Optimized Thermal Management
with Advanced Ceramic Materials for Power Electronics,
CPV and HCPV
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Ceramic Base Materials
for the Electronics Industry
We offer the full range of ceramic base m
­ aterials
for the electronic manufacturers:
• 96% Alumina – Rubalit®708S
• Zirkonit
For thick- and standard thinfilm applications
For extremly high mechanical strengh requirements
• 96% Alumina – Rubalit®HP
• Metallized ceramics
For high thermal cycling performance
Wide range of possibilities:
• 99% Alumina – Rubalit®710
W – Ni – Au – Ag – Cu etc.
• 50%, 85%, 96%, 99% Alumina – Rubalit®600, 702,
For highest quality thinfilm applications
• Aluminiumnitride –
708 and 710
Alunit®
For high thermal power applications
For cylindrical resistor cores
• Alumina with Zirkonia – Rubalit®HSS 25%
For high mechanical strength applications
Heat-sensitive semi-conductor components are often mounted onto standard substrates. They need to offer suitable thermal
conductivity in addition to electrical insulation. The result is often an assembly with multiple layers made of different materials.
Each layer introduces its own set of risks, thereby restricting thermal conductivity. Chip on Heatsink on the metalized surface
of CeramCool® heatsinks makes it possible to achieve an extremely compact design for the entire cooling system.
NEW: CeramCool® Chip on Heatsink Technology
Conventional Heatsink Structure CONVENTIONAL
HEATSINK
STRUCTURE
P
NEW
CERAMCOOL®
CHIP ON HEATSINK
TECHNOLOGY
Zth = 0,268 k/W*
Zth = 0,550 k/W*
P
Zth Die
Zth = 0,550 k/W*
Zth Die
Zth Solder
Zth Solder
Zth Cu
Zth Cu
Zth Al2O3
Zth Ceramic Heatsink
Zth Cu
* Examination done by
Fraunhofer IISB, Nuremberg
Zth Solder
Zth Baseplate
Zth Thermal grease
Zth Heatsink
* Examination done by
Fraunhofer IISB, Nuremberg
Comparison: Conventional Heatsink Structure vs. CeramCool® Chip on Heatsink Technology
1,2
350
Multi-K AlN
Pressure drop
1
250
0,8
200
0,6
150
600 W/cm 2
100
500 W/cm 2
400 W/cm 2
300 W/cm 2
50
0,4
0,2
200 W/cm 2
100 W/cm 2
0
0
0
10
20
30
40
Flowrate [l/min]
50
60
pressure drop [bar]
T die – coolant [K]
300
NEW
CERAMCOOL®
CHIP ON HEATSINK
TECHNOLOGY
CeramCool® Sandwich Cooling
Sandwich design for double-sided cooling
The power semi-conductor can be cooled from the bottom and top to reduce thermal resistance even further. In this sandwich
design the semi-conductor chip is mounted between two ceramic heatsinks. The necessary clearance is achieved by means of
via-filled, metalized ceramic cuboids that are highly conductive, both electrically and thermally, and have a thermal expansion
coefficient very close to that of silicon.
The cooling capacity can be increased by up 50% depending on the construction.
Optimized Thermal Management with CeramCool® Sandwich Cooling
140
120
T die – coolant [K]
NEW
Comparison CeramCool®
Multi-K vs. Sandwich Cooling
CERAMCOOL®
SANDWICH
COOLING
100
80
60
2
300 W/cm
40
Multi-K
single-sided
Sandwich Cooling
double-sided
20
0
0
2
3
4
10
Flowrate [l/min]
20
40
CeramCool®
3D Products
New possibilities with three-dimensional metalized substrates featuring structured copper technology (SCT) for highperformance electronic circuits.
Materials and surface quality
Typical Ra Value
as fired
Content
Rubalit® 708
≤ 0.8 µm
> 96% Al2O3
Rubalit® 710
≤ 0.55 µm
> 99% Al2O3
Alunit®
≤ 0.6 µm
ZrO2
≤ 0.45 µm
Parameters and tolerances
Length and width (as fired)
Thickness
Standard
tolerances
Special
tolerances
± 1%1
± 0.7%2
± 10%
± 7%
Hole diameter < 2 mm
± 0.05 mm
± 0.05 mm
Hole diameter 2 – 10 mm
± 0.10 mm
± 0.076 mm
Hole diameter > 10 mm
± 1%
± 0.7 mm
Distance between holes
(center distance)
± 1%1
± 0.7%2
Overall camber
0.4% of length 0.3% of length
Perpendicularity
± 0.5%1
Parallelism
Radii and corners
Quoted upon request
≤ 0.2%
but not less than +/– 0.1 mm
but not less than +/– 0.05 mm
3 but not less than +/– 0.076 mm
1
2
Please see our data sheets for further information
Indexes and parameters for ceramic substances: In order to
profile ceramic substances certain parameters are indicated.
