108-94402
Product
Specification
03 SEP 13 Rev A
Mini USB Header 180° - USCAR 30
1.
SCOPE
This specification covers the performance, tests and quality requirements on a Mini-USB 180° Vertical
PCB header, part number 2208408-[ ] to transfer data-rates up to 480 Mbit/s.
Figure 1 – Vertical PCB Header
2.
DESCRIPTION
This connector system provides a vertical board mount option for connectivity of mini B USB cables
assemblies for use in infotainment applications. It is comprised of a vertical plug connector with straight
solder tails, solder nails to ensure a reliable mechanical connection to the PCB, and is available in a
variety of keying/color options per 999-U-USB-Z01.
3.
APPLICABLE DOCUMENTS
Applicable portion of the following documents form a part of the specification, to the extent indicated
herein. In the event of conflict between the requirements of the specification and the product drawing,
the product drawing shall take precedence.
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4.
114-94128:
Application-Specification (Mini USB B USCAR30)
TEC-109-201 Component Heat Resistance to Lead-Free Reflow Soldering-“CONDITION B”
SAE/USCAR-30
Mechanical, Environmental, and RF, HF tests
USB 2.0 (ECN#1) 10/20/2000 – Electrical, RF and HF tests
IPC/JEDEC J-STD-020d.1 – Reflow Solderability
REQUIREMENTS
The introduced data transmission system supports the transfer of USB or LVDS data as described in
USB 2.0.
5.
DESIGN AND CONSTRUCTION
All components of this product line shall be of design, construction and physical dimensions specified in
the applicable product drawings. The connector will adhere to the design constraints of USB 2.0 and
SAE/USCAR-30. The header shroud will adhere to the design requirements of SAE/USCAR30 and
999-U-USB-Z01.
©2013 Tyco Electronics Corporation, a TE Connectivity Ltd. company
All Rights Reserved
| Indicates Change
*Trademark. TE Connectivity, TE connectivity (logo), and TE (logo) are trademarks. Other logos, product and/or company names may be trademarks of their respective owners.
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108-94402
6.
MATERIALS
Descriptions for materials:
● Contacts: Copper Alloy
Plating, contact interface: gold over nickel
Plating, solder tails: tin over nickel
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Insulator: LCP – GF30
●
Shield: Copper Alloy
Plating: nickel
●
Housing/Shroud: PCT GF30
●
Solder Nail: Brass
Plating: tin over nickel
7.
RATINGS
● Current: 1.0 Ampere
● Voltage: 30 VAC RMS max
● Operating temperature: -40°C to +85°C or +105°C
● Insulation resistance: 100MΩ
● Contact capacitance: 2pF max unmated/contact
● High speed signalling data rate: 480 Mbit/s
8.
GEOMETRY AND PIN OUT
Contact Number
1
2
3
4
5
Shell
Signal Name
VBUS
DD+
ID
GND
SHIELD
Typical Wiring Assignment
Red
White
Green
Not connected
Black
Drain Wire
Pin 1
Pin 5
Figure 2
Rev A
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108-94402
9. SYSTEM COMPONENTS
9.1.
Header
Chapter Direction
Contact
Type
TE-PN
Type of Fixation
Thumbnail
Notes
Solder Nail,
Gen 2
2.1.1
180°
TH
-reflow
solderable
2208408
Table 1
9.2.
Rev A
180° TH - Header
The 180° TH - Header serves to connect the PCB and the Mini-USB-Plug cable assembly. Ganging
features on either side of the header allow multiple headers to be joined and locked together. A catch
on the header ensures positive latching to a mini B plug. Solder nails ensure the header is secured
firmly to the PCB and provide mechanical strength to the header system.
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108-94402
10.
SYSTEM REQUIREMENTS
10.1.
Tests
TEST ITEM
Dimensional Inspection
Durability
Audible Click
REQUIREMENTS
PROCEDURE
Meets requirements of product drawing EIA 364-18
and TE specifications
Visual Inspection
No physical damage
MECHANICAL
No physical damage shall occur after SAE/USCAR-30 / EIA 364-09
10 cycles
Mate and unmate connector
assemblies for 10 cycles at maximum
speed of 200 cycles/hour
7dB above the recorded ambient for un- SAE/USCAR-2
conditioned parts and 5dB
1. Measure/record dB (A) level of the
for conditioned parts
ambient sound (must be between 30
and 50 dB (A))
2. Sound measuring device or
microphone located 600+/-50mm from
the connector.
3. Mate connectors in group 1 by hand
and measure the dB (A) level of the
sound as the lock engages. Do not
bias the connectors toward or away
from the latch as they are engaged.
4. Repeat Steps 1 through 3 using the
group 2 connectors, post moisture
conditioning. Parts are brought to their
practical limit of moisture content by
exposing “dry as molded parts” to 9598% Relative Humidity at 40ºC for 6
hours (minimum), then completing the
test within 30 minutes.
Mating Force
Mating ≤ 45N
EIA 364-13
Shall be measured with Tension gauge
or Tension tester. Measure force
necessary to mate assemblies at
maximum rate of 12.5mm per minute.
Unmating Force
Unmating w/ lock engaged ≥ 110N
Unmating w/ lock disengaged ≤ 45N
EIA 364-13
Shall be measured with Tension gauge
or Tension tester. Measure force
necessary to un-mate assemblies at
maximum rate of 12.5mm per minute.
