Packaging Portfolio
Copper Wire
ATEC is one of the pioneers in the industry in the use of the copper wire bonding
process in mass production. ATEC is capable of bonding 1um metallization thickness
with >0.2um ball bond penetration remain on bonding pad without sacrificing ball shear
and zero crater requirement.
Wire size capability: 2.0, 1.5 and 1.0 mil
1um metallization
thickness
Bond Stitch On Ball
ATEC Cu Wire
Technology_by edmon
“Confidential: Do not reproduce or distribute without written approval from ATEC”.
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Packaging Portfolio
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started mass production of 2 million units of SOIC 8L per week in 2008
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recognized and awarded by customer for shipping the first 100 million
units with zero customer complaints
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qualified Cu wire for SOT23 and QFN in 2009
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ramped up production of copper wire bonded units to more than 14
million units per week as of November 2010
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as of March 2015, ATEC has produced more than 2.061 billion units
using copper wire without customer complaint
“Confidential: Do not reproduce or distribute without written approval from ATEC”.
Copper Wire Bonding Milestones:
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