SurfMate™ Design Guide
Surface Mount Socketing System
for Vicor’s Maxi, Mini, Micro Series Modules
Contents
Introducing the SurfMate, a new surface mount
connector system for use with pin-compatible Vicor
Maxi, Mini, Micro Series DC-DC converters and
accessory modules. For the first time, circuit board
designers and assemblers have the ability to surface
mount high-density DC-DC converters having current
ratings up to 100 Amps.
Specifications and Materials . . . . . . . . . . . . . . .1
Printed Circuit Board Design
and Soldering Guidelines . . . . . . . . . . . . . .2
SurfMate — first in a family of ModuMate interconnect
products — utilizes a pair of surface mounted headers
which contain sockets to accept the input and
output pins of the module.
PCB Layout Drawings –
Maxi . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
Mini . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
The SurfMate header assembly is compatible with
any thickness PC board, does not increase the
module mounting height above the board, and
is available for all three standard module sizes —
Maxi, Mini, and Micro (full, half and quarter bricks).
Micro. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
SurfMate Outline Drawings –
Maxi . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Mini . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
SurfMates are available packaged in standard
recyclable JEDEC style trays for use with automated
pick and place equipment and are compatible with
standard reflow solder operations. After reflow, the
modules are simply inserted into the SurfMates. Any
secondary soldering operation used for thru hole
sockets or pins can now be entirely eliminated —
reducing manufacturing time and eliminating
dual processes.
Micro . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Part Numbering and Packaging –
SurfMates, Standoffs
& Exchange Tools . . . . . . . . . . . . . . . . . . . .8
This unique interconnect scheme combines the
inherent flexibility of component power designs
with the manufacturing efficiency of surface
mount assembly.
Vicor’s comprehensive line of power solutions
includes modular high density DC-DC converters
and accessory components, configurable power
supplies, and custom power systems.
SurfMates require the use of modules with
the ModuMate pin option and are not
designed for use with standard tin-lead pins.
v
i
c
o
r
p o
w e r . c o m
Specifications and Materials
Parameter
Specification Value
Reference
S
Short ModuMate pins
Compatibility
Module pin style
Mechanical
Contact normal force
100 grams EOL min
GR-1217-CORE, R5-23
5 min
Exception to GR-1217-CORE
which specifies 25 mating cycle
Module engagement force
32 lbs per connector set max
GR-1217-CORE, R5-31,32
Module disengagement force
32 lbs per connector set max
GR-1217-CORE, R5-31,32
Number of mating cycles
Electrical
Current rating
100 Amps - Maxi
50 Amps - Mini
25 Amps - Micro
(Based on 120°C max socket
temperature & 30°C max
temperature rise of contact)
Gold plating standards, and
accepted industry standards
such as IICIT, EIA, Bellcore guidelines
Low level contact resistance
0.080" dia socket (LLCR)
400 µ Ohms max
GR-1217-CORE, 6.2.1
Low level contact resistance
0.150" dia socket (LLCR)
300 µ Ohms max
GR-1217-CORE, 6.2.1
Low level contact resistance
0.180" dia sockets (LLCR)
200 µ Ohms max
GR-1217-CORE, 6.2.1
120°C max
Max continuous use
temperature for gold plating
30°C max
GR-1217-CORE(1)
EIA-364-70A(2)
Thermal
Max socket temperature
Temperature rise
SurfMate products are tested in random vibration environments to best simulate the
broad spectrum of frequencies and amplitudes that may be encountered in typical
applications. Actual system resonant frequencies will depend on PCB construction
and mounting details. For critical, or unusual, shock and vibration environments, the
performance of the system should be independently verified.
