EPOXY RESINS
Product Overview Guide
NORTH AMERICA
Expanding Opportunities for
Performance and Differentiation
Epoxy technology is a fundamental building block for innovation across
broad and diverse industries around the world. Dow is leading the
way, applying advanced epoxy chemistry to address critical material
challenges and help meet society’s energy, transportation, electronics,
and infrastructure needs.
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Dow is a global supplier of epoxy resins, diluents, curing agents, and intermediates.
With more than 50 years of innovation, we offer advanced epoxy products and solutions
based on the industry’s leading product and process technology. And, as one of the most
vertically-integrated epoxy suppliers, we are a highly reliable source of supply.
Dow is committed to your success. To better assist you during each stage of
formulation development, we have compiled this convenient overview of resin
products available in North America. Use it in combination with product information for
our robust line of epoxy hardeners to compare product options and decide which Dow
products provide the performance required in your applications.
Talk to your Dow representative to learn more about
how Dow can provide the products and support you
need to strengthen system differentiation and your
competitive position in the marketplace.
3
Resins from Dow
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Calculation of Stoichiometric Ratios
To obtain optimum properties with polyfunctional epoxide-reactive curing agents,
particularly the amines, it is desirable to react
the resin and the curing agent at approximately
stoichiometric quantities. To determine the
ratio required, calculations can be made as
follows, using D.E.H.™ 20 epoxy hardener
(NH2 – CH2 – CH2 – NH – CH2 – CH2 – NH2) as
an example:
1
2
3
To calculate the Amine H equivalent
weight, use the following equation:
Equation 1
Amine H eq wt =
MW of amine
no. of active hydrogens
Example
Amine H eq wt D.E.H. 20 = 103.2 = 20.6 gr/eq
5
To calculate the stoichiometric ratio of
D.E.H.™ 20 hardener to use with D.E.R.™ 331
epoxy resin having an epoxide equivalent
weight of 189:
Frequently, epoxy resins are blended,
filled, or modified with reactive and
non-reactive components. It is therefore
necessary to adjust the concentration of
the curing agent to cure only the portion
of the mix that is reactive; e.g., the resins
and any reactive diluent present. This
may be simply done by calculating the
epoxide equivalent weight (EEW) of the
total mix and then applying equation (2) to
determine the amount of curing agent to
add to 100 parts of formulation.
Equation 2
phr1 of amine = Amine H eq wt x 100
Epoxide eq wt of resin
Example
phr D.E.H. 20 hardener to be used with D.E.R. 331 epoxy resin
phr = 20.6 x 100 = 10.9
189
Equation 3
EEW of mix =
Total Wt
Wt a + Wt b + Wt c
EEW a EEW b EEW c
Total weight includes all materials, both reactive and
non-reactive. a,b,c, etc., are only the materials reactive with
the curing agent, and are characterized by an epoxy ring.
Example
100 parts D.E.R. 331
100 parts D.E.R. 337
30 parts BDDGE (diluent)
230 parts Filler
460 Total
EEW of mix =
Average EEW 189
Average EEW 240
Average EEW 130
–
460
= 460 = 391
100 + 100 + 30
1.176
189
240 130
By Equation 2
Amount D.E.H. 20 = 20.6 x 100 = 5.27 parts per hundred
391
parts filled formulation
® TM
Trademark of The Dow Chemical Company (“Dow”) or an affiliated company of Dow
1 Parts
by wt per 100 parts resin
5
Resins from Dow
Liquid Epoxy Resins
Grade
EEW
(gr/eq)
Viscosity
(mPa.s @ 25 °C)
Description
Bisphenol A Epoxy Resins
D.E.R.™ 332
171 – 175
4000 – 6000
High purity diglycidyl ether of bisphenol A. Its high purity and low oligomer content assures uniform performance,
exceptionally low viscosity and can provide improved elevated temperature properties over standard epoxy resins.
This resin grade is mainly used in filament winding, electrical laminates and encapsulation applications.
