Heat-Pipes Heat-Pipe Heat Sinks Heat-pipes heat-pipe tech Heat pipe (HP) is celebrated as an excellent heat transfer component, consisting of three parts called evaporating section, adiabatic section and condensation section. The main part is a sealed metal tube in which the air and other impurities must have been excluded out to maintain a micro-negative pressure and certain working fluid was filled in. When in operation, the liquid near heat source section evaporates after absorbing heat and becomes vapor, which carries latent heat and flows to the condensation section. After releasing heat through HP shell and outer cooling medium, the vapor then rechanges into liquid, which flows back into evaporating section at the pressure of capillary structure, and starts another working cycle. For the super heat transfer capability endued from its critically designed capillary structure, HP can carry large quantities of heat from heat source instantly and it is acclaimed super heat conductor. product exhibition (1)Product Exhibition WTL Sintered wick heatpipe WTL Axial grooved wick straight heatpipe WTL Axial grooved wick elbow heatpipe (2)Product Parameter Item Heat Pipe Length(mm) Container Materials Capillary Structure Working Fluid Designed Operating Temperature(℃) Designed Operating Inclination Angle(°) Heat Transfer Capacity (Qmax) Isothermal Test Heat Resistance (℃/W) Parameter 230~900 Cu Axial grooved wick / Sintered wick / Screen wick WTL Cooled Medium 20~200 α> 5 50~1000w (depends on the product specs) When heating in 50℃ water bath, the temperature difference between Evaporator section and adiabatic section is less than 2℃ < 0.08 (as reference) Principle of Heat Transfer Capacity Test Testing Requirements 1)Heating input-power is supplied by the special delicate power adjustment; 2)heat pipe is placed with a α inclination angle; 3)when the fluctuate of the supervisory temperature on the outer shell is within 0.5℃ in 5min, the heat transfer process reaches its balance and the maximum heat transfer capacity (Qmax) is also defined simultaneously. (3)Sample Charts of Heat Transfer Characteristics Test Fig.1 Heat Transfer Capacity Test of HP with 700mm Length Fig.2 Isotherm Test of HP with 700mm Length Heatpipe Product exhibition Heat Pipe Working Principle Heat Pipe Exhibition Heat-pipe heat sink heat-pipe heat sink brief Heat pipe heat sink (HP heat sink) was generated by combination of HP technology and expansion fin heat dissipating technology. Compared with the traditional pure aluminum heat sink, HP heat sink is superior in its heat transfer capacity and efficiency per unit volume, which makes it an appreciated heat dissipating product. By exclusively introducing most advanced HP technology and process, WTL has been researching, developing and manufacturing numerous of new products for various of users. The products, such as HP heat sink for power devices and HP heat sink for explosion-proof circumstance and etc, have been widely applied in such fields as high speed locomotive, railway, oil, chemical, coal, medium-voltage and high-voltage inverter and etc., and widely accepted both in domestic and abroad. Some products of our heat pipe heat sink are in the picture. Heatpipe Heat Sink For Silicon Controlled 1、Heatpipe Heat Sink For Silicon Controlled With the fast development of the power and electronic industry, it is obvious that the large scale integration, assembly modularization and volume minimization are becoming a trend in integrated circuits, resulting in the increasingly larger dissipating heat of the power devices (such as silicon controlled rectifier SCR, silicon transistor, IGBT and etc.) Accordingly, higher requirements are put forward for the heat sink. To satisfy the requirements of the large heat dissipation, the HP heat sink with compact design is found to have higher efficiency, smaller volume and lighter weight, when compared with the traditional pure aluminum heat sink. WTL produces the HP heat sink (following the national standard) for the power devices, such as the SCR (Refer to the Fig.1 and Fig 2). Fig.1 Series Parallel Connection Composite System Fig.2 Six-phase Semiwave Rectification Circuit Composite System Heatpipe Heat Sink for Inverter Arc Welding Source (1)Product Exhibition (2)Product Parameter 1. High heat dissipating efficiency, low thermal