Environmental
Shock and vibration
Material Properties of SurfMate Components
Materials
Ratings
Headers
Material: Vectra E150i LCP
Flammability
Thermal stability (short term)
Thermal stability (long term)
Solder Cap
Material
Liquid Crystal Polymer
UL94 V-0/5VA
260°C (500°F)
200°C (392°F)
260 cartridge brass
(70 Cu, 30 Zn)
100 µ in min Cu, followed by 50 to 100 µ in min
low stress sulfamate-based electrolytic nickel,
followed by 20 µ in min soft gold
Brush Wellman Alloy #25
C17200 deep draw quality
or equiv. 0.010” thick
Woods nickel strike followed by 50 µ in min low stress
sulfamate-based electrolytic nickel,
followed by 20 µ in min hard gold
followed by 10 µ in min soft gold
Plating
Sockets
Material
Plating
(1)GR-1217-CORE issue 1, November 1995
Generic requirements for separable electrical connectors used
in telecommunications hardware. A module of NEBSFR, FR-2063
v
i
c
o
r
p o
(2)ANSI/EIA-364 American National Standards Institute/
Electronic Industries Association
(Electronic Components, Assemblies & Materials Association)
w e r . c o m
1
Printed Circuit Board Design and Solder Guidelines
SurfMate Socketing System
Recommended PCB layout drawings for SurfMates
are provided on the following pages. All unspecified
PCB dimensional tolerances comply with ANSI/IPC-D300 for Class “B” boards.
Recommended PCB Construction
The SurfMate system is capable of very high current
carrying capacity. We therefore recommend a
multilayer PCB with 3-ounce copper and internal
power and ground planes. Consult the drawings for
the recommended size and quantity of via holes for
carrying current to the internal planes.
Solder Mask and Pad
Two solder mask keep-out areas are recommended.
The larger area encompasses the complete pad
area at either end. It ensures the proper height of the
3 ounce solder pads to the surrounding laminate. This
provides for the optimum gap between the SurfMate
and the PCB (0.0042" ±0.0004"), minimizing the solder
paste thickness required for quality solder joints.
Without this solder mask keep-out area, the gap may
widen, (see “flush-mounted pads”), requiring thicker
solder paste to fill the larger gap.
The smaller solder mask keep-out areas are circular,
and are located on each pad, for the solder joint
between the PCB and the SurfMate. The remainder
of the pad has a covering of solder mask. The solder
paste is dispensed in a rectangular area covering
the soldering area and part of the solder mask area.
During soldering, the paste will migrate away from
the solder mask area to the soldering area, providing
ample volume for quality solder joints.
Each pad features a non-plated thru hole in the
center of the pad to provide a venting function.
It is normal for the solder joint to have a slight void
centered on this thru hole.
Solder Paste
Solder paste thickness requirements will vary
depending on whether the board pads are flush or
elevated from the laminate.
Elevated Pads (preferred)
The ideal height for elevated pads is 0.0042" ±10%.
This can be achieved by using a 3-ounce copper
surface layer. With this height, a minimum solder
paste thickness of 0.006" should be used. Thicker
stencils of between 0.008" and 0.012" are preferred.
Flush Mounted Pads
For boards with flush mounted pads a minimum
of 0.010 " solder paste should be used. Preferred
thickness is between 0.012" and 0.016".
Placement
SurfMate locating pins will engage in the
corresponding PCB holes with a light push of
the SurfMate into the solder paste. The SurfMate
should not be taped or adhered in place. The
surface tension of the solder during reflow will
center the SurfMate parts on the PCB, resulting
in accurate positioning.
Equipment and Solder
Soldering of SurfMates should be done using either
an infrared or convection oven reflow process.
Solder type Sn63Pb37, or equivalent, with a eutectic
temperature of 183°C should be used. Higher
temperature solder is NOT recommended.
Standoffs
Mounting standoffs are required for SurfMate
applications. The location for standoff holes is shown
on the PCB layout drawing. A selection chart of
recommended standoff kits is provided on page 8.
Module Pins
SurfMates must be used with modules with the “S”
or “F” pin style.
