Document No.001-64625 Rev. *D
ECN # 4621554
Cypress Semiconductor
Product Qualification Report
QTP # 103001 VERSION*D
January, 2015
Laser Optical Sensor
OvationONS™ II Family
S8DI-5R Technology, Fab 4
CYONS2000
CYONS2001
CYONS2100
CYONS2101
CYONS2010
CYONS2011
CYONSTB2010
CYONSTB2011
OvationONS™ II Wired Laser Navigation
System on Chip
CYONS2110
OvationONS™ II Wired / Wireless Laser
Navigation System on Chip
OvationONS™ II Wired / Wireless Laser
Navigation System on Chip
CYONS2110
OvationONS™ II Wired Gaming Laser
Navigation System on Chip
Ovation NL ™Trackball Navigation
System on Chip
Ovation NL ™Trackball Navigation
System on Chip
FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Josephine Pineda (JYF)
Reliability Engineer
Reviewed By:
Rene Rodgers (RT)
Reliability Manager
Approved By:
Richard Oshiro (RGO)
Reliability Director
Company Confidential
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Page 1 of 13
Document No.001-64625 Rev. *D
ECN # 4621554
PRODUCT QUALIFICATION HISTORY
Qual Report
072403
100804
103001
Description of Qualification Purpose
Qualify New Device (7CN2000AC) New Process S8DI-5R Technology, Fab4
Qualify ULM-Photonics for Polarize Locked (PL) VCSEL (GaAs Laser) using A2 parts
for CYONS (Optical Navigation Sensor)
Qualify A5 Parts Polarize Locked (PL) VCSEL (GaAs Laser) from ULM- Photonics for
CYONS (Optical Navigation Sensor)
Company Confidential
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Page 2 of 13
Date Comp
Dec 08
Oct 10
Dec 10
Document No.001-64625 Rev. *D
ECN # 4621554
PRODUCT DESCRIPTION (for qualification)
Qualification Purpose: Qualify ULM850-A5 Polarize Locked (PL) VCSEL (GaAs Laser) from ULM- Photonics for
CYONS (Optical Navigation Sensor)
CYONS2000-LBXC, CYONS2001-LBXC, CYONS2100-LBXC, CYONS2101-LBXC,
Marketing Part #:
CYONS2110-LBXC, CYONS2010-LBXC, CYONS2011-LBXC, CYONSTB2010-LBXC,
CYONSTB2011-LBXC, CYONSFN2051-LBXC, CYONSFN2061-LBXC,
CYONSFN2151-LBXC, CYONSFN2161-LBXC, CYONSFN2162-LBXC
Laser Optical Sensor with Integrated Source
Device Description:
Cypress Division:
Cypress Semiconductor - SLM
TECHNOLOGY/FAB PROCESS DESCRIPTION S4AD-5
Number of Metal Layers:
3
Metal Composition: Metal 1: 100A Ti/3,200A Al 0.5% Cu/300A TiW
Metal 2: 100A Ti/3,200A Al 0.5% Cu/300A TiW
Metal 3: 500A TiW / 4um Al 0.5% Cu / 300A TiW
2,800A TEOS /7,000A Si3N4
Passivation Type and Materials:
Generic Process Technology/Design Rule (µdrawn):
1P3M, 0.15 µm Mixed Signal CMOS
Gate Oxide Material/Thickness (MOS):
Dual: 110A SiO2 / 32A SiO2
Name/Location of Die Fab (prime) Facility:
Fab 4, CMI-Minnesota
Die Fab Line ID/Wafer Process ID:
S8DI-5R
PACKAGE AVAILABILITY
PACKAGE
ASSEMBLY SITE FACILITY
42-Lead QFN
CML-R
Note: Package Qualification details upon request.
