Lisa Anfält
BACKGROUND LEVELS OF BANNED AND
RESTRICTED SUBSTANCES IN ERICSSON
PRODUCTS
EXAMENSARBETE
TRITA-KET-IM 2001:10
STOCKHOLM 2001
INDUSTRIELLT MILJÖSKYDD
KUNGLIGA TEKNISKA HÖGSKOLAN
Distribution:
Industriellt Miljöskydd
Institutionen för kemiteknik
KTH
100 44 Stockholm
Tel: 08 790 9118
Fax: 08 790 5034
TRITA-KET-IM 2001:10
ISSN 1402-7615
Preface
This Master of Science Thesis was initiated by Ericsson Utvecklings AB and carried
out as a co-operation between Ericsson Utvecklings AB and the Royal Institute of
Technology (KTH) in Stockholm during the autumn and winter of 2000-2001.
I would like to thank my supervisors, Ulf Malmring at Ericsson Utvecklings AB and
Lennart Nilsson at the Royal Institute of Technology, and all those who have helped
me and given their support throughout the project
Stockholm, 14 March 2001
Lisa Anfält
ii
Abstract
An Ericsson directive called “The Ericsson Lists of Banned and Restricted
Substances” lists substances that are either banned in Ericsson products or that will be
phased out within the foreseeable future. The bans and the restrictions aim at the
intentional use of the listed substances, not at very low concentrations of the
substances that exist as background levels within the materials used in the production.
The objective of this thesis was to map out the background levels of the substances
listed in the directive in materials used in CNCP products. Product specific reference
levels, indicating how much of a substance in a product can be expected to originate
from natural contamination, was also to be calculated. The background based on
which the substances in “The Ericsson Lists of Banned and Restricted Substances” are
not allowed or desirable in Ericsson products was also to be described.
Materials declarations were made for three printed board assemblies contained in
AXE switches and one cabinet. General background levels, based on information
from material producers and from material standards, were established for the
materials in the products. Reference levels, based on the materials declarations and
the background levels, were then calculated for each of the products.
The reference levels can be used as a way of controlling that the Ericsson directive is
being followed. When comparing the reference levels with chemical analysis data of a
product containing a small amount of an added banned substance, the analysis
concentration of the substance deviates significantly from the reference value. A great
advantage of the reference levels is that they are product specific and can be
calculated for products of very different types.
There are many sources of error in the calculations of the reference levels and they
should thus be used with care. More background data is needed on plastics and
ceramic materials.
iii
Sammanfattning
Ericssondirektivet “The Ericsson Lists of Banned and Restricted Substances”
innehåller listor över ämnen som är antingen förbjudna i Ericssons produkter eller
som kommer att fasas ut inom en överskådlig framtid. Förbuden och begränsningarna
syftar på det avsiktliga användandet av ämnena, inte på de mycket låga halter av
ämnena som finns naturligt, som bakgrunds halter, i produktionsmaterialen.
Syftet med detta examensarbete var att kartlägga bakgrundsnivåerna av ämnena i
direktivet i olika material som används i Ericsson Utvecklings AB’s produkter.
Dessutom skulle produktspecifika referens nivåer beräknas. Dessa anger hur mycket
av ett ämne i en produkt som härrör från naturliga föroreningar. Bakgrunden till
varför ämnena på “The Ericsson Lists of Banned and Restricted Substances” inte är
tillåtna eller önskvärda i Ericssons produkter skulle också redogöras för.
Tre kretskort ingående i AXE växlar och ett skåp ingående i byggsystemet BYB 501
materialdeklarerades. Med hjälp av information från materialtillverkare och
materialstandarder togs bakgrundshalter fram för de material som ingår i produkterna.
Referensnivåer, baserade på materialdeklarationerna och bakgrundsnivåerna,
beräknades sedan för respektive produkt.
Referensnivåerna kan användas som ett verktyg för att kontrollera att Ericsson
direktivet efterföljs. Om referens nivåerna för en produkt innehållandes små mängder
av ett tillsatt förbjudet ämne jämförs med resultaten från en kemisk analys av
produkten så bör den uppmätta koncentrationen av det förbjudna ämnet avvika
betydligt från motsvarande referensnivå. En stor fördel med referensnivåerna är att de
är anpassade för varje enskild produkt och kan beräknas för väldigt olika typer av
produkter.
Beräkningarna av referensnivåerna innehåller många möjliga felkällor och resultaten
bör därför användas med försiktighet. Mer bakgrundsdata bör tas fram för keramer
och plaster.
iv
Table of Contents
Introduction.............................................................................................................................................1
Background ..........................................................................................................................................1
Objectives.............................................................................................................................................1
Scope ....................................................................................................................................................2
Methodology.........................................................................................................................................3
Environmental impact ............................................................................................................................4
Metals...................................................................................................................................................4
Antimony, Sb ..................................................................................................................................4
Arsenic, As ......................................................................................................................................4
Beryllium, Be ..................................................................................................................................5
Bismuth, Bi......................................................................................................................................5
Cadmium, Cd ..................................................................................................................................5
Chromium, Cr..................................................................................................................................6
Lead, Pb...........................................................................................................................................6
Mercury, Hg ....................................................................................................................................7
Nickel, Ni ........................................................................................................................................8
Tin, Sn .............................................................................................................................................8
Organic compounds .............................................................................................................................8
Chlorofluorocarbons (CFCs) and halogenated hydrocarbons..........................................................8
Halons .............................................................................................................................................8
Halogenated flame retardants ..........................................................................................................9
Phthalates ......................................................................................................................................10
Halogenated polymers ...................................................................................................................10
Other organic compounds .............................................................................................................10
Legislation .............................................................................................................................................11
EU directives .................................................................................................................................11
National and international legislation............................................................................................11
The Products .........................................................................................................................................14
CNCP products ..................................................................................................................................14
Products concerned in this study .......................................................................................................14
Materials declarations ..........................................................................................................................16
Databases...........................................................................................................................................16
MATILDA ....................................................................................................................................16
PRIM .............................................................................................................................................16
ELIZA ...........................................................................................................................................16
Methodology.......................................................................................................................................17
Compilation of declarations...............................................................................................................18
Survey of natural contamination .........................................................................................................19
Methodology.......................................................................................................................................19
Materials used....................................................................................................................................20
Aluminium ....................................................................................................................................20
v
Antimony.......................................................................................................................................20
Bismuth .........................................................................................................................................20
Cadmium .......................................................................................................................................20
Ceramics........................................................................................................................................21
Chromium......................................................................................................................................21
Copper ...........................................................................................................................................21
Epoxy ............................................................................................................................................21
Laminate........................................................................................................................................21
Lead...............................................................................................................................................22
Nickel ............................................................................................................................................22
Tin .................................................................................................................................................22
Zink ...............................................................................................................................................22
Preparation and adaptation of data...................................................................................................23
Calculation of reference levels...........................................................................................................25
Results ....................................................................................................................................................27
Material content of the studied products............................................................................................27
Metals ............................................................................................................................................27
Plastics...........................................................................................................................................27
Ceramics........................................................................................................................................27
Other..............................................................................................................................................27
Background levels in the materials ....................................................................................................27
Product specific reference levels........................................................................................................28
Discussion and conclusion ....................................................................................................................29
Possible use of the reference levels....................................................................................................29
Comparison with analysed products ..................................................................................................29
Comparison with present CNCP-PBA level Maximum and Target Signal Values.............................30
Reliability of input data......................................................................................................................31
Creating reference levels for other products .....................................................................................32
Future research..................................................................................................................................33
Conclusion .........................................................................................................................................34
List of abbreviations .............................................................................................................................35
References..............................................................................................................................................36
Publicly available written sources .....................................................................................................36
Internal Ericsson documents..............................................................................................................38
Databases...........................................................................................................................................38
Internet/Intranet sources....................................................................................................................38
Personal communication....................................................................................................................39
Appendices.............................................................................................................................................41
Appendix I The Ericsson Lists of Banned and Restricted Substances .........................................43
Appendix II Summary of regulations concerning substances on The Ericsson Lists of Banned
and Restricted Substances .............................................................................................................51
Appendix III Materials declarations of the components in the studied printed board assemblies57
Appendix IV Materials declaration of ROJ 204 03 ......................................................................73
vi
Appendix V Materials declaration of ROJ 207 056 .....................................................................79
Appendix VI Materials declaration of ROJ 212 206 ....................................................................85
Appendix VII Materials declarations of the components in the studied equipment practise........93
Appendix VIII Materials declarations of cabinet, doors, back plate, side plate and earthquake
proof set.........................................................................................................................................99
Appendix IX Material contents of the studied products .............................................................103
Appendix X Calculations of reference levels for the printed board assemblies. ........................107
Appendix XI Calculations of reference levels for the equipment practice. ................................111
Appendix XII Ericsson internal: Code letters for component manufacturers.............................115
vii
viii
Introduction
In this chapter an introduction to the study is given and the objectives are described.
The scope of the study is defined and the methodology presented.
Background
The problem of pollution has gone from being a local or regional problem to being a
global problem. In developed countries the pollution no longer comes from point
sources, such as emissions from factories, but from diffuse sources such as products.
If the products are not waste treated and disposed of in a proper way, dangerous
substances diffuse into the environment. Since a perfectly ecocyclic waste
management is non existent today, some substances have been banned in certain
products.
To summarise existing and coming legislative demands, Ericsson made a list in 1998
of substances that should be banned or restricted in the company. The list was made a
directive in March 2000 and was called ‘The Ericsson lists of banned and restricted
substances’ (appendix I). This directive lists a number of substances that are either
banned in the production and in the products, or of which the use is restricted. The use
of substances that are listed as restricted is allowed but should be substituted as soon
as technically and economically acceptable alternatives are available. The bans and
the restrictions aim at the intentional use of the listed substances. They are not
intended for the presence of very low concentrations of substances originating from
‘natural’ contamination or for background levels of substances in the materials used in
the production. However, when chemical analysis of a product is done the banned and
the restricted substances will be found in very low concentrations, even if they are not
deliberately added to the product.
Initially the Ericsson lists of banned and restricted substances contained threshold
values. They were there to point out that very low concentrations due to natural
contamination always exist and are accepted. The values were estimated roughly and
the same value was used for several substances. These threshold values were taken
away from the directive since many people found it contradictory to allow a certain
amount of a substance that was banned. Also, Ericsson did not want to encourage the
suppliers to use the maximum amount allowed.
In 2000 Ericsson Network Core Products (CNCP) defined general maximum signal
values and target signal values for the substances of current interest in printed board
assemblies. The values were based on results from chemical analysis of printed board
assemblies, studies of soil exposed to people and nature and the limits set by Boliden
Mineral for recycling of electronic products.(Andersson, 2000)
Objectives
The objectives of this thesis are
• to map out the background levels of the substances listed in “The Ericsson List of
Banned and Restricted Substances” in materials used in CNCP products.
• to calculate unofficial ‘reference levels’ for the listed substances indicating how
much of a certain substance in a certain product can be expected to originate from
natural contamination. This could be done by means of analysis, literature studies
and statistical calculations. The values can be based on material declarations from
1
•
suppliers of components or, alternatively, on results from chemical analysis of
ground products. If a substance exceeds the reference level, it should result in an
in-depth analysis of the material content of the product. The values are aimed for
internal use at Ericsson and are not going to be made public or available for the
suppliers.
to describe the background based on which the substances in “The Ericsson List of
Banned and Restricted Substances” are not allowed or desirable in Ericsson
products.
Scope
The goal is of course to eventually have reference levels for all CNCP products, but
that is beyond the scope of a Master of Science thesis. The work is therefore focused
on three different printed board assemblies (ROJ 204 03, ROJ 207 056 and ROJ 212
206) and one cabinet (BYB 501 180). The printed board assemblies (PBAs) were
chosen because of their large production volumes and the difference between them.
The cabinet was chosen because of its production volume and also because a smaller
study of its material content had already been done (Ekstrand and Karlsson, 2000).
The reference levels are specific for each product. However, new reference levels, for
other products, can be calculated using the collected raw material data and the same
calculations and methods as in this study.
Since a printed board assembly (PBA) contain a large number of different materials,
the data on background levels is limited to materials that make up more than 1 % of
the product and materials where data is available. Background levels of precious
metals in the different materials have not been studied.
‘Natural contamination’ or ‘background levels’ in this context could be defined as
very low concentrations of a substance that has not been deliberately added to the
material. ‘Reference level’ is then defined as the concentration of a substance in a
product that is present exclusively due to natural contamination.
Reference levels are calculated for cadmium, mercury, antimony, arsenic, beryllium,
bismuth and lead but not for hexavalent chromium, nickel, tin and halogens even
though they are also present on the Ericsson list of restricted substances for some
applications. The reason for this is that it is not possible to distinguish the valence of
chromium in a chemical analysis of the type generally performed for PBAs (mass
spectrometry and emission spectrometry) and a reference value is therefore
unnecessary. The restriction for nickel is only applicable when in skin contact, which
is not the case for the products in this study. Organo-tin, which is on the restricted list,
is not used in the products. No values for halogens are calculated because of the
difficulty of getting information on their background concentrations in materials.
When describing the background based on which certain substances have been placed
on the Ericsson lists of banned and restricted substances, focus is set on
environmental impact and legislative demands. Environmental impact includes both
effects on the ‘green’ environment and health effects. Other factors however that
might have influenced the decision of putting a ban or restriction on a substance are
not described or discussed in the report. Examples of such factors could be green
business, public opinion, economic incentives and disincentives.
2
Methodology
Laboratories and design engineers were visited and a general knowledge of how the
PBAs and cabinets are composed was obtained. Time was spent getting to know and
use different databases within Ericsson, such as Prim, Eliza and Matilda. When
searching for literature it was found that there is not much general literature on
contamination of substances or background levels in materials. Most data had to be
taken directly from the industry.
The products to be studied were picked out with the help of product experts.
Material declarations of components in the products of interest were collected from
Matilda and requests for material declarations were sent out to the manufacturers.
When a declaration of a component was received it was integrated in an excel
workbook, in a format where the material composition of the whole product could be
easily calculated. A visit was made in the factory in Nynäshamn to see how the
printed boards were mounted and to learn about the soldering process.
When the main materials of the product could be distinguished, various attempts of
finding data on background levels of different substances in the materials were made.
The most awarding way was to contact material industries directly, via e-mail and
telephone. Material standards were also studied to see what background
concentrations they accepted. Data from a recent study where several different printed
boards had been analysed was used for the background levels in the printed board
laminate.
When sufficient materials declarations and background level data had been collected,
reference levels could be calculated. One set of background levels for each material
was prepared and used in the calculation of reference levels, i.e. the same material
data was used for all products.
3
Environmental impact
This chapter describes the effects of the substances on ‘The Ericsson Lists of Banned
and Restricted Substances’ on health and environment.
Metals
Heavy metals, i.e. elements with a density of more than 5 kg/dm3, are often
associated with health- and environmental effects. The most discussed and toxic ones
are Cd, Hg and Pb. They do not have any known useful function in biological
organisms. Other heavy metals, such as Sn and Cr, lighter metals and some halfmetals, such as As, are also a risk for the environment.1
Metal-organic compounds often constitute a larger risk than inorganic compounds.
This is due to the fact that organic substances are more easily taken up by living
organisms. When the first large environmental debates started in the sixties, partly due
to Rachel Carsons famous book “Silent spring”2, metal-organic compounds,
particularly alkyl-mercury, were the main topic.
Antimony, Sb
Sb2O3, the main antimony compound used commercially, is often used along with a
flame retardant. It shows no perceptible flame-retardant action on its own. Together
with halogen-containing compounds, however, it produces a marked synergistic
effect.3
Antimony and its compounds are harmful to the environment and human health. They
are dangerous to inhale and consume. They are also poisonous to water organisms and
may cause severe damage to water environments.40 Antimonytrioxide is probably
carcinogenic. It can be transported over long distances in the atmosphere and can
come down with the rain and make the earth less fertile. Antimony is not an essential
metal. The trivalent compounds are about ten times more toxic than the pentavalent.4
If the concentration of Antimony is high in products, the recycling units refuse to
recycle the products or have high penalties. The threshold from Boliden Mineral AB
regarding Antimony is 0,05 % and the penalty start from 0,01 %.40
Arsenic, As
Arsenic is a half-metal that exists in inorganic form in mineral. In Sweden some ores
contain arsenic pyrites (FeAsS). The Boliden mine is the biggest deposit of arsenic
pyrites.41 When mining these ores a local diffusion of arsenic can take place.
Diffusion via air also occurs around certain metal industries and smelting plants. An
example of this is the Rönnskär smelter in Skellefteå. In the sixties, the Rönnskär
smelter released about two thousand tonnes of arsenic yearly to the sea. These
releases had long term effects and the sediments in the whole gulf of Bothnia still
have levels of As ten times above the normal.42 Arsenic can also be spread when
burning coal.
Arsenic is poisonous if eaten or inhaled. Organic As, which is often found in fish and
seafood, is less poisonous than the inorganic arsenic compounds. The lethal dose of
Arsenic trioxide (As2O3), which was the classic substance for murder by poisoning, is
about 100 mg for human. In smaller doses As increase the risk of developing lung and
skin cancer. It is also believed that women exposed to arsenic might suffer from
reproduction disorders and deformations of the foetus. 41
4
Beryllium, Be
Beryllium is an alkaline earth metal with low density and high melting point, which is
why it is of large interest for different technical applications. It can be found in trace
amounts in minerals used for production of other metals. Beryllium is a relatively rare
element; its concentration in the earth crust is 6 ppm. In Sweden emissions of
beryllium have been observed at the re-smelting of beryllium-containing alloys.41
However, the main part of beryllium emissions comes from the combustion of fossil
fuels. The knowledge of how beryllium behaves in nature is very limited, but, at
today’s low levels in surface waters and soils, it probably does not have a negative
effect on the environment.5
Beryllium compounds are on the Ericsson list of restricted substances because of its
health effects. They may damage the health at prolonged exposure and cause Chronic
Beryllium Disease (CBD). CBD occurs after inhalation of dust or fumes containing
beryllium and affects primarily the lungs. The most typical signs of the disease are
pneumonia, cough, chest pain, weight loss, fatigue and general weakness. The
mortality rates among CBD patients are as high as 37%. In addition to CBD, there is
an increased risk for lung cancer if beryllium dust is inhaled.
The high thermal conductivity and good electrical insulation of beryllium oxide has
made it the natural choice for spreading heat in electronic packages, preventing
components from breaking due to high temperatures. Beryllium oxide is dangerous as
dust or fumes but harmless as a solid. In electronic products, the beryllium oxide is
normally sintered and encapsulated, resulting in very low risk during production and
use of the product. Instead, the greatest hazards exist in the extraction and production
of the beryllium compounds because a lot of dust is generated there. There could also
be some risks at the disassembly of electronic equipment if the beryllium oxide
components were to be dismounted in detail.5
Bismuth, Bi
Bismuth is negative for the recycling process since it makes copper brittle
(Mälhammar, 2001). Boliden has a penalty for Bi in material for recycling of copper
if the level exceeds 10 ppm. The corresponding limit at Union Miniere is 100 ppm
(Berglund, 2000).
Bi is sometimes used instead of lead in solder to lower the soldering temperature. This
could lead to a conflict since both lead and bismuth are to be phased out in Ericsson
products.
Cadmium, Cd
Over the last century there has been a spread of Cd to the environment in general.
This is a result of the industrial use, but Cd is also supplied as a contaminant of
phosphate-fertilisers.
Cadmium is taken up by humans from water, food and air pollution, and is
concentrated in the kidney. Cadmium has a very long biological half-life in the human
body, 10 to 30 years, and is therefore accumulated for a very long time. In addition to
kidney damages, which occur at relatively low doses, high levels of the metal can
cause changes in the skeleton and the lungs.1 Cadmium is classified as a probable
human carcinogen and higher doses can also give diabetes, spinal damages, anaemia
and affect the immune system.40
For non-smokers, the main source of exposure to Cd is through food. Cadmium
concentrates in, for example, wheat, rice and tobacco. The cadmium content in wheat
5
has doubled since the beginning of the last century. In Sweden the level is sometimes
higher than the threshold value suggested by WHO (0,1 mg/kg).6
The Cd deposition is larger in the south of Sweden than in the north. This is probably
due to the higher precipitation in the south of Sweden. Since the beginning of the
seventies, the deposition of Cadmium has decreased significantly. Sweden is close to
the environmental goal set by SEPA; to reach a balance between the in- and out flow
of Cd in arable land. The two main sources, deposition from air and from fertilisers,
have decreased a lot during the last few years.7
Cd is used as electrodes in certain kinds of batteries. In 1982 the use of Cd was
banned in colour pigments, surface treatments and stabilisers for plastics in Sweden.
However, the large import of such products made it difficult for the ban to get a full
effect.
Due to the increasing acidification, different kinds of rock and soil have started to
release Cd, making it more bio-available. This, along with the release of Aluminium,
is seen as a large threat. It is not so much the acidity as the metals that change the life
in lakes and streams. By knocking out crayfish and different invertebrates, certain
types of fish can also be affected indirectly.1
NiCd batteries for some applications, and cadmium in some thick film pastes are
exempt from the Ericsson ban. However, there are alternative cadmium-free pastes on
the market and a complete ban of Cd in Ericssons products is expected to come soon
(Andersson, 2000).