2
v
i
c
o
r
p o
w e r . c o m
v
i
c
o
r
p o
w e r . c o m
3
0.704
17.88
0.032 ±0.003
0.81 ±0.08
0.265
6.73
0.277
7.04
0.102
2.59
0.357
9.07
*
SEE NOTE 4
52 VIA HOLES
0.504
12.8
2X Ø
0.467
11.86
*
0.328
8.33
0.027
0.69
8X 0.110 / 2.79 X 45°
CHAMFER
0.032 ±.003
0.81 ±0.08
0.037
0.94
0.050
1.27
TYP
DETAIL A
DETAIL B
0.450
11.43
0.065
1.65
Ø
7X 0.233
5.84
FREE OF SOLDER MASK
(SEE NOTE 3C)
0.138
3.51
0.027
0.69
0.340
8.64
SOLDER MASK KEEP-OUT AREA
EXCEPT ON PADS
0.115
2.92
0.065
1.65
0.032 ±0.003
Ø 0.81 ±0.08
3 VIA HOLES
3 VIA HOLES
0.271*
6.89
0.271*
0.340
6.88
8.64
9X Ø 0.016 NONPLATED THRU
0.032 ±.003
0.81 ±0.08
.027
0.69
0.138
3.51
0.316
8.03
FREE OF SOLDER MASK
(SEE NOTE 3C)
2X
0.115
2.92
0.230*
5.84
TYP
SCALE: 4X
(MIRROR IMAGE TO OTHER SIDE)
0.314 *
7.98
0.158
4.01
0.027
0.69
0.352
8.94
0.414
10.52
SCALE: 4X
(MIRROR IMAGE TO OTHER SIDE)
0.027
0.69
0.065
1.65
0.313
7.95
*
*
0.102
2.59
0.115
2.92
0.230*
5.84
SOLDER MASK KEEP-OUT AREA
EXCEPT ON PADS
0.300
7.62
SEE DETAIL B
0.063
1.59
0.125 ±0.002
3.18 ±0.05
53.34
2.100
5
8
1.000
25.4
0.700
17.78
1.400
35.56
7
2
1.900 ±0.002
48.26 ±0.05
6
3
9
1
PCB MOUNTING SPECIFICATIONS
2X
99.06
3.900
4
0.400
10.16
0.250
6.35
0.080
2.03
(ALSO SEE NOTE 2 & EXCHANGE TOOL DETAILS IN RIGHT VIEWS)
106.68
4.200
0.063
REF
1.59
SEE DETAIL A
0.300
7.62
2.000
50.80
2.060
52.32
(SEE NOTE 3C)
(SEE NOTE 3C)
0.250
6.35
0.535
13.59
(SEE NOTE 3C)
PLATED THRU HOLES
FOR STANDOFF MTG
(SEE NOTES 3 & 6)
0.130 ±0.003
3.30 ±0.08
0.064 ±0.003
1.63 ±0.08
(#52 DRILL)
6X ø
6X ø
13.59
0.535
0.250
6.35
PCB
for Full-brick Module
All dimensions are Inch or Inch / Metric
ANSI / IPC-D-300 specifications apply for Class “B” boards.
Recommended PCB construction:
Multilayer 3 oz Cu with internal power and ground planes. Pad geometry and minimum number
of via holes for connection to power and ground planes shown in Details “A” & “B” for high current
applications. Pads to be covered with solder mask except in circular area shown in Detail “A” & “B”.
Final pad height above laminate to be 0.004" +/- 0.0004".
Light gray area denotes stencil aperture (should include circular solder mask keep-out area on each pad).
0.027
0.69
0.050
1.27
TYP
38°
0.050
1.27
TYP
0.027
0.69
16 VIA HOLES
Ø
0.027
0.69
TYP
0.050
1.27
0.027
0.69
0.130
3.30
0.254*
6.45
PCB Layout Drawing
MAX
0.56
14.1
2
3
MODULE
EXCHANGE
TOOLBOTH ENDS
(PARTIAL)
0.06
1.6
1
0.38
9.5
7
1.98
50.3
8
2
1.25
31.6
15°
MODULE EXCHANGE
TOOL
6
3
2.000
50.8
0.49
12.5
9
1
0.080 / 2,03
0.080 / 2,03
0.080 / 2,03
0.080 / 2,03
0.180 / 4,57
0.080 / 2,03
0.080 / 2,03
0.080 / 2,03
0.180 / 4,57
Pin Dia.
