7631-86-9
90598-46-2
7440-50-8
7439-89-6
7440-22-4
7440-22-4
90598-46-2
7440-50-8
7440-31-5
0.00145
0.00928
0.00499
0.01278
0.00039
0.00001
0.00043
0.00007
0.00030
0.00012
Material
Analysis
Weight
(%)
100%
65%
35%
97%
3%
0%
85%
15%
100%
100%
0.02982
* Tin whisker mitigation strategy is 150 C, 1 hour anneal within 24 hours of tin plating.
This part is compliant with EU Directive 2011/65/EU (RoHS Directive) and does not contain lead,
mercury, cadmium (0.01%), hexavalent chromium, PBB or PBDE in concentrations greater than 0.1%,
except as permitted by Annex III. Further part complies with 3 reflow cycles per JEDEC J-STD-020
April 2016
% of Total
Weight
5.8%
30.6%
16.5%
42.1%
1.3%
0.0%
1.7%
0.3%
1.2%
0.5%
PQFN 3.3X3.3 BOM 2
Component
Chip
Encapsulant
Lead Frame
Material
Name
Silicon
Epoxy
Resin
0.00145
Copper
0.01318
Wire bond
Silver
Epoxy
Copper
Lead Finish
NiPdAu
Die Attach
Material
Mass (g)
0.01427
0.0005
0.0003
0.00012
Element
Name
Composition
Si
SiO2
Epoxy Resin
Cu
Fe
Ag
Ag
Epoxy Resin
Cu
Ni
Pd
Au
Total Weight
(g)
CAS #
Substance
Mass (g)
7440-21-3
7631-86-9
90598-46-2
7440-50-8
7439-89-6
7440-22-4
7440-22-4
90598-46-2
7440-50-8
7440-02-0
7440-05-3
7440-57-5
0.00145
0.00928
0.00499
0.01278
0.00039
0.00001
0.00043
0.00007
0.0003
0.00011
0.00001
0
Material
Analysis
Weight
(%)
100%
65%
35%
97%
3%
0%
85%
15%
100%
92.40%
6.30%
1.30%
0.02982
This part is compliant with EU Directive 2011/65/EU (RoHS Directive) and does not contain lead,
mercury, cadmium (0.01%), hexavalent chromium, PBB or PBDE in concentrations greater than 0.1%,
except as permitted by Annex III. Further part complies with 3 reflow cycles per JEDEC J-STD-020
April 2016
% of Total
Weight
4.86%
31.12%
16.73%
42.86%
1.31%
0.03%
1.44%
0.23%
1.01%
0.37%
0.03%
0.00%
PQFN 3.3X3.3 Copper Clip BOM 3
Component
Chip
Material
Name
Material
Mass (g)
Silicon
Epoxy
Resin
0.00145
Lead Frame
Copper
0.01318
Die Attach
Soft
Solder
0.00050
Wire bond
Copper Clip
Lead Finish
Gold
Copper
Matte Tin
0.00030
0.00423
0.00012
Encapsulant
0.01427
Element
Name
Composition
Si
SiO2
Epoxy Resin
Cu
Fe
Ag
Pb
Sn
Ag
Au
Cu
Sn
Total Weight
(g)
CAS #
Substance
Mass (g)
7440-21-3
7631-86-9
90598-46-2
7440-50-8
7439-89-6
7440-22-4
7439-92-1
7440-31-5
7440-22-4
7440-57-5
7440-50-8
7440-31-5
0.00145
0.00928
0.00499
0.01278
0.0004
0.00001
0.00046
0.00003
0.00001
0.0003
0.00423
0.00012
Material
Analysis
Weight
(%)
100%
65%
35%
97%
3%
0%
92.5%
5%
2.5%
100%
100%
100%
0.03405
* Tin whisker mitigation strategy is 150 C, 1 hour anneal within 24 hours of tin plating.
This part is compliant with EU Directive 2011/65/EU (RoHS Directive) and does not contain lead,
mercury, cadmium (0.01%), hexavalent chromium, PBB or PBDE in concentrations greater than 0.1%,
except as permitted by Annex III. Further part complies with 3 reflow cycles per JEDEC J-STD-020
April 2016
% of Total
Weight
4.3%
27.3%
14.7%
37.5%
1.2%
0.0%
1.4%
0.1%
0.0%
0.9%
12.4%
0.4%
PQFN 3.3X3.3
Test Definition
Room
Temperature
Humidity
Storage
Temperature
Humidity
Unbiased
Test Conditions
o
30± 2 C/60± 3%RH
55± 3°C/85±3% RH
o
Temperature
Cycling
Inspection
Interval
Class 1 and
2 Products
Total
Duration
Class 1 and
2 Products
Maximum
Whisker
Length
(um)
1000 hours
4000 hours
1000 hours
4000 hours
20
500 cycles
1500 cycles
45
20
o
-40 to 55 C to 80 to 95 C,
air to air, 10 min soak,
approx 3 cycles /hours
Tin Whisker testing per JESD201, Environmental Acceptance Requirements for
Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finish
Tin Whisker Results (number of failing whiskers)
Test
1000 Hours
2000 Hours
3000 Hours
4000 Hours
0/24
0/24
0/24
0/24
0/24
0/24
0/24
0/24
Test
500 Cycles
1000 Cycles
1500 Cycles
Temperature Cycling
0/24
0/24
0/24
Room Temperature
Humidity Storage
Temperature Humidity
Unbiased
April 2016