Chromium, Cr
Hexavalent chromium, which is the form concerned in the list of banned substances,
can easily pass through cell membranes. Accordingly, it is easily absorbed and
produces various toxic effects within the cells. Furthermore, hexavalent chromium
causes severe allergic reactions. Small concentrations of hexavalent chromium in the
environment might lead to an increase of allergies. Asthmatic bronchitis is another
allergic reaction linked to hexavalent chromium. It is also considered genotoxic,
potentially damaging the DNA.8
Hexavalent chromium is carcinogenic. Exposed workers stand an increased risk of
developing lung cancer and cancer in the nasal cavity. Chromium is used in colour
pigments, as an alloy-metal in stainless steel and as protection against corrosion
(chromium plating).41 The risks associated with hexavalent chromium seem to be
highest in the chromium production industry followed by the chromium plating
industry. In addition to the health effects, hexavalent chromium compounds are
assumed to be toxic for the environment. Studies have shown that disturbed
reproduction and reduced growth are chronic effects on fish caused by chromium.5
Hexavalent chromium contained in wastes can easily leach from landfills that are not
appropriately sealed. During incineration of hexavalent chromium contaminated
wastes the metal evaporates through fly ash. Hexavalent chromium in fly ash is easily
soluble in water.9
Lead, Pb
The use of lead involves dispersing throughout all sections of the environment. Lead
in gasoline and lead ammunition, for example, is dispersed directly into the
environment. Other uses give rise to lead-bearing waste which, sooner or later, can
lead to lead dispersal.
Lead is very effectively bound to the surface layer of the ground and is only very
slowly transported away from there. Because of this, the lead concentrations in the
6
ground are still increasing in Sweden although the fallout of lead has decreased with
70% during the last 20 years.42
Lead bio-accumulates and is toxic to aquatic life and to warm-blooded animals. It also
accumulates in the environment and has high acute and chronic toxic effects on
plants, animals and micro-organisms.10
Lead can damage both the central and peripheral nervous system of humans. Effects
on the endocrine system have also been observed. In addition, lead can adversely
affect the cardiovascular system and the kidneys.8 Children are more sensitive to lead
than adults. Small children’s intellectual development can be negatively affected by
exposure to lead.11 More than 50 % of the emissions of lead to the air has come from
motor fuel.41
Consumer electronics constitute 40% of lead found in landfills. The main concern in
regard to the presence of lead in landfills is the potential for the lead to leach and
contaminate drinking water supplies.9
In 1991, the Swedish parliament passed a government bill specifying that all lead
usage should be phased out in the long-term, primarily through voluntary measures.11
An Ericsson directive says that lead-free solder shall be used in 80% of the new
products by the end of 2001.36 Lead shall be phased out completely after 2004. Lead
chromate, a substance used in pigments, is banned by Ericsson. Lead is present
mainly in solder and in accumulators.40
Mercury, Hg
Mercury is used both as a metal and as inorganic and organic compounds. When
mercury is released into the environment, micro-organisms can convert the metal into
methyl mercury. One of the serious problems as far as mercury is concerned is thus its
ability, in the environment, to lose its more stable metallic form and subsequently to
become more poisonous.11 Methyl mercury can pass through biological membranes
and is toxic to aquatic life and to warm-blooded animals. It has chronic effects and
causes damage to the brain. Mercury bio-accumulates, bio-magnifies and has a long
biological half-life.10 It can be transported over great distances in the atmosphere.
Pollution resulting from mercury handling is thus an international problem.
Mercury leaks from the surface ground-layers to lakes and streams, where it is taken
up by fish and other living organisms. The metal does not do much harm to the fish
itself, but since methylated mercury concentrates through the food chain via fish, it is
risky for humans to eat the fish. A large intake of mercury can cause damage to the
central nervous system. The National Food Administration advise pregnant and
breast-feeding women not to eat fish from Swedish lakes.42
Methyl mercury is easily transferred via the placenta to the foetus, whose brain is very
sensitive during the early stages of development. Children of mothers consuming a
great deal of fish containing high levels of mercury run a risk of retarded
psychological and physical development.12 However, today there are signs indicating
that the level of mercury in fish is on its way down.42
It is estimated that 22% of annual world consumption of mercury is used in electrical
and electronic equipment.8
7
Nickel, Ni
Nickel has not been proved essential to man. It can be taken up from food via the
intestines and also through air exposure. The most important health effect is contact
allergy. Exposed workers also have a higher frequency of cancer in lungs, nose and
sinuses. Certain compounds, such as nickel carbonyl (Ni(CO)4), are very toxic and
carcinogenic.41
Tin, Sn
Organic tin compounds are very poisonous. They have serious influence on the central
nervous system with symptoms like cramp attacks and hallucinations. Organic tin has
been used as fungicides, anti-fouling substances and stabilisers for PVC.41
Tributyltin (TBT) has been widely used as an additive in anti-fouling paint, which
prevents the growth of organisms such as barnacles on the hulls of ships. TBT causes
changes to many organisms, for example alterations in shell structure and growth in
oysters. The development of male sex organs in female gastropods ( a phenomenon
referred to as imposex) is a well documented example of morphological changes
induced by TBT. This phenomenon can ultimately cause population failure as
effective reproduction ceases.13
Organic compounds
Several organic compounds are mentioned in the Ericsson directive. It is especially
the halogenated organic compounds that are toxic to the environment since they are
stable and easily taken up by living organisms.
Chlorofluorocarbons (CFCs) and halogenated hydrocarbons
The ozone in the atmosphere prevents the suns UV-radiation from reaching the
ground. A depleted ozone layer gives less protection. The increased radiation causes
increased degradation of organic material, for living organisms as well as for technical
materials having organic coatings (eg. Paint, plastic).14
HCFC (hydrochlorofluoro carbon) and HFC (hydrofluorocarbon) now usually replace
completely halogenated substances such as CFC (freons) and halons as chemicals,
coolants and for other applications. This substitution has allowed a quick transition
from the substances with the most serious impact on the environment. However, the
substitutes are not harmless. HCFC-22, the most common substitute for CFC, has an
ozone depleting effect of about 5% of CFC-11 for the long-term effects, but 15-20%
for the short-term effects (20 years). The phase-out of HCFC is to be completed by
2030, but in Sweden it will probably be done earlier.14
In 1987, Ericsson decided to terminate all use of CFC-113 as soon as possible.15 From
1988 to 1994 the consumption of ozone depleting substances in Sweden decreased
with 93%.16
Halons
Halons are used for fire fighting. According to regulation (SFS 1995:636) new use of
Halons was prohibited from July 1, 1995, and use in existing fire extinguishers from
January 1, 1998.23 It can still be found in old fire extinguishers. Halons have ozonedepleting potentials several times larger than those of CFCs.42
8
Halogenated flame retardants
Flame-retardants are substances that are added to materials to prevent a fire from
starting or spreading. The most common flame-retardant in electronic products is
tetrabromobisphenol A (TBBA), followed by polybrominated diphenyl ether (PBDE).
PBDEs can be considered to be environmentally stable and persistent compounds. It is
bio-accumulative and fat-soluble. TBBA is believed to be at least ten times less toxic
than PBDE, when chemically bonded to the material.17 Brominated flame-retardants
accumulate in the body and cause disturbances in the immune system and the
hormonal system. Exposure to certain brominated flame-retardants in early life can
induce neurotoxic effects similar to those caused by other toxic lipophilic
organohalogens such as PCB and DDT Research has revealed that levels of PBDEs in
human breast milk are doubling every five years. These high levels are a reason for
concern since PBDEs are believed to cause problems with learning and remembering,
and retardation of the brain growth of the baby.41 Brominated flame-retardants might
also be the cause of cancer of the digestive and lymph systems.
The presence of polybrominated flame-retardants in plastic makes recycling
dangerous and difficult. It has been shown that polybrominated diphenylethers form
toxic polybrominated dibenzo furans (PBDF) and polybrominated dibenzo dioxins
(PBDD) during the extruding process, which is part of the plastic recycling process.18
In addition, high concentrations of PBDEs have been found in the blood of workers in
recycling plants. A recent study found that when electronic equipment is recycled,
dust containing toxic flame-retardants is spread in the air.19 Analysis of blood samples
from employees in an electronics-dismantling plant, clerks working full time at
computer screens and, as a control group, hospital cleaners showed that workers at
dismantling facilities had 70 times more of one form of flame-retardant than the
hospital cleaners had. The levels of flame-retardants in the blood of clerks working
full-time at computer screens were slightly higher than those for cleaners. Humans
may directly absorb PBDEs when they are emitted from electronic circuit boards,
plastic computer and TV covers.
The environmental risks posed by landfilling and burning are also significant.
Leachate from landfills may contaminate water sources. Fires at landfill sites or
incineration of electronic waste under badly controlled conditions may give rise to the
formation of halogenated dioxins and furans.20
The use of higher brominated flame-retardants is increasing. They are not as easy for
living creatures to take up as the lower brominated ones, but there is not enough
known about these substances to estimate how large a risk they constitute. There
might be a risk of them breaking down into lower brominated substances.21
It is likely that an EU directive will cover polybrominated biphenyls (PBB) and
PBDE, while TBBA presently does not seem to be facing a ban. Ericsson is planning
to eliminate halogenated flame retardants in printed boards in 80 percent of the
products before 2002 and are currently, like many other companies, evaluating and
making prototypes with halogen free printed boards.22 A wide range of Br-free
materials is already available on the market meeting the UL94 V-0 requirement (fireprotection requirement). There are halogen-free materials available for all levels of a
product, from enclosures down to printed board laminates and integrated circuit
encapsulants. The materials look promising.3
9
Phthalates
Phtalates are used as softeners in for example PVC. They are a group of colour- and
scentless liquids that have low volatility and very low solubility in water. DEHP
(diethylhexylphtalate) is the most commonly used. However, there is an increase in
use of DIDP (diisodecylphtalate) since it migrates less than DEHP.43 Phthalates are
found in high concentrations in sediments and sewage sludge and causes adverse
effects to the liver, the kidney and testicles.40
Halogenated polymers
The possible emission of dioxins during the production of poly vinyl chloride (PVC)
is an environmental problem. Another is the stabilisers, in particular the heavy metals
and phthalates (see above). Tin stabilisers in PVC have negative impacts on the
immune system of human beings. Another problem is the production of chlorine as a
raw material for production of the vinyl monomer. As chlorine is still to a great extent
made according to the mercury process, loss of mercury to the surrounding,
particularly around the production site, is a big health hazard. However, the use of
membrane cell technology will solve this problem in the future.40
Other organic compounds
Azo compounds used in colorants are allergenic.
Formaldehyde (Methanal) is on the Ericsson list of restricted substances. It is a
colourless, pungent gas that is easily dissolved in water (formalin), alcohol and ether.
It is used in the manufacture of plastics and as a preservative. Formalinic resin is used
as a binder or glue for laminate and wood. Formaldehyde has been used as a
preservative in cosmetics, detergents etc. Formaldehyde is allergenic and poisonous. It
is very reactive and binds to proteins and to DNA. The latter can cause chromosomal
damages constituting the first step to cancer.44
10
Legislation
In this chapter legislation on national, international and EU level concerning the
substances on the Ericsson Lists of banned and restricted substances is presented.
EU directives
On June 13, 2000, the European Commission issued two legislative proposals for
directives on electrical and electronic equipment. The Proposal on "Waste Electrical
and Electronic Equipment ("WEEE Proposal")" deals with the management of waste
from electrical and electronic equipment ("WEEE"). The Proposal for a "restriction of
the use of certain hazardous substances in electrical and electronic equipment"
("Restricted Substances Proposal") provides for the phase-out of certain substances in
electrical and electronic equipment.
According to the Restricted Substances Proposal, the use of lead, mercury, cadmium,
hexavalent chromium, polybrominated biphenyls (PBBs), and polybrominated
diphenylethers (PBDEs) must be substituted by January 1 2008, PBBs and PBDEs
possibly even by 2004. A review in 2004 will ensure that the ban is justified. The
proposal allows for exemptions from the ban for EEE materials or components if their
use is "technically or scientifically unavoidable" or substitutes would cause more
harm to human health or the environment. Several exemptions are included in the
directive: mercury in certain lamps and laboratory equipment; lead in some lighting,
in electronic parts and in steel alloys; cadmium in certain photocells as well as for a
few anti-corrosion uses.
A draft for of the directive is currently discussed (February, 2001). Given the usual
length of the decision procedure, the proposals will not become law before spring or
early summer 2001 at the earliest. The WEEE Proposal and the Restricted Substances
Proposal are not the only measures the Commission envisages with regard to
electrical and electronic equipment. The Commission has also drafted a proposal for a
directive that aims to reduce the overall harmful impact on the environment of
electrical and electronic equipment, the "EEE-proposal". This draft sets out certain
design standards and requires a conformity assessment procedure before electrical and
electronic equipment is placed on the market.40
National and international legislation
Lead, mercury and their compounds are already banned in many countries for certain
usage. They may not be imported or exported for industrial use. Products that contain
lead or mercury must be marked. The Danish proposed law, that would ban virtually
all use of lead in products, is the strictest. The EU has however opposed strongly to
the law since it might cause trade barriers. Lead and mercury are restricted or banned
by EU and 17 US states for use in packaging. Lead is restricted in Sweden in
mechanical plastic parts and EU has banned mercury for use in electronics, apart from
use in fluorescent lightning.
Cadmium is restricted or banned for use in pigments for plastics, paints and enamels,
as stabiliser for plastics, as protective surface coating, batteries and in packaging. The
Austrian and the Swedish legislation are the strictest. The EU 91/338/EEC restricts
use of cadmium in dyes, pigments, paints and enamels. Austria, Switzerland,
Denmark, New Zealand and Sweden ban cadmium as a plastic stabiliser. A proposed
battery draft calls for out-phasing of Ni-Cd batteries before year 2008. Some of
Ericssons customers have cadmium as a restricted substance. Many customers have
bans on NiCd batteries.
11
Chromium in paint and pigments is restricted by Telia. EU restricts the content of
hexavalent Chromium in packaging to 100 ppm in 30 June 2001.
There is a proposed ban for PBB in Denmark. Sweden has planned to ban all
marketing of halogenated flame-retardants. Although there is no direct ban on PBBs,
manufacturers in OECD countries made a Voluntary Industry Commitment to cease
manufacture of PBBs. To meet German dioxin prohibition, some EIA members
restrict use of PBBs and PBBOs, which may generate dioxin unintentionally during
manufacture.40
An international agreement concerning ozone-depleting substances –the Montreal
Protocol - was made in 1987. The use of fully halogenated chlorofluorocarbons is
banned in all countries that have signed the protocol. The Montreol Protocol states
that consumption levels of HCHCs until set target dates must not exceed a certain
percentage of the consumption level of 1986 with an increasing reduction rate of
ozone depleting substances. The Vienna Convention from 1985 is much weaker with
no set reduction targets. In 1988 the government and the parliament in Sweden
adopted a plan for a faster, gradual phase-out of the use of the CFC compounds 11,12,
113, 114 and 115. It was decided that “CFC use in Sweden should be reduced by 50%
by January 1, 1991, and virtually cease altogether by January 1, 1995.”23
The EU regulation 3093/94 applies to production, use, importation, exportation,
recovery and supply of: chlorofluorocarbons, other fully halogenated
chlorofluorocarbons, halons, carbon tetrachloride, 1,1,1-trichloroethane, methyl
bromide, hydrobromofluorocarbons and hydrochlorofluorocarbons. It shall also apply
to the reporting of information on these substances. No production of
chlorofluorocarbons, carbon tetrachloride or fully halogenated chlorofluorocarbons
shall occur after 31 December 1994, Halons after 31 December 1993,
hydrobromofluorocarbons and 1,1,1-trichloroethane after 31 December 1995. Methyl
bromide shall be phased out by Dec 31 2004 according to directive 2037/2000. No
producer or importer shall place hydrochlorofluorocarbons on the market or use them
for his own account after 31 December 2014. Import and export of the controlled
substances to a country that has not signed the Montreal Protocol are forbidden.
Controlled substances must be recovered and precautionary measures to prevent
leaking must be taken. After these dates users, importers and exporters of ozonedepleting substances may apply for a special license from the Environmental
Protection Agency, if no other alternative to the substance is possible. CFC 11, CFC
113 , CFC 114 , CFC 115 , CFC 12 ,HCFC 22 are on the Ericsson banned list and
shall not be used in products. FCs, HCFCs and various HFCs, except coolants, are on
the Ericsson restricted list and shall be phased out in the products .
On the 1 July 2000 Denmark introduced an environmental tax for importing cables
and other products containing PVC into the country. In Denmark the Ministry of
Environment and the industry have made an agreement to reduce the amount of PVC
ending up in incinerators, to phase out the use of lead-containing stabilisers and
pigments in PVC that is normally incinerated. EU has issued a Green Paper on PVC.A
green paper is not a legal requirement but an evaluation with recommendations that
might lead to regulatory measures. EC concludes that regulatory measures might be
necessary for the presence of heavy metals if it turns out that there is no safe way to
reuse, recover or dispose of such products. Plasticisers, mainly phthalates in PVC
have been much debated lately due to the environmental risk. Plasticisers are
necessary to make flexible PVC products. 93% of the plasticisers in PVC are
12
phthalates. Sweden, Austria and The Netherlands have banned all use of cadmium as
stabiliser in PVC. The Swedish government has presented a bill on reducing the use of
the main phthalate DEHP. Regulatory measures from EC on phthalates are likely to
come. Denmark has issued an action plan to reduce the use of Phthalates by 50% over
10 years.
The idea of producer responsibility is that the producer or vendor of a product should
take responsibility of the product when it becomes waste. The producers might have
to make sure that the waste is collected, transported, recycled, reused and disposed of
in a way that is health- and environmentally sustainable.24 The Swedish producer
responsibility enters into force 1 July 2001.
A summary/list of the laws and regulations concerning the substances of interest can
be found in appendix II
13
The Products
In this chapter a short overview of UAB products is given and the products studied in
detail are introduced.
CNCP products
Ericsson Utvecklings AB (UAB) comprises the main part of Ericsson Network Core
Products (CNCP) and is a central development unit within Ericsson. UAB has around
1200 employees and is located in Älvsjö in Stockholm.
AXE is the leading telecommunication platform, but platforms such as TSP are also
important products. AXE constitutes an important part of the infrastructure that makes
it possible to use mobile and fixed phones.
Products concerned in this study
Three PBAs contained in AXE nodes and a cabinet, part of an equipment practice,
were studied. Below follows a short description of these products.
Picture 1: The three studied printed boards. From top left to right: ROJ 204 03, ROJ
207 056 and ROJ 212 206.
ROJ 204 03 has the largest production volume of all UAB PBAs. (Eklöf, 2000) It is
an exchange terminal (ETC-5), i.e. it is the communication portal to other switches,
and weighs approximately 205 g.25
ROJ 207 056/1 is a regional processor (RP-4) and also has a large production volume.
The function of a regional processor is to decrease the load on the Central Processor
(CP), relieving it from capacity consuming tasks. ROJ 207 056/1 weighs
approximately 530 g.26
Because of the very high reliability requirement in telecommunications, the Central
processor (CP) is duplicated. ROJ 212 206 is a maintenance unit (MAU), i.e. it is
placed between the two halves of the CP controlling that they function properly and
handles the situation if one of them fails to work.(Träff, 2001) It was chosen for this
study since it contains quite a different set of components, coming from other
suppliers, compared to the other two PBAs. It weighs approximately 700g.27
14
Picture 2: Three filled cabinets of the type BYB 501 180.
BYB 501 is a general equipment practice that can be equipped with magazines and
PBAs. Products using BYB 501 are mainly the new AXE, but also APZ, AXD,
WDM, HLR, BSC and WCDMA.45 The cabinet exists in several different versions.
The version studied here is an empty 180 cm high cabinet, BYB 501 180.
15
Materials declarations
This chapter contains a description of how materials declarations for different parts
of the products were collected and compiled. Some helpful databases are also
presented.
Databases
Three databases were of great use in collecting materials declarations:
MATILDA
MATILDA is an Internet-based data tool for materials declarations, where
information about the different materials and their amounts are listed for each
component and part used in Ericsson products. The database is a common tool for the
whole Ericsson group and it communicates with other data tools within Ericsson, such
as PRIM and ELIZA. Its purpose is to support various needs of material information,
e.g. to provide a complete list of the materials included in a product. Or to tell if a
specific material or substance is included in a product, and if so, tell how much and in
which components. Apart from searching for materials declarations it is also possible
to send requests to manufacturers for material declarations through Matilda.
Matilda is a relatively new database. It was constructed to answer to demands from
legislation and the market on knowing the material content of Ericsson products.
Ericsson must be able to show that substances that are banned from use are not
included in the products. In order to phase out substances that are about to be banned
they have to know where and to what extent they are used in the products.
Information on hazardous materials and valuable materials is needed for the End of
Life treatment. This kind of information can be easily accessed from Matilda.
However, being a new tool, only a fraction of the products are declared in Matilda
today. To get a complete picture, of course, the majority of components have to be
registered in the database.
PRIM
PRIM is the acronym for Product Information Management. PRIM contains basic
information about all products, product structures, documents, and information
structures (that is all information that is linked together for the specific product)
within the Ericsson Corporation. Among other things it answers the following
questions: Who is responsible for a product? What does a specific product consist of?
Which product is my product a part of? Which document describes my product?
PIwin is a Windows application for accessing and manipulating Product Information
Data, which is convenient to use when collecting information. Product structures,
drawings of components and internal material standards are examples of information
that has been taken from PRIM.
ELIZA
ELIZA is the manufacturer database within Ericsson. ELIZA's prime function is to
associate Ericsson product numbers to the manufacturers product numbers together
with the manufacturers address and other contact information. Manufacturer id’s,
which are needed to make a request in MATILDA, are also found in ELIZA
16
Methodology
The structures of the products, that is the different components, and their quantities,
that constitute the product, were found in PRIM. Already existing materials
declarations of components were found in MATILDA. 30-60% of the components in
the PBAs were declared in MATILDA, but these components constituted less than
10% of the weight of the product due to the fact that heavy parts such as printed
boards and fronts were missing in MATILDA. Different methods were used to obtain
the remaining declarations.