(inches / mm.)
(ALSO SEE NOTE 2)
0.50
MIN
12.7
4.730
120.14
SurfMate
Output
Connector
PCB
MODULE BASEPLATE
(LESS STANDOFFS)
0.265
6.73
BOTTOM OF
CAP TO TOP
OF PCB
0.005
0.13 REF
0.300
7.62
PRODUCT APPLICATION SPECIFICATIONS
SCALE: 8X
DETAIL C
0.50
MIN
12.7
0.15
3.8
5
4
+IN
Prim. Control
Parallel
–IN
–OUT
–Sense
Sec. Control
+Sense
+OUT
0.440
11.18
EXCHANGE TOOL
HOOK AREA, 4 PLCS
(BOTH ENDS-SEE VIEWS)
MODULE
PCB
+
PC
PR
–
–
–S
SC
+S
+
Function
MAXI PIN LEGEND
Symbol
SurfMate Input
Connector
1
2
3
4
5
6
7
8
9
Pin
Number
4
v
i
c
o
r
p o
w e r . c o m
0.328*
8.33
0.604
15.34
0.350*
8.89
45º
0.05
1.27
TYP
0.034
0.86
0.027
REF
0.69
DETAIL A
DETAIL B
2Xø
0.271*
6.88
0.115
2.92
0.065
1.65
0.271*
6.88
0.027
0.69
0.340
8.64
0.138
3.51
ø 0.032 ±.003
0.81 ±0.08
3 VIA HOLES
ø 0.032 ±.003
0.81 ±0.08
3 VIA HOLES
0.027
0.69
0.138
3.51
0.34
8.64
9X ø0.016 NON PLATED THRU
7X ø 0.233
5.84
FREE OF SOLDER MASK
(SEE NOTE 3C)
SOLDER MASK KEEP-OUT AREA
EXCEPT ON PADS
0.316
8.03
FREE OF SOLDER MASK
(SEE NOTE 3C)
0.115
2.92
0.065
1.65
0.230*
5.84
TYP
SCALE: 4X
(MIRROR IMAGE TO OTHER SIDE)
0.318*
8.08
0.15
4.04
0.034
0.86
0.194
4.93
SCALE: 4X
(MIRROR IMAGE TO OTHER SIDE)
0.027
0.69
0.065
1.65
0.313*
7.95
0.102*
2.59
0.115
2.92
0.230*
5.84
0.300
7.62
1.600
40.64
5
4
0.700
17.78
8
1.400
35.56
1.000
25.40
7
2
1.900 ±0.002
48.26 ±0.05
6
3
2.000
50.80
2.060
52.32
(SEE NOTE 3C)
9
1
0.400
10.16
0.250
6.35
0.080
2.03
0.250
6.35
0.535 (SEE
13.59 NOTE 3C)
(ALSO SEE NOTE 2 & EXCHANGE TOOL DETAILS IN RIGHT VIEWS)
4X ø
PLATED THRU HOLE
FOR STANDOFF MTG
(SEE NOTES 3 & 6)
0.130 ±0.003
3.30 ±0.08
6X ø 0.064 ±0.003
1.63 ±0.08
(#52 DRILL)
0.535
(SEE NOTE 3C)
13.59
0.250
6.35
PCB
PCB MOUNTING SPECIFICATIONS
SEE DETAIL B
0.063
1.59
0.300
7.62
0.063 REF
1.59
SEE DETAIL A
2X .125 ±0.002
3.18 ±0.05
1.900
48.26
SOLDER MASK KEEP-OUT AREA
EXCEPT ON PADS
All dimensions are Inch or Inch / Metric
ANSI / IPC-D-300 specifications apply for Class “B” boards.
