Implications of the emergence of
UltraConductive Copper (UCC) wire
Malcolm Burwell – UCC program leader – International Copper Association Ltd.
Dr. Horst Adams – President – Adamco Inc.
Dr. Kyle Kissell – CTO –NanoRidge Materials Inc.
IEEE-PELS webinar – 31 August 2016
Today’s Webinar
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Objective: top-level answers to these questions:
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What is UltraConductive Copper (UCC)?
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What are its applications?
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Where is it in its development cycle?
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What are its performance parameters?
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How can you learn more about it?
15mm dia billet and 2mm dia wire from
nanocarbon/copper composite UCC
20-minute presentation, 10-minute Q&A
3µm-long carbon nanotubes in copper - aligned
through extrusion
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| Implications of the emergence of ultraconductive copper wire - IEEE-PELS webinar - 31 August 2016
What is ultraconductive copper?
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Ultraconductive copper (UCC) is a composite of
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<1% by weight nanocarbon (CNTs, graphene)
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>99% by weight pure copper
UCC shows a unique combination of properties
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Electrical conductivity of >110%IACS
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Bare wire ampacity >140% that of copper
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Improved thermal and mechanical performance
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Uses Cu’s existing supply-chain and infrastructure
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Two postulated alternative mechanisms of action:
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High electron mean free path in the region where
the carbon lattice meets the copper lattice
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Carbon lattice acts as seed for (1 1 1) grain plane
orientation in copper
SEM of etched UCC showing CNTs on and
within a copper crystalline surface
Electron sea from Cu
Cu
Cu
SWCNT
CNT
Annular electron Pi- orbitals
transport tunnel of C-atoms
One candidate mechanism of action: Cu/C
electron tunnels with high mean free path
| Implications of the emergence of ultraconductive copper wire - IEEE-PELS webinar - 31 August 2016
What are the applications for UCC?
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Conceptually, any electrical conductor application
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Pilot volumes (2023): ~4x cost of pure copper
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Mass volumes (2028): ~1.2x cost of pure copper
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Simple end-of-life recycling
First target applications:
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Military motor wire + cable (eg. UAVs, rail gun)
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Signal cable for exascale supercomputing
Mass-market applications must wait for
manufacturing process development/investment
(esp. for nanocarbon), real-time life-testing,
biosafety-testing, standards-development:
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Military aerospace provides the first target
applications for UCC wire
Cables for buildings, automotive, power distribution
High data-rate communications cable (>25GB/s)
Signal infrastructure for IBM BlueGene/L, a 500
teraflop supercomputer at Lawrence Livermore
| Implications of the emergence of ultraconductive copper wire - IEEE-PELS webinar - 31 August 2016
Where is UCC wire in its development cycle?
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UCC wire is still early in its development cycle
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Material now at TRL3, wire production at TRL4
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Repeatable at kg scale (SJTU,NanoRidge,Ultrawire)
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Development started in 2003, 6-12 years still to go
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>$15million of R&D funded worldwide since 2011
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Edisonian work, with sparse theory underpinning it
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Many other R&D groups with un-repeatable results
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European and Chinese groups leading worldwide
Extruded copper/carbon nanotube filaments in
2mm diameter wire
Many serious players engaged in R&D, including
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Companies: NanoRidge,HonHai,Siemens,Plansee,
Sumitomo,Aurubis,Nexans,KME,Wieland,Outotec
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Universities: Cambridge,AGH,SJTU,CSU,UCF,OU,
Penn,Rice,TASC,Hokkaido,Rochester,Tsinghua
15mm dia UCC bar (left), 2mm dia UCC wire
(right)
| Implications of the emergence of ultraconductive copper wire - IEEE-PELS webinar - 31 August 2016
What is UCC’s performance?
