2206 Journal of The Electrochemical Society, 147 (6) 2206-2209 (2000) S0013-4651(99)08-016-7 CCC: $7.00 © The Electrochemical Society, Inc. Retarding Effect of HCl on Rate of Chemical Vapor Deposition of TiN from TiCl4-H2-N2 E. Zimmermann, T. Wang, Ch.-Ho Yu, and D. Neuschützz Lehrstuhl für Theoretische Hüttenkunde, Rheinisch-Westfälische Technische Hochschule Aachen, D-52056 Aachen, Germany The deposition rate of TiN was measured in a hot-wall chemical vapor deposition reactor using TiCl4-H2-N2(-HCl) gas mixtures at 1 bar total pressure and 950-1470 K. With respect to HCl, the reaction order was found to be 23. From the experimental results, a reaction model was derived that assumes (Reaction I) TiCl4(g) 1 1/2H2 r TiCl3(g) 1 HCl to be the rate-determining reaction in the homogeneous gas phase, and (Reaction III) Ti(ad) 1 1/2N2 r TiN(s) to be the slow heterogeneous step. The heterogeneous reaction preceding Reaction III, which may be described as (Reaction II) TiCl3(g) 1 3/2H2 5 Ti(ad) 1 3HCl, was assumed to be sufficiently fast to attain equilibrium. Reaction II accounts for the strongly retarding effect of HCl on the rate of TiN deposition. By proper adaptation of the rate constants and the activation energies of Reactions I and III, the numerical simulation led to deposition rates in good agreement with the measured values. © 2000 The Electrochemical Society. S0013-4651(99)08-016-7. All rights reserved. Manuscript submitted August 5, 1999; revised manuscript received February 21, 2000. Chemical vapor deposition (CVD) frequently is applied to deposit titanium nitride on cutting tools (for its erosion and corrosion resistance)1 and on a variety of parts (for its decorative color). The kinetics of TiN deposition from the gas phase containing TiCl4, H2, and N2 have been investigated for more than 20 years. In early papers,2,3 the deposition rate was proportional to the partial pressure of TiCl4 in the feed gas, but later, a rate maximum was reported with increasing p(TiCl4); i.e., at higher p(TiCl4) beyond the maximum, the TiN deposition rate decreased again.4-8 Since partial pressures of reactive species are likely to change inside the hot-wall reactor due to chemical reactions, their values at the sample may be different from those in the feed gas. Therefore, the feed gas values are designated p°(i). The reaction order with respect to N2 was usually 0.5.2,4,8,9 When the gas flow rate was varied, the deposition rate increased with the flow rate and then reached a plateau, indicating that, above a critical gas flow, mass transport in the gas phase had no noticeable influence on the deposition rate of TiN.3,4,10 From the temperature dependence, several authors also concluded that chemical reactions, rather than gas diffusion, were rate determining since, at least below 1273 K, the apparent activation energies were higher than 100 kJ/mol.3,4,8-10 Only one investigation4 reports on the retarding influence of HCl added to the feed gases. Later papers neither extended these investigations nor took the HCl effect into consideration when discussing possible reaction mechanisms. Thus, the present work was carried out to determine experimentally the retarding influence of HCl, either added to the precursor gas mixture or formed in the reactor before the gases reach the sample. Using the measured deposition rates, a reaction model then was developed and the deposition rates simulated to validate the model. In a preceding investigation,11 we had determined similarly the influence of HCl on the rate of SiC deposition from methyltrichlorosilane/hydrogen mixtures. Experimental The deposition rate of TiN was measured in a hot-wall reactor at a total pressure of 1 bar in the temperature range of 950 to 1470 K. The mass increase of the substrate, which was a 10 3 50 3 1 mm alumina platelet evenly coated with TiN, was continuously recorded using a magnetic levitation balance. The TiN coating excluded nucleation problems from the investigation of deposition kinetics. The feed gases and their partial pressure ranges were TiCl4 (0.2313.6 hPa), H2 (33-500 hPa), N2 (6.7-500 hPa), HCl (0-21 hPa), and Ar (balance). Most of the measurements were carried out at an H2/N2 ratio of 1, at 1193 K, and using a gas flow rate of 2.5 slm (standard liters per minute). Figure 1 shows the experimental setup