Recommended PCB construction:
Multilayer 3 oz Cu with internal power and ground planes. Pad geometry and minimum number
of via holes for connection to power and ground planes shown in Details “A” & “B” for high
current applications. Pads to be covered with solder mask except in circular area shown in
Detail “A” & “B”. Final pad height above laminate to be 0.004" +/- 0.0004".
Light gray area denotes stencil aperture (should include circular solder mask keep-out area on each pad).
0.027
0.69
0.05
1.27
TYP
0.032 ±.003
0.81 ±0.08
16 VIA HOLES
38º
0.050
1.27
TYP
0.027
0.69
ø 0.032 ±.003
0.81 ±0.08
29 VIA HOLES
0.050
1.27
TYP
0.027
0.69
0.265
6.73
0.102
2.59
0.277
7.04
SEE NOTE 4
0.467 0.467
11.86 11.86
0.027
0.69
8X .110/2.79 X 45º
CHAMFER
0.130
3.3
0.254*
6.45
for Half-brick Module
PCB Layout Drawing
0.56
14.1
MAX
1
2
3
4
5
6
7
8
9
2
3
MODULE
+
PC
PR
–
–
–S
SC
+S
+
Symbol
MODULE
EXCHANGE
TOOLBOTH ENDS
(PARTIAL)
Pin
Number
Function
Symbol
Function
FARM
PIN LEGEND
Function
FIAM
Symbol
1
0.38
9.5
6
3
0.49
12.5
7
50.29
1.980
8
2
1.25
31.6
9
1
SCALE: 8X
DETAIL C
15°
MODULE EXCHANGE
TOOL
5
4
2.000
50.80
(ALSO SEE NOTE 2)
0.50
MIN
12.7
2.430
61.72
0.080 / 2,03
0.080 / 2,03
0.080 / 2,03
0.080 / 2,03
0.150 / 3,81
0.080 / 2,03
0.080 / 2,03
0.080 / 2,03
0.150 / 3,81
Pin Dia.
(Inches / mm)
BOTTOM OF
CAP TO TOP
OF PCB
0.005
REF
0.13
SurfMate
Output
Connector
PCB
MODULE
BASEPLATE
(LESS STANDOFFS)
EXCHANGE TOOL
HOOK AREA, 4 PLCS
(BOTH ENDS-SEE VIEWS)
0.265
6.73
0.300
7.62
PRODUCT APPLICATION SPECIFICATIONS
0.50
MIN
12.7
0.15
3.8
0.440
11.18
0.06
1.6
PCB
SurfMate Input
Connector
+IN
N
Neutral
+
+IN
Prim. Control EMI GRD
EMI
N/C
No Connection
Parallel
NC
No Connection EMI/GRD
Ground
–IN
L
Line
–
–IN
–OUT
–
– Out
–
–OUT
– Sense
EN
Enable
ON/OFF
ON/OFF
Sec. Control
ST
Strap
N/C
No Connection
+Sense
BOK
BUS OK
N/C
No Connection
+Out
+
+ OUT
+
+Out
Mini
v
i
c
o
r
p o
w e r . c o m
5
12.19
0.480
0.288
7.32
*
Ø
0.315
8.00
0.215
5.46
0.027
0.69
TYP
0.027
0.69
0.032 ±0.003
0.81 ±0.08
15 VIA HOLES
45°
45°
0.040
1.02
0.050
1.27
0.050
1.27
0.032 ±0.003
0.81±0.08
*
0.050
1.27
TYP
SEE NOTE 4
0.215
5.46
0.027
0.69
0.050
1.27
DETAIL A
0.065
1.65
0.038
0.97
45°
*
SCALE: 4X
(MIRROR IMAGE TO OTHER SIDE)
0.065
1.65
*
0.230
5.84
0.115
2.92
0.054
1.37
*
0.324
8.23
0.040
1.02