Polarization
Minimum of 90N. Test ensures that
the polarization feature(s) is adequate
to meet its intended purpose of
preventing incorrect mating of a
connector housing with its intended
mate, and preventing mating of a
connector housing with any
unintended mate.
SAE/USCAR-2
Engage the connector halves at a rate
not to exceed 50mm/min until a force
of 3X the maximum value of a properly
mated connector (with force being
>60N and <150N) is applied. Hold
force for 3 seconds.
Drop Test
Samples shall meet the acceptance
criteria of SAE/USCAR-30, 5.1.8,
visual.
SAE/USCAR-2
For each group, drop one sample at a
time once and only once onto a
horizontal concrete surface from a
height of at least 1 meter, dropping in
X, Y and Z orientation for each group.
Vibration
No loss of electrical continuity ≤ 1 μs
@ ≤ 7 Ω when mated USB
connectors are subjected to test.
EIA 364-28
Test Condition V1, test letter A
(components not coupled to engine).
Subject mated connectors to 5.35 G's
rms fifteen minutes in each of three
mutual perpendicular planes.
Mechanical Shock
No loss of electrical continuity ≤ 1 μs
@ ≤ 7 Ω when mated USB
connectors are subjected to test.
EIA 364-27
Test Condition V1, test letter A
(components not coupled to engine).
Subject mated samples to 10 shocks
per axis, 1/2 sine wave shape, positive
direction , 11 ms duration 30 Gs halfsine shock pulses. Three shocks in
each direction applied along three
mutually perpendicular planes for
a total of 18 shocks.
Table 2 (cont’d)
Rev A
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TEST ITEM
REQUIREMENTS
ENVIRONMENTAL
No loss of electrical continuity ≤ 1µs
@≤7Ω
Shall meet the requirements of low
level contact resistance of 50m Ω max
when measured @ 20mv max open
circuit and 100mA
PROCEDURE
Temp. / Humidity Cycling
Shall meet the requirements of low
level contact resistance of 50m Ω max
when measured @ 20mv max open
circuit and 100mA
EIA 364-31
Subject samples to 40 cycles of 8
hours each between -40° C to +85° C
and 0%-95% RH
High Temp. Exposure
Shall meet the requirements of low
SAE/USCAR-2
level contact resistance of 50m Ω max Subject samples to 85° C for 1008
when measured @ 20mv max open
hours.
circuit and 100mA
Resistance to reflow soldering heat
Samples shall show no sign of
blisters, deformation/warpage, melting
or physical damage detrimental to
product performance when inspected
@ 30X maximum magnification
Thermal Shock
Header Impedance
Header Attenuation
Low Level Contact Resistance
RF ELECTRICAL
90 Ω ±15% - measured w/ cable
assembly
EIA 364-32
Subject samples to 100 cycles @
–40 °C and +85 °C. (30 minutes
duration per cycle once stabilized @
each temperature range)
TEC-109-201, Test Method A (with
moisture soak @ 168 hours, 85°C,
85% RH)
Condition B - Peak Reflow - 260°C
Average ramp rate: 3°C per second
maximum
Preheat temperature (minimum):
150°C
Preheat temperature (maximum):
200°C
Preheat time: 60 to 180 seconds
Ramp to peak: 3°C per second
maximum
Time over liquidus (217°C): 60 to 150
seconds
Peak temperature: 260 +0/-5°C
Time within 5°C of peak: 20 to 40
seconds
Ramp - cool down: 6°C per second
maximum
Time 25°C to peak: 8 minutes
maximum
Per USB 2.0, Table 6-7
Up to 5.8 dB max @ 400 MHz, per
Per USB 2.0, Table 6-7
table 7-6 of USB 2.0 - measured w/
cable assembly
ELECTRICAL
50 m Ω max when measured @ 20mv EIA- 364-23
max open circuit and 100mA
SAE/USCAR-30 5.3.1.3
EIA 364-70 — Method B
USB 2.0, Table 6-7
When measured at an ambient
temperature of 25 °C. With power
applied to the contacts, the Δ T
must not exceed +30 °C at any
point in the USB connector under
test.
EIA 364-21
Test between adjacent contacts of
mated and unmated connector
assemblies.
Contact Current Rating
1.0 amp @ 250 VAC min
Insulation Resistance
100M Ω min
Dielectric Withstanding Voltage
500 VAC min for one minute
EIA 364-20
Test between adjacent contacts of
mated and unmated connector
assemblies.
Contact Capacitance
2 pF max unmated per contact.
EIA 364-30
Table 2 (end)
Rev A
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11.
11.1.
11.2.
11.3.
Rev A
QUALIFICATION AND REQUALIFICATION TEST SEQUENCE
The test sequences for mechanical tests, environmental tests and cable assembly electrical tests are
shown in the respective TE Connectivity specifications (See Section 3).
Requalification Testing
Modifications of form, fit or function made to the product or to the manufacturing process will require a
partial requalification of the product.
Sample Selection
The samples shall be prepared in accordance with product drawings. They shall be selected at random
from current production. The number of test samples has to be chosen according to SAE/USCAR 30.
Acceptance
Acceptance is based on verification that the product meets the requirements of this product
specification. Failures attributed to equipment, test setup or operator deficiencies shall not disqualify
the qualification. If product failures occur, corrective action shall be taken. The qualification has to be
verified again.
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