Platinum Temperature Sensors
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General Information
In many sectors, temperature measurement is one of the most important physically defined parameter to
determine product quality, security and reliability. Temperature sensors are produced with different
technologies to fit specific application requirements. To this end, IST has concentrated the development,
manufacturing processes and materials to produce high-end thin-film temperature sensors. This know-how,
partially derived from the semiconductor industry, allowing IST to manufacture sensors in very small
dimensions. Thin-film temperature sensors exhibit a very short response time due to their low thermal mass.
The technologies and processes of IST thin-film sensors combines the positive attributes of traditional wirewound platinum sensors - accuracy, long-term stability, repeatability and interchangeability within a wide
temperature range. The advantages of thin-film mass-production creates an optimal price/performance ratio.
Construction
The temperature sensor consists of a high-purity platinum meander, photolithographically structured on a
ceramic substrate. The resistivity is laser-trimmed and precisely adjusted to the final value. The resistive
structure is covered with a glass passivation layer protecting the sensor against mechanical and chemical
damages. The welded leadwires are covered with an additional fixation layer.
Special Features
– Fast response time
– Excellent long-term stability
– Low self-heating
– Optimal price/performance ratio
– Small dimensions
– Vibration and temperature shock resistant
– Simple interchangeability
Long-Term Stability
For all sensor types up to 7W (750°C), the change in ohmic value after 1000 hrs is less than 0.04% at
maximum operating temperatures.
Nominal Value and Temperature Coefficent
The nominal value of the sensor is the defined value of the sensor resistance at 0° C. The temperature
coefficient (TCR) is defined as
=
R100 - R0
100 · R0
-1
-1
[K ] according to the DIN IEC 751 numerical value of 0.00385 K .
Generally, the value is defined in ppm/K.
This example defines 3850ppm/K.
Platinum Temperature Sensors
2/21
Temperature Characteristic Curve
The curve determines the relationship between the electrical resistance and the temperature.
The below temperature curves refers to DIN EN 60751 standards.
2
3
-200 to 0°C
R(T) = R0 (1 + A * T + B * T + C * [T-100] * T )
0 to 850°C
R(T) = R0 (1 + A * T + B * T )
2
10
Other TCR available
8
7
6
"t [K]
Platinum (3911 ppm/K):
-3
-1
-7
-2
A = 3.9692 * 10 [°C ]; B = -5.829 * 10 [°C ];
-12
-4
C = -4.3303 * 10 [°C ]
C
9
Platinum (3850 ppm/K):
-3
-1
-7
-2
A = 3.9083 * 10 [°C ]; B = -5.775 * 10 [°C ];
-12
-4
C = -4.183 * 10 [°C ]
5
B
4
Platinum (3750 ppm/K):
-3
-1
-7
-2
A = 3.8102 * 10 [°C ]; B = -6.01888 * 10 [°C ];
-12
-4
C = -6 * 10 [°C ]
3
2
Platinum (3770 ppm/K):
-3
-1
-7
-2
A = 3.8285 * 10 [°C ]; B = -5.85 * 10 [°C ];
1
A
Y
0
-400
R0 = Resistance value in ohm at 0°C;
T = Temperature in accordance with ITS 90
-200
0
200
400
600
800
1000
t [°C]
General standard deviations
Tolerance Classes DIN EN 60751 Norm
Temperature sensors are classified according to DIN EN 60751, 2009-05.
Class
+/- deviations
in °C
DIN EN 60751, F 0.1 (formerly class 1/3 DIN B)
DIN EN 60751, F 0.15 (formerly class A)
DIN EN 60751, F 0.3 (formerly class B)
2 DIN EN 60751, F 0.6 (formerly class C)
1/5 DIN EN 60751 F 0.3
1/10 DIN EN 60751 F 0.3
IST AG
reference
0.10 + 0.0017 x | T |
0.15 + 0.002 x | T |
0.30 + 0.005 x | T |
0.60 + 0.01 x | T |
0.06 + 0.001 x | T |
0.03 + 0.0005 x | T |
Y
A
B
C
K
K
Temperature
range of validity
-50°C to +150°C
-90°C to +300°C
-200°C to +850°C
-200°C to +850°C
on request
on request
| T | is the numerical value of the temperature in °C without taking leading signs into account.
Applied Current
The current applied is highly dependent on the application and leads to self-heating effects. Depending on the
thermal transfer from the sensor into the application, the current can be increased. There is no bottom current
limit for platinum thin-film sensors. The maximum current for sensors between 750°C and 1000°C (7W, 8W,
10W) should not exceed 1mA.
Recommended current supplies:
100 J: 1mA
500 J: 0.5mA
1000 J: 0.3mA
2000 J: 0.2mA
10000 J: 0.1mA
The measurement point is 5mm from the wire end. For long wires (>20mm) the resistance is compensated
(measured at room temperature) to ensure the correct resistance at the chip edge.