Requests for materials declarations of the remaining components were sent out to the
suppliers through MATILDA. The name and the manufacturer id of the suppliers
were found through ELIZA. Contact persons at the manufacturers were in most cases
found through Daniel Bjärnström, ERA. He has put together a list of contact persons
for material declarations at different companies that Ericsson uses as suppliers and is
continuously updating it. However, not all suppliers are on this list. In some cases
contact persons were found on an address list on the UAB Component Technology
Team homepage, by asking people at UAB involved in the different components or
simply by asking for someone who can make materials declarations at the company’s
switchboard. Some suppliers preferred not to send the declarations through
MATILDA, but straight to me in a WORD or EXCEL document.
Some components are very similar and sometimes the same declaration can be used
for several components. To make the right approximations help was received from
component engineers.
Materials declarations of the printed circuit boards, which constitute the main part of
the material in the PBA, were obtained from Ulf Moberg at Ericsson Radio Systems
in Kumla. He has developed a program for calculating the material composition of
printed boards based on their CAD layout.(Moberg, 2000) The composition of the
electrical glass in the laminate was obtained from Polyclad. (Holmqvist, 2000)
Solder material is not specified in the product structure since it is not really a
‘component’. It is nevertheless of great importance for the material composition of the
PBA, especially since it is the main source of lead. Today, most of the components
are surface mounted, using solder paste. Wave soldering is less common and will be
even more so in the future. Surface mounting decreases the amount of solder
drastically. The solder paste is applied to the right spot on the printed board using a
stencil sheet. The holes in the sheet correspond to the area that is covered with solder
paste. The thickness of the layer of solder paste depends on the thickness of the sheet.
The normal thickness is 125-150 µm. The volume of solder paste used for a printed
board can be calculated by multiplying the area and the thickness. The mass is then
found by multiplying with the density of the paste. This has been done for a larger
number of cards and the average mass of solder paste needed for a card of
approximately A4-size was found to be 4 g (Jansson, 2001). Since the cards in this
study are approximately 1/3, ¾ and 5/4 of A4 respectively, it is estimated that 1,3 g, 3
g and 5 g of solder paste is used. The density of the solder is calculated for a
Sn63Pb37 solder. Taking into account that approximately 10% of the solder consists
of flux that is lost during the soldering process, the density is found to be 7,9 g/cm3.
17
All of the PBAs in this study are also wave soldered. This is because the connectors
and a few other components are hole-mounted. Wave solder sticks to the pads, in the
vias and in the holes for the hole-mounted components. To estimate the mass of wave
solder the volume of solder that enters the holes and vias is calculated and multiplied
with the density of the solder:
Volume of solder in a hole-mounted component hole:
the radius of the hole2*π*the thickness of the card
– the radius of the ‘leg’2*π*the thickness of the card*
Volume of solder in a via:
the radius2*π*the thickness of the card
The thickness of the card is given in the materials declaration. The numbers of vias
and components holes, as well as their radii, are estimated by studying the card. The
layer of solder that sticks to the pads is thin enough to be disregarded (Jansson, 2000).
In spring 2000, Jan-Erik Karlsson and Claes Ekstrand made a materials declaration of
the cabinet, BYB 501 180. Declarations of most of the constituting parts were
therefore to be found in MATILDA. According to construction data the cabinet,
including doors, front- and back plate but no earthquake proof set, has a mass of
approximately 70 kg (Ekstrand, 2001).
Compilation of declarations
An EXCEL format was used to present the material declarations. It was constructed in
1999 for a materials declaration of the telephone T28 and was then called Marda.
Declarations for a few more mobile phones were also made in this format during the
summer 2000, by Lisa Johansson and Sara Nelson, ECS. The format helps coordinating material declarations for similar products. It is made in an EXCEL
workbook and it consists of a main sheet, and one sub-sheet for each product. One
workbook was used for the PBAs and one for the equipment practice. On the main
sheet the material contents of all the components contained in, in this case, the three
PBA’s or the different parts of the cabinet, are declared. The sub-sheets are linked to
the main sheet and sum up the material content of each product separately (appendix
III-VIII).
As materials declarations were received from the suppliers they were integrated in the
document. The status of each component was continuously updated, making it easy to
overview which declarations were still missing.
When making the materials declarations alloys were generally divided into their
elements. Ceramics and plastics however were declared as compounds.
18
Survey of natural contamination
In this chapter the process of finding suitable background levels of banned and
restricted substances within the production materials is described. It is explained how
the collected data has been adjusted and weighed and how it is used in the calculation
of product specific reference levels. General information about the materials of
interest, how they exist in nature and what they are used for, is also included.
Methodology
Once it was possible to distinguish, from the materials declarations, which materials
were used in important amounts in the products studied, information on these was
sought for. General information on the materials was found in literature. Inquiries
were then sent out to component manufacturers in order to get information on the
material producers they buy from and which material quality they use. The idea was
to then contact the given material producers to get information on the mentioned
quality of a certain material. It was soon realised that this was a huge task and would
not fit within the scope of a thesis of this kind.
Material standards were thought to be another way of finding out background levels in
different materials. It turned out to be rather complicated, and expensive, to get hold
of all the different standards. But visits were made at Standardiseringen i Sverige
(SIS) and Svensk Material- och mekanstandard (SMS) in Stockholm and eventually
standards were studied for most materials. However, they were not quite as useful as
expected. In the standard the required concentrations of elements that compose the
material is given, eg 16-19% of chromium and 6,5-9,5% of nickel for a certain quality
of stainless steel, and also maximum values for some pollutants. The pollutants listed
are usually substances that might influence the physical or electrical properties of the
material. In the case of stainless steel C, Mn, P, S, Mo, and Si might be listed.
Substances that can affect the environment, however, are not often listed. This was the
case especially for steel and aluminium. When substances of interest to this study
were listed, maximum values were given. When compared to typical values from
chemical analysis of materials, the values seem to be very much higher than what you
actually find in the material. Therefore, when values from standards are used in the
calculations, a certain percentage is subtracted from the standard value to make the
value closer to the reality (see ‘Preparation and adaptation of data’). However, values
from standards are only used in the calculations when no better values, such as values
from analysis, are at hand.
Since none of the above methods were very successful, the focus was set on wellknown material producers instead, mainly Swedish but also some Norwegian and
Finnish. Contacts were kept via telephone and e-mail. The material producers were
asked to provide analysis results or yearly statistics on the materials. Not all producers
made this kind of analysis on a regular basis, and the degree of accuracy varied
between companies. Depending on the material, only some substances of special
importance for the material were measured. Sometimes maximum values were given,
sometimes typical values and sometimes a typical range. This made it rather difficult
to know which values to use in the calculations and to make them comparable.
Trade organisations, such as Jernkontoret were also contacted.
The name of different steel and aluminium qualities used in the cabinet were found on
19
the drawings in PRIM, where the Ericsson material specification for the material used
also could be found. For metals where the quality wasn’t specified, inquiries were
always made on the purest material available.
Materials used
When trying to find out background concentrations of certain substances in materials
it is of interest to know what might influence the concentration. Many factors are of
importance, and some questions that could be asked are:
In which form do the elements exist naturally?
Which elements are usually found together?
What is the average concentration of the elements in the crust of the earth?
What concentrations are accepted in different materials, for example according to
material standards?
To what extent is it profitable to refine a metal?
Which processes are used to extract and produce a material?
Does it make a difference if the material is produced from recycled material or not?
In order to find the answers to some of these questions, a short summary with general
information about the materials of interest, how they exist in nature and what they are
used for, follows below. The information originates mainly from literature but also
from contacts with material industries.
Aluminium
Aluminium is the most commonly occurring metal in the crust of the earth. In spite of
this, aluminium was not much used until the last century when it was discovered how
to produce it electrolytically. Before that aluminium was a very precious metal with a
higher price per kilo than gold.41
Aluminium is widely used, both as pure metal and in alloys. The same material can
vary significantly depending on where it is manufactured and from what. Aluminium
made from bauxite is much purer than aluminium made from recycled materials (B.
Ericsson, 2000).
Antimony
Shale is rich in antimony whereas sandstone contains very little. In nature it exists
together with sulphur and arsenic.28 Antimony is used in batteries, flame retardants
and in glass and ceramics. Stibnite, Sb2S3, is the most important antimony ore.4
Bismuth
The world reserves of bismuth are usually associated with lead deposits. Sometimes it
is also found with tungsten ores or with copper-gold ores. Bismuth minerals rarely
occur in sufficient quantities to be mined as principal products. It can be recovered
during copper, zinc or lead smelting.
Cadmium
Cadmium is mainly found in zinc ores in nature Cadmium exists naturally in the crust
of the earth at a level of 0,08-0,5 mg/kg. It usually exists together with zinc. Zinccontaining sulphide ores of lead and copper therefore also contains cadmium.7
Cadmium is used in pigments, corrosion protection, batteries and as stabiliser.
20
Ceramics
The term ceramic is often applied to all inorganic non-metallic materials, including
both amorphous and crystalline materials. Glass is a non-crystalline ceramic with a
viscosity so high that it can be considered rigid. The most familiar glasses are alkali
metal or alkaline earth metal silicates or borosilicates.28 Ceramics are normally
produced in a process where heating to very high temperatures, above 1000°C, is an
important part.
The glass fibres in the printed board consist of electrical glass, that is mainly silicone
dioxide, calcium oxide aluminium oxide and boron oxide (Holmqvist, 2000).
Chromium
The average chromium concentration in the earth crust is 100 ppm and the only raw
material for chromium chemicals is chromite, FeO⋅Cr2O3. Iron is alloyed with
chromium in order to improve resistance to corrosion, hardness and workability of the
iron. Stainless steel always contains chromium. Cr is also used in the manufacture of
some metal ceramics (Jonsson, 2000).
Copper
Copper has been used by man for more than 6000 years. In nature, copper is usually
bound to sulphur. The two most common copper ores are copper pyrites (CuFeS2) and
copper sulphide (Cu2S).29 Copper is extracted by smelting. Electrolytic copper is a
very pure form of copper (min 99,90%Cu), which is commonly used for electronics.
A large part of the copper used today is produced from recycled material. Aluminium
and steel are downgraded when recycled, i.e. the recycled material does not have the
same quality as the original material. This is not true for copper (Lehner, 2000). The
quality of the material can of course vary. According to some data the cadmium
concentration is sometimes higher in copper of Japanese origin (Ax, 2000).
Epoxy
Epoxy is the generic term for a group of plastics that are condensation-products of
epichlorohydrin and compounds containing at least two hydroxyl groups, often
bisphenol-A. Being a thermosetting plastic, epoxy is insoluble and can not be
melted.30
Epoxy reinforced with glass fibres is used in printed board laminate. Epoxy, with or
without fillers, is also used for casting and encapsulating of electronic components.31
Traces of chlorine, that has not been eliminated in the synthesis, can be found in
epoxy (Valfridsson, 2000).
Laminate
As mentioned above, printed board laminate consists mainly of glass-fibres and
epoxy. You can expect it to be contaminated with arsenic, since arsenic exists
naturally with silicon. If very pure silicon dioxide is used, no arsenic should be found.
However, this is only used for components where a very high purity is needed.
Very small amounts of lead can originate from a lead pulley that the glass fibres are
pulled through in the production. Today, significant amounts of bromine is found in
the laminate, due to the use of brominated flameretardants. These substances are to be
phased out in the near future. The substitutes will contain mainly P, N and SiO2.
Hexavalent chromium and Cl are also expected to be found in the material
(Valfridsson, 2000). Apart from bromine originating from the flame retardant, small
amounts can also be found in the glassfibres (Svensson, 2000).
21
Additives such as maleic acid anhydride are used to improve the adhesion between the
plastic and the glass fibres. Additives to protect the material from sun wear and heat
might also be used (Johansson, 2000).
Lead
In our culture, lead has been used for more than 1000 years. Because of that, but also
beacause of the use of organic lead compounds in motor fuel, all our surroundings are
contaminated with lead. It is therefore difficult to indicate the ‘natural’ lead
concentration in water, earth and rock. The average lead concentration of the crust of
the earth, however, is approximately 16 ppm.4 Lead is extracted from lead sulphide.29
It is mainly used in batteries and as fuel additive, but also in e.g. pigments,
accumulators, crystal, chemicals and solder.
Nickel
Nickel is extracted from pentlandite, (FeNi)9S8, which is often found along with other
sulphide minerals. More than half of the nickel in the world is used as alloy-metal in
stainless steels.46 It is also used for nickel plating and in accumulators.
Tin
Apart from soldering, tin is also used as an alloy-metal, in for example brass and
bronze, and as corrosion protection for iron sheets. The most important Tin ore is
Kasiterit (SnO2).
Zink
Zinc is the fourth most widely used metal in the world. Zinc occurs naturally in the
environment in rock, soil, freshwater and seawater. The minerals where zinc occurs in
amounts that allow for profitable mining often contain other commercially attractive
metals such as lead, copper and precious metals.
Zinc is a metal for many uses. The main application of zinc today is galvanising, i.e.
corrosion protection of steel. Galvanising considerably extends the useful life of steel
structures by providing a protective layer against corrosion on the steel surface.46
Concentrations of elements in the crust of the earth
Element
As
Be
Bi
Cd
Hg
Pb
Continental
crust
Ocean crust
3,4
2,9
0,08
0,10
0,02
15
1,5
1
0,06
0,13
0,02
0,89
Table 1: Concentrations of elements on the Ericsson Lists of Banned and Restricted
Substances in the crust of the earth, given in ppm. The concentration of antimony in
the ground is varying between 0,05 to 10 ppm.4
22
Preparation and adaptation of data
The information on background concentrations available is presented below. The
shaded values are the ones actually used in the calculations of reference levels.
Material
Aluminium
AA6063
electrolytic aluminium
electrolytic aluminium
Copper
(99,9999%)
rolled foil
EN 1978
Gold
ASTM B562
Laminate
Manufacturer
SAPA
Hydro Aluminium, Soderberg
Hydro Aluminium, Prebake
Outokumpu
Diff.sources, through Outokumpu,
Boliden Mineral AB
Standard
(99,98%)
Silver
Be
1
<1
1
1
6,3
0,1
5-20
8,4
Boliden Mineral AB
Standard
Lead
DIN 1719
EN 12659 (99,99%)
Nickel
As
Boliden Mineral AB
Standard
Standard
Outokumpu
Falconbridge Nikkelverk AS
30
35
35
2
<2
10
5
2
2
1,4
1,4
Cd
2
<2
2
2
2
0,01
2-10
<0,1
Hg
2
<5
<0,5
<0,5
0,1
5
<5
20
11
11
15
15
50
100
1
<1
0,1
<0,1
1,1
1,1
0,1
<0,1
1
2
0,13
0,13
0,1
<0,1
200
200
9
9
18
1,4
5
2
10
<10
2
<2
<2
2
1
<1
5
500
500
500
1000
50
50
1
1
2
<2
3
0,28
1
2
<2
<2
<2
Boliden Mineral AB
Standard
ASTM B413
Solder
Sn63Pb37, solderpaste
Candor
Sn63Pb37, solderpaste
Senju
Sn63Pb37,EN29453, wave sol Standard
Lead free solder
lead free solder, Sn/Ag/Cu
Indium
Stainless Steel
regular 18/8, max
Sandvik Steel
Steel
Carbon Steel
Rautaruukki Steel
Weathering Steel
Rautaruukki Steel
Tin
EN 610 (99,99%)
Standard
Zinc
(99,995%)
Norzinc AS
zinc coating
Rautaruuki Steel
Outokumpu
SS-EN 1179, (99,995%)
Standard
* This value applies to the copper in the laminate
Bi
7
<5
10
6
1,05
0,1
1-5
0,05
200
100
300
300
0,1
<0,1
<0,1
0,1
<0,1
Pb
17,2
5-20
27
12
1,4
0,2
1-6
0,4
5
2
<2
20
1,4*
(25000)
1
<1
1
2
<2
10
30
10
50
20
5
<5
0,2
<0,2
<0,2
1,4
5
3,8
0-5
5
4
30
2
<2
0,02
<0,02
<0,02
0,02
<0,02
300
300
10
10
2
2
2
11,2
40
16
10-20
13
20
30
Sb
1
<1
<1
2,5
0,6
3-10
0,5
2
<2
81
81
1
1
10
5
1
<1
0,5
<0,5
1750
500
3000
1200
100
100
100
100
4
4
7
2,8
10
2
<2
Table 2: Background concentrations of banned and restricted elements in different
materials, given in ppm. The shaded values are the ones chosen for the calculations of
reference levels.
A few general rules have been used when putting together an adequate set of
background level data to be used when calculating the reference levels. Typical values
have been chosen rather than maximum values. If data from more than one producer
is available, an average value has been used as long as it is possible and justified. If a
concentration is given as a range, e.g. 2-10 ppm, the arithmetic mean is used, i.e. 6
ppm in this case. When maximum, or ‘less than’ values (<), are obtained from
companies basing their data on analysis results, the maximum value is believed to be
relatively close to the typical value and the maximum value is hence used in the
calculations. Maximum values from standards however are believed to be quite
different from the values you actually find in the materials. Therefore the maximum
value is multiplied by a factor 0,28 before being used in the calculations. The factor is
based on the average difference between concentrations found through analysis and
concentrations given in standards, in the material used in this study.
Below follows a more detailed description of which data that has been chosen as
23
appropriate for the calculations, of adjustments that have been made and why.
Aluminium: Data available from SAPA for a quality called 6063. The results are
based on analyses with optical emission spectrometer of 8 samples of aluminium of
type 6063. Reference samples were not available for all substances, making the result
less accurate. One more quality of aluminium is used in the cabinet studied, in the
PBAs the quality is not specified. Hydro Aluminium delivered yearly mean values
from two aluminium plants, Soderberg and Prebake. The metal that they deliver to
customers is usually a mixture of electrolysis metal coming from both plants (Matre,
2001). Alloys for profiles also contain some material from other sources. The mean
value of Soderberg, Prebake and SAPA was used in the calculation. No data for As
available.
Copper: Yearly average values for pure electrolytic copper from Boliden Mineral and
Outokumpu are available. Data from Outokumpu with typical ranges for rolled copper
foil, originating from different places and different companies around the world, was
also obtained. In printed boards both electrolytic copper and foil is used. By
calculating an average of the three sets of data, one set of data that can be used for all
the copper in the product is obtained. No data for Be available.
Gold: Data from Boliden mineral AB was used. The concentrations are the yearly
averages of different substances in the material. They are based on analyses made on a
regular basis. No data is available for As and Be.
Laminate: No background concentrations on laminate could be obtained from the
producers. Instead mean values from chemical analyses of 10 different Ericsson
printed boards were used. The concentrations consequently reflect the whole content
of the printed board, i.e. not only epoxy and glass but also copper and Pb/Sn. The
values were taken from a study made in 2000.32 The concentration of lead has not
been used since lead is added to the card. Instead the concentration of lead in copper
has been used and multiplied with the amount of copper in the laminate.
Lead: Data from Boliden Mineral AB was used. The concentrations are the yearly
averages of different substances in the material. They are based on analyses made on a
regular basis. No data is available for Be.
Nickel: Mean values were taken from Outokumpu and Falconbridge Nikkelverk AS.
Only figures for As, Pb and Sb available..
Silver: Data from Boliden Mineral AB was used. The concentrations are the yearly
averages of different substances in the material. They are based on analyses made on a
regular basis. No data is available for As and Be.
Solder: Data for Sn63Pb37 solder paste was obtained from two companies, Candor
and Senju. Senju is Japans largest manufacturer of solder. An average set of values of
these two was used in the calculations. Note that this data is not used for solder in the
components. Solder in components has been declared as lead and tin separately and
the background levels for the separate materials are used in calculating the reference
levels. For the solder used in mounting the components on the printed board,
however, the above mentioned data is used, for solder paste as well as for wave
24
solder.
Lead free solder: Tommy Berglind provided data for a lead free solder paste of a
type that probably will be used in the near future. By using these data, instead of the
ones for Sn/Pb solder, in the calculations of the reference levels a comparison can be
made. The solder is produced by Indium and is composed of 95,45 % Sn, 3,79 % Ag
and 0,69% Cu. It has a background level of Pb of 300 ppm, which is of course
included in the calculations of the background levels. No data on As, Be, Cd and Hg.
Stainless steel: The data applies to a regular 18/8 steel (18 % Cr and 8 % Ni). This
corresponds to the stainless steel used in the cabinet. The data come from Sandvik
Steel. They take part in a trade co-operation arranged by Jernkontoret and according
to Sandvik Steel the data correspond very well to data from other steel industries in
the Nordic countries.
Steel: The BYB 501 cabinet contains two types of unalloyed steel, normal carbon
steel (M2044/SS141142) and smaller amounts of free cutting steel of carbon steel
type (M2070/SS141914). Since no data for free cutting steel was available, data on
carbon steel from Rautaruukki Steel is used for all unalloyed steel. One can expect the
concentration of S and Pb to be a little bit higher in the free cutting steel than in the
normal carbon steel, but apart from that both qualities are fairly pure.29
Rautaruukki Steel also takes part in the trade co-operation arranged by Jernkontoret
and hence the data correspond well to data from other steel industries in the Nordic
countries.
Tin: No industrial data was found for tin. Material standard values were the only data
found. The material standard EN 610 for 99,99% Sn was used and 72% were
subtracted from the concentrations given in the standard to make up for the fact that
the values in the standard are maximum values that probably differ significantly from
actual concentrations in the tin used. No data for Be and Hg available.