D.E.R. 383
176 – 183
9000 – 10500
D.E.R. 383 epoxy resin is a low viscosity bisphenol A epoxy resin. Applications are similar to those of D.E.R. 331 liquid
epoxy resin. D.E.R. 383 epoxy resin frequently crystallizes at room temperature. Heating to 50-55°C restores the resin
to a liquid state. Long-term warm storage may result in a slight discoloration but does not affect the resin performance.
D.E.R. 330
176 – 185
7000 – 10000
D.E.R. 330 epoxy resin is a low viscosity bisphenol A epoxy resin commonly used in civil engineering and industrial
coatings. D.E.R. 330 epoxy resin frequently crystallizes at room temperature, Heating to 50-55°C restores the resin
to liquid state. Long-term warm storage may result in slight discoloration but does not effect the resin performance.
D.E.R. 331
182 – 192
11000 – 14000
A widely used, general-purpose liquid epoxy resin based on bisphenol A. It is recognized as a standard from which
many variations have been developed.
D.E.R. 317
192 – 203
16000 – 25000
High viscosity, fast reacting bisphenol A epoxy resin.
Modified Bisphenol A Epoxy Resins
D.E.R. 321
180 – 188
500 – 700
Diglycidylether of bisphenol A/CGE.
Diglycidylether of bisphenol A/CGE.
D.E.R. 3212
179 – 193
750 – 1400
D.E.R. 322
183 – 193
5500 – 8500
Diglycidylether of bisphenol A/reactive diluent.
D.E.R. 323
190 – 204
1000 – 1200
Aliphatic glycidyl ether reactive diluent, modified liquid epoxy resin which is very similar to D.E.R. 324 liquid epoxy resin
but with lower diluent content.
D.E.R. 324
195 – 204
600 – 800
D.E.R. 324 liquid epoxy resin offers low viscosity and low surface tension. The low surface tension explains why this
resin wets the surface better, gives better adhesion and will have slightly lower viscosity at any given filler loading. The
diluent increases pot-life, flexibility (impact resistance) and acid resistance, but limits the solvent resistance. D.E.R. 324
liquid epoxy resin is prone to crystallization.
D.E.R. 325
185 – 206
850 – 2800
Diglycidylether of bisphenol A/AGE.
D.E.R. 329
145 – 155
900 – 1300
Diglycidylether of bisphenol A/TMPTGE.
D.E.R 362
185 – 205
4500 – 6500
XZ 92742.00
160 – 180
500 – 700
TM
6
Modified liquid epoxy resin.
Diglycidylether of bisphenol A/BDDGE.
Trademark of The Dow Chemical Company (“Dow”) or an affiliated company of Dow
Liquid Epoxy Resins (cont.)
Grade
EEW
(gr/eq)
Viscosity
(mPa.s @ 25 °C)
Description
Modified Bisphenol A/F Epoxy Resins
D.E.R.™ 353
190 – 200
800 – 1000
D.E.R. 353 liquid epoxy resin is a low viscosity epoxy resin with a very low crystallization tendency. The performance
of D.E.R. 353 in ambient cure formulations is similar to those obtained when using D.E.R. 324 liquid epoxy resin.
167 – 174
3400 – 4200
Standard bisphenol F-based epoxy resin of low viscosity, used for solvent-free coatings, concrete reinforcements,
adhesives, electrical insulation and filament winding. This resin can provide improved resistance performance against
solvents compared to standard bisphenol A liquid epoxy resins.
D.E.R. 736
175 – 205
30 – 60
D.E.R. 736 is a short chain length polyglycol di-epoxide liquid resin. Its applications include coatings and adhesives
for improved flexibility, elongation, and impact resistance.
D.E.R. 732
310 – 330
60 – 70
D.E.R. 732 is a long chain length polyglycol di-epoxide liquid resin. Its applications include coatings and adhesives
for improved flexibility, elongation, and impact resistance.
D.E.R. 750
176 – 186
2500 – 4500
Diglycidylether of bisphenol A/flexible epoxy resin.
D.E.R. 3913
345 – 365
7500 – 9500
D.E.R. 3913 epoxy resin is designed to impart flexibility into epoxy binder systems. In combination with suitable
curing agents, high elongations at break can be achieved, at room temperature as well as at -20 °C.