with reactor, furnace, thermobalance, and gas supply, as previously z E-mail: [email protected] used in kinetic investigations on the deposition of SiC,11,12 pyrocarbon,13 and hexagonal BN.14 The reactor tube had 28 mm inside diam and was composed of 78% Al2O3 and 22% SiO2. The substrate was connected to the magnetic coupling device by means of a thin alumina rod, which was kept free of TiN deposit by flushing a small argon stream downward through a thin tube surrounding the rod. The substrate was placed into the tube furnace (the tube length was 700 mm, the heating zone length from room temperature to the temperature maximum was 250 mm) so that its center was in the temperature maximum at typical flow rates and gas compositions. The temperature variations along the substrate axis were within 65 K. The yellow-gold-colored deposit was analyzed with X-ray diffraction and electron probe microanalysis for its structure and its composition. Only cubic TiN was identified with a molar Ti/N ratio of about 51/49. Discoloration of the deposit was not noticed at modified test conditions. Since the partial pressure of N2 was always high, the nitrogen content of the TiN deposited was in all cases at or near the maximum. Results When the deposition rate of TiN was measured from TiCl4-H2-N2 mixtures initially free of HCl as a function of gas flow rate and temperature, results were obtained as shown in Fig. 2. At temperatures up to 1223 K, the rates approach nearly constant values with increasing flow rates, while at 1323 K the rate neither originates at zero Figure 1. Experimental setup with hot-wall reactor, thermobalance, and gas supply system. Journal of The Electrochemical Society, 147 (6) 2206-2209 (2000) 2207 S0013-4651(99)08-016-7 CCC: $7.00 © The Electrochemical Society, Inc. Figure 2. Measured deposition rate as a function of the gas flow rate at different temperatures; H2/N2 ratio 5 1. flow rate nor becomes constant at higher flow rates. Most further measurements were carried out at 1193 K, and in all cases the gas flow rate was held constant at 2.5 slm. In Fig. 3, the same results are plotted vs. the reciprocal temperature with flow rates as the parameter. The influence of the flow rate becomes more pronounced at higher temperatures. The reason for this is that the increasing deposition rate leads to a noticeable depletion of the gas phase with respect to the main reactant (TiCl4) while it flows from the cold inlet to the hot substrate. When the flow rate is increased, the residence time of the reactant gases before reaching the substrate is shortened, and the depletion reduced. Figures 2 and 3 show clearly that under the conditions chosen here, the deposition rates, as measured at the substrate hanging in the maximum temperature zone of the hot-wall reactor, are in the range where depletion of reactants cannot be neglected. This implies that the formation of HCl through the reactions occurring in the hot tube must be taken into consideration at all times. Figure 4 shows the influence of HCl additions to the feed gas mixture on the TiN deposition rate at 1193 K and different TiCl4 partial pressures in the feed gas. At initial HCl pressures of >6 hPa, the apparent reaction order with respect to HCl was 23 (dashed line in Fig. 4). At lower p°(HCl), the retarding influence of HCl added to the feed gas became smaller, because the total HCl partial pressure at the substrate was increasingly determined by the HCl formed in situ. The curves in Fig. 4 are results of a mathematical simulation described later. Figure 4. Deposition rate as a function of HCl partial pressure in the feed gas at different TiCl4 feed gas pressures; H2/N2 ratio 5 1. Symbols: measured; curves: simulated. From the results presented in Fig. 2-4 it is obvious that the deposition rates of TiN measured in a hot-wall reactor cannot be correlated directly to the feed gas partial pressures p°(i). The reactions taking place before the gas reaches the substrate at the temperature maximum of the furnace lead to noticeable depletions of reactants and a rise in the concentration of the product gas HCl, both strongly influencing the actual deposition rate at the substrate. A tentative reaction model and rate equations for the deposition of TiN were derived from the results of Fig. 2-4 and taken as the basis for the