Thermal Interface
SOLUTIONS
www.lairdtech.com
Thermal Interface M A T E R I A L S
Tgard Electrical Insulators
TM
Tgard™ thermally conductive electrical insulators are used where electrical
isolation is a critical design consideration, with reliability, cut-through
resistance, and thermal conductivity. The Tgard product line has a wide
variety of materials for the unique performance, handling, and assembly
considerations required in electronics devices.
Applications
• Industrial – power supplies and standard TO- packages that
require isolation
• Telecom – board-to-chassis system electrical isolation
25000
0.7
0.6
20000
0.5
15000
0.4
0.3
10000
0.2
5000
0.1
0
0
CP
ar 177
d
CP
22
8
ar
d
Tg
0
50
ar
d
Tg
Tg
0
23
ar
d
0
22
ar
d
Tg
Tg
00
Dielectric Breakdown
Voltage (VAC, 60Hz)
21
ar
d
Tg
00
30
Tg
ar
d
50
3
Tg
ar
d
C-
50
ar
d
TN
20
ar
d
Tg
Tg
K5
ar
d
Tg
Tg
ar
d
2
0
Thermal Resistance
@50psi
Tpcm and Tgrease
High-Performance Products
TM
TM
High-performance products are used in applications where mechanical
tolerances and general design has been optimized for thermal performance.
The Tpcm™ phase change product line is used in applications where
reliability, repeatability, and handling must be controlled to optimize
the performance as part of the total thermal solution. The Tpcm product
line is available in a screen printable formulation that offers the reliability
and performance of a phase change material with the low-cost handling
of thermal grease.
Tgrease™ is used in applications where a minimum bond line, constant
pressure, and ease of screen printing is desired for optimal performance.
Laird Technologies’ high-performance Tgrease products are designed
to maximize reliability by eliminating pump out in most applications.
0.08
5.0
0.07
4.5
4.0
0.06
3.5
0.05
3.0
0.04
2.5
Applications
0.03
• IT – servers, desktops, notebooks, and memory modules
0.02
• Industrial – power supplies, lighting, LED lighting,
and industrial electronics
0.01
0.5
0.0
0.0
90
Tp
0
cm
HP
10
5
Tp
cm
58
Tp
0
cm
58
0S
Tp
cm
67
0
Tp
cm
Tg
68
re
0
as
e
1
Tg
50
re
0
as
e
25
Tg
00
re
as
e
88
Tg
0
re
as
e
98
0
m
e
29
00
1.0
Tp
c
Tm
• Consumer – gaming systems and portable devices
1.5
at
• Telecom – routers and wireless infrastructure
2.0
Thermal Conductivity
(W/mK)
www.lairdtech.com
Thermal Resistance
@50psi (Cin2/w)
Tflex Gap Fillers
TM
Tflex™ gap fillers are used to bridge the interface between hot
components and a chassis or heat sink assembly. The combination
of good thermal conductivity and softness reduces mechanical stress,
but maintains thermal performance.
Applications
• Telecom – wireless infrastructure, routers, and VOIP phones
• IT – notebooks, servers, memory modules, hard disk drives,
solid state drives, scanners, and printers
• Consumer – gaming systems, LCD PDP televisions, and displays
• Industrial – LED lighting, power supplies, lighting ballasts,
controllers, scanners, and power converters
6.0
70%
• Aerospace and military – power supplies,microwave radio,
and controllers
5.0
60%
50%
4.0
40%
3.0
SPECIFICATIONS
30%
Thickness range
0.2 to 8.9mm (0.008” to 0.350”),
availability varies by product line
2.0
UL flammability
94 V0, UL file number E180840
1.0
10%
0.0
00%
0
0
x
le
Tf
x
Tf
le
70
50
0
SF
x
Tf
x
le
Thermal Conductivity
(W/mK)
le
HR
60
60
0
0
50
0
le
Tf
Tf
Tf
Tf
x
le
x
40
0
XS
40
HR
x
x
le
le
Tf
Tf
le
x
20
0
30
V0
0
20%
Softness-Deflection @ 50psi
(2.5mm thick sample)
Tlam™ and Tpreg™ Thermal
Printed Circuit Board
Tlam™ thermally conductive circuit boards are designed with Laird
Technologies’ unique dielectric materials 1KA, HTD and LLD. Tlam
technology improves thermal performance while retaining good
dielectric isolation.
The 1KA material offers high thermal conductivity for applications where a
thick dielectric is required. The 1KA material is available as a freestanding
Tpreg™ to facilitate multilayer and FR4 hybrid circuit boards.
The HTD material is used where high withstand voltage (>5000 V DC)
and continuous use temperature of 150°C are required.
5,000
2.0
4,000
Applications
1.5
3,000
• LED lighting – architectural lighting and street/highway/parking/
signal lighting
1.0
2,000
• Telecom – DC/DC convertors and base stations
0.5
1,000
• Automotive – motor control systems, power steering modules,
ABS braking systems, headlights, brake lights, and day
time running lights
0.0
0
1K
A
1K
A
1K
A
HT
D0
HT
D0
04
LL
D
08
2.5
06
6,000
04
3.0
The LLD material is specifically designed for LED applications where cost
and performance need to be balanced for high volume applications.