Platinum Temperature Sensors
3/21
Self Heating
The electric current generates self-heating resulting in errors of measurement. To minimize the error, the
testing current should be kept as low as possible. The measurement error caused by self-heating is dependent
2
on temperature error MT = RI / E .
E = self-heating coefficient in mW/K, R = resistance in kJ, I = measuring current in mA
Response Time
The response time is defined as the time in seconds the sensor needs to detect the change in temperature.
T0.63 describes the time in seconds the sensor needs to measure 63% of the temperature change. The
response time is depending on the sensor dimensions, the thermal contact resistance and the surounding
medium.
Dimensions
Number
Sensor Size
Response Time in Seconds
L x W x T / H in mm
161
1.6 x 1.2 x 0.25/0.8
308
3.0 x 0.8 x 0.25/0.6
232
2.3 x 2.0 x 0.25/0.9
202
2.0 x 2.0 x 0.65/1.3
216
2.5 x 1.6 x 0.65/1.3
2.3 x 2.0 x 0.65/1.3
325
3.0 x 2.5 x 0.65/1.3
516
5.0 x 1.6 x 0.65/1.3
520
5.0 x 2.0 x 0.65/1.3
525
5.0 x 2.5 x 0.65/1.3
538
505
102
281
Water 0.4 m/s
Self-Heating
Air 1m/s
t0.5
0.0
5
0.0
t0.63
t0.9
0.08
0.18
1
1.2
2.5
0.10
0.25
1.2
1.5
3.5
15
6.7
8
0.0
9
0.1
0.12
0.33
2.7
3.6
7.5
40
0.16
0.38
3.6
4.9
10.2
32
1
0.1
2
0.1
0.18
0.42
4
5.4
11
0.2
0.55
4.5
6
5
0.2
5
0.2
0.3
0.7
5.5
7.5
0.3
0.7
5.5
7.5
16
80
1.3
7
14
5
0.2
5
0.3
0.3
0.75
6
8.5
18
80
1.3
7
14
0.4
0.85
6.5
9
19
90
1.1
8
13
0.4
0.9
7.5
10
20
140
0.7
10
10
0.5
1.1
8
11
21
150
0.7
11
9
0.4
0.85
7.5
10.5
20
140
0.7
10
10
4.5
8
10
15
28
60
1.7
5.5
18
4
25
3
5.0 x 3.8 x 0.65/1.3 0.3
5
5.0 x 5.0 x 0.65/1.3 0.4
10.0 x 2.0 x 0.65/1.3 0.3
3
1 x 13 x Ø 2.8
2.5
t0.5
t0.63
t0.9
Water
Air
v = 0 m/s
v = 0 m/s
mW/K MT[mK]* mW/K MT[mK
]*
12
8.3
1.8
56
2.2
46
2.5
4
25
3.1
3.2
31
36
2.8
3.6
28
12
40
2.5
4
25
16
90
1.1
8
13
281
2 x 13 x Ø 2.8
2
2.5
5.5
10
12
22
45
2.2
451
1 x 13 x Ø 4.5
8
10
22
12
22
40
85
1.2
8
13
451
2 x 13 x Ø 4.5
6
14
16
18
37
60
1.7
6.5
15
SMD 1206
3.2 x 1.6 x 0.4
0.25
0.45
3.5
4.2
10
55
1.8
7
14
SMD 0805
2.0 x 1.2 x 0.4
5
0.1
5
0.1
0.12
0.33
2.5
3
8
38
2.6
4
25
25
4
2.5
40
0
0.0
FC 0603
1.5 x 0.75 x 0.4
0.10
0.25 1.8
2.2
5.5
8 at 1mA applied current at 0ºC
*self heating MT[mK] measured with Pt100
L: Sensor length (without connections)
W: Sensor width
T: Sensor thickness (without connections)
H: Sensor height (incl. connections and strain relief)
The values in the table are for informative purposes only. Based on the assembly method and the different
measurement conditions, self-heating and response time can variate.
Dimensions Tolerances
Sensor width (W) ± 0.2 mm
Sensor length (L) ± 0.2 mm
Sensor height (H) ± 0.3 mm
Sensor thickness (T) ± 0.1 mm
Wire length ± 1.0 mm (5-30 mm)
Wire length >30mm, tolerances on request
Platinum Temperature Sensors
CustomSens
Thin-film temperature sensors with universal connection possibilities
To best serve our customers needs, IST policy is putting forward as many sensor options as possible. The true
to this policy is to create and provide a versatile CustomSens product solution facing all customer specific
requirements. The highlight of these thin-film temperature sensor solutions is the flexibility of determining your
own packaging which could help to improve your assembly solutions considerably.