Zinc: Background concentrations are available for a 99,995% Zn from Norzink AS,
Zn from Outokumpu and a zinc coating from Rautaruukki Steel. An average of these
three sets of data is used. This seems reasonable since zinc coating is used in several
places in the products and because the only major difference between the zinc and the
zinc coating data is the concentration of Cr. The Cr concentration is higher in the zinc
coating because of the chromating with hexavalent chromium. This specific coating
contains 2 mg of hexavalent chromium per square meter.
Calculation of reference levels
The background levels resulting from the preparation above are used in the following
calculations.
The calculations were made in EXCEL sheets linked to the compiled materials
declarations, MARDA.
To calculate, say the reference level for Bi, the amount of Bi in each material in the
product is calculated by multiplying the mass of the material with the Bi concentration
in the material. The sum of the amounts of Bi in each material is divided by the total
mass of the product to get the concentration of Bi in the whole product. If Bi is
declared in a component that amount is only added to the sum of Bi if it is declared as
25
a trace element. This can be the case when a materials declaration is in the form of
results from a chemical analysis of the component, which in Matilda is called a
substance declaration. In these cases it is sometimes difficult to know whether a
concentration is found due to natural contamination or deliberate addition, or both. It
should not be added if it is declared as one of the materials making up the product.
The reference levels are only supposed to reflect concentrations of the substance that
has not been deliberately added to a product, i.e. the natural background concentration
of the substance in the product.
Calculations of reference levels can be found in appendix X-XI.
26
Results
In this chapter the results are presented in the form of material contents of the
products, background levels in the materials and product specific reference levels.
Material content of the studied products
The complete materials declarations, where it can be seen what each component
contains and what the finished products contain, can be found in appendix III-VIII.
Approximately 72%, 84% and 87% of the material in ROJ 204 03, ROJ 207 056 and
ROJ 212 206 respectively was declared. 98,5% of the material in the equipment
practice was declared.
A summary of the material contents of the products is found in appendix IX. Below
follows some comments on the material contents.
Metals
The most abundant metal in the PBAs is copper but there are also large amounts of
iron or zinc due to the front. Aluminium and tin are also relatively abundant. The
equipment practice consists almost entirely of aluminium and steel.
Approximately three grams of hexavalent chromium is declared in BYB 501 180. It is
present as a surface finish material.
It should be noted that some capacitors were found to contain Cd. All three cards
studied here contained this type of capacitors.
Plastics
The dominating plastic in the PBAs is of course epoxy, which is found in the laminate
and in component encapsulants.
Most of the unspecified polymers in the cabinet are powder paint (Ekstrand, 2001).
The PVC in BYB 501 180 is found in the packaging and is not really part of the
product. On the inside of the doors there is a strip of neopren rubber (part of
remaining polymers). Neopren is believed to be carcinogenic (Ekstrand, 2001)
Ceramics
The electric glass constitute the major part of the ceramics in the PBAs.
Other
The bromine in the flameretardants is sometimes declared separately and sometimes
as TBBA. Silicon is mainly found in chips. The unspecified other material is mainly
electrolytes in capacitors.
Background levels in the materials
Background concentrations of banned and restricted substances in materials of interest
are found in table 3. These concentrations are general and could be applied for other
products than the ones studied here. In the table it can be easily seen in which
materials you can expect to find the highest concentration of a specific substance.
27
Material
As
Be
Bi
1
7
Aluminium
6,3
1,05
Copper
8,4
5
Gold
35
1,4
11
Laminate
2
15
Lead
2
Nickel
1
Silver
200
500
Solder
50
Lead free solder
200
10
1
Stainless Steel
9
2
2
Steel
1,4
0,28
Tin
2
2
2
Zinc
* This value applies to the copper in the laminate
Cd
2
2
1
1,1
0,1
Hg
2
0,1
0,1
0,13
0,1
0,1
30
0,1
5
0,2
1,4
3,8
2
0,02
0,02
Pb
17,2
1,4
2
1,4*
1
2
300
10
2
11,2
16
Sb
1
2,5
2
81
1
1
0,5
1750
100
100
4
2,8
2
Table 3: Background levels of banned and restricted substances in different materials,
given in ppm.
Product specific reference levels
A set of reference levels for each PBA can be found in table 4. Concentrations from
analysis of each PBA are also included in the table to enable a comparison. The
chemical analysis of the PBAs was done in the end of 1999 and beginning of 2000 by
SGAB Analytica.25-27 The element concentrations were determined by plasma mass
spectrometry and plasma emission spectrometry
ROJ 204 03
ROJ 207 056
ROJ 212 206
Concentration Calculated
Concentration
Element Calculated
Concentration Calculated
from chemical reference
from chemical
reference
from chemical reference
level
analysis
level
analysis
level
analysis
As
19,1
32,0
23,9
23,4
31,9
Be
<0,125
0,6
<0,125
1,1
1,1
1,0
Bi
13,7
52,1
15,5
67,6
12,2
117,0
Cd
2,0
4,7
1,4
3,0
1,2
3,8
Hg
<0,25
<0,25
0,1
0,2
0,1
Pb
4,4
13400,0
2,0
12200,0
1,3
7370,0
Sb
119,0
174,0
181,0
64,3
74,3
65,4
BYB 501 180
Calculated
reference
level
4,2
1,3
3,5
0,8
0,7
7,3
2,2
Table 4: Calculated reference levels for the PBA’s and the cabinet and concentrations
from chemical analysis of the PBAs, all in ppm.
If the reference levels are calculated using lead free solder instead of Sn/Pb solder, the
reference levels of lead are approximately doubled. This is due to the relatively high
background concentration of lead in lead free solder.
28
Discussion and conclusion
In this chapter the possible uses of the calculated reference levels are discussed and
comparisons are made between the reference levels, results from chemical analysis
and existing CNCP signal values. Sources of error are also discussed and suggestions
for further research are given. At last, some final conclusions are drawn.
Possible use of the reference levels
To be able to use the levels in a correct way it is important to fully understand what
they can tell you and what they correspond to. The calculated reference levels are
typical values, not maximum or minimum values, and should therefore not be treated
as threshold values. They indicate a probable concentration of a substance in a
product that the substance in question has not been deliberately added to. If chemical
analysis shows that a concentration in a product is considerably higher than the
corresponding reference level, there is reason to believe that the substance has been
added to the product.
Having some kind of reference levels is important for the supervision of
manufacturers. The Ericsson directive on banned and restricted substances is more
useful if it is possible to control that it is being observed. The reference levels
calculated here constitute a means of comparison that can be used as a complement to
chemical analysis. However, since the values only reflect natural contamination, there
is not reason to believe that the directive has been abused if a concentration is found
to be higher than the reference level. Substances such as Sb, Bi ,Pb and As are still
allowed in the products and will often be found in much higher concentrations. When
the restricted substances are phased out and placed on the banned list, these reference
levels can be of more direct use, indicating how much of each substance the product
can be expected to contain. Until then they can serve as reference values indicating
how much of a substance is present due to natural contamination, and hence how
much has been deliberately added.
Since a relatively complete materials declaration is a condition for calculating the
reference levels, an appropriate time to use the levels could for example be when
evaluating the results from a chemical analysis of a PBA that is about to be released
on the market. Earlier in the process of developing a product, at the prototype stage
for example, a materials declaration for the product might not be available.
The reference levels can also be calculated for parts of products or for components. A
possible time to use them could thus be when buying components and when choosing
component supplier.
Comparison with analysed products
When comparing reference levels and analysis data, it should be kept in mind that the
reference levels include the front of the PBA whereas the fronts are usually separated
from the rest of the PBA off before grinding the sample to be chemically analysed.
Reference levels can of course also be calculated for the PBAs without the front, but
that has not been done in this study. In spite of this, some careful comparisons will be
made here.
In a comparison between the reference levels of the PBAs studied and the analysis
values of the same products 25-27 it can be seen that all reference levels, with the
exception of the ones for beryllium, are significantly lower than the respective
concentrations determined in the analysis (see table 4). This is normal since the
analysis data also contain deliberately added substances. Mercury has about the same
29
value, which you could also expect since mercury should not have been added to the
PBAs.
Even though the difference is only about one ppm the values for beryllium are
approximately ten times higher in the calculated values than in the analysis data. The
main part of the beryllium in the calculation originates from steel, zinc and printed
board laminate. The front of the card, which is either made of steel or zinc, has been
taken away before grinding the PBA for analysis and is therefore not included in the
analysis concentrations. The higher concentration can also be explained by the fact
that the manufacturers of steel and zinc have given ‘less than’ (<) concentrations of
beryllium, since it is difficult to measure concentrations of this size. The
concentration might be below the detection limit of their analysis equipment, and
therefore they indicate a higher concentration to be on the safe side.
In the case of cadmium the concentrations are significantly higher in the analysed
card. All three PBAs have Cd declared in a few capacitors. The declared amount of
Cd in each product is 0,4 mg, 1,4 mg and 1,0 mg respectively. This is the kind of case
where it would be very useful to have something to compare with. The difference
between background concentration and actual concentration should be noticeable; in
this case the analysis concentration is more than twice the size of the calculated value.
If the front had been included in the analysed material the difference between
calculated and analysed concentrations would have been bigger in ROJ 204 03, since
its front is made of zinc and zinc has a relatively high background concentration of
Cd.
The other substances, As, Bi, Pb and Sb, are known to be present in the analysed
cards, explaining the difference between the background and actual values.
There are no analysis data for the equipment practice available and no comparisons
like the ones above can therefore be made. It can however be noticed that the
background levels of As, Bi and Sb are very much lower in the cabinet than in the
PBAs. This is partly explained by the fact that the printed board laminate is
responsible for a large part of the PBA concentrations of these substances. The
equipment practice consists to more than 80% of steel and aluminium and this is of
course reflected in its reference levels. Aluminium contains relatively high
background levels of Pb, resulting in a relatively high Pb reference level for the
product.
When comparing the calculated reference levels with the average concentrations of
the same elements in the crust of the earth, the calculated values for the PBAs and the
cabinet are generally found to be higher (see table 5). The values for lead and
beryllium however are lower.
Comparison with present CNCP-PBA level Maximum and
Target Signal Values
In 2000 CNCP defined general PBA maximum signal values and target signal values
for substances on the Ericsson Lists of Banned and Restricted Substances. The values
were based on chemical analysis data for a large number of CNCP PBAs and also on
studies of soil exposed to people and nature and the limits set by Boliden Mineral for
recycling of electronic products.34 The advantages with these values
are that they are based on experience and on a large set of data and they are general.
The fact that they are general and apply to all PBAs can however also be a
disadvantage. They don’t take into account that different PBAs have different material
30
Calculated
reference level
212 206
31,9
7,0
50,0
25,0
3,4
<0,125
2,0
?
5,0
2,9
117,0
100,0
500,0
100,0
0,08
3,8
8,0
20,0
10,0
0,1
<0,25
0,0
2,0
0,0
0,02
7370,0 12500,0 20000,0 no limit
15
181,0
230,0
1000 500,0 0,05-10
Continental crust
ROJ
23,4
1,0
12,1
1,2
0,1
1,2
65,4
Ocean crust
CNCP-PBA
Target
Signal
Value
ROJ 207 056
23,8
1,1
0,6
15,4
67,6
1,4
3,0
0,2
1,9 12200,0
74,3
174,0
CNCP-PBA Max
Signal value
404 03
32,0
<0,125
52,1
4,7
<0,25
13400,0
119,0
Average per PBA
in CNCP nodes
1999
Calculated
reference level
ROJ
19,1
1,1
13,6
2,0
0,1
4,2
64,2
Concentration
from
chemical
analysis
Concentration
from
chemical
analysis
As
Be
Bi
Cd
Hg
Pb
Sb
Calculated
reference level
Calculated
reference level
Concentration
from
chemical
analysis
Element
compositions and therefore different background concentrations of the substances in
question. This makes it possible for small amounts of an added banned substance to
pass unnoticed. The cadmium added to the PBAs in this study, for example, would
not be noticed when comparing the analysis concentrations to the CNCP signal
values.
The reference levels calculated in this study are not general but product specific, i.e.
each product has its own set of reference levels. This might give values that are closer
to the truth for each product, and hence make it easier to notice even smaller amounts
of added substances in a specific product. Comparing the yearly CNCP-PBA average
from 1999 34 with the analysis data for the specific cards in this study shows that the
difference is sometimes relatively large (see table 5).
Another advantage of the product specific values are that they can be calculated for
practically any product, not only PBAs. As long as complete materials declarations
exist for the product, values could be calculated just as well for a mobile phone or a
transceiver unit as for a PBA.
1,5
1
0,06
0,13
0,02
0,89
-
BYB 501
4,2
1,3
3,5
0,8
0,7
7,3
2,2
Table 5: Comparison of reference levels, signal values, concentrations from chemical
analysis and concentrations in the crust of the earth, all in ppm.
Reliability of input data
Only 72%, 84% and 87% of the material in ROJ 204 03, ROJ 207 056 and ROJ 212
206 respectively was declared. Background concentrations were available on 85%,
86% and 89% of the declared material. The missing material is mainly some heavy
components such as connectors and some large circuits for which there were problems
with getting materials declarations. The fact that some declarations are substance
declarations that are based on chemical analysis and only present, say 10% of the total
component material also decreases the declared percentage. The calculated reference
levels are given in ppm of declared material, i.e. the reference level would not
necessarily be higher if 100% of the product was materials declared.
One of these substance declarations was taken out of the materials declaration at a late
stage because it was difficult to distinguish whether some of the substances were
added to the product or just there as contamination. If they had been counted as
contamination they would have influenced the reference levels very much. The
component in question is a large hybrid circuit weighing approximately 20 g and is
present in all three PBAs (RYT 913 101).
According to product data BYB 501 180 weighs approximately 70 kg without the
earthquake proof set. 69,9 kg of material was declared, i.e. almost 100%.
Approximately 100% of the earthquake proof set was also declared. Background data
was available for 83% of the declared material.
31
The same kind of component can be produced by several different manufacturers and
can differ a lot depending on where it is produced. In this study the materials
declaration from the manufacturer that has answered the request has been used. In
some cases there have been materials declarations from two manufacturers available
for the same component. In those cases the declaration that seems to have the highest
quality has been used. No mean values have been used. Declarations for the same
component have in some cases differed significantly.
An important source of error is the calculation of the amount of solder in the PBAs.
The calculation method is very approximate (see ‘Materials declarations:
Methodology’) and should be looked over in the future. Since the contamination
levels are relatively high in solder, even a small change in solder amount would affect
the reference levels.
The materials in the components are produced all over the world and the quality of the
same kind of material can differ depending on where it is produced. It would be an
enormous project, but probably theoretically possible, to find out which component
manufacturers have been engaged in a certain PBA and which material producers they
have bought the materials from. The materials producers could then be contacted
hoping that they would be able and willing to provide data on background
concentrations in the material that they produce. This would give more reliable values
but would probably not be worth the effort.
Another problem is variations in the materials. Most of the background concentrations
used in this study are yearly mean values. The span of the concentrations that the
mean value is based on can however be very wide and the material can differ
significantly from batch to batch. Hence a deviation from the reference level could
also be explained by material variations.
The background concentration data used in this study covers most of the metallic
material. For plastics and ceramics however there were some difficulties finding
information. Many material producers like to keep the contents of these types of
materials secret. Most of the plastic and ceramic materials in the PBAs are part of the
laminate and are therefore covered, but there are smaller amounts in the components
for which no background data is available. It would also be preferable to treat the
materials composing the laminate separately, i.e. to have background concentration
data on epoxy, glass and copper separately. It would then be easier to trace the
background concentrations to a certain material.
Biased material producers could be a problem when searching for background
concentrations. It would be better to get the data from an objective source since it is
difficult to control the correctness of the information received from the material
producers.
To sum up, it can be said that there are many sources of error in the calculations of the
reference levels and they should thus be used with care. Attention should not be put
on the exact value but on the size of the value.
Creating reference levels for other products
Assuming that complete materials declarations exist for the products, it should be easy
to use the background concentration data from this work to calculate reference levels
32
for other products. Ideally the complete materials declaration for the product should
be found in Matilda. The reference levels can then be calculated in Excel. The same
structure can be used, as in this report, only the amounts of the different materials
have to be inserted. However, if substance declarations are part of the complete
materials declaration, distinction has to be made between deliberately added
substances and natural contamination. It is thus preferable to use part declarations,
which is also the declaration form that is becoming dominant in Matilda.
It might be an idea to integrate the calculations in Matilda, so that when generating a
materials declaration report it could also be possible to chose to generate reference
levels for the product.
If this kind of reference levels was to be used in the future, more background
concentration data should be collected. Reliable background data is a condition for the
calculations. Not all material producing companies seem to be able to provide this
type of data today. However, there seem to be a growing interest in this kind of
detailed information that has for example provoked the trade co-operation between
different Nordic steel manufacturers and Jernkontoret. They are investigating the
contents of steel produced in different factories around Sweden and the nordic
countries. The results of this co-operation will soon be found on the Jernkontoret
homepage, in the form of typical background concentrations in steel (Lundell, 2000)
Future research
To see if the method here proposed works, reference values should be calculated for a
large number of products with known material content and compared with chemical
analysis data of the products. It could then be seen if the addition of banned
substances can really be discovered with the help of the reference values. From these
data it could also be estimated how many percent the analysis value should deviate
from the reference value to provoke further investigations of the contents of the
product. When adding this percentage to the reference level, the new level could than
be called a signal level.
It could be expected that plastic materials are not significantly contaminated with
metals, since they are usually synthetic products and should be rather pure.
Background concentration data on plastics should however be used to get more
accurate reference levels. Data on different ceramic materials is also needed.
Cables and connectors have not been included in this study to any larger extent. It
could be interesting to study their contents more closely and for example investigate
what the plastic additives (softeners, stabilisers etc.) contain.
A recent study shows that chip capacitors of the type RJC 543 xxxx, that are present
in the studied PBAs, contain Cd.32 Some capacitors have up to 2100 ppm of Cd. The
manufacturers, M and N (see appendix XII for code letters), has also stated in
materials declarations of these capacitors that they contain Cd. The Cd is contained in
a ceramic material that is not mentioned as an exception to the ban of Cd in the
Ericson Lists of banned and restricted substances. However, this might be an area of
use where Cd can not yet be banned. This type of capacitor is used in large volumes
today. Ericsson is currently discussing the matter with manufacturer M and
investigating whether other manufacturers of the same components also use Cd.
Capacitors of the type RJC463xxxx are very similar to RJC 543 xxxx and also contain
Cd (Erik Elfwing,2001).
33
Cd is still allowed in NiCd batteries for some applications and in some thick film
pastes for certain hybrid circuits. Björn Wiklund, MIC, is currently investigating
whether Cd in thick film pastes really should be an exception from the ban of Cd, or
whether alternatives are already available. According to Krister Andersson (EMW),
who is testing Cd-free thick film pastes, there are alternatives.
Conclusion
The reference levels can be used when evaluating the results from a chemical analysis
of a PBA. Since they are based on materials declarations the reference levels are
probably more useful in a relatively late stage of the development of the product, e.g
when the product is about to be released on the market.
An advantage of these reference levels is that they are product specific and can easily
be calculated for different types of products and on different product levels. They can
be used for a single component as well as for a printed board assembly.
Another advantage of calculating product specific reference levels, instead of using
general signal values for all PBAs, is that this might give values that are closer to the
truth for each product and hence make it easier to notice even smaller amounts of
added substances in a specific product.
There are many sources of error in the calculations of the reference levels and they
should thus be used with care. To see how well they work reference levels should be
calculated for a large number of products with known material content and compared
with chemical analysis data of the products. From these data it could also be estimated
how many percent the analysis value should deviate from the reference value to
provoke further investigations of the contents of the product, i.e. to make it a signal
level.
34
List of abbreviations
APZ
BSC
CAD
CBD
CFC
CNCP
CP
DDT
DEHP
DIDP
EP
HCFC
HFC
HLR
PBA
PBB
PBDD
PBDE
PBDF
PCB
ppm
PRIM
PVC
TBBA
TBT
UAB
WCDMA
WDM
AXE Control System
Base Station Controller
Computer Aided Design
Chronic Beryllium Disease
chloro fluoro carbon
Ericsson Network Core Products
Central Processor
dichloro diphenyl trichloroethane
diethyl hexylphtalate
diiso decylphtalate
European Parliament
hydro chloro fluoro carbon
hydro fluoro carbon
Home Location Register
Printed Board Assembly
polybrominated biphenyls
polybrominated dibenzo dioxins
polybrominated diphenyl ethers
polybrominated dibenzo furans
polychlorinated biphenyls
parts per million
Product Information Management
Poly Vinyl Chloride
tetrabromo bisphenol A
Tributyl tin
(Ericsson) Utvecklings AB
Wideband Code Division Multiple Access
Wavelength Division Multiplex
35
References
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Carson, Rachel, Silent spring, Houghton Mifflin Company, 1962.
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Swedish Institute of Production Engineering Research /IVF, Alternatives to
halogenated flame retardants in electronic and electrical products -Results
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4
Merian E. et al., Metalle in der Umwelt –Verteilung, Analytik und biologische
Relevanz, Verlag Chemie, 1984.
5
Jonsson, Tomas, Environmental impact study of beryllium oxide,
chromium(VI) and possible alternatives, Degree project, University of Umeå
and Ericsson Radio Access AB, 2000.
6
Fakta om metallerna och miljön. Naturvårdsverket, 1995, faktablad 1995:2.
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Hedlund B, Eriksson J, Pettersson-Grawé K, Öborn I, Kadmium –tillstånd och
trender, Naturvårdsverkets rapport 4759, 1997, Naturvårdsverkets förlag,
Stockholm.