DETAIL B
0.230
5.84
0.115
2.92
0.027
0.69
0.179
4.56
SCALE: 4X
(MIRROR IMAGE TO OTHER SIDE)
0.040
1.02
0.050
1.27
*
0.230
5.84
0.115
2.92
*
0.272
6.91
0.340
8.64
0.340
8.64
SOLDER MASK KEEP-OUT AREA
EXCEPT ON PADS
0.138
3.50
0.027
0.69
0.016
0.41
*
0.272
6.90
0.032 ±0.003
0.81 ±0.08
3 VIA HOLES
3 VIA HOLES
0.81 ±0.08
0.032 ±.003
7X Ø
*
0.240
6.10
0.027
0.69
0.138
3.51
0.233 ±0.003
5.84 ±0.08
1.650
41.92
0.063
1.59
0.350
8.89
6
2
0.800
20.32
3
1.300± 0.002
33.02± 0.05
5
4
0.525
13.34
7
1
0.400
10.16
0.250
6.35
0.080
2.03
0.275
6.99
PCB MOUNTING SPECIFICATIONS
SEE DETAIL B
2X 0.125 ±0.002
3.18 ±0.05
2.000
50.81
0.063
1.59
SEE DETAIL A
0.235
5.97
1.270
32.26
1.460
37.08
(SEE NOTE 3C)
6X Ø
4X Ø
0.190
4.83
PLATED THRU HOLE
FOR STANDOFF MTG
(SEE NOTES 3 & 6)
1
2
3
4
5
6
7
Pin
Number
0.130 ±0.003
3.30 ±0.08
0.064 ±0.003
1.63 ±0.08
(#52 DRILL)
(SEE
NOTE 3C)
0.435 (SEE
11.05 NOTE 3C)
0.435
11.05
0.190
4.83
PCB
(ALSO SEE NOTE 2 & EXCHANGE TOOL DETAILS IN RIGHT VIEWS)
FREE OF SOLDER MASK
(SEE NOTE 3C)
7X Ø
SOLDER MASK KEEP-OUT AREA
EXCEPT ON PADS
All dimensions are Inch or Inch / Metric
ANSI / IPC-D-300 specifications apply for Class “B” boards.
Recommended PCB construction:
Multilayer 3 oz Cu with internal power and ground planes. Pad geometry and minimum number of via holes
for connection to power and ground planes shown in Details “A” & “B” for high current applications. Pads to
be covered with solder mask except in circular area shown in Detail “A” & “B”. Final pad height above
laminate to be 0.004" +/- 0.0004".
Light gray area denotes stencil aperture (should include circular solder mask keep-out area on each pad).
0.470
11.93
0.054
1.37
8X 0.050/1.27 X 45°
CHAMFER
0.040
1.02
*
0.230
5.84
0.115
2.92
+
PC
PR
–
–
SC
+
0.56
14.1
MAX
+IN
Prim. Control
Parallel
–IN
–OUT
Sec. Control
+OUT
Function
Micro
Symbol
for Quarter-brick Module
PCB Layout Drawing
2
3
MODULE
EXCHANGE
TOOLBOTH ENDS
(PARTIAL)
–
EN
B OK
+
N
ST
L
1
0.72
18.2
0.38
9.5
0.14
3.6
0.340
8.64
+
N/C
N/C
–
–
GRD
+
Function
IAM 48
Symbol
2
6
1.32
33.6
3
7
1
15°
SCALE: 8X
DETAIL C
0.59
15
MODULE EXCHANGE
TOOL
5
4
1.400
35.56
0.005
REF
0.13
SurfMate
Output
Connector
PCB
(ALSO SEE NOTE 2)
0.080 / 2,03
0.080 / 2,03
0.080 / 2,03
0.080 / 2,03
0.080 / 2,03
0.080 / 2,03
0.080 / 2,03
Pin Dia.