The crystalline nature of these substances, statistical fluctuations in the composition of the substances and in the
factors that impact on the production processes indicate
that the figures quoted are typically mean values and hence
the substance parameters quoted in this brochure are only
standard, recommended or guide values that might differ
given dissimilar dimensions and production processes.
CeramCool®
Advanced Ceramic Materials
The ceramic materials used are Rubalit® aluminum oxide and Alunit® aluminum nitride, which can feature a number of different
metalizations and conductor path structures – if necessary, even three-dimensional and “around the edge”.
Functional Surfaces
Structured Copper Technology
1D, 2D and 3D metallization Materials
Rubalit® 708, Rubalit® 708S, Rubalit® 708HP, Rubalit® HSS, Alunit®
Materials and surface quality
Basic
metallization
Standard ceramic materials
Metal plating
Electroless
Au flash
Ni (≥ 2 µm – 8 µm)
(approx. 0.1 µm),
Pd Au
Cu
Cu
Ag
Ni (≥ 2 µm – 8 µm)
Au flash
(approx. 0.1 µm),
Pd Au
Ag ≥ 6 µm
–
–
Au ≥ 6 µm
–
–
–
–
W ≥ 6 µm
Al ≥ 6 µm
Property
Other metallization on demand
Property
Values
Standard dimension of
­Mastercard
Standard usable design area
Metallization
­Adhesion
17 µm up to 300 µm
Layout related
Other thicknesses on demand
Pitch
Min. 200 µm
(copper thickness and layout
related)
Flatness
Layout and material
combination related
Plating
Ni (2 – 8 µm)
NiAu (Au 0.03 – 0.15 µm)
NiPdAu (Pd 0.05 – 0.1 µm)
Ag
Cu surface
≥ 25 N/mm2
Solder wettability
≥ 95%
Solder mask
Available, on demand
Substrates
Lifetime
(shock testing -55°C
up to 150°C)
Solder wettability
on Cu surface
Materials and surface quality
127.0 mm x 178.0 mm
(± 0.05mm)
Cu layer thicknesses
Double side metallization; vias viafilling
and dielectric layer on demand
Options
Values
Al2O3 (0.38 mm/0.5 mm/
0.63 mm/1.0 mm)
AlN (0.63 mm/1.0 mm)
Others thicknesses on demand
As fired
138.0 mm x 190.5 mm
(± 1.5%)
Rt: ≤ 50 µm, Ra: ≤ 2 µm
Lower roughness on demand
Al2O3 (0.32 mm – 0,38 mm)
> 1,000 cycles
AlN (0.63 mm)
> 900 cycles
SnAg preform,
SnCuIn preform
≥ 95% wetting
Typical Ra Value
as fired
Content
Thick wire bondability
300 µm Alumina wire AlH11
> 1,000 cN Shear force
Rubalit® 708 S
< 0.6 µm
> 96% Al2O3
Rubalit® 708 HP
< 0.6 µm
> 96% Al2O3
Thin wire bondability
(on NiPdAu surface)
25 µm Au wire
> 30 cN Shear force
Vias and through connections
Possible, on demand
Alunit®
≤ 0.8 µm
AlN
Printed resistors
Dimensions and tolerances
Property
Dimensions
Length and with
(as fired) tolerance
Thickness
Multilayer
Values
115.0 mm x 115.0 mm
115.0 mm x 165.0 mm
127.0 mm x 165.0 mm
138.0 mm x 190.5 mm
185.0 mm x 230.0 mm
± 1.5%
0.25 mm, 0.38 mm
0.50 mm, 0.63 mm
0.76 mm, 0.89 mm
1.00 mm, 1.27 mm,
Thickness tolerance
± 10%
Special thicknesses
from 0.1 mm up to 1.5 mm
Up to 4 Layers
Possible
Copperfree perimeter
around holes
A ≥ 0.2 mm
Copperfree perimeter
around single parts
A ≥ 0.25 mm
Peel strength
Solderstop width
Missmatch between
solder mask and copper
Delivery form
Tolerance of total
thickness
Application temperature
Min. 25 N/mm2
Min. 0.4 mm +/– 0.2 mm
+/– 0.2 mm
Mastercards or single pieces
(min. dimension 15 mm edge
length)
+7%/–10%
–55°C/700°C
CeramTec-Weg 1
95615 Marktredwitz
Germany
Phone: +49.9231.69-0
Fax: +49.9231.62-409
[email protected]
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www.ceramtec.com
The measured values mentioned before were determined for test samples and are applicable as standard values. The values were determined on the basis of DIN-/DIN-VDE
standards and if these were not available, on the basis of CeramTec standards. The values indicated must not be transferred to arbitrary formats, components or parts featuring
different surface qualities. They do not constitute a guarantee for certain properties. We expressly reserve the right to make technical changes.
EL130032 • EN • 500 • 1604 • Lorenz • Printed in Germany
CeramTec GmbH