Company Confidential
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Page 3 of 13
Document No.001-64625 Rev. *D
ECN # 4621554
MAJOR PACKAGE INFORMATION FOR THIS QUALIFICATION
Package Designation:
LB42
Package Outline, Type, or Name:
42-Plastic Quad Flat, No Lead (PQFN)
Mold Compound Name/Manufacturer:
EME G700H Type A/ Sumitomo
Mold Compound Flammability Rating:
V-0 PER UL94
Mold Compound Alpha Emission Rate:
N/A
Oxygen Rating Index:
None
Lead Frame Material:
Copper
Lead Finish, Composition / Thickness:
NiPdAu
Die Backside Preparation
Method/Metallization:
Backgrind
Die Separation Method:
100% Saw
Die Attach Supplier:
Dexter/Ablestik
Die Attach Material:
QMI 509 (Silicon Die)
Ablebond 84-1LMISR4
(VCSEL)
Die Attach Method:
Epoxy
Wire Bond Method:
Thermosonic
Wire Material/Size:
Au. 0.8 mil
Thermal Resistance Theta JA °C/W:
24°C/W
Package Cross Section Yes/No:
N/A
Name/Location of Assembly (prime) facility:
CML-R
MSL Level
1
Reflow Profile
260C
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
CML-R
Note: Please contact a Cypress Representative for other packages availability.
Company Confidential
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Page 4 of 13
Document No.001-64625 Rev. *D
ECN # 4621554
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT
Stress/Test
Test Condition
(Temp/Bias)
Result
P/F
High Temperature Operating Life Early
Failure Rate
Dynamic Operating Condition, Vcc Max=3.8V, 40°C/ 150°C
Dynamic Operating Condition, Vcc Max=5.5V, 125°C
Dynamic Operating Condition, Vcc Max=3.8V, 125°C
JESD22-A108
P
High Temperature Operating Life
Latent Failure Rate
Dynamic Operating Condition, Vcc Max=3.8V, 125°C
JESD22-A108
P
High Temperature Steady State life
125°C, 3.6V, Vcc Max
JESD22-A108
P
Low Temperature Operating Life
-30°C
JESD22-A108
P
High Temperature Storage
100C, no bias
JESD22-A103
P
Temperature Cycle
MIL-STD-883, Method 1010, Condition N, -40°C to 85°C
Precondition: JESD22 Moisture Sensitivity Level 3
192 Hrs, 30C/60%RH, 260°C +0, -5°C
MIL-STD-883, Method 1010, Condition C, -65°C to 150°C
Precondition: JESD22 Moisture Sensitivity Level 1
168 Hrs, 85C/85%RH, 260°C +0, -5°C
P
Temperature Humidity Bias
JESD22-A101:85C, 85%RH, 3.6V
Precondition: JESD22 Moisture Sensitivity Level 3/ Level 1
192 Hrs, 30C/60%RH+Reflow, 260°C +0, -5°C
168 Hrs, 85C/85%RH+ Reflow, 260°C +0, -5°C
P
Age Bond Strength
200C, 4hrs
MIL-STD-883, Method 883-2011
P
Ball Shear
JESD22-B116
P
Bond Pull
MIL-STD-883 – Method 2011
P
Current Density
Meets the Technology Device Level Reliability Specifications
P
Data Retention
Die Shear
150°C ± 5°C No Bias
MIL-STD-883, Method 2019
P
P
Electrostatic Discharge
Human Body Model (ESD-HBM)
2,200V
JESD22, Method A114
P
Electrostatic Discharge
Charge Device Model (ESD-CDM)
500V
JESD22-C101
P
Endurance Test
Internal Visual
Physical Dimension
JESD22-A117 and JESD22-A103
MIL-STD-883-2014
MIL-STD-1835, JESD22-B100
P
P
P
Static Latch-up
85C, ± 200mA,5.4V/ ± 240mA, 6.5V
JESD78
P
SEM Cross Section
MIL-STD-883, Method 2018
P
X-Ray
MIL-STD-883 - 2012
P
Company Confidential
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Page 5 of 13
Document No.001-64625 Rev. *D
ECN # 4621554
RELIABILITY FAILURE RATE SUMMARY
Stress/Test
High Temperature Operating Life
Early Failure Rate (VCSEL)
3
Device Tested/
Device Hours
#
Fails
Activation
Energy
Thermal
A.F
Failure
Rate
1553 Devices
0
N/A
N/A
0 PPM
438,462 DHRs
0
0 .7
170
19 FIT
1, 2
High Temperature Operating Life
Long Term Failure Rate
1
Assuming an ambient temperature of 55°C and a junction temperature rise of 15°C.