You can decide how much work we should take off your hands. You can choose between short or long leads,
whether they are to be bare or insulated, and whether the sensor is to be completed in 2-, 3- or even 4-wire
technology. It is not only the great choice of these variables which offers you many advantages.
Through our customized connection structure we can propose you sensors directly soldered on a metallic
surface (such as copper, stainless steel, or brass) and which is also characterized by superior product
properties, giving you a double benefit.
Universal connection solutions
Directly welded:
Leads up to 1000mm, 2- / 3-/ 4-wire, bare wire, PTFE insulated
solutions (-50°…+200°C), single wire or stranded wire (generally
AWG30, or AWG28/7), with connectors (e.g. JST PHR-2, JST ZHR-3,
Molex 6471).
Extended:
All lead length available, 2- / 3-/ 4-wire extensions, extended by
soldering process, welding or brazing, connection protections using
shrinking sleeves, PTFE insulated solutions (-50°C … +200°C), or
using glas fibre sleeves (-50°… +400°C).
Sensors soldered on metallic surface
All our sensor solutions with metallised backside can be soldered on a
metallic sheet or surface. Enhanced thermal contact to the measured
medium improves response time considerably.
Based on our experience and outstanding soldering processes we can
offer you various solutions with backside solderable sensors (even on
stainless steel materials) at favourable prices.
Sensors with soft-coating
Depending on the assembly method and various materials used for
housing and potting, the sensor element could change it’s caracteristic
curve or basic value.
We can offer you sensors with soft-coating creating a “deformable
zone” to avoid any mechanical stress against the sensing element
caused by embedding materials.
Sensors with custom housing
Within our large product range we can offer you custom specific
housings. Depending on your requirements with regard to dimensions,
electrical specifications, temperature range, tolerances etc., or based
on your formal drawing, we can propose you a suitable assembly
solution.
4/21
Platinum Temperature Sensors
SMD - Product Series
Temperature Range: -50°C...+150 (250)°C
RTDs in SMD construction
DIN EN 60751 class F 0.3 (formerly class B) and class F 0.15 (formerly class A) available
Technical Data
Temperature range:
Accuracy:
Contacts:
Solderability:
Resistance to soldering heat:
Long-term stability:
-50°C to +150°C (2P), -50°C to +250°C (3P, 4P)
DIN EN 60751 F 0.15 (Class A)
DIN EN 60751 F 0.3 (Class B)
2x DIN EN 60751 F 0.3 (Class B)
Contacts around the sides:
2P = Contacts tin-coated (96.5Sn/3Ag/0.5Cu), LMP lead-free, reflow soldering
3P = Contacts tin-coated (5Sn/93.5Pb/1.5Ag), HMP, reflow soldering
4P = Contacts gold-coated, solderable coating
The soldering process can influence accuracy.
235°C 8s (DIN IEC 68 T2-20, Ta Meth. 1)
260°C 10s (DIN IEC 68 T2-20, Ta Meth. 1A)
Maximal drift = 0.04% after 1000h at 130°C
Examples of chip sizes
Dimensions in mm
Nominal Resistance
at 0°C in Ohm
Chip-Dimensions
in mm
Description
100
500
1000
LxW 2.0 x 1.2
LxW 2.0 x 1.2
LxW 2.0 x 1.2
P0K1.0805.xP.x
P0K5.0805.xP.x
P1K0.0805.xP.x
100
500
1000
LxW 3.2 x 1.6
LxW 3.2 x 1.6
LxW 3.2 x 1.6
P0K1.1206.xP.x
P0K5.1206.xP.x
P1K0.1206.xP.x
5/21
Platinum Temperature Sensors
FC - Product Series
Temperature Range: -50° C...+150/250/400/600°C
RTDs without leadwires as Flip Chip (FC) construction
The contacts are solderable (1FC, 2FC, 5FC), bondable (3FC) or weldable (6FC)
DIN EN 60751 class F 0.3 (formerly class B) available
Technical Data
Temperature range:
Accuracy:
Contacts:
Solderability:
Resistance to soldering
heat:
Long-term stability:
-50°C to +150°C (1FC), -50°C to +250°C (2FC, 3FC), -50°C to +400°C (5FC),
-50°C to +600°C (6FC)
DIN EN 60751 F 0.3 (Class B), 2x DIN EN 60751 F 0.6 (Class 2B)
Pads:
1FC = Contacts tin-coated, soldering depot, LMP lead-free, 100% Sn (reflow
soldering)
2FC = Contacts tin-coated, soldering depot, HMP, 5Sn/93.5Pb/1.5Ag (reflow
soldering)
3FC = Au-Pads (bonding pads), various types available
5FC = Reinforced thinfilm Pt-pads (solderable pads)
6FC = Thick film Pt-pads (weldable)
The soldering process can influence accuracy.