numerical simulation of local deposition rates to be calculated as a function of feed gas partial pressures, temperature, and flow rate. The model then was validated by comparison of the simulated rates with the experimental results. Reaction Model and Rate Equations The most striking dependencies of the deposition rate as a function of feed gas partial pressure have been the rate maximum with varying p°(TiCl4) and the strong retardation of the deposition with rising HCl content. Both observations have been reported previously.3-7 However, the magnitude of the negative reaction order of HCl, nHCl 5 23, was measured here for the first time. Any reaction model must be able to reproduce these two phenomena with sufficient accuracy. A number of models were conceived, tested, and found incompatible with these experimental observations. It became clear that a model with only one rate-determining reaction step would not describe the observed dependencies. The reaction model would have to consist of two subsequent rate-determining steps, one in the homogeneous gas phase and the other in the adsorbed state on the surface of the reactor walls and the substrate. The reaction model finally selected contains as the first step the decomposition of TiCl4 in the presence of hydrogen in the gas phase. As was shown by Teyssandier and Allendorf15 by kinetic simulations, TiCl3 1 HCl are the predominant decomposition products of TiCl4 in the presence of hydrogen, the approach of equilibrium being fast (10 ms) at 1500 K and slow (102-104 s) at 1000 K. We may conclude that in our case [temperatures around 1200 K, p°(TiCl4) 1001000 Pa], the TiCl3 formation in the gas phase (Reaction I), is still slow. Its rate jI is assumed to be given by Eq. 2 Reaction I Figure 3. Measured deposition rate as a function of temperature for different gas flow rates; H2/N2 ratio 5 1. TiCl4(g) 1 1/2H2 r TiCl3(g) 1 HCl [1] jI 5 d[TiCl3]/dt 5 kI[TiCl4][H2]1/2 [2] where the brackets denote concentrations and kI is a temperaturedependent rate constant. 2208 Journal of The Electrochemical Society, 147 (6) 2206-2209 (2000) S0013-4651(99)08-016-7 CCC: $7.00 © The Electrochemical Society, Inc. Reaction I takes place in the hot-wall reactor as soon as the temperature of the gas phase is sufficiently high. It leads to a depletion of TiCl4, while the effect on hydrogen is small because of the relative abundance of H2. Reaction I produces equal amounts of TiCl3 and HCl. A fraction of the TiCl3(g) formed is assumed to adsorb on the reactor wall and the substrate surface, establishing an adsorption equilibrium. The model implies that the adsorbed species involved are present in dilute concentrations, i.e., far from saturation, so that their concentrations are proportional to the respective partial pressures in the gas phase. Due to the presence of hydrogen, the adsorbed TiCl3(ad) is then, stepwise, reduced to finally form elemental Ti(ad). These reactions are assumed to be relatively fast and therefore to attain equilibrium Reaction II TiCl3(g) 1 3/2H2 5 Ti(ad) 1 3HCl KII 5 [Ti(ad)][HCl]3[TiCl3(g)]21[H2]23/2 [3] [4] The adsorbed elemental Ti finally reacts with nitrogen to form solid TiN (Reaction III) Reaction III Ti(ad) 1 1/2N2 r TiN(s) [5] This reaction is taken to be the rate-determining step on the surface. Its rate jIII is jIII 5 d[TiN]/dt 5 kIII[Ti(ad)][N2]1/2 [6] When [Ti(ad)] is replaced by kII, the rate equation becomes jIII 5 k9III[TiCl3(g)][H2]3/2[N2]1/2[HCl]23 [7] where k9III is another temperature-dependent rate constant. Gaseous TiCl4 also adsorbs at the substrate and is eventually reduced to elemental Ti and nitrided to form TiN. However, a parallel reaction path based on TiCl4(ad) cannot be split into two consecutive rate-determining steps and is not suited to reproduce both the rate maximum and the HCl dependence. Therefore, it is concluded that the contribution of such a parallel reaction path to the overall deposition rate of TiN can only be relatively small under the conditions of our experiments. The reaction model and the rate equations given above were used to simulate local TiN deposition rates and to reproduce the experimentally determined rates as a function of feed gas partial pressures, temperatures, and flow rates. For the numerical simulation, the rate constants ki in Eq. 2 and 7 were assumed to consist