8
Commission of the European Communities, Proposal for a Directive of the
European Parliament and of the council on the restriction of the use of certain
hazardous substances in electrical and electronic equipment, Brussels, 2000.
9
Commission of the European Communities, Proposal for a Directive of the
European Parliament and of the council on waste electrical and electronic
equipment, Brussels, 2000.
10
Hedemalm P., Carlsson P., Palm V., Waste from electrical and electronic
products –a survey of the contents of materials and hazardous substances in
electric and electronic products, Nordic Council of Ministers, Tema Nord
1995:554, 1995.
11
The Swedish National Chemicals Inspectorate, Phasing out lead and mercury,
Report no 8/94, 1994.
12
Hellner C, Håkansson L, Johansson K, Mercury in the environment –Problems
and remedial measures in Sweden, Swedish environmental protection agency,
1991.
13
Connell D, Lam P, Richardson B, Wu R, Introduction to ecotoxicology,
Blackwell Science Ltd, Oxford, 1999.
36
14
Naturvårdsverkets rapport 4631: Ozonnedbrytande ämnen –så långt har vi
kommit,Naturvårdsverkets förlag, 1996.
15
Naturvårdsverkets rapport 3976, Erfarenheter från CFC avvecklingen –
Utvärdering av CFC-avvecklingen inom svensk elektronikindustri, 1991.
16
Svensk avveckling av ozonuttunnande ämnen –en utvärdering,
Naturvårdsverket, 1995.
17
Hedemalm et al, Halogenerade flammskyddsmedel i elektriskt och elektroniskt
avfall -förekomst och spridning i Sverige, Swedish Environmental Protection
Agency, report 4968, 1999.
18
Jacob Scheinert, Jose Reyes, Pierre Georlette, Dioxin assessment and
recycling aspects of plastics containing polybrominated flame retardants,
1999.
19
Sjödin et al, Flame Retardant Exposure: Polybrominated Diphenyl Ethers in
Blood from Swedish Workers, Journal of the National Institute of
Environmental Health Sciences, vol 107, 643-648, 1999.
20
Swedish Environmental Protection Agency, Electronic and electrical
equipment -the basis for producer responsibility, report 4406, 1995.
21
Swedish Environmental Protection Agency /Naturvårdsverket, Många frågor
kring de nya bromerade flammskyddsmedlen, pressrelease, 30/8/2000.
22
Environmental Report 1999, Telefonaktiebolaget LM Ericsson, Stockholm.
23
Experience from CFC phaseout: summary, Swedish environmental protection
agency, 1991.
24
Rubenson, Stefan, Miljöbalken –Den nya miljörätten, andra upplagan,
Norstedts Juridik AB, 1999.
25
SGAB Analytica, Analysis report, Doc.no. 1598-ROJ 204 03/1 Uen, 2000.
26
SGAB Analytica, Analysis report, Doc.no. 1598-ROJ 207 056/1 Uen, 2000.
27
SGAB Analytica, Analysis report, Doc.no. 1598-ROJ 212 206/1 Uen, 2000.
28
Shriver D.F., Atkins P.W, Langford C.H, Inorganic Chemistry, Second
Edition, Oxford University Press, 1994.
29
Brennert, Sven, Materiallära, elfte utgåvan, Karlebo Förlag AB, 1989.
30
Albertsson et al, Introduktion till Polymerteknologi, Institutionen för
polymerteknologi, KTH, Stockholm, 1999.
31
Krugloff, Olof, Plastskolan, Plast- och Kemibranscherna (PIR), 1997.
37
32
Rodushkin I., Chemical caracterisation of electronic components on printed
board assemblies, Final report, SGAB Analytica, 2000.
Internal Ericsson documents
33
Svensson, Jörgen, The Ericsson lists of banned and restricted substances,
Ericsson directive, Doc.no. 03401-2294 Uen, Rev. A, 2000.
34
Andersson, Tomas, Evaluating results from chemical analysis of printed
board assemblies (PBA), Limited internal directive, Doc.no. UAB/Q-00:127
Uen, 2000.
35
Eriksson, Mikael, Phase out plan –Ericsson list of restricted substances in
products, Limited internal information report, Doc.no. ERA/RN-00:559 Uen,
2000.
36
Bernau, Lars-Göran, Ericsson’s Environmental Directives, Limited internal
directive, Doc.no. 034 01-2295 Uen, 2000.
Databases
Matilda, http://materialsdata.ericsson.se/, 2000.
Eliza, can be downloaded from http://www.eliza.ericsson.se
Prim, can be downloaded from http://www.al.edt.ericsson.se/~prim/
Internet/Intranet sources
40
Lindström E, Ericssons internal web page on environmental legislation, 2000,
http://environment.ericsson.se/law/
41
Arbets- och miljömedicin, Uppsala Universitet, 2000,
http://www-hotel.uu.se/occmed/metal/ni4.html
42
Tungmetaller, Naturvårdsverket, 2000,
http://www.environ.se/dokument/fororen/metaller/tungmet.html
43
PVC-Forum, Plast- och Kemibranscherna, 2000,
http://www.plast-kemi.se/pvc/index.htm
44
Komvux Bollnäs, 2001,
http://www.komvux.bollnas.se/users/b/bas9802/baskemikalier/forma.html
45
Kemikontoret, 2000,
http://www.chemind.ihb.se/Kemikontoret/medlem.htm
46
Miljö ordbank, svensk-engelsk, Skolverket, 2001,
http://www.skolverket.se/vax/mt_6_98/md_t.htm
47
Ordlista, Jernkontoret, 2001,
38
http://www.jernkontoret.se/
48
CNCP homepage, 2001,
http://uabweb.uab.ericsson.se/
49
Outokumpu homepage, 2000
http://www.outokumpu.fi/
Personal communication
Abrahamsson, Lars, Stena Metall, 2000
Ahti, Tommi, Segerström och Svensson, 2000
Andersson, Krister, Ericsson Microwave Systems AB (EMW), 2000
Andersson, Margareta, Institutionen för materialteknik, KTH, 2000
Andrae, Anders, Ericsson Business Networks AB (EBC), 2000
Arponen, Mikko, Rautaruukki Steel, 2000
Aspelin, Lars-Åke, Ericsson Utvecklings AB (UAB), 2000-2001
Ax, Tom, Outokumpu, 2000
Berg, Arne, SAPA, 2000
Bergendal, C-G, Institutet för Verkstadsteknisk Forskning (IVF), 2000
Berglind, Tommy, Ericsson Mobile Communications (ECS), 2000
Better, Göran, Institutet för Verkstadsteknisk Forskning (IVF), 2000
Bjärnström ,Daniel, Ericsson Radio Systems AB (ERA), 2000
Blomberg, Stig, Ericsson Utvecklings AB (UAB), 2000-2001
Carlander, Thomas, Ericsson Radio Systems AB (ERA), 2000
Carlsson, Leif, Ericsson Utvecklings AB (UAB), 2001.
Claesson, Ove, Svensk Material- och Mekanstandard, 2000
Ek, Stig, Ericsson Radio Systems AB (ERA), 2000
Eklöf, Gustaf, Ericsson Utvecklings AB (UAB), 2000-2001
Ekstrand, Claes, Ericsson Utvecklings AB (UAB), 2000-2001
Elfwing, Erik, Ericsson Radio Systems AB (ERA), 2001
Engblom, Lars, Ericsson Utvecklings AB (UAB), 2000
Eriksson, Barbro, SAPA, 2000
Hallberg, Wenche, Ericsson Radio Systems AB (ERA), 2000
Hauge, Tom, Hydro Aluminium, 2001
Holmqvist, Ingrid, Polyclad Europe AB, 2000
Irhem, Johan, Standardiseringen i Sverige (SIS), 2000
Jansson, Peter, Ericsson Radio Systems AB (ERA), 2001
Johansson, Anders, Institutet för fiber- och polymerteknologi, 2000
Johansson, Lisa, Ericsson Radio Systems AB (ERA), 2000
Karlsson, Jan-Erik, Segerström och Svensson, 2000
Kristina Rydberg, Ericsson Utvecklings AB (UAB), 2000
Lehner, Théo, Boliden Mineral AB, 2000
Lundell, Ulf, Sandvik Steel, 2000
Magnusson, Jan, Nolato, 2000
Malmberg, Gunnar, Ericsson Utvecklings AB (UAB), 2000
Malmodin, Jens, Ericsson Radio Systems AB (ERA), 2000
Matre, Oyvind, Hydro Aluminium, 2001.
Moberg, Ulf, Ericsson Radio Systems AB (ERA), 2000
39
Mälhammar, Göran, Ericsson Telecom AB, 2001
Nicolini, Mario, Ericsson Utvecklings AB (UAB), 2000
Nykvist, Peter, Segerström och Svensson, 2001
Nylén, Margareta, Institutet för metallforskning, 2000
Näsström, Tommy, Ericsson Utvecklings AB (UAB), 2000
Odell, Joel, UAB, Ericsson Utvecklings AB (UAB), 2001
Omberg, L-G, SGAB Analytica, 2000
Svensson, Hans, Polyclad Europe AB, 2000
Svensson, Jörgen, Ericsson Mobile Communications (ECS), 2001
Thorsén, Erkki, Sandvik Steel, 2000
Tingvall, Rolf, SAPA, 2000
Tolvgård, Arne, Ericsson Radio Systems AB (ERA), 2000
Träff, Ingvar, Ericsson Utvecklings AB (UAB), 2001
Valfridsson, Martin, Ericsson Radio Systems AB (ERA), 2000-2001
Wiklund, Björn, Ericsson Micro Components (MIC), 2001
Wikström, Krister, Bourns, 2000
Åström, Leif, Svensk Material- och Mekanstandard (SMS), 2000
40
Appendices
I
The Ericsson Lists of Banned and Restricted Substances
II
Summary of regulations concerning substances on The
Ericsson Lists of Banned and Restricted Substances
III
Materials declarations of the components in the studied
printed board assemblies
IV
Materials declaration of ROJ 204 03
V
Materials declaration of ROJ 207 056
VI
Materials declaration of ROJ 212 206
VII
Materials declarations of the components in the studied
equipment practice
VIII
Materials declarations of cabinet, doors, back plate, side
plate and earthquake proof set.
IX
Material contents of the studied products
X
Calculations of reference levels for the printed board
assemblies.
XI
Calculations of reference levels for the equipment practice.
XII
Ericsson internal: Code letters for component manufacturers
41
Appendix I
The Ericsson Lists of Banned and Restricted Substances
43
44
THE ERICSSON LISTS OF BANNED AND RESTRICTED SUBSTANCES
1. PURPOSE
The purpose is to meet laws and legislation or expected new laws and
legislation due to strong trends in the countries we are operating in.
2. Directive
These lists specify the chemical substances that are generally banned
from Ericsson´s operations.
The substances are not to be present in the products Ericsson delivers
to the market nor in products Ericsson purchases from other suppliers,
and pertains to everything from electronics to furniture and other
materials.
Nor shall they be present in the production processes used in
fabrication of the products.
A sub-division has been made, with two lists of banned substances and
another two lists of substances, which are to eventually phased out.
This is to be interpreted such that
•
•
banned substances shall under no circumstances be present, not
even in low concentrations,
restricted substances shall be phased out as soon as possible
and replaced with technically and economically acceptable alternatives.
This assumes that alternative solutions are actively being sought.
The focus of the ban and the restriction are on any deliberate use of the
listed chemical substances.
Conversely, the ban or restriction does not apply in any cases where
such a presence derives from a natural contamination, that is, an
undesired presence in very small concentrations.
3. Application
All product managers, product design functions and purchasing
functions are responsible as well as Ericsson suppliers.
45
The Ericsson list of banned substances (in products)
Group of substances
Substance
Chemical name
Cadmium and its compounds except in batteries and thick film pastes
1
2
3
4
5
6
Metals
CFCs-chlorofluorocarbons
-
Leadchromate
CAS-number
Main area of use
Various
Pigments
Toxic
Bioaccummulative
7758-97-6
Pigments
Mercury and its compounds except in electric lighting
Various
Electronic equipment.
CFC 11
Trichlorofluoromethane
75-69-4
CFC 113
1.1.2-trichloro-1.2.2-trifluoroethane
76-13-1
CFC 114
Tetrafluorodichloroethane
76-14-2
Solvents
CFC 115
Chloropentafluoroethane
76-15-3
and
coolants
CFC 12
Dichlorodifluoromethane
75-71-8
HCFCs-chloroflourohydrocarbons
HCFC 22
Chlorodifluoromethane
75-45-6
Dekabromobiphenyl
13654-09-6
Brominated flame retardants
PBB polybrominated
biphenyls
PBDE -
Pentabromodiphenylether
32534-81-9
polybrominated
Octabromodiphenylether
32536-52-0
diphenylethers
Decabromodiphenylether
1163-19-5
Halon 1211
Bromodifluorochloromethane
353-59-3
Halon 1301
Bromotrifluoromethane
75-63-8
Halon 2402
Dibromotetrafluoroethane
124-73-2
Halons-bromofluorochlorocarbons
Chlorinated hydrocarbons
-
Carbon tetrachloride
56-23-5
-
Methylene chloride
75-09-2
-
1.1.1-trichloroethane
Chloroparaffins
63449-39-8
46
Toxic
Ozone depletion
Plastics
Bioaccumulative
Fire extinguisher
Ozone depletion
Ozone depletion
Solvents
71-55-6
-
Main risk
Carcinogenic
Ozone depletion
Lubricants, plasticisers
Bioaccumulative
The Ericsson list of banned substances (in production)
Group of substances
1
2
CFCs-chlorofluorocarbons
HCFCs-chloroflourohydrocarbons
Substance
4
Chlorinated hydrocarbons
Surfactants
CAS-number
Trichlorofluoromethane
CFC 113
1.1.2-trichloro-1.2.2-trifluoroethane
76-13-1
CFC 114
Tetrafluorodichloroethane
76-14-2
Main area of use
CFC 115
Chloropentafluoroethane
76-15-3
Solvents
Dichlorodifluoromethane
75-71-8
and
HCFC 22
Chlorodifluoromethane
75-45-6
coolants
HCFC 141 b
1.1-dichloro-1-fluoroethane
1717-00-6
1-chloro-1.1-difluoroethane
75-68-3
-
Carbon tetrachloride
56-23-5
-
Methylene chloride
75-09-2
-
1.1.1-trichloroethane
71-55-6
-
Chlorobromomethane
74-97-5
Nonylphenolethoxylates
Nonylphenolpolyglycolethers
47
Main risk
75-69-4
CFC 12
HCFC 142 b
3
Chemical name
CFC 11
9016-45-9
Ozone depletion
Ozone depletion
Solvents
Carcinogenic
Ozone depletion
Cleaning agents
Bioaccumulative
The Ericsson list of restricted substances (in products)
Group of substances
1
Metals
Substance
Chemical name
CAS-number
Antimony and its compounds
Various
Arsenic and its compounds except in semiconductors
Various
Beryllium and its compounds except in berylliumcopperalloys (<3 % Be)
Various
Main area of use
Main risk
Toxic
Electronic equipment
Bismuth
-
7440-69-9
Negative for recycling
Cadmium in batteries
-
7440-43-9
Carcinogenic
Chromium(VI)compounds
-
18540-29-9
Surface treatment
Lead and its compounds
-
Various
Electronic equipment,
Allergenic
Bioaccumulative
pigments, stabilizers
2
3
4
Halogenated flame retardants
Halogenated hydrocarbons
Organic compounds
Nickel and alloys except in steel alloys. Applicable only when in skin contact
Various
Electronic equipment
Organo-tin compounds
Various
Stabilizers
TBBA, reactive or additive
Plasticisers
Tetrabromobisphenol-A
Allergenic
Toxic
79-94-7
Printed boards
All others
-
Various
Plastics
FCs - fluorocarbons
-
Various
Coolants
Global warming potential
Global warming potential
HCFCs- chlorofluorohydrocarbons
Various
HFCs - fluorohydrocarbons except coolants
Various
Solvents
Azo compounds with carcinogenic amino compounds
-
5
-
Phthalates
Bioaccumulative
Ozone depletion
Various
LCDs, plastics
Formaldehyde
50-00-0
Preservatives
Various
Various
Polyvinylchloride (PVC)
Carcinogenic
Allergenic
Bioaccumulative, ecotoxic
Corrosion and/or risk of formation of
6
Polymers
Halogenated polymers except PVC in power cables
Various
Electronic and mechanical
equipment
48
halogenated dibenzodioxins and
-furans at uncontrolled fire
The Ericsson list of restricted substances (in production)
Group of substances
1 Halogenated hydrocarbons
Substance
CAS-number
Main area of use
FCs - fluorocarbons
Various
Coolants
HCFCs- chlorofluorohydrocarbons
Various
Ozone depletion
HFCs - fluorohydrocarbons except coolants
Various
Global warming potential
Perchloroethylene
Tetrachloroethylene
127-18-4
Trichloroethylene
79-01-6
Ethylenediaminetetraaceteic acid
64-02-8
2 Organic compounds
EDTA
Chemical name
49
Solvents
Complexing agent
Main risk
Global warming potential
Carcinogenic
Bioaccumulative
Appendix II
Summary of regulations concerning substances on The Ericsson
Lists of Banned and Restricted Substances
51
52
Summary of regulations
Country
Date for
entry
into
force
Antimony
Sweden
1995
Taiwan
1992
Förordning (1995:701) om gränsöverskridande
transporter av
Rules on Hazard Communication of Dangerous
Materials and Toxic Materials
Arsenic
EU
Germany
Taiwan
1976
1993
1992
The
Netherlands
USA
EU
(Proposed
regulation)
Market
demands
1998
76/769/EEC
Federal Law Gazette BGBI. I page 1493
Rules on Hazard Communication of Dangerous
Materials and Toxic Materials
Disposal of Brown and White Goods Decree
mid-2000
Resource Conservation and Recovery Act (RCRA)
prEN 13432 Draft European Standard
Telia recommends that arsenic shall be avoided for use i
products if possible. NTT DoCoMo list arsenic as a
restricted substance.
Beryllium
Sweden
1995
Sweden
1994
Förordning (1995:701) om gränsöverskridande
transporter av
Kemikalieinspektionens föreskrifter (1994:12) om
klassificering och märkning av kemiska produkter
Nickel
EU
EU
Japan
1976
1991
?
Switzerland
1998
The
Netherlands
UK
(Decree)
EU
(Proposed
regulations)
Market
demands
1998
76/769/EEC
91/537/EEG
Law for Promotion & Utilization of Recyclable
Resources
Ordinance on the return, the taking back and the disposal
of electrical and electronic appliances (ORDEA)
Disposal of Brown and White Goods
mid-2000
Restriction on the placing on the market of products
containing Nickel
prEN 13432 Draft European Standard
Telia requires that Nickel shall be avoided if possible.
Cadmium
53
Austria
1994
Denmark
EU
EU
EU
Sweden
Switzerland
The
Netherlands
(Proposed
regulations).
Market
demands.
Chromium
EU
2008
1992
1996
Ordinance Concerning Bans and Restrictions of
Cadmium and its Compounds, as well as White Lead
("Cadmium Ordinance")
Statutory Order on the Prohibition of Sale, Import, and
Manufacture of Cadmium-Containing Products
Outphasing of Cd in Electronic equipment, WEEE-draft
91/338/EEC, ändring av direktiv 76/769/EEG om
begränsning av användning oc h utsläppande på
marknaden av vissa farliga ämnen och preparat
(beredningar)
91/157/EEC
The Cadmium Ordinance. KIFS 1985:839
SR814.013
Regulation on methods for determining the cadmium
content of products
NTT DoCoMo has cadmium as a restricted substance.
Many customers have bans on NiCd batteries. Telia has
Cadmium as a restricted substance in stationary batteries
other applications are banned
1994
Germany
The
Netherlands
USA
1978
1998
Council Directive 94/62/EC on Packaging and
Packaging Waste
Blue Angel Eco-label
Disposal of Brown and White Goods Decree
EU
(Proposed
regulations)
EU
mid-2000
Resource Conservation and Recovery Act(RCRA) + 17
US states
prEN 13432 Draft European Standard
Second Draft Proposal for a Directive on Waste from
Electrical and Electronic Equipment
DoCoMo and Telia has listed chromium as a restricted
substance. Chromium is listed on
Kemikalieinspektionen´s begränsningslista and all
products comtaining chromium must therefore be labeld
according to FMV
Market
demands
Mercury
Austria
1990
Denmark
1994
EU
EU
1976
1993
EU
Germany
1996
1993
BGBI.1 1990/514 Ordinance on the Return of Batteries
and Accumulators
1994/520 Statutory order on prohibition of sale of
mercury-containing products
76/769/EEC amendment 89/677/EEC
Council Directive 91/157/EEC on Batteries and
Accumulators Containing Certain Dangerous Substances
EU Packaging Directive 94/62/EEC
BGBI.1 Prohibitation of chemicals ordinance -
54
Germany
Ireland
1978
1994
Norway
1990
Norway
1998
Sweden
1999
Taiwan
Taiwan
1996
1992
United
Kingdom
USA
EU
(Proposed
regulations)
Market
demands
1994
1996
Cemverbots V
Blue Angel Eco-label
European Communities (Batteries and Accumulators)
Regulations No. 262 Of 1994.
Regulations Relating to Environmentally Harmful
Batteries
Regulations Regarding Scrapped Electrical and
Electronic Products, March 1998
Förordning 1998:944 om förbud mm i vissa fall i
samband med hantering, införsel och utförsel av kemiska
produkter
Green Mark
Rules on Hazard Communication of Dangerous
Materials and Toxic Materials
The Batteries and Accumulators (Containing Dangerous
Substances) Regulations 1994
Law 104-142; 42 USC 14301
The use of Mercury shall be phased out in 2008.