- Electrical conductivity
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Commercial interest in UCC starts at 110%IACS
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In 2015 one R&D group demonstrated
114%IACS, which was independently verified
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This is the highest repeatable room temperature
conductivity ever seen in a solid macro material
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Confirms the ultraconductivity effect to be real
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Nanocarbon type used = graphene
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Small foil sample – work now progressing with wire
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Several R&D groups have seen intriguing but unrepeatable conductivity of >>100%IACS
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Thermal coefficient of resistivity is 21% lower than
pure copper – supports high temperature uses
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100%
IACS
Independently verified UCC conductivity of
114%IACS (right hand red bar)
Example of unrepeatable conductivity results –
ranging from 40%IACS to >10,000%IACS
(100%IACS is the central blue axis)
| Implications of the emergence of ultraconductive copper wire - IEEE-PELS webinar - 31 August 2016
What is UCC’s performance?
- Ampacity
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Ampacity = maximum current that a wire can
carry without exceeding its specified temperature
A bare wire of UCC repeatably exceeds by ~40%
the ampacity of a similar pure copper wire
21 AWG Market Copper Wire (NanoRidge Testing)
23 AWG Market Copper Wire (GE Testing)
21 AWG TeraCopper(R) Wire (NanoRidge Testing)
23 AWG TeraCopper(R) Wire (GE Testing)
25000
Current Density (Amps/cm2)
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20000
15000
10000
5000
0
100
I 2R
200
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Although
losses minimally reduced, UCC wire
can safely carry higher current than pure Cu wire
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Mechanism appears to be increased heat transfer
coefficient at the wire surface, suggested by
Constant temp
background
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Separate thermal experiments
Wire clamp
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Exploration of surface enrichment with nanocarbon
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Development work ongoing to explore effects of
added outer insulation layer
300
400
500
600
700
Wire Surface Temperature (C)
UCC ampacity (upper curve) higher than pure
copper (lower curve)
Infrared
camera
Ampacity test set-up
| Implications of the emergence of ultraconductive copper wire - IEEE-PELS webinar - 31 August 2016
What is UCC’s performance?
- Other properties
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Thermal properties significantly increased
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Surface heat transfer coefficient +40%
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Thermal conductivity improved; not yet quantified
Mechanical properties typically increased by >3x
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Strength
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Tensile modulus
Experimental set-up for heat transfer coefficient
measurement using UCC tubing
Hot ductility is not significantly increased
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Mechanical flow properties of Cu maintained
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Rolling/extrusion forces not increased significantly
Corrosion resistance appears substantially similar
to pure copper
Strength and elastic modulus of UCC ~300%
that of pure copper
| Implications of the emergence of ultraconductive copper wire - IEEE-PELS webinar - 31 August 2016
How can you learn more about UCC?
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Reference-list at the end of this presentation
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Contact authors of this webinar for referrals to
organizations working on UCC
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Attend the end-of-project Ultrawire “open day”
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September 21 2016 – Leuven, Belgium
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Largest UCC project worldwide – €5.1million (FP7)
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http://ultrawire.eu
Co-deposited Cu/CNT foil before hot-pressing
into a billet
Join the Nanocarbon Enhanced Material
Consortium (Europe), which concentrates on UCC
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http://www.cfbi.com/nanocarbon.htm
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http://www.cnt-ltd.co.uk/services-events/ncemconsortium/
Cu/CNT powder sintered into busbar geometry
| Implications of the emergence of ultraconductive copper wire - IEEE-PELS webinar - 31 August 2016
UCC references
- technical papers
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O. Hjortstam, P. Isberg, S. Söderholm & H. Dai, “Can We Achieve Ultra-Low Resistivity in Carbon Nanotube-Based Metal Composites?”, Appl.