Bisphenol F Epoxy Resins
D.E.R. 354
Flexible Epoxy Resins
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Resins from Dow
Epoxy Emulsions and Dispersions
Grade
EEW (gr/eq)
on solids
Solids Content
(wt%)
Description
D.E.R.TM 917
193 – 204
63 – 65
Aqueous liquid epoxy resin emulsion of the D.E.R. 331 liquid epoxy resin type. This material is suitable for coatings on
metallic substrates, coating on concrete and also in concrete ad-mixtures (i.e. epoxy cement concrete). Note that the
use of water-borne systems requires some control of atmospheric conditions (temperature and humidity) to develop
optimum performance and appearance.
D.E.R. 916
184 – 204
57 – 59
Aqueous semi-solid epoxy novolac resin emulsion of the D.E.N.TM 438 epoxy novolac resin type. This
product can produce highly cross-linked matrices, providing excellent heat and chemical resistance similar
to solvent-borne novolac resins.
D.E.R. 915
475 – 500
46 – 48
Experimental aqueous solid “1-type“ epoxy resin dispersion of the D.E.R. 671 solid epoxy resin type. This resin
emulsion is not only suggested for corrosion protection applications on steel but can also be used for coatings on
concrete where solvent cannot be tolerated.
Epoxy Toughening Agents and Toughened Epoxy Resins
Grade
EEW
(gr/eq)
Viscosity
(mPa.s @ 25 °C)
Description
FORTEGRATM 100 Epoxy
Toughening Agent
N/A
3000 – 4000
FORTEGRA 100 epoxy toughener is a low viscosity toughening agent, designed for use in amine cured
epoxy systems.
FORTEGRA 102
Toughened Epoxy Resin
345 – 374
5000 – 8000
Blend of bisphenol A liquid epoxy resin (50 wt%) and a block copolymer toughening agent (50 wt%).
FORTEGRA 104
Toughened Epoxy Resin
960 – 1060
N/A
FORTEGRA 201
Toughened Epoxy Resin
315 – 360
150,000 – 230,000
FORTEGRA 301
Toughened Epoxy Resin
200 – 225
~70,000
TM
8
Trademark of The Dow Chemical Company (“Dow”) or an affiliated company of Dow
Blend of bisphenol A solid epoxy resin (88 wt%) and FORTEGRA 100 (12 wt%).
Blend of bisphenol A liquid epoxy resin and a carboxyl terminated butadiene-acrylonitrile elastomer (40 wt%).
Blend of bisphenol A liquid epoxy resin and core shell rubber particles (15 wt%).
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Resins from Dow
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Epoxy Novolac Resins
Grade
EEW on solids
(gr/eq)
Viscosity
(mPa.s @ 25 °C)
Description
D.E.N.TM 425
169 – 175
9500 – 12500
D.E.N. 425 epoxy novolac resin has an average functionality of 2.5.
D.E.N. 431
172 – 179
1100 – 17001
D.E.N. 431 epoxy novolac resin has multi-epoxy functionality (± 2.8) which makes it useful in adhesives, electrical
and structural laminates, coatings and castings for elevated temperature service. D.E.N. 431 will exhibit high
chemical resistance and excellent elevated temperature performance. Adhesives based on D.E.N. 431 are ideal
binders for abrasives in grinding and polishing products.
D.E.N. 438
176 – 181
31000 – 400001
D.E.N. 438 is a widely used, general-purpose epoxy novolac resin. It is recognized as a standard for high temperature
applications. D.E.N. 438 has multi-epoxy functionality (± 3.6).
D.E.N. 438L
176 – 181
27500 – 325001
Slightly lower viscosity version of D.E.N. 438.
D.E.N. 438-A85
176 – 181
500 – 1200
Solution of D.E.N. 438 in acetone.
D.E.N. 438-EK85
176 – 181
600 – 1600
Solution of D.E.N. 438 in methyl ethyl ketone.