Mercury and mercury compunds are on the Telia
restricted list for button cell batteries and banned for use
in mercury oxide batteries and in other applications apart
from fluorescent lamps. NTT DoCoMo has Mercury as a
restricted substance. Many customers have bans on
Mercury and its compounds.
Lead
Austria
Denmark
1993
2000
EU
EU
1991
EU
Ireland
1994
Japan
The
Netherlands
Sweden
EU
(Proposed
regulations)
US
Competitors
1998
mid-2000
Federal Law Gazette No 855/1993
Statuary order on prohibition of import, marketing, and
manufacture of lead and products containing lead
89/677/EEC added lead to 76/769/EEC
Council Directive 91/157/EEC on Batteries and
Accumulators Containing Certain Dangerous Substances
Packaging Directive 94/62/EEC
European Communities (Batteries and Accumulators)
Regulations No. 262 Of 1994.
Law for Promotion & Utilization of Recyclable
Resources
Disposal of Brown and White Goods Decree
SFS 1998:944
prEN 13432 Draft European Standard-requirements for
packaging recoverable through composting and
biodegradation - test scheme and evaluation criteria for
the final acceptance of packaging
TRI Lead rule
Panasonic Group will phase out Lead solder completely
from all products like household electronics, IT
equipments and industrial appliance until the end of
55
2002. Panasonic will replace Lead solder with the
alternatives like silver and cupper and strengthen the
environmental activity. From now on, Lead solder will
be replaced with Tin/Silver/Bismuth and
Tin/Silver/Cupper solder. Also instead of Lead solder, an
electric conductive adhesive will be adopted
Lead is restricted by Telia in batteries for wireless
equipment. Lead is banned by Telia in cables, extension
pipes, extension plates, coloring pigments, crystal glass,
addition to polymers, and it is listed as a restricted
substance by DoCoMo. FMV also list lead as a restricted
substance as it is present on Kemikalieinspektionen list
of restricted substances.
Market
demands
Producer
responsabili
ty
Sweden
Sweden
1 July
2001
2001
Förordning (2000:208) om producentansvar för
elektriska och elektroniska produkter
The regulations of The Swedish Environmental
Protection Agency for the pre-treatment of waste
consisting of or containing electrical or electronic
products.
Other
Austria
1990
Austria
1990
Ordinance of the Federal Minister of the
environment,Youth and the Family Prohibiting Halons
Ordinance Concerning Restrictions and Bans on the Use,
Manufacture, and Placing on the Market of Fully
Halogenated Chlorofluorocarbons
ROHS-directive
Accelerated freeze of HCFC production in developing
countries
Methyl bromide rule
Brominated flame retardants ban
EU
EU
US
Denmark
(Proposed
regulations)
56
Appendix III
Materials declarations of the components in the studied printed
board assemblies
57
58
Abbreviations and explanations
Ag
Al
As
Au
Ba
Bi
Be
Br
Cd
Co
Cr
Cu
Fe
Hg
Mg
Ni
P
Pb
Pd
Ru
Status:
Silver
Aluminium
Arsenic
Gold
Barium
Bismuth
Beryllium
Bromine
Cadmium
Cobalt
Chromium
Copper
Iron
Mercury
Magnesium
Nickel
Phosphorus
Lead
Palladium
Ruthenium
1
2
3
4
5
Sb
Si
Sn
Ta
Te
Ti
Zn
TBBA
Sb2O3
EP
PEEK
PI
PTFE
PVC
UP
SP-LCP
PC
pol.
cer.
Antimony
Silicon
Tin
Tantalum
Tellurium
Titanium
Zinc
Tetrabromo bisphenol
Antimonytrioxide
Epoxy
Polyetheretherketone
Polyimide
Polytetrafluoroethylene
Vinyl chloride
Unsaturated polyester
Liquid crystalline polymers of polyestertype
Polycarbonate
remaining polymers
unspecified glass/ceramics
complete decl from supplier / 1a equal to other component (classified as 1) according to component engineer
mass measured, material from doc 1301, specialists or other sources
incomplete decl from supplier / 3a equal to other component (classified as 3) according to component engineer
component supposed to be similar so other component, see comment
no decl available
Suggestions for using marda for other PBAs:
1. Copy and rename the document
2. Only save the worksheet called "all components" - otherwise the document will be too heavy
3. Insert the components of the new PBA at the end of the column with Components
4. Insert a new column where you can put an "x" for all the components in the new PBA.
5. "Sort ascending" (make sure the rest of the document and all the declarations follows the components to which they belong)
59
1
1
1
1
1
1
1
1
1
1
Status
ROJ 212 206/1
Product name:
FUNCTIONAL COMPONENT
FUNCTIONAL COMPONENT
FUNCTIONAL COMPONENT
FUNCTIONAL COMPONENT
MEMORY SET/MAUR
LABEL/PRODUCT 30+17X10 1
LABEL/Product 27+16x10
1
LABEL/PRODUCT 38 X 6.35
LABEL/PRODUCT 50.8 X6.35 1
INDUCTOR/INDUCTOR/
TRANSFORMER/PULSE TRA 1
TRANSFORMER/ETHERNET
INDUCTOR/SMD,10UH 20%
INDUCTOR/SMD,1.0UH 20%
INDUCTOR/SMD,2.2UH 20%
TRANSFORMER/COMMON
1
RESISTOR/22 KOHM 5% 12 2
RESISTOR/4.7ohm 5% 0603
RESISTOR/12ohm 1% 0603
RESISTOR/22ohm 1% 0603
RESISTOR/27ohm 1% 0603
RESISTOR/33ohm 1% 0603
RESISTOR/56ohm 1% 0603
RESISTOR/68ohm 1% 0603
RESISTOR/75ohm 1% 0603 12
RESISTOR/82ohm 1% 0603
RESISTOR/100ohm 1% 0603
RESISTOR/120ohm 1% 0603
RESISTOR/150ohm 1% 0603
RESISTOR/160ohm 1% 0603
RESISTOR/200ohm 1% 0603
RESISTOR/220ohm 1% 0603
RESISTOR/270ohm 1% 0603 1
RESISTOR/470ohm 1% 0603
RESISTOR/560ohm 1% 0603
RESISTOR/1.0kohm 1% 060 2
RESISTOR/1.5kohm 1% 060
RESISTOR/1.8kohm 1% 060
RESISTOR/2.2kohm 1% 060 2
RESISTOR/2.7kohm 1% 060
RESISTOR/3.3kohm 1% 060
RESISTOR/7.5kohm 1% 060
RESISTOR/10kohm 1% 0603
RESISTOR/15kohm 1% 0603
RESISTOR/22kohm 1% 0603
RESISTOR/27kohm 1% 0603
RESISTOR/39kohm 1% 0603
RESISTOR/47kohm 1% 0603
RESISTOR/100kohm 1% 060
RESISTOR/120kohm 1% 060
RESISTOR/220kohm 1% 060
RESISTOR/330kohm 1% 060
RESISTOR/470kohm 1% 060
RESISTOR/1.0Mohm 1% 060 2
RESISTOR/MELF 33K2, +-.1
RESISTOR/100K, +-0.1%, +RESISTOR/200 KOHM,+-0.1
RESISTOR/1 OHM,5%,MELF 2
RESISTOR/2 OHM,5%,MELF
RESISTOR/3.9 OHM,5%,ME
RESISTOR NETWORK/4 X 2 2
RESISTOR NETWORK/4 X 5 6
RESISTOR NETWORK/4 X 1 2
RESISTOR NETWORK/4 X 1 1
RESISTOR NETWORK/4 X 2 1
RESISTOR NETWORK/4 X 4 3
ROJ 207 056/1
Component:
(RON 109 167)
(RON 109 168)
(RON 109 169)
(RON 109 170)
(RYS 107 359)
LZF 083 204/1L
LZF 083 204/3
LZF 083 256/1
LZF 083 260/1
REG 318 2368
REG 608 002
REG 608 102
REG 709 232/1
REG 709 531/1
REG 709 531/22
REG 735 09/1
REP 513 425/22
REP 623 441/47
REP 623 642/12
REP 623 642/22
REP 623 642/27
REP 623 642/33
REP 623 642/56
REP 623 642/68
REP 623 642/75
REP 623 642/82
REP 623 643/1
REP 623 643/12
REP 623 643/15
REP 623 643/16
REP 623 643/2
REP 623 643/22
REP 623 643/27
REP 623 643/47
REP 623 643/56
REP 623 644/1
REP 623 644/15
REP 623 644/18
REP 623 644/22
REP 623 644/27
REP 623 644/33
REP 623 644/75
REP 623 645/1
REP 623 645/15
REP 623 645/22
REP 623 645/27
REP 623 645/39
REP 623 645/47
REP 623 646/1
REP 623 646/12
REP 623 646/22
REP 623 646/33
REP 623 646/47
REP 623 647/1
REP 633 905/332
REP 633 906/1
REP 633 906/2
REP 670 441/1
REP 670 441/2
REP 670 441/39
RER 755 1442/22
RER 755 1442/56
RER 755 1443/1
RER 755 1443/15
RER 755 1443/27
RER 755 1443/47
ROJ 204 03/1
Materials declarations for components in ROJ 204 03/1, ROJ 207 056/1 and ROJ 212 206/1
Supplier
(for mat.
dekl.)
Comments
3a
2
1b
1c
2
suppliers estimation
1
3
3
3
d
d
d
e
find approver
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1a
1
1a
1
1
1
1*
1*
1*
1*
1*
1*
f
f
f
f
f
f
f
f
f
g
f
f
f
f
f
f
f
f
g
f
f
f
f
f
f
f
f
f
f
f
f
g
f
f
f
g
f
h
h
h
i
i
i
j
j
j
j
j
j
Ag
Al
As
1
1
2
1
2
1
2
59
4
44 12
19 23
2
1
16 26
2
4
1
6
32
8
5
26 16
10 5
2
8
87
4
53
2
2
2
4
2
2
6
9
1
2
3
2
1
2
1
4
2
0,00013
0,00006
0,00006
0,00006
0,00006
0,00006
0,00006
0,00006
0,00006
0,00005
0,00006
0,00006
0,00006
0,00006
0,00006
0,00006
0,00006
0,00006
0,00005
0,00006
0,00006
0,00006
0,00006
0,00006
0,00006
0,00006
0,00006
0,00006
0,00006
0,00006
0,00006
0,00005
0,00006
0,00006
0,00006
0,00005
0,00006
0,00907
0,00907
0,00907
0,00019
0,00019
0,00019
0,00019
0,00019
0,00019
60
0,00163
0,00163
0,00163
0,00163
0,00163
0,00163
0,00163
0,00163
0,00163
0,00163
0,00163
0,00163
0,00163
0,00163
0,00163
0,00163
0,00163
0,00163
0,00163
0,00163
0,00163
0,00163
0,00163
0,00163
0,00163
0,00163
0,00163
0,00163
0,00163
0,00163
0,00163
0,00163
0,00163
0,00486
0,00486
0,00486
0,00486
0,00486
0,00486
Au
Component:
Ba
(RON 109 167)
(RON 109 168)
(RON 109 169)
(RON 109 170)
(RYS 107 359)
LZF 083 204/1L
LZF 083 204/3
LZF 083 256/1
LZF 083 260/1
REG 318 2368
REG 608 002
REG 608 102
REG 709 232/1
REG 709 531/1
REG 709 531/22
REG 735 09/1
REP 513 425/22
REP 623 441/47
REP 623 642/12
REP 623 642/22
REP 623 642/27
REP 623 642/33
REP 623 642/56
REP 623 642/68
REP 623 642/75
REP 623 642/82
REP 623 643/1
REP 623 643/12
REP 623 643/15
REP 623 643/16
REP 623 643/2
REP 623 643/22
REP 623 643/27
REP 623 643/47
REP 623 643/56
REP 623 644/1
REP 623 644/15
REP 623 644/18
REP 623 644/22
REP 623 644/27
REP 623 644/33
REP 623 644/75
REP 623 645/1
REP 623 645/15
REP 623 645/22
REP 623 645/27
REP 623 645/39
REP 623 645/47
REP 623 646/1
REP 623 646/12
REP 623 646/22
REP 623 646/33
REP 623 646/47
REP 623 647/1
REP 633 905/332
REP 633 906/1
REP 633 906/2
REP 670 441/1
REP 670 441/2
REP 670 441/39
RER 755 1442/22
RER 755 1442/56
RER 755 1443/1
RER 755 1443/15
RER 755 1443/27
RER 755 1443/47
Bi
Be
Br
Cd
Co
Cr
Cu
Fe
Hg
Mg
Ni
P
Pb
Pd
1,00000
0,12680
0,10632
0,10632
0,00001
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00001
0,00001
0,00001
61
0,00001
0,00001
0,00001
0,00001
0,00001
0,00001
0,00001
0,00001
0,00001
0,00000
0,00001
0,00001
0,00001
0,00001
0,00001
0,00001
0,00001
0,00001
0,00000
0,00001
0,00001
0,00001
0,00001
0,00001
0,00001
0,00001
0,00001
0,00001
0,00001
0,00001
0,00001
0,00000
0,00001
0,00001
0,00001
0,00000
0,00001
0,00009
0,00009
0,00009
0,00805
0,00805
0,00805
0,02874
0,02874
0,02874
0,04510
0,02706
0,02706
0,02520
0,01782
0,01782
0,00008
0,00010
0,00010
0,00010
0,00010
0,00010
0,00010
0,00010
0,00010
0,00008
0,00010
0,00010
0,00010
0,00010
0,00010
0,00010
0,00010
0,00010
0,00008
0,00010
0,00010
0,00010
0,00010
0,00010
0,00010
0,00010
0,00010
0,00010
0,00010
0,00010
0,00010
0,00008
0,00010
0,00010
0,00010
0,00008
0,00010
0,00032
0,00032
0,00032
0,00036
0,00036
0,00036
0,00016
0,00016
0,00016
0,00016
0,00016
0,00016
0,00007
0,00002
0,00002
0,00002
0,00002
0,00002
0,00002
0,00002
0,00002
0,00001
0,00002
0,00002
0,00002
0,00002
0,00002
0,00002
0,00002
0,00002
0,00001
0,00002
0,00002
0,00002
0,00002
0,00002
0,00002
0,00002
0,00002
0,00002
0,00002
0,00002
0,00002
0,00001
0,00002
0,00002
0,00002
0,00001
0,00002
0,00002
0,00002
0,00002
0,00004 0,00019
0,00004 0,00019
0,00004 0,00019
0,00002
0,00002
0,00002
0,00002
0,00002
0,00002
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
0,00000
Component:
PI
PTFE
(RON 109 167)
(RON 109 168)
(RON 109 169)
(RON 109 170)
(RYS 107 359)
LZF 083 204/1L
LZF 083 204/3
LZF 083 256/1
0,09000
LZF 083 260/1
REG 318 2368
REG 608 002
REG 608 102
REG 709 232/1
REG 709 531/1
REG 709 531/22
REG 735 09/1
REP 513 425/22
REP 623 441/47
REP 623 642/12
REP 623 642/22
REP 623 642/27
REP 623 642/33
REP 623 642/56
REP 623 642/68
REP 623 642/75
REP 623 642/82
REP 623 643/1
REP 623 643/12
REP 623 643/15
REP 623 643/16
REP 623 643/2
REP 623 643/22
REP 623 643/27
REP 623 643/47
REP 623 643/56
REP 623 644/1
REP 623 644/15
REP 623 644/18
REP 623 644/22
REP 623 644/27
REP 623 644/33
REP 623 644/75
REP 623 645/1
REP 623 645/15
REP 623 645/22
REP 623 645/27
REP 623 645/39
REP 623 645/47
REP 623 646/1
REP 623 646/12
REP 623 646/22
REP 623 646/33
REP 623 646/47
REP 623 647/1
REP 633 905/332
REP 633 906/1
REP 633 906/2
REP 670 441/1
REP 670 441/2
REP 670 441/39
RER 755 1442/22
RER 755 1442/56
RER 755 1443/1
RER 755 1443/15
RER 755 1443/27
RER 755 1443/47
RER 755 1444/22
RER 755 1445/1
PVC
UP
SP-LCP
PC
pol.
cer.
SiO2
Al2O3
TiO2
MgO
0,05000
0,03400
0,00001
0,00007
0,00008
0,00178
0,00008
0,00178
0,00008
0,00178
0,00008
0,00178
0,00082
0,00082
0,00082
0,02543
0,02543
0,02543
0,00026
0,00026
0,00026
0,00026
0,00026
0,00026
0,00026
0,00026
62
0,00694 0,00008
0,00694 0,00008
0,00694 0,00008
CaO
Component:
BO
(RON 109 167)
(RON 109 168)
(RON 109 169)
(RON 109 170)
(RYS 107 359)
LZF 083 204/1L
LZF 083 204/3
LZF 083 256/1
LZF 083 260/1
REG 318 2368
REG 608 002
REG 608 102
REG 709 232/1
REG 709 531/1
REG 709 531/22
REG 735 09/1
REP 513 425/22
REP 623 441/47
REP 623 642/12
REP 623 642/22
REP 623 642/27
REP 623 642/33
REP 623 642/56
REP 623 642/68
REP 623 642/75
REP 623 642/82
REP 623 643/1
REP 623 643/12
REP 623 643/15
REP 623 643/16
REP 623 643/2
REP 623 643/22
REP 623 643/27
REP 623 643/47
REP 623 643/56
REP 623 644/1
REP 623 644/15
REP 623 644/18
REP 623 644/22
REP 623 644/27
REP 623 644/33
REP 623 644/75
REP 623 645/1
REP 623 645/15
REP 623 645/22
REP 623 645/27
REP 623 645/39
REP 623 645/47
REP 623 646/1
REP 623 646/12
REP 623 646/22
REP 623 646/33
REP 623 646/47
REP 623 647/1
REP 633 905/332
REP 633 906/1
REP 633 906/2
REP 670 441/1
REP 670 441/2
REP 670 441/39
RER 755 1442/22
RER 755 1442/56
RER 755 1443/1
RER 755 1443/15
RER 755 1443/27
RER 755 1443/47
RER 755 1444/22
RER 755 1445/1
FeO
0,00004
BaTiO3
other
materials'
sum
product
weigt
given
product
weigt
1,30000
0,05000
2,00000
0,09000
0,03400
1,50000
0,05000
2,00000
0,15000
0,03400
0,30810
0,22448
0,22448
0,00193
0,77000
0,59600
0,59600
0,00287
0,00205
0,00191
0,00191
0,00191
0,00191
0,00191
0,00191
0,00191
0,00191
0,00208
0,00191
0,00191
0,00191
0,00191
0,00191
0,00191
0,00191
0,00191
0,00208
0,00191
0,00191
0,00191
0,00191
0,00191
0,00191
0,00191
0,00191
0,00191
0,00191
0,00191
0,00191
0,00208
0,00191
0,00191
0,00191
0,00208
0,00191
0,01765
0,01765
0,01765
0,06889
0,06889
0,06889
0,00577
0,00577
0,00577
0,00577
0,00577
0,00577
0,00577
0,00577
0,00209
0,00199
0,00199
0,00199
0,00199
0,00199
0,00199
0,00199
0,00199
0,00214
0,00199
0,00199
0,00199
0,00199
0,00199
0,00199
0,00199
0,00199
0,00214
0,00199
0,00199
0,00199
0,00199
0,00199
0,00199
0,00199
0,00199
0,00199
0,00199
0,00199
0,00199
0,00214
0,00199
0,00199
0,00199
0,00214
0,00199
0,01912
0,01912
0,01912
0,06900
0,06900
0,06900
0,00867
0,00867
0,00867
0,00867
0,00867
0,00867
0,00867
0,00867
63
2
2
2
8
16
2
1
5 193
6
1
2
9
2
4
16
9
2
2
2
2
5
2
Status
ROJ 212 206/1
Product name:
CAPACITOR/1.0uF +/-10% 0
CAPACITOR/1.2nF +/-5% 06 2
CAPACITOR/10uF +/-10% 12
CAPACITOR/180nF,10%,250 4
CAPACITOR/10nF 1210 50V
CAPACITOR/10pF 0603 100V
CAPACITOR/47pF 0603 100V
CAPACITOR/22pF 0805 200V
CAPACITOR/470nF +/-10% 1 1
CAPACITOR/100nF +/-10% 0 29
CAPACITOR/10nF +/-10% 08
CAPACITOR/2.2nF +/-10% 0
CAPACITOR/100nF +/-10% 1
CAPACITOR/63V,68UF,AL-R
CAPACITOR/22 UF/20 V, SM
CAPACITOR/68 UF, 20 V, EDIODE/DIODE, SIGNAL
DIODE/SW. 70V .1A 6ns SOT
DIODE/DUAL SERIES 70V .2 10
DIODE/DIODE 200V 1A 35ns 2
REGULATOR DIODE/REG 3 4
OVERVOLTAGE ARRESTER
DIODE/DOUBLE SCHOTTKY
DIODE/SCHOTTKY 0.2A 30V
DIODE/DOUBLE SCHOTTKY 2
LIGHT EMITTING DIODE/SM 1
LIGHT EMITTING DIODE/SM
LIGHT EMITTING DIODE/HS
PUSH-BUTTON SWITCH/
TOGGLE SWITCH/
REAR PCB CONNECTOR/VI 5
REAR PCB CONNECTOR/RI
REAR PCB CONNECTOR/RI
CONTACT STRIP/
15
PROD. ADAPT. CIRCUIT/GR 1
PROD. ADAPT. CIRCUIT/RP
PIN CONNECTOR/KRAFT -4
CONNECTOR/HEADER FOR
PIN CONNECTOR/KORTFRO 2
PIN CONNECTOR/KORTFRO
PIN CONNECTOR/KORTFRO 1
PIN CONNECTOR/SKÄRMA
OSCILLATOR/SPXO 25.000
OSCILLATOR/SPXO 40.960M 1
OSCILLATOR/SPXO 20.000M
QUARTZ CRYSTAL UNIT/QU
TRANSISTOR/
TRANSISTOR/PNP, 65V, SO
TRANSISTOR/
TRANSISTOR/NCH 200V 0.1 2
MICROCIRCUIT/OPAMP x4
1
MICROCIRCUIT/COMP x2 7v
MICROCIRCUIT/DELAY CIR
MICROCIRCUIT/RS232 2/2 T
MICROCIRCUIT/AM26LV31C 1
MICROCIRCUIT/AM26LV32C 1
MICROCIRCUIT/LVDS QUAD
MICROCIRCUIT/LVDS RECE 1
MICROCIRCUIT/I2C 8-BIT I/O 1
MICROCIRCUIT/FIFO 1K9 2
MICROCIRCUIT/ICL7665 U/
MICROCIRCUIT/MAX706T S
MICROCIRCUIT/LM4040 VO
MICROCIRCUIT/VREG,3.3V
MICROCIRCUIT/MAX811S R
MICROCIRCUIT/EEPROM 25 1
MICROCIRCUIT/FLASH 8M(
MICROCIRCUIT/DRAM 4M
ROJ 207 056/1
ROJ 204 03/1
Component:
RJC 464 3047/1
RJC 464 4034/12
RJC 516 3568/1T
RJC 526 3276/18
RJC 543 4065/1
RJC 543 4372/1
RJC 543 4372/47
RJC 543 4582/22
RJC 544 3056/47
RJC 544 3556/1
RJC 544 3575/1
RJC 544 3584/22
RJC 544 3676/1
RJE 328 2632/68
RJE 584 3208/22
RJE 584 3208/68
RKZ 120 16/1
RKZ 123 02/1
RKZ 123 03/1
RKZ 123 05/2
RKZ 223 01/4
RKZ 223 485/68
RKZ 323 08/1
RKZ 323 102/1
RKZ 323 17/3
RKZ 433 25/2
RKZ 433 25/3
RKZ 433 622/1
RMD 943 01/01
RMF 350 01/04
RNV 601 1111
RNV 620 1111
RNV 621 1111
RNV 703 0001/1
ROP 101 896
ROP 101 897
RPT 405 1119/40
RPV 391 03/110
RPV 421 1111
RPV 421 1112
RPV 421 1113
RPV 431 1911
RTL 201 012/01
RTL 201 012/11
RTL 201 028/13
RTM 486 003/02
RYN 120 15/1
RYN 120 16/2
RYN 121 36/1
RYN 123 36/1
RYT 101 064/C
RYT 101 122/C
RYT 108 011/3C
RYT 109 099/C
RYT 109 106/2C
RYT 109 107/2C
RYT 109 126/4C
RYT 109 127/4C
RYT 109 6048/2C
RYT 110 015/3C
RYT 113 013/4C
RYT 113 036/3C
RYT 113 044/2C
RYT 113 6104/C
RYT 113 7604/C
RYT 118 044/2C
RYT 118 072/6C
RYT 119 076/2C
Supplier
(for mat.
dekl.)