Chi-squared 60% estimations used to calculate the failure rate.
3
Thermal Acceleration Factor is calculated from the Arrhenius equation
4
Fit rate calculation based on limited sample size and device hours
2
E  1 1  
AF = exp  A  -  
 k  T 2 T1  
Where:
EA =The Activation Energy of the defect mechanism.
-5
k = Boltzmann's constant = 8.62x10 eV/Kelvin.
T1 is the junction temperature of the device under stress and T2 is the junction temperature of the
device at use conditions.
Company Confidential
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Page 6 of 13
Document No.001-64625 Rev. *D
ECN # 4621554
Reliability Test Data
QTP #: 072403
Device
Fab Lot # Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: AGE BOND STRENGTH
CYONS2001 (7CN2001AC) 4820479
610836700
CML-R
COMP
10
0
CYONS2100 (7CN2001AC) 4820153
610842926
CML-R
COMP
10
0
CYONS2110 (7CN2001AC) 4829362
610838315
CML-R
COMP
10
0
610836700
CML-R
COMP
10
0
610836700
CML-R
COMP
10
0
STRESS: BOND PULL
CYONS2001 (7CN2001AC) 4820479
STRESS: DIE SHEAR
CYONS2001 (7CN2001AC) 4820479
STRESS: DATA RETENTION, PLASTIC, 150C
CYONS2001 (7CN2001AC) 4820479
610836700
CML-R
168
77
0
CYONS2001 (7CN2001AC) 4820479
610836700
CML-R
500
77
0
CYONS2100 (7CN2001AC) 4820153
610842926
CML-R
500
76
0
CYONS2110 (7CN2001AC) 4829362
610838315
CML-R
168
75
0
CYONS2110 (7CN2001AC) 4829362
610838315
CML-R
500
74
0
STRESS: E-TEST
CYONS2001 (7CN2001AC) 4820479
STRESS:
COMPARABLE
HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (40, 3.8V, Vcc Max), VCSEL
CYONS2001 (7CN2001AC) 4820479
610836700
CML-R
168
330
0
CYONS2100 (7CN2001AC) 4820153
610842926
CML-R
168
330
0
CYONS2110 (7CN2001AC) 4829362
610838315
CML-R
168
333
0
STRESS:
HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (125, 3.8V, Vcc Max), SILICON
CYONS2001 (7CN2001AC) 4820479
610836700
CML-R
72
623
0
CYONS2110 (7CN2001AC) 4829362
610838315A1
CML-R
72
367
0
STRESS:
HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (125, 5.5V, Vcc Max)
CYONS2001 (7CN2001AC) 4820479
610836700
CML-R
72
45
0
Company Confidential
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Page 7 of 13
Document No.001-64625 Rev. *D
ECN # 4621554
Reliability Test Data
QTP #: 072403
Device
Fab Lot # Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (125C, 3.8V, Vcc Max), SILICON
CYONS2001 (7CN2001AC) 4820479
610836700
CML-R
180
225
0
CYONS2001 (7CN2001AC) 4820479
610836700
CML-R
300
224
0
CYONS2100 (7CN2001AC) 4820153
610842926
CML-R
180
448
0
CYONS2100 (7CN2001AC) 4820153
610842926
CML-R
300
448
0
CYONS2110 (7CN2001AC) 4829362
610838315
CML-R
180
225
0
CYONS2110 (7CN2 001AC) 4829362
610838315
CML-R
300
225
0
CYONS2001 (7CN2001AC) 4820479
610836700
CML-R
168
77
0
CYONS2100 (7CN2001AC) 4820153