resistance, light weight; having larger heat dissipating capability when compared Features with the normal pure aluminum heat sink in the same volume; 2. Simple structure and compact design; easy installation and low maintenance costs. Application heat dissipating for inverter arc welding source Operation Temperature(℃) 20~200 Heat Dissipated Power(w) According to customer requirements Thermal Resistance((℃/w) ≤0.09 Substrate:Al Materials Fin: Al HP shell: Cu Type of cooling Forced air cooling Outline Structure HP Heat Sink For Medium/High Voltage Inverter (1)Product Exhibition (2)Product Parameter 1. High heat dissipating efficiency, low thermal resistance, light weight; having larger heat dissipating capability when compared Features with the normal pure aluminum heat sink in the same volume; 2. Simple structure and compact design; easy installation and low maintenance costs. Application Heat Sink For Medium/High Voltage Inverter Operation Temperature(℃) 20~200 Heat Dissipated Power(w) According to customer requirements Thermal Resistance((℃/w) ≤0.015 Substrate: Al/Cu Materials Fin: Al/Cu HP shell: Cu Type of cooling Forced air cooling HP heat sink for Plating Power Supply (1)Product Exhibition (2)Product Parameter 1. High heat dissipating efficiency, low thermal resistance, light weight; having larger heat dissipating capability when compared Features with the normal pure aluminum heat sink in the same volume; 2. Simple structure and compact design; easy installation and low maintenance costs. Application Heatpipe heat sink for Plating Power Supply Operation Temperature(℃) 20~200 Heat Dissipated Power(w) According to customer requirements Thermal Resistance((℃/w) ≤0.03 Substrate: Al/Cu Materials Fin: Al HP shell: Cu Type of cooling Forced air cooling Outline Structure HP Heat Sink For Mining Explosion Proof Inverter (1)Product Exhibition (2)Product Parameter 1. High heat dissipating efficiency, low thermal resistance, light weight; having larger heat dissipating capability when compared Features with the normal pure aluminum heat sink in the same volume; 2. Simple structure and compact design; easy installation and low maintenance costs. Application Heatpipe Heat Sink For Mining Explosion Proof Inverter Operation Temperature(℃) 20~200 Heat Dissipated Power(w) 500~20000 Thermal Resistance((℃/w) ≤0.015 Substrate:Al/Cu Materials Fin: Cu HP shell: Cu Type of cooling Natural cooling/Forced air cooling HP Heat Sink For VVVF Inverter、SIV Auxiliary Power Unit (1)Product Exhibition (2)Product Parameter 1. High heat dissipating efficiency, low thermal resistance, light weight; having larger heat dissipating capability when compared Features with the normal pure aluminum heat sink in the same volume; 2. Simple structure and compact design; easy installation and low maintenance costs. Application Heatpipe Heat Sink For VVVF Inverter、SIV Auxiliary Power Unit Operation Temperature(℃) 20~200 Heat Dissipated Power(w) 1500~3000 Thermal Resistance((℃/w) ≤0.03 Substrate:Al Materials Fin: Cu HP shell: Cu Type of cooling Natural cooling Heatpipe Heat Sink For SVC/SVG (1)Product Exhibition SVC SVG (2)Product Parameter 1. High heat dissipating efficiency, low thermal resistance, light weight; having larger heat dissipating capability when compared Features with the normal pure aluminum heat sink in the same volume; 2. Simple structure and compact design; easy installation and low maintenance costs. Application Heatpipe heat sink for SVC/SVG Operation Temperature(℃) 20~200 Heat Dissipated Power(w) According to customer requirements Thermal Resistance((℃/w) ≤0.045 Substrate: Al Materials Fin: Al HP shell: Cu Type of cooling Natural cooling/Forced air cooling Heatpipe Heat Sink For APF (1)Product Exhibition (2)Product Parameter 1. High heat dissipating efficiency, low thermal resistance, light weight; having larger heat dissipating capability when compared Features with the normal pure aluminum heat sink in the same volume; 2. Simple structure and compact design; easy installation and low maintenance costs. Application Heatpipe heat sink for APF Operation Temperature(℃) 20~200 Heat Dissipated Power(w) According to customer requirements Thermal Resistance((℃/w) ≤0.045 Substrate: Al Materials Fin: Al HP shell: Cu Type of cooling Forced air cooling
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