Phys. A Vol. 78, 2004, 1175 (link)
Chandramouli Subramaniam, Takeo Yamada, Kazufumi Kobashi, Atsuko Sekiguchi, Don N. Futaba, Motoo Yumura & Kenji Hata, “One Hundred
Fold Increase in Current Carrying Capacity in a Carbon Nanotube–Copper Composite”, Nature Comm. Vol. 4, 2013, 2202 (link)
P.G. Collins & Ph. Avouris, “Multishell Conduction in Multiwalled Carbon Nanotubes”, Appl. Phys. A Vol. 74, 2002, 329 (link)
Philip G. Collins, M. Hersam, M. Arnold, R. Martel & Ph. Avouris, “Current Saturation and Electrical Breakdown in Multiwalled Carbon
Nanotubes”, Phys. Rev. Lett., Vol. 86, No. 14, 2001, 3128 (link)
Chris Rutherglen and Peter Burke, “Nanoelectromagnetics: Circuit and Electromagnetic Properties of Carbon Nanotubes”, Small Vol. 5, No. 8,
2009, 884 (link)
A. Bachtold, M. S. Fuhrer, S. Plyasunov, M. Forero, Erik H. Anderson, A. Zettl & Paul L. McEuen, “Scanned Probe Microscopy of Electronic
Transport in Carbon Nanotubes”, Phys. Rev. Lett. Vol. 84, No. 26, 2000, 6082 (link)
H. J. Li, W. G. Lu, J. J. Li, X. D. Bai and C. Z. Gu, “Multichannel Ballistic Transport in Multiwall Carbon Nanotubes”, Phys. Rev. Lett. Vol. 95,
2005, 086601 (link)
Johannes Svensson and Eleanor E. B. Campbell, “Schottky Barriers in Carbon Nanotube-Metal Contacts”: J. Appl. Phys. Vol. 110, 2011, 111101
(link)
C. T. White & T. N. Todorov, “Carbon Nanotubes as Long Ballistic Conductors”, Nature Vol. 393, 1998, 240
Geng Xu, Jingna Zhao, Shan Li, Xiaohua Zhang, Zhenzhong Yong & Qingwen Li, “Continuous Electrodeposition for Lightweight, Highly
Conducting and Strong Carbon Nanotube-Copper Composite Fibers”, Nanoscale, Vol. 3, 2011, 4215 (link)
Praveennath G. Koppad, H.R. Aniruddha Ram, C.S. Ramesh, K.T. Kashyap & Ravikiran G. Koppad, ”On Thermal and Electrical Properties of
Multiwalled Carbon Nanotubes/Copper Matrix Nanocomposites”, J. of Alloys and Compounds Vol. 580, 2013, 527 (link)
Abolfazl Alizadeh Sahraei, Alireza Fathi, Mohammad Kazem Besharati Givi, Shahab Boroun and Mohammad Hadi Pashaei, “Enhanced Hardness
and Electrical Properties of Copper Nanocomposites Reinforced by Functionalized MWCNTs”, J. of Composite Materials 2013,
0021998313510333
Guifu Ding, Yan Wang, Min Deng, Xuemei Cui, Huiqing Wu and Lida Zhu, “Research and Application of CNT Composite Electroplating”, From
Research to Applications, Dr. Stefano Bianco (Ed.), ISBN: 978-953-307-500-6 (link)
Nobuya Banno and Takao Takeuchi, “Enhancement of Electrical Conductivity of Copper/Carbon Nanotube Composite Wire”, J. Japan Inst. Met.,
Vol. 73, No. 9, 2009, 651-658
Paul Jarosz, Christopher Schauerman, Jack Alvarenga, Brian Moses, Thomas Mastrangelo, Ryne Raffaelle, Richard Ridgley and Brian Landi,
“Carbon Nanotube Wires and Cables: Near-Term Applications and Future Perspectives”, Nanoscale Vol. 3, 2011, 4542 (link)
A.T. Costa, Jr. and S. Bose, “Impurity Scattering Induced Entanglement of Ballistic Electrons”, Phys. Rev. Lett. Vol. 87, 2001, 277901 (link)
Guangyu Chai, Ying Sun, Jianren ‘Jenny’ Sun and Quanfang Chen, “Mechanical Properties of Carbon Nanotube–Copper Nanocomposites”, J.