610842926
CML-R
168
77
0
CYONS2110 (7CN2001AC) 4829362
610838315
CML-R
168
71
0
STRESS: ENDURANCE
STRESS:
ESD-CHARGE DEVICE MODEL, (500V)
CYONS2001 (7CN2001AC) 4820479
610836700
CML-R
COMP
9
0
CYONS2100 (7CN2001AC) 4820153
610842926
CML-R
COMP
9
0
CYONS2110 (7CN2001AC) 4829362
610838315
CML-R
COMP
9
0
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (2,200V)
CYONS2001 (7CN2001AC) 4820479
610836700
CML-R
COMP
8
0
CYONS2100 (7CN2001AC) 4820153
610842926
CML-R
COMP
8
0
CYONS2110 (7CN2001AC) 4829362
610838315
CML-R
COMP
8
0
STRESS: HIGH TEMPERATURE STORAGE, 100C no bias
CYONS2001 (7CN2001AC) 4820479
610836700
CML-R
500
77
0
CYONS2001 (7CN2001AC) 4820479
610836700
CML-R
1000
77
0
STRESS: HIGH TEMP STEADY STATE LIFE TEST (125C, 3.6V)
CYONS2001 (7CN2001AC) 4820479
610836700
CML-R
168
153
0
CYONS2001 (7CN2001AC) 4820479
610836700
CML-R
336
153
0
CYONS2001 (7CN2001AC) 4820479
610836700
CML-R
COMP
2
0
CYONS2100 (7CN2001AC) 4820153
610842926
CML-R
COMP
2
0
CYONS2110 (7CN2001AC) 4829362
610838315
CML-R
COMP
2
0
500
77
0
STRESS: INTERNAL VISUAL
STRESS: LOW TEMPERATURE DYNAMIC OPERATING LIFE, -30C
CYONS2001 (7CN2001AC) 4820479
610836700
CML-R
Company Confidential
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Page 8 of 13
Document No.001-64625 Rev. *D
ECN # 4621554
Reliability Test Data
QTP #: 072403
Device
Fab Lot # Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: PHYSICAL DIMENSION
CYONS2001 (7CN2001AC) 4820479
610836700
CML-R
COMP
30
0
CYONS2100 (7CN2001AC) 4820153
610842926
CML-R
COMP
30
0
CYONS2110 (7CN2001AC) 4829362
610838315
CML-R
COMP
30
0
STRESS: STATIC LATCH-UP (± 200mA, 5.4V)
CYONS2001 (7CN2001AC) 4820479
610836700
CML-R
COMP
12
0
CYONS2100 (7CN2001AC) 4820153
610842926
CML-R
COMP
12
0
CYONS2110 (7CN2001AC) 4829362
610838315
CML-R
COMP
12
0
STRESS: STATIC LATCH-UP (± 240mA, 6.5V)
CYONS2001 (7CN2001AC) 4820479
610836700
CML-R
COMP
6
0
CYONS2100 (7CN2001AC) 4820153
610842926
CML-R
COMP
6
0
CYONS2110 (7CN2001AC) 4829362
610838315
CML-R
COMP
6
0
610836700
CML-R
COMP
2
0
STRESS:
SEM CROSS SECTION
CYONS2001 (7CN2001AC) 4820479
STRESS: SORT YIELD
CYONS2001 (7CN2001AC) 4820479
COMPARABLE
STRESS: TC COND. C -40C TO 85C, PRE COND 192 HRS 30C/60%RH (MSL3)
CYONS2001 (7CN2001AC) 4820479
610836700
CML-R
300
77
0
CYONS2001 (7CN2001AC) 4820479
610836700
CML-R
500
77
0
CYONS2100 (7CN2001AC) 4820153
610842926
CML-R
300
76
0
CYONS2100 (7CN2001AC) 4820153
610842926
CML-R
500
76
0
CYONS2110 (7CN2001AC) 4829362
610838315
CML-R
300
77
0
CYONS2110 (7CN2001AC) 4829362
610838315
CML-R
500
77
0
STRESS: TEMPERATURE HUMIDITY BIAS, 85C, 85%RH, 3.6V, PRE COND 168 HRS 30C/60%RH (MSL3)
CYONS2001 (7CN2001AC) 4820479
610836700
CML-R
168
77
0
CYONS2100 (7CN2001AC) 4820153
610842926