235°C 8s (DIN IEC 68 T2-20, Ta Meth. 1)
1FC, 2FC, 5FC
260°C 10s (DIN IEC 68 T2-20, Ta Meth. 1A)
1FC, 2FC, 5FC
Maximal drift = 0.04% after 1000h at 130°C
Examples of chip sizes
Dimensions in mm
other chip sizes available
Nominal Resistance
at 0°C in Ohm
ChipDimensions in
mm
Description
100
500
1000
LxW 2.3 x 2.0
LxW 2.3 x 2.0
LxW 2.3 x 2.0
P0K1.232.xFC.x
P0K5.232.xFC.x
P1K0.232.xFC.x
100
500
1000
LxW 2.0 x 1.2
LxW 2.0 x 1.2
LxW 2.0 x 1.2
P0K1.0805.xFC.x
P0K1.0805.xFC.x
P0K1.0805.xFC.x
6/21
Platinum Temperature Sensors
2S – Product Series
Temperature Range: -50°C...+200°C
RTDs with SIL connections 10mm length
Advantages:
- Solderable, weldable, crimpable
- Very robust connections
- Connections remain in shape
- Easy handling
Examples of chip sizes
Dimensions in mm
Nominal Resistance
at 0°C in Ohm
Chip-Dimensions
in mm
Description
100
1000
LxW 3.0 x 2.5
LxW 3.0 x 2.5
P0K1.325.2S.010
P1K0.325.2S.010
100
1000
LxW 5.0 x 2.5
LxW 5.0 x 2.5
P0K1.525.2S.010
P1K0.525.2S.010
100
1000
LxW 5.0 x 3.8
LxW 5.0 x 3.8
P0K1.538.2S.010
P1K0.538.2S.010
100
1000
LxW 5.0 x 5.0
LxW 5.0 x 5.0
P0K1.505.2S.010
P1K0.505.2S.010
7/21
Platinum Temperature Sensors
2I/2L - Product Series
Temperature Range: -50°C...+200°C
RTDs with long insulated lead wires
2I
2L
Cu/Ag-single wire, PTFE insulated, AWG 30, length >20 mm (solderable, weldable crimpable)
Cu/Ag-stranded wire, PTFE insulated, AWG 30/7, length >20 mm (solderable, weldable, crimpable)
Examples of chip sizes
Dimensions in mm
Nominal Resistance Chip-Dimensions
at 0°C in Ohm
in mm
Description
100
1000
(AWG 32)
LxW 1.6 x 1.2
LxW 1.6 x 1.2
P0K1.161.2I.x.x
P1K0.161.2I.x.x
100
500
1000
LxW 2.3 x 2.0
LxW 2.3 x 2.0
LxW 2.3 x 2.0
P0K1.232.2I.x.x
P0K5.232.2I.x.x
P1K0.232.2I.x.x
100
1000
LxW 2.3 x 2.0
LxW 2.3 x 2.0
P0K1.232.2L.x.x
P1K0.232.2L.x.x
100
500
1000
LxW 5.0 x 1.6
LxW 5.0 x 1.6
LxW 5.0 x 1.6
P0K1.516.2I.x.x
P0K5.516.2I.x.x
P1K0.516.2I.x.x
100
1000
LxW 5.0 x 2.0
LxW 5.0 x 2.0
P0K1.520.2I.x.x
P1K0.520.2I.x.x
100
1000
LxW 5.0 x 2.0
LxW 5.0 x 2.0
P0K1.520.2L.x.x
P1K0.520.2L.x.x
see page 4 for other chip versions
8/21
Platinum Temperature Sensors
3FW - Product Series
Temperature Range: -200...+300°C
RTDs with flat wire (FW) connections
Ni/Au flat wire 0.2 x 0.4 x 7/10 mm (HxWxL), (solderable, weldable, crimpable)
Examples of chip sizes
Dimensions in mm
Nominal Resistance
at 0°C in Ohm
Chip-Dimensions Description
in mm
100
1000
LxW 2.5 x 1.6
LxW 2.5 x 1.6
P0K1.216.3FW.x.x
P1K0.216.3FW.x.x
100
500
1000
LxW 2.0 x 2.0
LxW 2.0 x 2.0
LxW 2.0 x 2.0
P0K1.202.3FW.x.x
P0K5.202.3FW.x.x
P1K0.202.3FW.x.x
100
500
1000
LxW 2.3 x 2.0
LxW 2.3 x 2.0
LxW 2.3 x 2.0
P0K1.232.3FW.x.x
P0K5.232.3FW.x.x
P1K0.232.3FW.x.x
500
10’000
LxW 5.0 x 2.0
LxW 5.0 x 2.0
P0K5.520.3FW.015
P10K.520.3FW.010
other chip sizes and connection lengths available
9/21
Platinum Temperature Sensors
4W - Product Series
Temperature Range: -200°C...+400°C
RTDs with wire connections
Ag-wire 0.25mm x 10mm (Ø x L), (solderable, weldable)
Examples of chip sizes
Dimensions in mm
2.5
Nominal Resistance
at 0°C in Ohm