of a pre-exponential factor ki8 and an exponential term containing the temperature dependence ki 5 ki8 exp(2Ai/RT) TiCl3(g) concentration just determined. Finally, a mass balance was made with respect to remaining TiCl4, TiCl3, H2, N2, and HCl, which were then transferred to the adjacent upper cell, where these concentrations represented the starting values for the next calculations. When the cell at the temperature maximum was reached, the deposition rate of TiN on the wall (which then also means: on the substrate) was calculated as a function of the real local concentrations of the gas species involved. Since these real local concentrations are unambiguously related to definite sets of feed gas partial pressures, the simulated deposition rates on the substrate could be plotted vs. the feed gas partial pressures and thus be compared directly to the experimental values. Discussion In Fig. 4-8, measured deposition rates as functions of feed gas partial pressures po(TiCl4), po(HCl), po(N2), and po(H2) and of temperature are compared with the results of the mathematical simulations. In Fig. 4, the deposition rates determined experimentally at 1193 K as a function of HCl partial pressures in the feed gas are compared to simulated results obtained on the basis of the rate equations, Eq. 2 and 7. The general agreement is good. At po(HCl) $ 1000 Pa, the rate is strongly retarded by HCl, the reaction order with respect to HCl reaching a value of nHCl 5 23. At lower HCl concentrations in the feed gas, the curves become flatter and finally horizontal below p°(HCl) 5 100 Pa. The reason for this is that the actual HCl partial pressure at the substrate is the sum of the HCl formed while the gas flows to the substrate plus the HCl contained in the feed gas. Above po(HCl) 5 1000 Pa, the contribution of the newly formed HCl becomes negligible, while below po(HCl) 5 100 Pa, the HCl in the feed gas can be neglected. In Fig. 5, the influence of the TiCl4 partial pressure in the feed gas on the deposition rate of TiN is shown at 1193 K and at different HCl feed gas concentrations. As reported in the literature,4,5,10 the rates increase with po(TiCl4), pass through a maximum, and decrease again. Rising po(HCl) shifts the curves to lower rates and the rate maxima to higher po(TiCl4). The calculated rate curves coincide relatively well with the experimental results. At low po(TiCl4) and low po(HCl), the measured rate of TiN deposition is nearly proportional to p°(TiCl4). With increasing feed gas concentration of TiCl4, the rising deposition rate leads to a depletion in TiCl4 and to an increase in HCl. Both effects eventually slow the deposition rate and finally combine to decrease the measured rate. In Fig. 6 and 7, the influence of the hydrogen and the nitrogen partial pressures in the feed gas on the deposition rate is shown at constant temperature and different TiCl4 concentrations in the feed gas. These po(TiCl4) values were selected to have two measurements each on the [8] with ki8 and Ai as adaptable parameters. Optimum agreement with the experimental results was achieved when the activation energies were assumed to be AI 5 150 and AIII 5 340 kJ/mol. In the simulation, laminar vertical gas flow was assumed in the hot-wall reactor with fast horizontal mass and heat transfer. A parabolic temperature profile along the furnace axis was used. The substrate was placed at the maximum of this temperature profile. The tube reactor was divided into about 150 disk-shaped cells with constant inner tube diameter and variable height to accommodate in each cell the same number of gas molecules at constant pressure and changing temperature. The mean of the residence time of the flowing gas was selected as the reaction time. The lowest cell was placed at 600 K, the highest cell at the temperature maximum. The calculations started with the lowest cell taking the feed gas concentrations as input values. From the gas flow rate and the temperature, the residence time of the gas in the cell was calculated, and with the rate equation for Reaction I, the TiCl3 concentration in that cell at the end of the corresponding residence time. For the rate jIII of the subsequent heterogeneous reactions, the area of the tube reactor wall belonging to this cell was taken as the reaction surface. The concentration [TiCl3(g)] in Eq. 7 was taken to be proportional to the Figure 5. Deposition rate as a function of TiCl4 partial pressure in the feed gas at different HCl feed gas pressures; H2/N2 ratio 5 1. Symbols: measured; curves: simulated. Journal of The Electrochemical Society, 147 (6) 2206-2209 (2000) 2209 S0013-4651(99)08-016-7 CCC: $7.00 © The Electrochemical Society, Inc. Figure 6. Deposition rate vs. feed gas hydrogen partial pressure at different feed gas TiCl4 pressures (Ar is balance). Symbols: measured; curves: simulated. Figure 8. Deposition rate vs. reciprocal temperature at different feed gas TiCl4 pressures; H2/N2 ratio 5 1. Symbols: measured; curves: simulated. equations with the numerical values selected are a useful approximation of the deposition process of TiN from TiCl4-H2-N2-HCl gas mixtures at 1 bar total pressure in a hot-wall CVD reactor. Conclusions The experiments confirmed that HCl has a strongly retarding influence on the rate of TiN deposition from TiCl4-N2-H2 gas mixtures in the temperature range of 950 to 1470 K. The reaction model developed as a basis for the mathematical simulation of local deposition rates contains this influence in the form of a negative reaction order, nHCl 5 23. With an optimized set of four parameters, kI, k9III, AI, the AIII, simulations delivered deposition rates that were in good agreement with measured results as a function of feed gas partial pressures and temperature. Therefore, it is concluded that the model chosen here serves as a realistic basis for further and more detailed investigations into the reaction mechanisms involved and for the mathematical simulation of local deposition rates of TiN on substrates of more complex geometries. Figure 7. Deposition rate vs. feed gas nitrogen partial pressure at different feed gas TiCl4 pressures (Ar is balance). Symbols: measured; curves: simulated. left and the right side of the rate maximum in Fig. 5. The results of both measurements and calculations show that, at low po(TiCl4), the deposition rates increased only little with po(N2) and po(H2), while at high po(TiCl4), the increases were more pronounced. The general agreement between experiments and simulations appears fairly acceptable. Finally, Fig. 8 shows the deposition rate as a function of temperature at po(HCl) 5 0 and three different TiCl4 concentrations in the feed gas. These three feed gas TiCl4 values were selected to represent widely different conditions with respect to the rate maximum of Fig. 5, upper curve: p°(TiCl4) 5 66 Pa is situated far to the left of the rate maximum, 446 Pa is at the maximum, and 950 Pa is somewhat to the right of it. With rising temperature, the rates first display normal behavior with a typical Arrhenius rate increase, but above a certain temperature, the measured rates drop below the straight lines and even decrease below values at lower temperatures. This effect is caused by the depletion of the gas phase with respect to TiCl4 (and TiCl3) at the substrate. With lower p°(TiCl4), the effect of depletion appears earlier, i.e., at lower temperatures. In fact, the precursor may be completely consumed by the time the gas reaches the substrate when the feed gas concentration and the flow rate are low and the temperature in the reactor tube is sufficiently high. The simulated rate curves in Fig. 8 are in good agreement with the measured rates. This supports the idea that the model and the rate Acknowledgment The authors gratefully acknowledge financial support by the Deutsche Forschungsgemeinschaft (DFG) within the Collaborative Research Center 289 “Thixoforming.” Dedicated to Professor Günter Marx, TU Chemnitz, on the occasion of his 60th birthday. Rheinisch-Westfälische Technische Hochschule Aachen assisted in meeting the publication costs of this article. References 1. G. Wahl, in Chemical Vapor Deposition, M. L. Hitchman and K. L. Jensen, Editors, p. 591, Academic Press, London (1993). 2. T. Sadahiro, T. Cho, and S. Yamaya, J. Jpn. Inst. Met., 41, 542 (1977). 3. M. S. Kim, J. S. Chun, Thin Solid Films, 107, 129 (1983). 4. T.-Ch. Jung, Ch.-E. Bao, and M. H. Fang, Trans. Inst. Min. Metall., 95, C63 (1986). 5. J. R. Peterson, J. Vac. Sci. Technol., 11, 715 (1974). 6. C.-Zh. Rong, D. Y. Sheng, and M. H. Fang, Surf. Eng., 5, 315 (1989). 7. M. 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