CML-R
168
76
0
CYONS2110 (7CN2001AC) 4829362
610838315
CML-R
168
77
0
610836700
CML-R
COMP
15
0
STRESS: X-RAY
CYONS2001 (7CN2001AC) 4820479
Company Confidential
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Page 9 of 13
Document No.001-64625 Rev. *D
ECN # 4621554
Reliability Test Data
QTP #: 100804
Device
Fab Lot # Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: AGE BOND STRENGTH
CYONSFN2051(7CN2006A) 4943118
611011458
CML-R
COMP
15
0
CYONSFN2051(7CN2006A) 4943118
611011459
CML-R
COMP
15
0
CYONSFN2051(7CN2006A) 4943118
611011460
CML-R
COMP
15
0
STRESS:
HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (125, 3.8V, Vcc Max) VCSEL
CYONSFN2051(7CN2006A) 4943118
STRESS:
611011458
CML-R
96
517
0
HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 3.8V, Vcc Max) VCSEL
CYONSFN2051(7CN2006A) 4943118
611011459
CML-R
48
518
0
CYONSFN2051(7CN2006A) 4943118
611011460
CML-R
48
518
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (125C, 3.8V, Vcc Max)
CYONSFN2051(7CN2006A) 4943118
611011458
CML-R
168
229
0
CYONSFN2051(7CN2006A) 4943118
611011458
CML-R
1000
216
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 3.8V, Vcc Max)
CYONSFN2051(7CN2006A) 4943118
611011459
CML-R
80
239
0
CYONSFN2051(7CN2006A) 4943118
611011459
CML-R
500
215
0
CYONSFN2051(7CN2006A) 4943118
611011460
CML-R
80
230
0
CYONSFN2051(7CN2006A) 4943118
611011460
CML-R
500
219
0
STRESS:
ESD-CHARGE DEVICE MODEL, (500V)
CYONSFN2051(7CN2006A) 4943118
611011458
CML-R
COMP
9
0
CYONSFN2051(7CN2006A) 4943118
611011459
CML-R
COMP
9
0
CYONSFN2051(7CN2006A) 4943118
611011460
CML-R
COMP
9
0
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (2,200V)
CYONSFN2051(7CN2006A) 4943118
611011458
CML-R
COMP
8
0
CYONSFN2051(7CN2006A) 4943118
611011459
CML-R
COMP
8
0
CYONSFN2051(7CN2006A) 4943118
611011460
CML-R
COMP
8
0
Company Confidential
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Page 10 of 13
Document No.001-64625 Rev. *D
ECN # 4621554
Reliability Test Data
QTP #: 100804
Device
Fab Lot # Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: TC COND. C -65C TO 150C, PRE COND 168 HRS 85C/85%RH
CYONSFN2051(7CN2006A) 4943118
611011458
CML-R
500
80
0
CYONSFN2051(7CN2006A) 4943118
611011458
CML-R
1000
80
0
CYONSFN2051(7CN2006A) 4943118
611011459
CML-R
500
81
0
CYONSFN2051(7CN2006A) 4943118
611011459
CML-R
1000
81
0
CYONSFN2051(7CN2006A) 4943118
611011460
CML-R
500
81
0
CYONSFN2051(7CN2006A) 4943118
611011460
CML-R
1000
81
0
STRESS: TEMPERATURE HUMIDITYS, 85C, 85%RH, PRE COND 168 HRS 85C/85%RH
CYONSFN2051(7CN2006A) 4943118
611011458
CML-R
168
80
0
CYONSFN2051(7CN2006A) 4943118
611011458
CML-R
500
79
0
CYONSFN2051(7CN2006A) 4943118
611011458
CML-R
1000
79
0
CYONSFN2051(7CN2006A) 4943118
611011459