Chip-Dimensions i Description
mm
100
500
1000
LxW 1.6 x 1.2
LxW 1.6 x 1.2
LxW 1.6 x 1.2
P0K1.161.4W.x.010
P0K5.161.4W.x.010
P1K0.161.4W.x.010
100
500
1000
2000
LxW
LxW
LxW
LxW
2.0 x 2.0
2.0 x 2.0
2.0 x 2.0
2.0 x 2.0
P0K1.202.4W.x.010
P0K5.202.4W.x.010
P1K0.202.4W.x.010
P2K0.202.4W.x.010
LxW 2.5 x 1.6
P0K1.216.4W.x.010
100
500
1000
2000
LxW
LxW
LxW
LxW
2.3 x 2.0
2.3 x 2.0
2.3 x 2.0
2.3 x 2.0
P0K1.232.4W.x.010
P0K5.232.4W.x.010
P1K0.232.4W.x.010
P2K0.232.4W.x.010
100
500
1000
2000
LxW
LxW
LxW
LxW
5.0 x 1.6
5.0 x 1.6
5.0 x 1.6
5.0 x 1.6
P0K1.516.4W.x.010
P0K5.516.4W.x.010
P1K0.516.4W.x.010
P2K0.516.4W.x.010
100
10/21
Platinum Temperature Sensors
4W - Product Series
Examples of chip sizes
Dimensions in mm
Temperature Range: -200°C...+400°C
Nominal Resistance Chip-Dimensions Description
at 0°C in Ohm
in mm
100
500
1000
10’000
LxW
LxW
LxW
LxW
5.0 x 2.0
5.0 x 2.0
5.0 x 2.0
5.0 x 2.0
P0K1.520.4W.x.010
P0K5.520.4W.x.010
P1K0.520.4W.x.010
P10K.520.4W.x.010
100
1000
LxW 5.0 x 3.8
LxW 5.0 x 3.8
P0K1.538.4W.x.010
P1K0.538.4W.x.010
100
1000
LxW 5.0 x 5.0
LxW 5.0 x 5.0
P0K1.505.4W.x.010
P1K0.505.4W.x.010
100
500
1000
LxW 10.0 x 2.0
LxW 10.0 x 2.0
LxW 10.0 x 2.0
P0K1.102.4W.x.010
P0K5.102.4W.x.010
P1K0.102.4W.x.010
5.0
3.8
5.0
5.0
other chip sizes and connection lengths available
11/21
Platinum Temperature Sensors
6W - Product Series
Temperature Range: -200°C...+600°C
RTDs with wire connections
Pt/Ni – clad wire 0.2mm x 10mm (Ø x L), (solderable, weldable, crimpable)
Examples of chip sizes
Dimensions in mm
2.5
Nominal Resistance
at 0°C in Ohm
Chip-Dimensions
in mm
Description
100
500
1000
LxW 1.6 x 1.2
LxW 1.6 x 1.2
LxW 1.6 x 1.2
P0K1.161.6W.x.010
P0K5.161.6W.x.010
P1K0.161.6W.x.010
100
500
1000
2000
LxW
LxW
LxW
LxW
2.0 x 2.0
2.0 x 2.0
2.0 x 2.0
2.0 x 2.0
P0K1.202.6W.x.010
P0K5.202.6W.x.010
P1K0.202.6W.x.010
P2K0.202.6W.x.010
100
1000
LxW 2.5 x 1.6
LxW 2.5 x 1.6
P0K1.216.6W.x.010
P1K0.216.6W.x.010
100
500
1000
2000
LxW
LxW
LxW
LxW
P0K1.232.6W.x.010
P0K5.232.6W.x.010
P1K0.232.6W.x.010
P2K0.232.6W.x.010
2.3 x 2.0
2.3 x 2.0
2.3 x 2.0
2.3 x 2.0
12/21
Platinum Temperature Sensors
6W - Product Series
Examples of chip sizes
Dimensions in mm
Temperature Range: -200°C...+600°C
Nominal Resistance Chip-Dimensions Description
at 0°C in Ohm
in mm
500
1000
2000
LxW 5.0 x 1.6
LxW 5.0 x 1.6
LxW 5.0 x 1.6
P0K5.516.6W.x.010
P1K0.516.6W.x.010
P2K0.516.6W.x.010
LxW
LxW
LxW
LxW
5.0 x 2.0
5.0 x 2.0
5.0 x 2.0
5.0 x 2.0
P0K1.520.6W.x.010
P0K5.520.6W.x.010
P1K0.520.6W.x.010
P10K.520.6W.x.010
100
1000
LxW 5.0 x 3.8
LxW 5.0 x 3.8
P0K1.538.6W.x.010
P1K0.538.6W.x.010
100
500
1000
LxW 10.0 x 2.0
LxW 10.0 x 2.0
LxW 10.0 x 2.0
P0K1.102.6W.x.010
P0K5.102.6W.x.010
P1K0.102.6W.x.010
100
500
1000
10’000
other connection lengths available
13/21
Platinum Temperature Sensors
7W - Product Series
Temperature Range: -200°C...+750°C
RTDs with wire connections
Platinum wire 0.2mm x 7mm (Ø x L), (solderable, weldable, crimpable)
Examples of chip sizes
Dimensions in mm
Nominal Resistance Chip-Dimensions
at 0°C in Ohm
in mm
Description
100
1000
LxW 2.3 x 2.0