Comments
Ag
Al
1k
4a
suppose RJC 464 3034/1
0,00030
1l
1m
0,00730
1n
0,00400
4a n
supposeRJC 543 4372/47,Cd0,00051
3n
Cd
0,00051
1n
0,00111
1
1210RJC,background levels 0,00830
1n
2 very different declarations! 0,00157
1n
0,00157
1n
0,00157
1n
0,00293
1* o
3p
0,00826
4n
suppose: RJE5843202/22
0,00826
suppose: RKZ 323 08/1
1a f
1q
0,00001
1f
3r
1f
1a f
1a f
Au
0,80100
0,00001
suppose: RKZ 323 08/1
suppose: RKZ 323 08/1
1
5
4
2
1
5
5
8
1
12 4a
2 4a
3
1*
1
1
1
2
As
Nolato will not make declaration
Nolato will not make declaration
s
s
s
0,00020
0,00020
0,00020
suppose RNV 601 1111
suppose RNV 601 1111
mass?
t
t
put in Matilda
0,02700
0,04419
0,04000
0,00453
u
u
RTL201011, substance decl. 0,00462
RTL201011, substance decl. 0,00462
0,00048
0,00025
0,00020
0,00020
0,00050
2
3
1
1
2
8
4
1
1
1
1
1
1 1a
1a
3
1 3
1 1
3 1
1 1
1a
1a
1a
1a
1 1a
3 1a
3 1a
1a
4 1a
1a
4 1
2 1a
1
1 1a
1a
2 1a
1 1a
1a
12 4a
0,00001
0,00001
f
suppose: RYN 120 16/2
suppose:of type SOP8
suppose:of type SOP8
suppose:of type SOP8
suppose:of type SOP8
suppose:of type PLCC32
suppose:of type PLCC32
suppose:of type PLCC32
suppose:of type PLCC32
suppose:RYT3310244
x
v
v
v
v
v
suppose: RYT 113 036/3C
suppose: RYT 113 036/3C
suppose: RYT 113 036/3C
suppose: RYT 113 036/3C
suppose:of type SOP8
suppose: RYT1196059
suppose RYT 1196059/3
x
64
0,00058
0,00058
0,00058
0,00058
0,00158
0,00158
0,00158
0,00158
0,00113
0,02339
0,00045
0,00045
0,00045
0,00045
0,00045
0,00058
0,01132
0,01132
0,00001
0,00001
0,00001
0,00001
0,00021
0,00021
0,00021
0,00021
0,00021
0,00001
0,00001
0,00020
0,00020
0,00020
0,00020
0,00113
0,00113
0,00113
0,00113
0,00030
0,00940
0,00020
0,00020
0,00020
0,00020
0,00020
0,00020
0,00350
0,00350
Component:
Ba
RJC 464 3047/1
RJC 464 4034/12
RJC 516 3568/1T
RJC 526 3276/18 0,03178
RJC 543 4065/1
RJC 543 4372/1
RJC 543 4372/47
RJC 543 4582/22
RJC 544 3056/47
RJC 544 3556/1
RJC 544 3575/1
RJC 544 3584/22
RJC 544 3676/1
RJE 328 2632/68
RJE 584 3208/22
RJE 584 3208/68
RKZ 120 16/1
RKZ 123 02/1
RKZ 123 03/1
RKZ 123 05/2
RKZ 223 01/4
RKZ 223 485/68
RKZ 323 08/1
RKZ 323 102/1
RKZ 323 17/3
RKZ 433 25/2
RKZ 433 25/3
RKZ 433 622/1
RMD 943 01/01
RMF 350 01/04
RNV 601 1111
RNV 620 1111
RNV 621 1111
RNV 703 0001/1
ROP 101 896
ROP 101 897
RPT 405 1119/40
RPV 391 03/110
RPV 421 1111
RPV 421 1112
RPV 421 1113
RPV 431 1911
RTL 201 012/01
RTL 201 012/11
RTL 201 028/13
RTM 486 003/02
RYN 120 15/1
RYN 120 16/2
RYN 121 36/1
RYN 123 36/1
RYT 101 064/C
RYT 101 122/C
RYT 108 011/3C
RYT 109 099/C
RYT 109 106/2C
RYT 109 107/2C
RYT 109 126/4C
RYT 109 127/4C
RYT 109 6048/2C
RYT 110 015/3C
RYT 113 013/4C
RYT 113 036/3C
RYT 113 044/2C
RYT 113 6104/C
RYT 113 7604/C
RYT 118 044/2C
RYT 118 072/6C
RYT 119 076/2C
Bi
Be
Br
Cd
Co
Cr
Cu
Fe
0,00140
0,00008
0,00036
0,00006
0,00006
0,00013
0,00005 0,00005
0,00096
0,00015
0,00015
0,00032
0,00066
0,00064
0,00064
0,00064
0,00138
Mg
Ni
P
0,00170
0,00003
0,01755
0,00022
0,00052
0,00008
0,00008
0,00017
0,00005 0,00056
0,00017
0,00017
0,00017
0,00035
Pb
Pd
0,01856
0,01856
0,00151
0,00125
0,00151
0,01344
0,01344
0,00109
0,00090
0,00109
0,00003 0,00035
0,00002
0,00105
0,00052 0,00044
0,00008 0,00004
0,00008 0,00004
0,00017 0,00008
0,00063 0,00675
0,00009 0,00020
0,00009 0,00020
0,00009 0,00020
0,00019 0,00030
0,11200
0,00008
0,00008
0,00006
0,00003
0,00006
0,00151
0,00151
0,00151
0,00109
0,00109
0,00109
0,00006
0,00006
0,00006
0,00005
0,00260
0,00260
0,00005
0,00003
0,00010
Hg
0,02066
0,00005
0,00005
0,00005
1,27908
1,27908
1,27908
0,13328
0,23900
0,00300
0,00300
0,00010 0,00274
0,00010 0,00274
0,00010 0,00274
0,00272
0,02550
0,02550
0,01140
0,00050
0,00031
0,07170
0,07170
0,33180
0,00005
0,00005
0,00003
0,00005
0,00054
0,00054
0,00054
0,00054
0,00644
0,00644
0,00644
0,00644
0,00060
0,01563
0,00040
0,00040
0,00040
0,00040
0,00040
0,00054
0,00632
0,00632
0,00950
0,00608
0,00485
0,00485
0,01680
0,00246
0,00246
0,00128
0,00099
0,00246
0,02234
0,02234
0,02234
0,02234
0,42081
0,42081
0,42081
0,42081
0,04478
1,02724
0,02886
0,02886
0,02886
0,02886
0,02886
0,02234
0,44725
0,44725
65
0,00070
0,00070
0,00070
0,00070
0,00070
0,00071
0,00004
0,00023
0,00023
0,00023
0,00023
0,00007
0,00007
0,00007
0,00007
0,00173
0,00173
0,00173
0,00173
0,00016
0,00744
0,00030
0,00030
0,00030
0,00030
0,00030
0,00007
0,00158
0,00158
0,00023
0,00023
0,00023
0,00023
0,00023
0,00023
0,00001
0,00001
0,00001
0,00001
0,00001
Component:
Ru
RJC 464 3047/1
RJC 464 4034/12
RJC 516 3568/1T
RJC 526 3276/18
RJC 543 4065/1
RJC 543 4372/1
RJC 543 4372/47
RJC 543 4582/22
RJC 544 3056/47
RJC 544 3556/1
RJC 544 3575/1
RJC 544 3584/22
RJC 544 3676/1
RJE 328 2632/68
RJE 584 3208/22
RJE 584 3208/68
RKZ 120 16/1
RKZ 123 02/1
RKZ 123 03/1
RKZ 123 05/2
RKZ 223 01/4
RKZ 223 485/68
RKZ 323 08/1
RKZ 323 102/1
RKZ 323 17/3
RKZ 433 25/2
RKZ 433 25/3
RKZ 433 622/1
RMD 943 01/01
RMF 350 01/04
RNV 601 1111
RNV 620 1111
RNV 621 1111
RNV 703 0001/1
ROP 101 896
ROP 101 897
RPT 405 1119/40
RPV 391 03/110
RPV 421 1111
RPV 421 1112
RPV 421 1113
RPV 431 1911
RTL 201 012/01
RTL 201 012/11
RTL 201 028/13
RTM 486 003/02
RYN 120 15/1
RYN 120 16/2
RYN 121 36/1
RYN 123 36/1
RYT 101 064/C
RYT 101 122/C
RYT 108 011/3C
RYT 109 099/C
RYT 109 106/2C
RYT 109 107/2C
RYT 109 126/4C
RYT 109 127/4C
RYT 109 6048/2C
RYT 110 015/3C
RYT 113 013/4C
RYT 113 036/3C
RYT 113 044/2C
RYT 113 6104/C
RYT 113 7604/C
RYT 118 044/2C
RYT 118 072/6C
RYT 119 076/2C
Sb
Si
Sn
Ta
0,00040
0,00003
0,00043
0,00048
0,00064
0,00009
0,00009
0,00020
0,00064
0,00020
0,00020
0,00020
0,00043
Te
Ti
0,01096
0,00001
Zn
TBBA
Sb2O3
EP
0,00027
0,00036
0,00005
0,00005
0,00012
0,00066
0,00001
0,00001
0,00001
0,00003
0,00377
0,00072 0,11088
0,00377
0,00072 0,11088
0,00010 0,00010 0,00024
0,00006 0,00041 0,00011
0,00005 0,00010 0,00024
0,00607
0,12937
0,12937
0,00125
0,00481
0,00125
0,03542
0,00010 0,00010 0,00024
0,00010 0,00010 0,00024
0,00010 0,00010 0,00024
0,00125
0,00125
0,00125
0,08208
0,08208
0,08208
0,24500
0,04395
0,00475
0,00150
0,00995
0,00995
0,00475
0,00300
0,00300
0,00100
0,00023
0,00008
0,00008
0,00006
0,00008
0,00113
0,00113
0,00113
0,00113
0,01353
0,01353
0,01353
0,01353
0,00297
0,08442
0,00023
0,00023
0,00010
0,00023
0,00219
0,00219
0,00219
0,00219
0,04101
0,04101
0,04101
0,04101
0,00560
0,03940
0,00310
0,00310
0,00310
0,00310
0,00310
0,00113 0,00219
0,03162 0,05870
0,00288 0,05870
0,02675
0,15734
0,00016
0,00033
0,00033
0,00033
0,00033
0,00844
0,00844
0,00844
0,00844
0,00064
0,01266
0,00170
0,00170
0,00170
0,00170
0,00170
0,00033
0,00632
0,00632
0,00004
0,00004
0,00004
0,00004
0,00004
66
0,00079
0,00079
0,00079
0,00079
0,00079
0,00008
0,02040
0,00514
0,00514
0,00078
0,00514
0,05226
0,05226
0,05226
0,05226
0,62481
0,62481
0,62481
0,62481
0,09583
3,02645
0,01070
0,01070
0,01070
0,01070
0,01070
0,05226
1,01918
1,01918
Polyester
PEEK
Component:
BO
RJC 464 3047/1
RJC 464 4034/12
RJC 516 3568/1T
RJC 526 3276/18
RJC 543 4065/1
RJC 543 4372/1
RJC 543 4372/47
RJC 543 4582/22
RJC 544 3056/47
RJC 544 3556/1
RJC 544 3575/1
RJC 544 3584/22
RJC 544 3676/1
RJE 328 2632/68
RJE 584 3208/22
RJE 584 3208/68
RKZ 120 16/1
RKZ 123 02/1
RKZ 123 03/1
RKZ 123 05/2
RKZ 223 01/4
RKZ 223 485/68
RKZ 323 08/1
RKZ 323 102/1
RKZ 323 17/3
RKZ 433 25/2
RKZ 433 25/3
RKZ 433 622/1
RMD 943 01/01
RMF 350 01/04
RNV 601 1111
RNV 620 1111
RNV 621 1111
RNV 703 0001/1
ROP 101 896
ROP 101 897
RPT 405 1119/40
RPV 391 03/110
RPV 421 1111
RPV 421 1112
RPV 421 1113
RPV 431 1911
RTL 201 012/01
RTL 201 012/11
RTL 201 028/13
RTM 486 003/02
RYN 120 15/1
RYN 120 16/2
RYN 121 36/1
RYN 123 36/1
RYT 101 064/C
RYT 101 122/C
RYT 108 011/3C
RYT 109 099/C
RYT 109 106/2C
RYT 109 107/2C
RYT 109 126/4C
RYT 109 127/4C
RYT 109 6048/2C
RYT 110 015/3C
RYT 113 013/4C
RYT 113 036/3C
RYT 113 044/2C
RYT 113 6104/C
RYT 113 7604/C
RYT 118 044/2C
RYT 118 072/6C
RYT 119 076/2C
FeO
BaTiO3
0,08200
0,05055
sum
given
product product
weigt
weigt
0,02050
0,02050
0,00348
0,00350
0,10000
0,10000
0,06393
0,06400
0,03980
0,04000
0,00587
0,00590
0,00587
0,00590
0,01274
0,01280
0,06929
0,06667
0,01274
0,01280
0,01274
0,01280
0,01274
0,01280
0,02696
0,02710
0,67000
1,65100
1,67000
0,31210
0,32730
0,31210
0,32730
0,00800
0,00800
0,00763
0,00814
0,00800
0,00800
0,06215
0,06400
other
materials'
0,00800
0,00800
0,00800
0,00800
0,00800
0,00800
2,70520
2,70520
2,70520
2,70930
2,70930
2,70930
0,49425
1,75285
0,93600
1,75290
0,12282
0,12282
0,13005
0,40338
0,00925
0,00798
0,00510
0,00798
0,07989
0,07989
0,07989
0,07989
1,11969
1,11969
1,11969
1,11969
0,15200
4,24624
0,07823
0,07823
0,07823
0,07823
0,07823
0,07989
1,58580
1,55706
0,95000
0,95000
0,15115
0,60465
0,00800
0,00800
0,00510
0,00800
0,08000
0,08000
0,08000
0,08000
1,13000
1,13000
1,13000
1,13000
0,15200
4,25210
0,07800
0,07800
0,07800
0,07800
0,07800
0,08000
1,58600
1,58600
67
3
1
2
1
2
1
8
2
2
2
1
2
7
3
1
1
1
1
1
1
1
1
2
2
5
2
5
2
2
2
2
1
1
3
1
1
1
3
1
1
1
2
1
1
1
1
2
2
1
1
1
1
1
1
1
Status
ROJ 212 206/1
ROJ 207 056/1
ROJ 204 03/1
Component:
Product name:
RYT 329 0125/2C MICROCIRCUIT/74'125 LVT
RYT 329 0125/C MICROCIRCUIT/74'125 LVT
RYT 329 0244/C MICROCIRCUIT/74'244 LVT
RYT 329 1244/C MICROCIRCUIT/74'16244 LV
RYT 329 1374/C MICROCIRCUIT/74'16374 LV
RYT 329 1827/2C MICROCIRCUIT/74'16827 AL
RYT 329 2002/C MICROCIRCUIT/74'18502 LV
RYT 329 6005/C MICROCIRCUIT/74'1403 LVT
RYT 331 0000/2C MICROCIRCUIT/74'00 LVC 4
RYT 331 0000/C MICROCIRCUIT/74'00 LVC 4
RYT 331 0002/C MICROCIRCUIT/74'02 LVC 4
RYT 331 0004/C MICROCIRCUIT/74'04 LVC 6
RYT 331 0014/C MICROCIRCUIT/74'14 LVC 6
RYT 331 0027/C MICROCIRCUIT/74'27 LVC T
RYT 331 0032/C MICROCIRCUIT/74'32 LVC 4
RYT 331 0074/C MICROCIRCUIT/74'74 LVC 2
RYT 331 0086/C MICROCIRCUIT/74'86 LVC 4
RYT 331 0244/C MICROCIRCUIT/74'244 LVC
RYT 913 101/4C HYBRID CIRCUIT/DC/DC -48
RYT 913 101/8C HYBRID CIRCUIT/DC/DC -48
RYT 913 6010/1 MICROCIRCUIT/DC/DC conv
SBA 120025/0060 ScrewScrewScrewScrew
SBA 120025/0080 ScrewScrewScrewScrew
SBF 340025/0100 ScrewScrewScrewScrew
24/SBF 370 025/00SCREW/SCREW RTK-EJOT
SXA 123 0509/2 KEY4/RED-PBA
SXA 123 0509/5 KEY4/BLUE-PBA
SXA 123 0538/1 SHIELDING GASKET/L=38.5
SXA 1230538/2
Shielding strip L=107
SXA 1230599/1
Shielding stripShielding strip
SXA 1230620/51 outer frontouter front
SXA 1230626/2
TäckbrickaTäckbricka
SXA 1230632/1
studstudstudstudstudstud
SXA 1230677/11 support, greensupport, green
SXA 123 0681/1 LIGHT CONDUCTOR/LIGHT
SXA 1230820/51 inner frontinner front
SXA 1239681/1
light conductor
SXA 13271/1
FrontFrontFrontFrontFront
SXA 2100020/3
inner frontinner front
SXA 2100021/3
outer frontouter front
SXK 1180106/11 lever green long
SXK 1180106/21 lever green short
solder (ROJ 204 03)
solder (ROJ 207 056)
solder (ROJ 212 206)
TVJ 804 03
PRINTED BOARD/ETC5
TVJ 807 056
PRINTED BOARD/RP4-D
TVJ 812 206
PRINTED BOARD/MAU
1a
1a
1a
1a
1a
1a
1a
1
1a
1a
1a
1
1a
1a
1a
1a
1a
1
3
3
3a
1
1
1
4a
1
4a
4a
1
1
1
1
1
4a
1
1
1
1
1
1
1
2
2
2
1*
1*
1*
Supplier
(for mat.
dekl.)