CML-R
168
82
0
CYONSFN2051(7CN2006A) 4943118
611011459
CML-R
500
82
0
CYONSFN2051(7CN2006A) 4943118
611011459
CML-R
1000
81
0
CYONSFN2051(7CN2006A) 4943118
611011460
CML-R
168
82
0
CYONSFN2051(7CN2006A) 4943118
611011460
CML-R
500
82
0
CYONSFN2051(7CN2006A) 4943118
611011460
CML-R
1000
82
0
STRESS: TEMPERATURE HUMIDITY BIAS, 85C, 85%RH, 3.6V, PRE COND 168 HRS 85C/85%RH
CYONSFN2051(7CN2006A) 4943118
611011458
CML-R
168
78
0
CYONSFN2051(7CN2006A) 4943118
611011458
CML-R
500
78
0
CYONSFN2051(7CN2006A) 4943118
611011458
CML-R
836
77
0
CYONSFN2051(7CN2006A) 4943118
611011458
CML-R
1000
77
0
CYONSFN2051(7CN2006A) 4943118
611011459
CML-R
168
79
0
CYONSFN2051(7CN2006A) 4943118
611011459
CML-R
500
78
0
CYONSFN2051(7CN2006A) 4943118
611011458
CML-R
836
78
0
CYONSFN2051(7CN2006A) 4943118
611011459
CML-R
1000
77
0
CYONSFN2051(7CN2006A) 00002_100A N/A
N/A
500
30
0
CYONSFN2051(7CN2006A) PL-S0101U N/A
N/A
500
30
0
CYONSFN2051(7CN2006A) 0002_239A
N/A
1000
15
0
N/A
Company Confidential
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Page 11 of 13
Document No.001-64625 Rev. *D
ECN # 4621554
Reliability Test Data
QTP #: 103001
Device
Fab Lot # Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: TC COND. C -65C TO 150C, PRE COND 168 HRS 85C/85%RH
CYONS2000 (7CN2001A)
4949089
611019107
CML-R
500
82
0
CYONS2000 (7CN2001A)
4949089
611019107
CML-R
1000
82
0
STRESS: TEMPERATURE HUMIDITY, 85C, 85%RH, PRE COND 168 HRS 85C/85%RH
CYONS2000 (7CN2001A)
4949089
611019107
CML-R
168
81
0
CYONS2000 (7CN2001A)
4949089
611019107
CML-R
500
79
0
CYONS2000 (7CN2001A)
4949089
611019107
CML-R
1000
79
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 12 of 13
Document No.001-64625 Rev. *D
ECN # 4621554
Document History Page
Document Title:
103001: Ovation ONS Polarize Locked (PL) VCSEL (GaAs Laser) from ULM Photonics
Qualification Report
001-64625
Document Number:
Rev. ECN
No.
**
3050982
*A
3466476
Orig. of
Change
NSR
NSR
*B
3852259 NSR
*C
4241831 JYF
*D
4621554 JYF
Description of Change
Initial spec release
Sunset Review
Removed obsolete spec (25-00017) and replace with 12-00292.
Removed QTP version 1.0 in the title page.
Sunset Review.
Removed Assembly Process Flow with obsolete spec 001-07345.
Replaced the reference Cypress specs with industry standards in the
reliability tests performed table.
Sunset review:
Updated title of QA Engineering Director to Reliability Director in QTP
title page;Deleted obsolete spec 001-16125 in Major Package
Information table; Complete re-write of Reliability Tests Performed table
for template alignment.
Sunset review:
Updated QTP title page for template alignment.
Distribution: WEB
Posting:
None
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 13 of 13