6
7,000
4
3.5
• Consumer – LCD LED backlighting units
• Industrial – solar voltaic, industrial voltage regulators, and
power supplies
Thermal Conductivity
(W/mK)
www.lairdtech.com
Dielectric Strength
(VAC)
Tputty , Tpli , and Tgon
Gap Fillers
TM
TM
TM
Tputty™ gap fillers are used to bridge the interface between hot components
and a chassis or heat sink assembly when elimination of mechanical stress or
bulk dispensing are critical design considerations.
Tpli™ gap fillers are used where high thermal conductivity and low pressures
are required.
Tgon™ 800 is a high-performance, cost-effective TIM that can be used where
electrical isolation is not required. Tgon 800’s unique grain oriented graphite
plate structure provides high 240 W/mK thermal conductivity along the XY
plane, and 5 W/mK through the Z axis.
Applications
• Telecom – wireless infrastructure, routers, and VOIP phones
• IT – notebooks, servers, memory modules, hard disk drives,
solid state drives, scanners, and printers
• Consumer – gaming systems, LCD PDP televisions, and displays
6.0
• Industrial – LED lighting, power supplies, lighting ballasts,
controllers, scanners, and power converters
5.0
• Aerospace and military – power supplies,microwave radio,
and controllers
• Tgon 800 is especially good for applications that require
high conductivity and low cost without softness
90%
7.0
80%
70%
60%
4.0
50%
3.0
40%
30%
2.0
20%
1.0
10%
0.0
Thermal Conductivity
(W/mK)
www.lairdtech.com
0
6
80
on
Tg
Tp
ut
ty
50
4
50
Tp
ut
ty
50
ty
94 V0, UL file number E180840
ut
UL flammability
Tp
0.5 to 5.1mm (0.020 to 0.200-inch),
bulk, availability varies by product line
Tp
Thickness range
li
20
2
00%
0
SPECIFICATIONS
Softness-Deflection @ 50psi
(2.5mm thick sample)
Innovative Technology
for a Connected World
Innovative Technology
for a Connected World
About Laird Technologies
Thermal Interface Materials
Laird Technologies designs and manufactures customized, performance-critical
products for wireless and other advanced electronics applications.
As an industry leader in high-performance, cost-effective Thermal Interface
Materials (TIMs) and technologies, Laird Technologies designs and
manufactures thermal products; including gap fillers and putties, phase
change materials, thermal grease and thermally-conductive insulator
materials that meet the demands of any application.
The company is a global market leader in the design and supply of
electromagnetic interference (EMI) shielding, thermal management products,
mechanical actuation systems, signal integrity components, and wireless
antenna solutions, as well as radio frequency (RF) modules and systems.
Laird Technologies partners with its customers to customize product solutions
for applications in many industries including:
• Telecommunications
• Mobile Communications
• Network Equipment
• Automotive
• Industrial & Instrumentation
• Aerospace
• Defense
• Medical
• Consumer Electronics
• Food & Beverage
Laird Technologies offers its customers unique product solutions, dedication to
research and development, as well as a seamless network of manufacturing and
customer support facilities across the globe.
Meeting Ever Increasing
Thermal Demands
Today’s electronics are smaller and more powerful than ever before, leading
to ever increasing thermal challenges for the systems designer. While fans,
heat sinks, and even liquid cooling and thermoelectric devices can be used
to provide enough cooling power, the problem remains transferring the heat
from the hot components into the cooling hardware. TIMs are designed to
fill in air gaps and microscopic irregularities, resulting in dramatically lower
thermal resistance and thus better cooling. Laird Technologies is the world
leader in material development for TIMs, and offers the broadest line of
products to meet every design challenge.
With gap filler pads as thick as 9 mm, as well as electrically insulating and
electrically conductive pads, Laird Technologies can solve any TIM design
challenge. In addition, Laird Technologies provides phase change TIMs that
soften and fill tiny gaps at operating temperature, as well as thermally
conductive greases that conform to any irregularity.
Laird Technologies’ TIMs offer operating temperatures up to 200°C, thermal
conductivities over 5 W/m-K in the Z axis, and tremendous flexibility in form
factor and packaging, including die-cut parts on tape and other solutions to
support any manufacturing scenario.
global solutions: local support
TM
Americas: +1.888.246.9050
Europe: +49.(0).8031.2460.0
Asia: +86.755.2714.1166
www.lairdtech.com
ANTENNAS & RECEPTION
MOBILE DEVICE MECHANISMS
EMI SOLUTIONS
THERMAL MANAGEMENT
WIRELESS M2M & TELEMATICS
THR-BRO-THERMINTERFACE-SOL 1009
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without
notice. Responsibility for the use and application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be
aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability of any Laird Technologies materials or
products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies
products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon
request. © Copyright 2009 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade
marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third
parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.