(Inches / mm)
EXCHANGE TOOL
HOOK AREA, 4 PLCS
(BOTH ENDS-SEE VIEWS)
MIN
MODULE
BASEPLATE
(LESS STANDOFFS)
0.50
12.7
2.410
61.22
BOTTOM OF
CAP TO TOP
OF PCB
0.37
9.3
0.205
5.21
0.300
7.62
+IN
–
-Out
No Connection
N/C
No Connection
No Connection ON/OFF
ON/OFF
-IN
+
+OUT
-OUT
+
+IN
Ground
N/C
No Connection
+OUT
–
–IN
Function
PRODUCT APPLICATION SPECIFICATIONS
0.50
MIN
12.7
0.15
3.8
PCB
-Out
Enable
-Bus OK
+Out
Neutral
Strap
Line
Symbol
FiltMod
PIN LEGEND
Function
MODULE
Symbol
VI-ARM
6
v
i
c
o
r
p o
w e r . c o m
0.238
Ø0.059 ±0.001
0.44
0.063
0.125
0.118 ±0.002
0.050
-C-
0.400
0.250
1.000
MATERIALS:
SOCKETS: BE-CU #25, Au PLATED.
CAPS: 260 BRASS, Au PLATED.
HOUSINGS: VECTRA E150i LCP, 50% GLASS FILLED, BLACK COLOR.
-B-
0.172
0.016 ± 0.002
EXCHANGE TOOL NOTCH
1.900
1.400
2.00
INPUT CONNECTOR
0.054
3x
M
A B C
M
A B C
A B C
ø0.003
M
A B C
Ø0.059 ±0.001
DIAMOND PIN SHAPE
0.125
ø 0.005
M
Ø 0.050 ± 0.002
(BOTTOM OF SOCKET CAP,
SOLDERING TO PCB)
ø0.010
4 x Ø 0.193
-A-
2 x Ø 0.055 x 0.005 ± 0.003
CONVEX PROTRUSION SHOWS
POSITION OF PINS BELOW
ø0.007
ø0.080 PIN SOCKET
ø0.064 / ø0.063 ID
-B-
0.172
0.44
Ø0.059 ± 0.001
0.238
0.125
0.063
0.118 ± 0.002
0.016 ± 0.002
2 x Ø 0.055 x 0.010 ± 0.003
CONVEX PROTRUSION SHOWS
POSITION OF PINS BELOW
0.050
-C-
0.250
for Maxi and Mini Size Modules
SurfMate Outline Drawing
0.400
0.700
1.000
2.00
1.900
1.400
-A-
M
ø0.010
0.125
A B C
(BOTTOM OF SOCKET CAP,
SOLDERING TO PCB)
M
M
A B C
ø0.003
ø0.005
M
A B C
Ø0.050 ±0.002
DIAMOND PIN SHAPE
ø0.010
A B C
(BOTTOM OF SOCKET CAP,
SOLDERING TO PCB)
M
A B C
2 x ø0.276
ø0.007
ø 0.080 PIN SOCKET
ø 0.060 / ø 0.063 ID
ø0.007 M A B C
MINI, ø 0.150 PIN SOCKET
ø 0.130 / ø 0.133 ID
MAXI, ø 0.180 PIN SOCKET
ø 0.160 / ø 0.163 ID
Ø 0.059 ± 0.001
3 x ø0.193
0.054
3x
EXCHANGE TOOL NOTCH
OUTPUT CONNECTOR
v
i
c
o
r
p o
w e r . c o m
7
0.125
Ø 0.059 ± 0.001
0.198
0.063
0.118 ± 0.002
-C-
0.250
0.050
1.300
0.800
0.525
0.275
1.400
MATERIALS:
SOCKETS: BE-CU #25, Au PLATED.
CAPS: 260 BRASS, Au PLATED.
HOUSINGS: VECTRA E150i LCP, 50% GLASS FILLED, BLACK COLOR.