D.E.N. 438-MAK80
176 – 181
600 – 1200
Solution of D.E.N. 438 in methyl n-amyl ketone.
D.E.N. 438-MK75
176 – 181
200 – 600
Solution of D.E.N. 438 in methyl isobutyl ketone.
D.E.N. 438-X80
176 – 181
1200 – 2000
D.E.N. 439
191 – 210
15000 – 35000
D.E.N. 439-EK85
191 – 210
4000 – 10000
Solution of D.E.N. 438 in xylene.
2
D.E.N. 439 is a widely used, general-purpose epoxy novolac resin. It has multi-epoxy functionality (±3.8) which is
slightly higher than D.E.N. 438 epoxy novolac resin.
Solution of D.E.N. 439 in methyl ethyl ketone.
Brominated Resins
Grade
EEW on solids
(gr/eq)
Viscosity
(mPa.s @ 25 °C)
Description
D.E.R.TM 530-A80
425 – 440
1500 – 2500
Brominated epoxy resin in acetone.
D.E.R. 538-A80
465 – 495
800 – 1800
Brominated epoxy resin in acetone.
D.E.R. 542
305 – 355
N/A
D.E.R. 560
440 – 470
140 – 2153
D.E.R. 592-A80
350 – 370
1000 – 2400
D.E.R. 593
350 – 370
400 – 1100
Solid epoxy resin of the tetrabromo bisphenol A epichlorohydrin type. Softening point: 52 – 62˚C.
Solid brominated epoxy resin.
Brominated epoxy resin in acetone.
Brominated epoxy resin in DOWANOLTM PM glycol ether.
at 51.7 °C
at 71 °C
3
at 150 °C
1
2
® TM
Trademark of The Dow Chemical Company (“Dow”) or an affiliated company of Dow
11
Resins from Dow
Solid Epoxy Resins
Grade
EEW
(gr/eq)
Softening Point
(°C)
Description
Low Molecular Weight Solids
D.E.R.TM 661
500 – 560
75 – 85
D.E.R. 661 solid epoxy resin is a standard “1-type“ epoxy resin. Formulated with suitable hardeners it forms an excellent
base for many high quality chemical-resistant coatings withstanding exposure to corrosive atmospheres.
D.E.R. 6116
520 – 560
80 – 90
Low molecular weight “1.5-type“ epoxy resin.
D.E.R. 662E
590 – 630
87 – 93
D.E.R. 662E solid epoxy resin is a standard “2-type“ epoxy resin developed for use mainly in powder coatings where it
provides excellent flow.
D.E.R. 6224
675 – 725
88 – 98
Low molecular weight “2.5-type“ epoxy resin.
D.E.R. 662UH
675 – 750
90 – 98
Low molecular weight “2.5-type“ epoxy resin.
D.E.R. 663U
730 – 820
92 – 102
Low molecular weight “3-type“ epoxy resin.
D.E.R. 663UE
740 – 800
98 – 104
Low molecular weight “3-type“ epoxy resin for both pure epoxy and epoxy/polyester powder coatings requiring good gloss,
smoothness and excellent flexibility.
D.E.R 664
875 – 955
100 – 110
Low molecular weight “4-type“ epoxy resin. Non-powder grade solid epoxy resin catalyzed for esterification.
D.E.R. 664U
875 – 955
100 – 110
Medium molecular weight “4-type“ epoxy resin for both decorative and functional coatings.
D.E.R. 664UE
860 – 930
104 – 110
Medium molecular weight “4-type“ epoxy resin for both decorative and functional coatings to provide improved viscosity
characteristics and greater flexibility.
D.E.R. 6330-A10
780 – 900
98 – 106
Low molecular weight solid epoxy resin containing 10 wt% polyacrylate flow modifier.
D.E.R. 642U
500 – 560
89 – 97
Novolac-modified, medium molecular weight solid epoxy resin for functional powder coatings requiring high chemical
resistance.
D.E.R. 672U
740 – 830
110 – 120
D.E.R. 6225
650 – 725
87 – 95
Modified bisphenol A solid epoxy resin for high flow, high gloss powder coatings.
