SPECIFICATIONS 1310 nm Superluminescent LED DL

DENSELIGHT SEMICONDUCTORS PTE. LTD.
6 Changi North St. 2, S498831 SINGAPORE
Tel: (65) 64154488
Fax: (65) 64157988
www.denselight.com
SPECIFICATIONS
1310 nm Superluminescent LED
DL-CS3055B
DenseLight Semiconductors reserves the right to make product design or specifications changes without
notice.
Rev B
July 2004
DL-CS3055B
1/5
A. PRODUCT DESCRIPTION
The DenseLight DL-CS3055B series is a broadband SLED that operates in a true inherent
superluminescent mode. This superluminescent property generates broader band at
higher drive currents in contrast to other conventional SLEDs which are ASE-based, where
high drive tends to give narrower band. Its low coherence reduces Rayleigh
backscattering noise. Coupled with high power and large spectral width, it offsets
photoreceiver noise and improves spatial resolution (in OCT) and measurand sensitivity (in
sensors). The SLED is available in 14-pin DIL package. It is compliance with the
requirements of Bellcore Document GR-468-CORE.
Enabled by DensePICTM spread spectra bandgap engineering technology, future
generations of DenseLight SLEDs promise higher chip powers (up to 50mW possible), and
broader spectral bands (beyond 120nm). Higher levels of integration may feature
integrated SLEDs with phase modulators, optical couplers and photodetectors into a
complete optical sensor chipset.
B. FEATURES
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Ex-fiber output power of >5mW
3dB bandwidth of >45nm
Typical spectral modulation of 0.15dB
14-pin DIL package
Single mode fiber
C. APPLICATIONS
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Fiber Optic Gyroscope
Optical Test Instrument
Fiber Optic Sensors
Fiber Optic Communications
Optical Coherence Tomography
Biomedical Imaging Device
Clinical Healing Equipment
Rev B
July 2004
DL-CS3055B
2/5
D. ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Condition
Reverse voltage
VR
2
Forward current
IF
300
mA
Forward voltage
VF
Iop
2.5
V
Case temperature
Tc
Iop
-40
65
°C
SLED temperature1
TSLED
Iop
0
70
°C
Thermoelectric cooler voltage
VTEC
3
V
Thermoelectric cooler current
ITEC
1.8
A
Storage temperature
Tstg
-40
85
°C
5
85
%RH
500
V
Unbiased
Storage humidity
Min
Max
Human body
model
Unit
V
Electro static discharge (ESD)
VESD
Lead soldering temperature
Stemp
260
°C
Lead soldering time
Stime
10
sec
E. SPECIFICATIONS (TSLED = 25 °C)
Parameter
Symbol
Condition
Min
Typ
Operating current
Iop
Forward voltage
VF
Iop
Power in SMF
Po
Iop
5
Central wavelength
λ
Iop
1290
1310
Bandwidth
BFWHM
Iop
45
50
Spectrum modulation
R
Iop
Thermistor resistance
Rtherm
Thermoelectric cooler voltage
VTEC
TSLED = 25 °C
Iop
Thermoelectric cooler current
ITEC
Iop
Max
Unit
250
mA
2
9.5
V
mW
1330
nm
nm
0.15
0.3
dB
10
10.5
kΩ
2.5
V
1.1
A
1 TSLED is monitored by internal thermistor with external pin out.
Rev B
July 2004
DL-CS3055B
3/5
F. PACKAGE
DIL package
Part
Description
Package type
Fiber:
MFD
Cladding diameter
Coating diameter
Jacket
Fiber pigtail length
Fiber bending radius
Fiber Connector
Dimensions
DIL
SMF-28
9µm
125µm
245µm
900µm loose tube
1m
>40mm
FC/APC
See figure
Rev B
July 2004
DL-CS3055B
4/5
G. TYPICAL PERFORMANCE CHARACTERISTICS
Operating condition: TSLED= 25 °C
Power Density (dBm/0.1nm)
Fiber output power (mW)
-15
6
4
2
0
0
50
100
150
200
-20
-25
-30
-35
1240
250
1260
Current injection (mA)
P-I Curve
1320
1340
Power Density (dB/0.1nm)
-19.0
2.0
Voltage (V)
1300
Spontaneous Emission Spectrum
2.5
1.5
1.0
0.5
0.0
0
50
100
150
200
Current injection (mA)
I-V Curve
Rev B
July 2004
1280
Wavelength (nm)
250
-19.5
-20.0
-20.5
-21.0
1297
1298
1299
1300
1301
1302
Wavelength (nm)
Spectrum Modulation
DL-CS3055B
5/5