LxW 2.3 x 2.0
P0K1.232.7W.x.007
P1K0.232.7W.x.007
100
500
1000
LxW 5.0 x 1.6
LxW 5.0 x 1.6
LxW 5.0 x 1.6
P0K1.516.7W.x.007
P0K5.516.7W.x.007
P1K0.516.7W.x.007
100
500
1000
LxW 5.0 x 2.0
LxW 5.0 x 2.0
LxW 5.0 x 2.0
P0K1.520.7W.x.007
P0K5.520.7W.x.007
P1K0.520.7W.x.007
100
500
1000
LxW 10.0 x 2.0
LxW 10.0 x 2.0
LxW 10.0 x 2.0
P0K1.102.7W.x.007
P0K5.102.7W.x.007
P1K0.102.7W.x.007
other chip sizes and connection lengths available
14/21
Platinum Temperature Sensors
8W - Product Series
Temperature Range: -200°C...+850°C
RTDs with wire connections
Platinum wire 0.2mm x 7mm (Ø x L), (solderable, weldable, crimpable)
Examples of chip sizes
Dimensions in mm
Nominal Resistance Chip-Dimensions
at 0°C in Ohm
in mm
Description
100
1000
LxW 5.0 x 1.6
LxW 5.0 x 1.6
P0K1.516.8W.x.007
P1K0.516.8W.x.007
200
LxW 4.0 x 2.0
P0K2.420.8W.x.007
10W/10K - Product Series
Temperature Range: -70°C...+1000°C
RTDs with wire connections
Temperature coefficient 3770 ppm/K
DPH - platinum wire 0.2mm x 7mm (Ø x L), (solderable, weldable, crimpable)
Example of chip size
Dimensions in mm
Nominal Resistance
at 0°C in Ohm
Chip-Dimensions
in mm
Description
200
LxW 4.0 x 2.0
P0K2.420.10K.K.007
15/21
Platinum Temperature Sensors
PW - Product Series
16/21
Temperature Range: -200°C...+600°C
RTDs in class F 0.15 from -200°C to +600°C
Advantages:
- Alternative to wire-wound sensors
- Reduced hysteresis
- Increased long-term stability
- Short-term applicable up to +750°C
Platinum wire 0.2mm x 7mm (Ø x L), (solderable, weldable, crimpable)
Temperature coefficient 3850 ppm/K
F 0,1 (class 1/3 DIN B)
F 0,15 (formerly class A)
F 0,3 (formerly class B)
Class 1/5 DIN B
Class 1/10 DIN B
-200°C to +500°C
-200°C to +600°C
-200°C to +600°C
-100°C to +300°C
-50°C to +125°C
Example of chip size
Dimensions in mm
Nominal Resistance Chip-Dimensions Description
at 0°C in Ohm
in mm
100
500
1000
LxW 2.5 x 1.6
LxW 2.5 x 1.6
LxW 2.5 x 1.6
PW0K1.216.7W.x.007
PW0K1.216.7W.x.007
PW0K1.216.7W.x.007
Also available in round housing
Example of chip size
Dimensions in mm
Nominal Resistance Chip-Dimensions Description
at 0°C in Ohm
in mm
100
500
1000
LxØ 13.0 x 2.8
LxØ 13.0 x 2.8
LxØ 13.0 x 2.8
PW0K1.281.7W.x.R
PW0K5.281.7W.x.R
PW1K0.281.7W.x.R
Platinum Temperature Sensors
PG - Product Series
Temperature Range: -200°C...+600°C
RTDs with temperature coefficient 3911 ppm/K
Advantages:
- Alternative to wire-wound sensors
- Reduced hysteresis
- Short-term applicable up to +750°C
Temperature range: -200°C…+600°C:
Platinum wire 0.2mm x 7mm (Ø x L), (solderable, weldable, crimpable)
F 0,1 (class 1/3 DIN B)
F 0,15 (formerly class A)
F 0,3 (formerly class B)
-200°C to +500°C
-200°C to +600°C
-200°C to +600°C
Temperature range: -200°C…+400°C:
Pt/Ni clad wire 0.2mm x 7mm (Ø x L), (solderable, weldable, crimpable)
F 0,1 (class 1/3 DIN B)
F 0,15 (formerly class A)
F 0,3 (formerly class B)
-200°C to +400°C
-200°C to +400°C
-200°C to +400°C
Example of chip size
Dimensions in mm
Nominal Resistance
at 0°C in Ohm
Chip-Dimensions
in mm
Description
50
100
500
1000
LxW
LxW
LxW
LxW
2.5 x 1.6