D.E.R. 6508
380 – 420
95 – 105
High temperature performance solid epoxy resin for fusion-bonded epoxy powder coatings.
Specialty Solids
Novolac-modified, high molecular weight solid epoxy resin for more flexible, corrosion-resistant epoxy powder coatings.
High Molecular Weight Solids
1
2
High molecular weight “5-type“ epoxy resin.
D.E.R. 6155
1250 – 1400
30000 – 550001
D.E.R. 667E
1600 – 1950
2000 – 2900
High molecular weight “7-type“ epoxy resin with good solution stability.
D.E.R. 668-20
2000 – 3500
2700 – 50002
High molecular weight “8-type“ epoxy resin designed for use in one pack stoving enamels for metal decoration,
interior and exterior can coatings, tube and drum linings, coil primers and many other industrial applications.
D.E.R. 669-20
3500 – 5500
4400 – 100002
(solution visc.)
High molecular weight “9-type“ epoxy resin.
D.E.R. 669E
2500 – 4000
4500 – 100002
High molecular weight “9-type“ epoxy resin with good solution stability.
2
at 150 °C
40 wt% in diethylene glycol monobutyl ether
TM
Trademark of The Dow Chemical Company (“Dow”) or an affiliated company of Dow
12
13
Resins from Dow
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Epoxy Resin Solutions
Grade
D.E.R.TM 337-DA97
1
EEW (gr/eq)
on solids
230 – 278
Viscosity
(mPa.s @ 25 °C)
N/A
Description
Solution of D.E.R. 337 with diacetone alchohol.
D.E.R. 337-X80
230 – 260
500 – 1200
Solution of D.E.R. 337 in xylene.
D.E.R. 337-X90
230 – 250
5000 – 15000
Solution of D.E.R. 337 in xylene.
D.E.R. 338-X90
230 – 280
5000 – 50000
Solution in xylene.
D.E.R. 660-B80
300 – 350
2300 – 7500
Semi-solid epoxy resin solution of D.E.R. 660 in butanol.
D.E.R. 660-MAK80
300 – 350
1000 – 1500
Semi-solid epoxy resin solution of D.E.R. 660 in methyl n-amyl ketone.
D.E.R. 660-PA80
300 – 350
1500 – 4500
Semi-solid epoxy resin solution of D.E.R. 660 in propyl acetate.
D.E.R. 660-X80
300 – 335
3500 – 7000
Semi-solid epoxy resin solution of D.E.R. 660 in xylene.
D.E.R. 661-A75
500 – 550
800 – 2500
Solution of D.E.R. 661 in acetone.
D.E.R. 661-A80
475 – 575
3500 – 8500
Solution of D.E.R. 661 in acetone.
D.E.R. 671-MAK75
425 – 550
3000 – 15000
Solution of D.E.R. 671 in methyl n-amyl ketone.
D.E.R. 671-PM75
425 – 500
9500 – 15000
Solution of D.E.R. 671 in DOWANOLTM PM glycol ether.
D.E.R. 671-T75
425 – 550
2200 – 10000
Solution of D.E.R. 671 in toluene.
D.E.R. 671-X70
445 – 500
2000 – 4000
Solution of D.E.R. 671 in xylene.
D.E.R. 671-X75
430 – 480
7500 – 11500
Solution of D.E.R. 671 in xylene.
D.E.R. 671-XM75
425 – 550
2500 – 9000
Solution of D.E.R. 671 in xylene/methyl isobutyl ketone.
D.E.R. 684-EK40
2800 min.
600 – 25001
Solution of an ultra-high molecular weight epoxy resin. It has essentially no epoxy functionality and provides
coatings with outstanding physical and chemical resistance properties by solvent evaporation alone. Main
applications include maintenance- and flash-primers, shop coats, wire enamels, road markers and clear
coatings for brass, chrome and aluminium.
cSt
® TM
Trademark of The Dow Chemical Company (“Dow”) or an affiliated company of Dow
15
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products from the initial concept and research to the manufacture, sale, distribution, and disposal of each product.
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