18-5-2016
The company Sintecs
© SINTECS BV
April 2016
The Company Sintecs
Embedded System design & services partner
Founded in 2000
Core competences in
electronic/embedded system development
embedded software development
FPGA design
Electronic design analysis & verification
System-On- Module supplier
April 2016
Sintecs Company presentation
www.sintecs.eu
Page 2
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18-5-2016
The Company Sintecs
More than 30 people active within Sintecs
Main office, Hengelo (OV), the Netherlands
2 R&D offices in Europe
Corporate office, Hengelo the Netherlands
April 2016
Sintecs Company presentation
www.sintecs.eu
Page 3
Main Market Segments
Automotive
Avionics
Defense
Industrial
Medical
Telecommunications
Transportation
April 2016
Sintecs Company presentation
www.sintecs.eu
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Activities
System On Module
System Design
Design
Services
April 2016
Sintecs Company presentation
www.sintecs.eu
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SYSTEM ON MODULE
April 2016
Sintecs Company presentation
www.sintecs.eu
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System-On-Module
In 2013 started with the
development of
System-On-Modules
Freescale platform
i.MX536 / 6 family
QorIQ T1 / T2 family
April 2016
Sintecs Company presentation
www.sintecs.eu
Page 7
System-On-Module
overview
NXP QorIQ T1020 (dual core, integrated GBe)
NXP QorIQ T1022 (dual core)
NXP QorIQ T1040 (quad core , integrated GBe)
NXP QorIQ T1042 (quad core)
NXP QorIQ T2081(quad core, double threaded)
NXP QorIQ LS2088 (end 2016 / begin 2017)
NXP i.MX6 Solo
NXP i.MX6 Dual Lite
NXP i.MX6 Dual
NXP i.MX6 Dual Plus
Carrier board T10xx modules
NXP i.MX6 Quad
Carrier board T2081
NXP i.MX6 Quad+
Carrier board i.MX6 (later 2016)
April 2016
Sintecs Company presentation
www.sintecs.eu
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SOM partners
NXP (Freescale)
Proven partner since 2014
Micron Technology
Samtec
Linear Technology
Mentor Graphics
April 2016
Sintecs Company presentation
www.sintecs.eu
Page 9
Custom Board Development
Development of custom board
Possible in different EDA tool flows
April 2016
Sintecs Company presentation
www.sintecs.eu
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SYSTEM DESIGN
April 2016
Sintecs Company presentation
www.sintecs.eu
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System Design
Product Development
Electronic Design
Embedded Software
FPGA Design
SOM development
Application software design
April 2016
Sintecs Company presentation
www.sintecs.eu
Page 12
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Technology experience
Memory interfaces
SRAM
Up-to LPDDR4
Up to DDR4
QDR*
RLDRAM*
HMC (Hybrid Memory Cube)
Optical Interfaces
SFP/SFP+
QSFP/QSFP+
April 2016
Sintecs Company presentation
HDMI
USB*
Gigabit Ethernet
1/10/100GBe
PCI-e
Gen1/2/3
SATA
SERDES
Up to 25Gb/s
www.sintecs.eu
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Embedded software
Multiple Platforms support
Linux, Android
Board Support Package development
Device driver development
April 2016
Sintecs Company presentation
www.sintecs.eu
Page 14
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FPGA Development
Device selection
Altera
Microsemi
Xilinx
Design Entry
Design Entry
Functional simulation
Synthesis
Place & Route
Timing Simulation
Prototyping
Programming & Debug
April 2016
Sintecs Company presentation
www.sintecs.eu
Page 15
Hardware verification
Prototype verification
Functional verification
Temperature tests
Type approval
EMC
April 2016
Sintecs Company presentation
www.sintecs.eu
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DESIGN SERVICES
April 2016
Sintecs Company presentation
www.sintecs.eu
Page 17
Services overview
Design Rule Check
Constraints
management
Signal Integrity
PCB technology
Decoupling
DDRx timing
Power Integrity
June 2014
Thermal
Sintecs Company presentation
DFM & DFA
www.sintecs.eu
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PCB layout service
April 2016
Sintecs Company presentation
www.sintecs.eu
Page 19
EDA tool flow support
CADSTAR
CR5000
PADS
April 2016
Sintecs Company presentation
Allegro
Expedition
Orcad
Boardstation
www.sintecs.eu
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Library development
Creation and verification of:
Design For Assembly (DFA)
Schematic symbols + footprints
April 2016
Sintecs Company presentation
www.sintecs.eu
Page 21
Design Technology setup
Explore which impedances are needed on the board
How many signal and power planes are needed
What is smallest pitch of BGA’s
How many power rails?
April 2016
Sintecs Company presentation
www.sintecs.eu
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Topology study
Investigate
Component selection
Termination
Impedance
Routing topology
Length
Develop constraints for driving PCB layout
April 2016
Sintecs Company presentation
www.sintecs.eu
Page 23
Signal integrity
Signal over/undershoot
Trace impedances
Eye Pattern / Mask
Crosstalk
Monotonic signals
April 2016
Sintecs Company presentation
www.sintecs.eu
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Timing analysis
DDRx timing
Controller timing model creation
DDRx timing analysis
Detailed timing report
Worst case timing
April 2016
Sintecs Company presentation
www.sintecs.eu
Page 25
Power Integrity
DC analysis
Voltage drop
Current densities
AC analysis
decoupling / Target impedance
Plane noise
April 2016
Sintecs Company presentation
www.sintecs.eu
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Power Integrity - DC
Identify excessive
voltage drop and high
current densities
Determine if there is
enough copper and
transition vias
Analyze circuits pre-and
post layout
April 2016
Sintecs Company presentation
www.sintecs.eu
Page 27
Power Integrity - AC
Identify PDN impedance across
all frequencies
Determine cap values, numbers,
mounting
Experiment with power plane
spacing, location
View propagation of noise from
power pins and vias
April 2016
Sintecs Company presentation
www.sintecs.eu
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Design for Power Integrity
Reduce PCB product costs by…
Minimizing capacitor BOM
Reducing PCB size and layer count
Eliminating design iterations
Up-front PDN planning
Improve time-to-results
Improve product reliability by…
Identifying excessive voltage drop
and high current densities at DC
Meet noise IC noise margins
requirements
April 2016
Sintecs Company presentation
www.sintecs.eu
Page 29
Thermal analysis
Early exploration of thermal
behavior of your board
Try to avoid to block the airflow
with higher parts
Don’t place e.g. critical parts above
high power parts
Start simulation before routing the
board
April 2016
Sintecs Company presentation
www.sintecs.eu
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Thermal analysis
Board Level Simulation
System Level simulation
April 2016
Sintecs Company presentation
www.sintecs.eu
Page 31
Design For Manufacturing
and Assembly
April 2016
Sintecs Company presentation
www.sintecs.eu
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DFM/DFA – Assembly
The DFM/DFA analysis consist out of the following sections:
Assembly:
Component checks
Fiducial checks
Testpoint checks
Padstack checks
Solder paste checks
Pin to pad checks
April 2016
Sintecs Company presentation
www.sintecs.eu
Page 33
DFM/DFA - Fabrication
The DFM/DFA analysis consist out of the following sections:
Fabrication:
Signal layer checks
Drill checks
P/G checks
Solder mask checks
Silkscreen checks
April 2016
Sintecs Company presentation
www.sintecs.eu
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DFM/DFA - Report
April 2016
Sintecs Company presentation
www.sintecs.eu
Page 35
Questions
April 2016
Sintecs Company presentation
www.sintecs.eu
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