2.5 x 1.6
2.5 x 1.6
2.5 x 1.6
PG1K0.216.7W.x.007
PG1K0.216.7W.x.007
PG1K0.216.7W.x.007
PG1K0.216.7W.x.007
50
100
1000
LxW 2.5 x 1.6
LxW 2.5 x 1.6
LxW 2.5 x 1.6
PG050.216.4K.x.007
PG0K1.216.4K.x.007
PG1K0.216.4K.x.007
Nominal Resistance
at 0°C in Ohm
Chip-Dimensions
in mm
Description
50
100
500
1000
LxØ 13.0 x 2.8
LxØ 13.0 x 2.8
LxØ 13.0 x 2.8
LxØ 13.0 x 2.8
PG050.281.7W.x.R
PG0K1.281.7W.x.R
PG0K5.281.7W.x.R
PG1K0.281.7W.x.R
50
100
1000
LxØ 13.0 x 2.8
LxØ 13.0 x 2.8
LxØ 13.0 x 2.8
PG050.281.4K.x.R
PG0K1.281.4K.x.R
PG1K0.281.4K.x.R
Also available in round housing
Example of chip size
Dimensions in mm
17/21
Platinum Temperature Sensors
4SW - Product Series
Temperature Range: -200°C...+400°C
RTDs with perpendicular wire connections
Silver wire 0.25mm x 10mm (Ø x L), (solderable, weldable)
Example of chip size
Dimensions in mm
Nominal Resistance Chip-Dimensions
at 0°C in Ohm
in mm
Description
100
500
1000
P0K1.232.4SW.x.010
P0K5.232.4SW.x.010
P1K0.232.4SW.x.010
LxW 2.3 x 2.0
LxW 2.3 x 2.0
LxW 2.3 x 2.0
available with metallised (solderable) backside
other connection lengths and chip sizes available
U - Product Series
Temperature range: -200°C...+600°C
RTDs with backwards welded wire connections
Advantages:
- Improved isolation towards mounting surface
- Wires can be bent vertically over the chip area
- Ideal for limited space requirements
Examples of chip sizes
Dimensions in mm
Nominal Resistance Chip-Dimensions
at 0°C in Ohm
in mm
Description
100
500
1000
LxW 1.6 x 1.2
LxW 1.6 x 1.2
LxW 1.6 x 1.2
P0K1.161.2I.x.040.U
P0K5.161.2I.x.040.U
P1K0.161.2I.x.040.U
100
500
1000
LxW 2.3 x 2.0
LxW 2.3 x 2.0
LxW 2.3 x 2.0
P0K1.232.2I.x.100.U
P0K5.232.2I.x.100.U
P1K0.232.2I.x.100.U
100
LxW 2.3 x 2.0
P0K1.232.6W.x.010.U
also available with metallised (solderable) backside
18/21
Platinum Temperature Sensors
T/D – Product Series
Temperature Range: -200°C...+400/600/850°C
RTDs with thinner substrate thickness for a fast response time
Ag wire 400°C, 0.25mm x 15mm (Ø x L), (solderable, weldable, crimpable)
Pt/Ni Clad wire 600°C, 0.2mm x 10mm (Ø x L), (solderable, weldable, crimpable)
Substrate thicknesses:
T (10 mils) = 0.254 mm
D (15 mils) = 0.38 mm
Examples of chip sizes
Dimensions in mm
0.9
Nominal Resistance
at 0°C in Ohm
Chip-Dimensions
in mm
Description
100
500
1000
LxW 2.3 x 2.0
LxW 2.3 x 2.0
LxW 2.3 x 2.0
P0K1.232.6W.x.010.T
P0K5.232.6W.x.010.T
P1K0.232.6W.x.010.T
100
200
LxW 2.3 x 2.0
LxW 2.3 x 2.0
P0K1.232.6W.x.010.D
P0K2.232.6W.x.010.D
100
LxW 5.0 x 2.0
P0K1.520.6W.x.007.T
100
LxW 5.0 x 2.0
P0K1.520.6W.x.007.D
other chip sizes, nominal values and wire lengths available
19/21
Platinum Temperature Sensors
R - Product Series
Temperature Range: -50°C...+600°C
RTDs in round ceramic housing
Only applicable in dry environments
Pt/Ni clad wire 0.2mm x 7mm (Ø x L), (solderable, weldable, crimpable)
Examples of chip sizes
Dimensions in mm
Nominal Resistance
at 0°C in Ohm
Chip-Dimensions
in mm
Description
100
500
1000
LxØ 13.0 x 4.5
LxØ 13.0 x 4.5
LxØ 13.0 x 4.5
P0K1.451.6W.x.R
P0K5.451.6W.x.R
P1K0.451.6W.x.R