Micromech. Microeng. Vol. 18, 2008, 035013 (link)
10 | Implications of the emergence of ultraconductive copper wire - IEEE-PELS webinar - 31 August 2016
UCC references
- patents
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Toshiharu Furukawa, Mark Charles Hakey, David Vaclav Horak, Charles William Koburger III, Mark Eliot Masters, Peter H. Mitchell &
Stanislav Polonsky, “Integrated Circuit Chip Utilizing Carbon Nanotube Composite Interconnection Vias”, US Patent number 7,135,773,
November 14, 2006 (link)
Taysir H. Nayfeh & Anita M. Wiederholt, “Nano-Engineered Ultra-Conductive Nonocomposite Wire”, US Patent Application No. 20120152480 A1,
June 21, 2012 (link)
James Antoni Wasynczuk, “Bulk Carbon Nanotube and Metallic Composites and Method of Fabricating”, WO2014042755 A1, 20 March 2014
(link)
Quanfang Chen, “Carbon Nanotube Reinforced Metal Composites”, US Patent number 7,651,766 B2, January 26, 2010 (link)
Quanfang Chen, “Carbon Nanotube Reinforced Metal Composites”, US Patent Application number 20070036978 A1, February 15, 2007 (link)
Quanfang Chen, “Electrochemical-Codeposition Methods for Forming Carbon Nanotube Reinforced Metal Composites”, US Patent Application
number 20100122910 A1, May 20, 2010 (link)
Randall Reagan Buckner, Kyle Ryan Kissell, Howard Scott Horton & Clayton Charles Gallaway, “Conductive Metal Enhanced with Conductive
Nanomaterial”, WO2013072687, 23 May 2013 (link)
Enrique V. Barrera & Yildiz Bayazitoglu, “Containerless Mixing of Metals and Polymers with Fullerenes and Nanofibers to Produce Reinforced
Advanced Materials”, US Patent number 7,323,136 B1, January 29, 2008 (link)
Clayton Gallaway, Dean Hulsey, Michael Searfass & Joshua Falkner, “Metallized Nanotubes”, US Patent Application number 20110174701 A1,
July 21, 2011 (link)
Horst Adams, “Carbon Nanotube Enhanced Electrical Cable”, WO2013127444, 6 September 2013 (link)
Xin Wei, Yuanjian Deng, Renard L. Thomas & Bobby Wilson, “Instantaneous Electrodeposition of Metal Nanostructures on Carbon Nanotubes”,
US Patent Application number 20100140097 A1, June 10, 2010 (link)
Katsuyoshi Kondoh & Bunshi Fugetsu, “Composite Metal Material and Method for Producing the Same”, US Patent Application number
20100261028 A1, October 14, 2010 (link)
James L. Maxwell, “Method of Fabrication of Fibers, Textiles and Composite Materials”, US patent Application number 20100055352 A1, March
4, 2010 (link)
Mianjun Duan & Ling Wei, “Novel High Conductivity and High-Strength Graphene/Copper Material and Preparation Method Thereof” Chinese
Patent number CN103614583, March 5, 2014 (link)
Sachin Belgamwar and Nitin Nipun Sharma, “Method of Producing Uniform Mixture of Copper and Carbon Nanotube in Bulk for Copper Metal
Nanocomposite”, Indian Patent Application number 2454/DEL/2012, July 12, 2012 (link)
Young Deog Kim & Won Joon Song, “Method of Producing Light Metal Alloy Dispersed with Carbon Nanotubes”, Korean Patent Registration
number 10-1222038, January 8, 2013
Yang Wei & Shou-Shan Fan, “Carbon Nanotube Wire Composite Structure and Method for Making the Same”, US Patent Application number
2012/0045644 A1, February 23, 2012 (link)
11 | Implications of the emergence of ultraconductive copper wire - IEEE-PELS webinar - 31 August 2016
Thank you
For more information please contact:
[email protected]
[email protected]
[email protected]
[email protected]
12 | Implications of the emergence of ultraconductive copper wire - IEEE-PELS webinar - 31 August 2016