-B-
0.34
0.172
0.016 ± 0.002
EXCHANGE TOOL NOTCH
INPUT CONNECTOR
0.054
3x
M
A B C
M
A B C
M
A B C
ø0.003
M
A B C
Ø 0.059
DIAMOND PIN SHAPE
0.125
ø0.005
Ø 0.050 ± 0.002
(BOTTOM OF SOCKET CAP;
SOLDERING TO PCB)
ø0.010
4 x Ø 0.193
-A-
CONVEX PROTRUSION SHOWS
POSITION OF PINS BELOW
2 x Ø 0.055 x 0.010 ± 0.003
ø0.007
ø0.080 PIN SOCKET
ø0.064 / ø0.063 ID
-B-
0.016 ±0.002
0.125
-C-
0.050
Ø 0.059 ± 0.001
0.198
0.063
0.118 ± 0.002
0.34
0.172
0.250
0.400
1.300
0.800
1.400
OUTPUT CONNECTOR
EXCHANGE TOOL NOTCH
for Micro Size Modules
SurfMate Outline Drawing
0.054
3x
M
A B C
M
A B C
0.125
ø0.005
M
ø0.003
M
A B C
A B C
Ø0.050 ±0.002
(BOTTOM OF SOCKET CAP;
SOLDERING TO PCB)
ø0.010
3 x Ø0.193
Ø0.059 ±0.001
DIAMOND PIN SHAPE
-A-
CONVEX PROTRUSION SHOWS
POSITION OF PINS BELOW
2 x ø0.055 x 0.010 ± 0.003
ø0.007
ø0.080 PIN SOCKET
ø0.064 / ø0.063 ID
Part Numbering and Packaging
SurfMates
Five pair sets*
Maxi
Mini
Micro
16017
16021
16025
Mini
22100
22102
Micro
* Inputs and outputs for five modules
Individual Part Numbers*
Input
Output
Input
Output
Maxi
22100
22101
22103
22104
* Sold only in multiples of 35 Maxi, Mini, or 40 Micro. Shipped in JEDEC trays.
Standoff Kits for SurfMate Mounted Modules*
Heat Sinks
Thru hole
Threaded heat sink
No heat sink
Slotted Baseplate
Module Kit # 100 pc Kit #
20178
20188
20179
20189
20185
20188
Thru-hole Baseplate
Module Kit #
100 pc Kit #
20176
20186
20177
20187
20184
20186
Threaded Baseplate
Module Kit # 100 pc Kit #
20176
20186
N/A
N/A
20184
20186
Height above board
with standoff
* Module kits contain enough standoffs and screws for one module. 100 piece kits contain standoffs only.
Module Exchange Tools
Maxi
Mini
Micro
Part Number
22827
22828
22829
NOTE: These tools properly extract modules
from the SurfMate sockets. Removal of a
module without using the tool may damage
the sockets.
8
v
i
c
o
r
p o
w e r . c o m
NOTES
v
i
c
o
r
p o
w e r . c o m
9
Vicor Corporation
25 Frontage Road
Andover, MA 01810-5413
Tel: 978-470-2900
Fax: 978-475-6715
Lombard, IL
Tel: 630-769-8780
Fax: 630-769-8782
Sunnyvale, CA
Tel: 408-522-5280
Fax: 408-774-5555
Austin, TX
Tel: 512-833-6177
Fax: 512-833-6181
Vicor France
Tel: +33-1-3452-1830
Fax: +33-1-3452-2830
Vicor Germany
Tel: +49-89-962439-0
Fax: +49-89-962439-39
Vicor Italy
Tel: +39-02-2247-2326
Fax: +39-02-2247-3166
Vicor U.K.
Tel: +44-1276-678-222
Fax: +44-1276-681-269
Vicor Japan Co., Ltd.
Tel: +81-3-5487-3880
Fax: +81-3-5487-3885
Vicor Hong Kong
Tel: +852-2956-1782
Fax: +852-2956-0782
v i c o r p o w e r. c o m
24217 Rev 3.1 07/06