2 x 100
2 x 500
2 x 1000
LxØ 13.0 x 4.5
LxØ 13.0 x 4.5
LxØ 13.0 x 4.5
2xP0K1.451.6W.x.R
2xP0K5.451.6W.x.R
2xP1K0.451.6W.x.R
100
500
1000
LxØ 13.0 x 2.8
LxØ 13.0 x 2.8
LxØ 13.0 x 2.8
P0K1.281.6W.x.R
P0K5.281.6W.x.R
P1K0.281.6W.x.R
2 x 100
2 x 500
2 x 1000
LxØ 13.0 x 2.8
LxØ 13.0 x 2.8
LxØ 13.0 x 2.8
2xP0K1.281.6W.x.R
2xP0K5.281.6W.x.R
2xP1K0.281.6W.x.R
other nominal values and wire lengths available
20/21
1
K
0.
5
2
0.
4
W. B. 0 1 0. M
Specials
T Substrate thickness 0.25 mm
D Substrate thickness 0.38 mm
R Round housing
W Sintered powder
M Metallised (solderable) backside
U Wire connections backward welded
S Special*
Connection length in mm
Tolerance classes
A Class F 0.15 (formerly Class A)
B Class F 0.3 (formerly Class B)
C Class 2 x F 0.3 (formerly 2 x Class B)
Y Class F 0.1 (formerly 1/3 Class B)
P Pairs*
G Groups*
K Customer specific*
2P = Contact tin-coated,
Extension type
LMP lead free,
S
SIL (Single in line)
RoHS-conform
P
SMD contact around the sides
3P = Contact tin-coated,
FC Flip Chip
HMP, RoHS-conform
W
Wire
SW Perpendicular leads
4P = Gold coated contacts,
FW Flat wire
solderable layer
I
Insulated contacts
E
Enameled wires
L
Insulated stranded wires
1FC = contact tin-coated, LMP lead
K
Customer specific*
free
Temperaturerange
2FC
=
contact
tin-coated, HMP
1
-50°C to 150°C
3FC = Au-Pads (bonding pads)
2
-50°C to 200°C
3
-200°C to 300°C
5FC = increased thin film
4
-200°C to 400°C
Pt-Pads (solderable pads)
6
-200°C to 600°C
6FC = Thick film Pt-pads
7
-200°C to 750°C
(weldable)
8
-200°C to 850°C
10
-70°C to 1000°C
Mechanical Dimensions (see various Dimensions) in mm
Resistance value in ohm at 0°C
Characteristic curve
Pt 3850 ppm/K
W Pt 3850 ppm/K (extended temperature range)
U
Pt 3750 ppm/K
G Pt 3911 ppm/K
Material identification
P Platinum
*Additional details, specifications required from the customer
Order example:
P 1K0. 520. 4 W. B. 010. M 1: Material identification
1 2
3
4 5 6 7
8 2: Resistance value in ohm
3: Chip Dimensions
4: Temperature range/technology
5: Extension
6: Tolerance class
7: Wire length
8: Special
= Platinum Temperature Sensor
= 1'000 J / 0°C
= 5 mm x 2 mm
= -200°C to +400°C
= Wire connections (Ag, Ø 0.25 mm)
= DIN EN 60751 F 0.3 (formerly class B)
= 10 mm
= metallised (solderable) backside
All mechanical Dimensionss are valid at 25°C ambient temperature, if not differently indicated. \ All data except the mechanical Dimensionss only have information purposes and are not to be understood as assured characteristics. \ Technical changes without previous
announcement as well as mistakes reserve. \ The information on this data sheet was examined carefully and will be accepted as correct; No liability in case of mistakes.\ Load with extreme values during a longer period can affect the reliability. All rights reserved. The material
contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. Typing errors and mistakes reserved. Product specifications are subject to change without notice. All rights reserved
P.
21/21
BTP_E1.0
Platinum Temperature Sensors
Order Information