Comments
Ag
Al
As
suppose:of type SOP8
0,00058
0,00001
suppose:of type SOP8
0,00058
0,00001
suppose:RYT3310244
0,00113
suppose:RYT3310244
0,00113
suppose:RYT3310244
0,00113
suppose: RYT1196059
0,01132
suppose: RYT1196059
0,01132
x
suppose:RYT3310244
0,00113
x
suppose: RYT 331 0004/C 0,00086
suppose:of type SOP8
0,00058
0,00001
x
suppose: RYT 331 0004/C 0,00086
x
0,00086
suppose:of type SOP8
0,00058
0,00001
x
suppose: RYT 331 0004/C 0,00086
x
suppose: RYT 331 0004/C 0,00086
x
suppose: RYT 331 0004/C 0,00086
x
suppose: RYT 331 0004/C 0,00086
x
0,00113
y
substance declaration
y
substance declaration
y
suppose of type RYT 913 101, substance declaration
å
suppose steel=Fe
å
suppose steel=Fe
å
suppose steel=Fe
å
suppose SBF 340 025/0100
z
z
suppose SXA 123 0509/2
å
suppose SXA 123 0538/2*(38,5/107)
å
å
å
21,34000
å
suppose steel =Fe
å
å
å
suppose SXA1239681/1
å
å
å
1,68000
å
å
17,46000
å
å
68
Au
0,00020
0,00020
0,00030
0,00030
0,00030
0,00350
0,00350
0,00030
0,00030
0,00020
0,00030
0,00030
0,00020
0,00030
0,00030
0,00030
0,00030
0,00030
Component:
Ba
RYT 329 0125/2C
RYT 329 0125/C
RYT 329 0244/C
RYT 329 1244/C
RYT 329 1374/C
RYT 329 1827/2C
RYT 329 2002/C
RYT 329 6005/C
RYT 331 0000/2C
RYT 331 0000/C
RYT 331 0002/C
RYT 331 0004/C
RYT 331 0014/C
RYT 331 0027/C
RYT 331 0032/C
RYT 331 0074/C
RYT 331 0086/C
RYT 331 0244/C
RYT 913 101/4C
RYT 913 101/8C
RYT 913 6010/1
SBA 120025/0060
SBA 120025/0080
SBF 340025/0100
24/SBF 370 025/0070
SXA 123 0509/2
SXA 123 0509/5
SXA 123 0538/1
SXA 1230538/2
SXA 1230599/1
SXA 1230620/51
SXA 1230626/2
SXA 1230632/1
SXA 1230677/11
SXA 123 0681/1
SXA 1230820/51
SXA 1239681/1
SXA 13271/1
SXA 2100020/3
SXA 2100021/3
SXK 1180106/11
SXK 1180106/21
solder (ROJ 204 0
solder (ROJ 207 0
solder (ROJ 212 2
TVJ 804 03
TVJ 807 056
TVJ 812 206
Bi
Be
Br
Cd
0,00054
0,00054
0,00060
0,00060
0,00060
0,00632
0,00632
0,00060
0,00048
0,00054
0,00048
0,00048
0,00054
0,00048
0,00048
0,00048
0,00048
0,00060
Co
Cr
Cu
Fe
0,02234
0,02234
0,04478
0,04478
0,04478
0,44725
0,44725
0,04478
0,03652
0,02234
0,03652
0,03652
0,02234
0,03652
0,03652
0,03652
0,03652
0,04478
Hg
Mg
Ni
P
0,00023
0,00023
0,00023
0,00023
Pb
Pd
0,00007
0,00007
0,00016
0,00016
0,00016
0,00158
0,00158
0,00016
0,00012
0,00007
0,00012
0,00012
0,00007
0,00012
0,00012
0,00012
0,00012
0,00016
0,40000
0,40000
0,40000
0,40000
0,06100
0,17000
0,37400
0,27000
0,75000
1,65000
0,02500
0,07000
0,15400
0,66000
4,00000
1,26000
61,44000
1,28000
0,42000
55,68000
1,16000
0,54000
14,74010
90,21000
99,63520
69
1,02900
2,57000
2,57000
0,31780
0,42340
0,83200
Component:
Ru
RYT 329 0125/2C
RYT 329 0125/C
RYT 329 0244/C
RYT 329 1244/C
RYT 329 1374/C
RYT 329 1827/2C
RYT 329 2002/C
RYT 329 6005/C
RYT 331 0000/2C
RYT 331 0000/C
RYT 331 0002/C
RYT 331 0004/C
RYT 331 0014/C
RYT 331 0027/C
RYT 331 0032/C
RYT 331 0074/C
RYT 331 0086/C
RYT 331 0244/C
RYT 913 101/4C
RYT 913 101/8C
RYT 913 6010/1
SBA 120025/0060
SBA 120025/0080
SBF 340025/0100
24/SBF 370 025/0070
SXA 123 0509/2
SXA 123 0509/5
SXA 123 0538/1
SXA 1230538/2
SXA 1230599/1
SXA 1230620/51
SXA 1230626/2
SXA 1230632/1
SXA 1230677/11
SXA 123 0681/1
SXA 1230820/51
SXA 1239681/1
SXA 13271/1
SXA 2100020/3
SXA 2100021/3
SXK 1180106/11
SXK 1180106/21
solder (ROJ 204
solder (ROJ 207
solder (ROJ 212
TVJ 804 03
TVJ 807 056
TVJ 812 206
Sb
0,00113
0,00113
0,00297
0,00297
0,00297
0,00288
0,00288
0,00297
0,00242
0,00113
0,00242
0,00242
0,00113
0,00242
0,00242
0,00242
0,00242
0,00297
Si
0,00219
0,00219
0,00560
0,00560
0,00560
0,05870
0,05870
0,00560
0,00460
0,00219
0,00460
0,00460
0,00219
0,00460
0,00460
0,00460
0,00460
0,00560
Sn
Ta
0,00033
0,00033
0,00064
0,00064
0,00064
0,00632
0,00632
0,00064
0,00048
0,00033
0,00048
0,00048
0,00033
0,00048
0,00048
0,00048
0,00048
0,00064
Te
Ti
Zn
TBBA
Sb2O3
EP
Polyester
0,05226
0,05226
0,09583
0,09583
0,09583
1,01918
1,01918
0,09583
0,07812
0,05226
0,07812
0,07812
0,05226
0,07812
0,07812
0,07812
0,07812
0,09583
0,74000
1,28000
39,90000
1,16000
1,75100
4,38000
4,38000
0,34870
0,46420
0,91160
2,91280
6,48710
14,13660
70
18,47790
40,46760
89,83420
PEEK
Component:
PI
RYT 329 0125/2C
RYT 329 0125/C
RYT 329 0244/C
RYT 329 1244/C
RYT 329 1374/C
RYT 329 1827/2C
RYT 329 2002/C
RYT 329 6005/C
RYT 331 0000/2C
RYT 331 0000/C
RYT 331 0002/C
RYT 331 0004/C
RYT 331 0014/C
RYT 331 0027/C
RYT 331 0032/C
RYT 331 0074/C
RYT 331 0086/C
RYT 331 0244/C
RYT 913 101/4C
RYT 913 101/8C
RYT 913 6010/1
SBA 120025/0060
SBA 120025/0080
SBF 340025/0100
24/SBF 370 025/0070
SXA 123 0509/2
SXA 123 0509/5
SXA 123 0538/1
SXA 1230538/2
SXA 1230599/1
SXA 1230620/51
SXA 1230626/2
SXA 1230632/1
SXA 1230677/11
SXA 123 0681/1
SXA 1230820/51
SXA 1239681/1
SXA 13271/1
SXA 2100020/3
SXA 2100021/3
SXK 1180106/11
SXK 1180106/21
solder (ROJ 204 0
solder (ROJ 207 0
solder (ROJ 212 2
TVJ 804 03
TVJ 807 056
TVJ 812 206
PTFE
PVC
UP
SP-LCP
PC
pol.
cer.
SiO2
Al2O3
TiO2
MgO
CaO
0,76500
0,76500
1,10000
0,50000
0,50000
5,00000
5,40000
0,06500 0,13000 18,73000 4,86000 0,13000 1,04000 6,94000
0,06870 0,30000 41,70300 10,81890 0,30890 2,31680 15,44560
0,33280 0,67000 90,88000 23,56000 0,67000 5,05000 33,66000
71
Component:
BO
RYT 329 0125/2C
RYT 329 0125/C
RYT 329 0244/C
RYT 329 1244/C
RYT 329 1374/C
RYT 329 1827/2C
RYT 329 2002/C
RYT 329 6005/C
RYT 331 0000/2C
RYT 331 0000/C
RYT 331 0002/C
RYT 331 0004/C
RYT 331 0014/C
RYT 331 0027/C
RYT 331 0032/C
RYT 331 0074/C
RYT 331 0086/C
RYT 331 0244/C
RYT 913 101/4C
RYT 913 101/8C
RYT 913 6010/1
SBA 120025/0060
SBA 120025/0080
SBF 340025/0100
24/SBF 370 025/0070
SXA 123 0509/2
SXA 123 0509/5
SXA 123 0538/1
SXA 1230538/2
SXA 1230599/1
SXA 1230620/51
SXA 1230626/2
SXA 1230632/1
SXA 1230677/11
SXA 123 0681/1
SXA 1230820/51
SXA 1239681/1
SXA 13271/1
SXA 2100020/3
SXA 2100021/3
SXK 1180106/11
SXK 1180106/21
solder (ROJ 204
solder (ROJ 207
solder (ROJ 212
TVJ 804 03
2,77000
TVJ 807 056
6,17820
TVJ 812 206
13,46000
FeO
0,07000
0,15440
0,34000
BaTiO3
other
materials'
sum
given
product product
weigt
weigt
0,07989
0,08000
0,07989
0,08000
0,15200
0,15200
0,15200
0,15200
0,15200
0,15200
1,55706
1,58600
1,55706
1,58600
0,15200
0,15200
0,12390
0,12400
0,07989
0,08000
0,12390
0,12400
0,12390
0,12400
0,07989
0,08000
0,12390
0,12400
0,12390
0,12400
0,12390
0,12400
0,12390
0,12400
0,15200
0,15200
18,68000
18,68000
18,68000
0,40000
0,40000
0,40000
0,40000
0,40000
0,40000
0,40000
0,40000
0,76500
0,85000
0,76500
0,85000
0,35600
0,37000
0,99000
1,00000
2,17800
2,20000
22,00000 22,00000
4,00000
4,00000
2,00000
2,00000
1,10000
1,10000
0,50000
0,50000
64,00000 64,00000
0,50000
0,50000
42,00000 42,00000
58,00000 58,00000
18,00000 18,00000
5,00000
5,00000
5,40000
5,40000
2,78000
2,78000
6,95000
6,95000
6,95000
6,95000
71,53230 71,53850
215,34680 215,35500
373,97240 373,97500
72
Appendix IV
Materials declaration of ROJ 204 03
73
74
Materials declaration of ROJ 204 03/1
Component:
LZF 083 204/1L
LZF 083 204/3
LZF 083 260/1
REG 608 002
REG 735 09/1
REP 513 425/22
REP 623 642/75
REP 623 643/27
REP 623 644/1
REP 623 644/22
REP 623 647/1
REP 670 441/1
RER 755 1442/22
RER 755 1442/56
RER 755 1443/1
RER 755 1443/15
RER 755 1443/27
RER 755 1443/47
RER 755 1444/22
RER 755 1445/1
RER 755 1445/82
RJC 464 4034/12
RJC 526 3276/18
RJC 544 3056/47
RJC 544 3556/1
RKZ 123 03/1
RKZ 123 05/2
RKZ 223 01/4
RKZ 323 17/3
RKZ 433 25/2
RNV 601 1111
RNV 703 0001/1
ROP 101 896
RPV 421 1111
RPV 421 1113
RTL 201 012/11
RYN 123 36/1
RYT 101 064/C
RYT 109 106/2C
RYT 109 107/2C
RYT 109 127/4C
RYT 109 6048/2C
RYT 118 044/2C
RYT 329 6005/C
RYT 331 0244/C
RYT 913 6010/1
SBA 120025/0080
SBF 340025/0100
SXA 1230538/2
SXA 1230677/11
SXA 1239681/1
SXA 13271/1
0
TVJ 804 03
Ag
Al
Au
Ba
Bi
Br
Cd
Co
Cr
Cu
Fe
Mg
Ni
P
Pb
Pd
0,0000
0,0008
0,0001
0,0001
0,0001
0,0001
0,0181
0,0004
0,0012
0,0004
0,0002
0,0002
0,0006
0,0002
0,0008
0,0004
0,0006
0,0292
0,0083
0,0456
0,0195
0,0016
0,0000
0,0000
0,0000 0,0000
0,0000
0,0000
0,0033
0,0033
0,0097
0,0292
0,0097
0,0049
0,0049
0,0146
0,0049
0,0194
0,0097
0,1271
0,0003
0,0001 0,0001
0,0007
0,0186
0,0001
0,0010
0,0001 0,0012
0,0002 0,0000
0,0000 0,0001
0,0000 0,0000
0,0002
0,0000 0,0000
0,0000 0,0002
0,0000 0,0000
0,0000 0,0002
0,0000 0,0000
0,0575
0,0007 0,0001 0,0004
0,0003
0,0000
0,0010
0,0001
0,0003
0,0000
0,0002
0,0000
0,0002
0,0000
0,0005
0,0001
0,0002
0,0000
0,0007
0,0001
0,0003
0,0000
0,0001
0,0001 0,0007
0,0009
0,0042
0,0001 0,0006
0,0006 0,0067
0,0048
0,0026 0,0059
0,0151
0,0109
0,0006
0,0413
0,0001
0,0030
0,0010
6,3954
0,0270
0,0400
0,1333
0,0046
0,0002
0,0000
0,0002
0,0011
0,0011
0,0011
0,0003
0,0002
0,0006
0,0003
0,0006
0,0016
0,0016
0,0016
0,0011
0,0006
0,0023
0,0011
0,0000
0,0002
0,0002
0,0002
0,0000
0,0027
1,6800
0,0095
0,0005
0,0717
0,0049
0,0002
0,0001
0,0017
0,0017
0,0017
0,0002
0,0001
0,0003
0,0002
0,0002
0,8000
0,8000
0,7500
0,1700
0,0001
0,0005 0,0137
0,0030 0,0255
0,0049
0,0223
0,4208
0,4208
0,4208
0,0448
0,0223
0,0896
0,0448
0,0001
0,0005
0,0064
0,0064
0,0064
0,0006
0,0005
0,0012
0,0006
0,0022
0,0700
0,4200
1,0290
14,7401
0,3178
0,1494 1,8152 0,0462 0,1271 0,0192 0,0240 0,0004 0,0001 0,1731 23,2468 2,4283 0,0002 0,1778 0,0138 1,3629 0,0181
75
Component:
Ru
LZF 083 204/1L
LZF 083 204/3
LZF 083 260/1
REG 608 002
REG 735 09/1
REP 513 425/22
REP 623 642/75
REP 623 643/27
REP 623 644/1
0,0000
REP 623 644/22
REP 623 647/1
REP 670 441/1
RER 755 1442/22 0,0000
RER 755 1442/56 0,0001
RER 755 1443/1 0,0000
RER 755 1443/15 0,0000
RER 755 1443/27 0,0000
RER 755 1443/47 0,0000
RER 755 1444/22 0,0000
RER 755 1445/1 0,0000
RER 755 1445/82 0,0000
RJC 464 4034/12
RJC 526 3276/18
RJC 544 3056/47
RJC 544 3556/1
RKZ 123 03/1
RKZ 123 05/2
RKZ 223 01/4
RKZ 323 17/3
RKZ 433 25/2
RNV 601 1111
RNV 703 0001/1
ROP 101 896
RPV 421 1111
RPV 421 1113
RTL 201 012/11
RYN 123 36/1
RYT 101 064/C
RYT 109 106/2C
RYT 109 107/2C
RYT 109 127/4C
RYT 109 6048/2C
RYT 118 044/2C
RYT 329 6005/C
RYT 331 0244/C
RYT 913 6010/1
SBA 120025/0080
SBF 340025/0100
SXA 1230538/2
SXA 1230677/11
SXA 1239681/1
SXA 13271/1
0
TVJ 804 03
0,0002
Sb
Si
Sn
Ti
Zn
TBBA Sb2O3 EP
Polyester UP
SP-LCP PC
0,0500
2,0000
0,0340
pol.
cer.
SiO2
0,0019
0,0006
0,0000
0,0000
0,0000
0,0001
0,0001
0,0000
0,0001
0,0000
0,0071
0,0005
0,0016
0,0005
0,0003
0,0003
0,0008
0,0003
0,0010
0,0005
0,0001
0,0019 0,0438 0,0011
0,0006
0,0007
0,0059
0,0004
0,0005 0,0010 0,0024
0,0121
0,0005
0,0000
0,0000
0,0001
0,0001
0,0030
0,0125
0,0708
0,0360
0,0002 0,0002 0,0005
0,0025
0,0072
0,0002
0,0509
0,0005
0,0016
0,0005
0,0003
0,0003
0,0008
0,0003
0,0010
0,0005
0,0055
0,0471
0,0003
0,2854
0,4104
6,7050
0,2450
0,0048 0,0048 0,0268
0,0099
0,0002
0,0011
0,0135
0,0135
0,0135
0,0030
0,0011
0,0059
0,0030
0,0005
0,0022
0,0410
0,0410
0,0410
0,0056
0,0022
0,0112
0,0056
0,0030
0,0103
0,0523
0,6248
0,6248
0,6248
0,0958
0,0523
0,1917
0,0958
0,0003
0,0084
0,0084
0,0084
0,0006
0,0003
0,0013
0,0006
1,1000
0,5000
39,9000
1,7510
0,3487
2,9128
18,4779
0,0556 0,4086 2,5738 0,0438 39,9051 2,9176 0,0048 20,9687
76
2,0000 0,0840
0,0650 0,1300 18,7300
6,7050 7,0000 0,0650 0,5251 18,7732
Component:
Al2O3 TiO2
LZF 083 204/1L
LZF 083 204/3
LZF 083 260/1
REG 608 002
REG 735 09/1
REP 513 425/22
REP 623 642/75
REP 623 643/27
REP 623 644/1 0,0036
REP 623 644/22
REP 623 647/1
REP 670 441/1
RER 755 1442/22
RER 755 1442/56
RER 755 1443/1
RER 755 1443/15
RER 755 1443/27
RER 755 1443/47
RER 755 1444/22
RER 755 1445/1
RER 755 1445/82
RJC 464 4034/12
RJC 526 3276/18
RJC 544 3056/47
RJC 544 3556/1
RKZ 123 03/1
RKZ 123 05/2
RKZ 223 01/4
RKZ 323 17/3
RKZ 433 25/2
RNV 601 1111
RNV 703 0001/1
ROP 101 896
RPV 421 1111
RPV 421 1113
RTL 201 012/11
RYN 123 36/1
RYT 101 064/C
RYT 109 106/2C
RYT 109 107/2C
RYT 109 127/4C
RYT 109 6048/2C
RYT 118 044/2C
RYT 329 6005/C
RYT 331 0244/C
RYT 913 6010/1
SBA 120025/0080
SBF 340025/0100
SXA 1230538/2
SXA 1230677/11
SXA 1239681/1
SXA 13271/1
0
TVJ 804 03
4,8600 0,1300
4,8636 0,1300
MgO
0,0000
CaO
BO
given
product
BaTiO3 weigt
0,0500
2,0000
0,0340
FeO
0,0000
0,0029
0,0239
0,0020
0,0043
0,0040
0,0040
0,1380
0,0173
0,0520
0,0173
0,0087
0,0087
0,0260
0,0087
0,0347
0,0173
0,0070
0,2560
0,0506 0,0667
0,3712
0,0800
0,1280
0,0160
13,5465
0,9360
0,9500
0,0160
0,0800
1,1300
1,1300
1,1300
0,1520
0,0800
0,3040
0,1520
18,6800
0,8000
0,8000
1,0000
1,1000
0,5000
42,0000
2,7800
1,0400 6,9400 2,7700 0,0700
71,5385
1,0400 6,9400 2,7700 0,0700 0,0506 167,5836
77
78
Appendix V
Materials declaration of ROJ 207 056
79
80
Materials declaration of ROJ 207 056
Component:
LZF 083 204/3
LZF 083 256/1
REG 318 2368
REP 623 642/22
REP 623 642/33
REP 623 642/56
REP 623 642/82
REP 623 643/1
REP 623 643/12
REP 623 643/16
REP 623 643/22
REP 623 643/56
REP 623 644/1
REP 623 644/15
REP 623 644/18
REP 623 644/27
REP 623 645/1
REP 623 645/15
REP 623 645/27
REP 623 645/39
REP 623 646/1
REP 633 905/332
REP 633 906/1
REP 633 906/2
REP 670 441/2
RJC 464 3033/68
RJC 464 3034/1
RJC 464 3035/47
RJC 464 3036/1
RJC 516 3568/1T
RJC 543 4372/1
RJC 543 4372/47
RJC 544 3556/1
RJE 328 2632/68
RJE 584 3208/22
RKZ 120 16/1
RKZ 123 05/2
RKZ 223 485/68
RKZ 323 08/1
RKZ 323 102/1
RKZ 433 25/2
RNV 601 1111
ROP 101 897
RPT 405 1119/40
RPV 421 1112
RTL 201 028/13
RYT 101 122/C
RYT 108 011/3C
RYT 109 126/4C
RYT 109 127/4C
RYT 109 6048/2C
RYT 113 036/3C
RYT 113 6104/C
RYT 118 044/2C
RYT 118 072/6C
RYT 119 6059/3
RYT 329 0014/3C
RYT 329 0125/2C
RYT 329 1244/C
RYT 329 1374/C
RYT 331 0000/2C
RYT 331 0004/C
RYT 331 0027/C
RYT 331 0086/C
RYT 913 6010/1
Ag
0,0038
0,0028
0,0012
0,0001
0,0008
0,0001
0,0001
0,0020
0,0003
0,0012
0,0006
0,0001
0,0005
0,0034
0,0001
0,0003
0,0001
0,0001
Al
Au
Bi
Br
Cd
0,0959
0,0715
0,0309
0,0016
Cr
Cu
0,0002
0,0001
0,0001
0,0000
0,0000
0,0000
0,0000
0,0001
0,0000
0,0000
0,0000
0,0000
0,0000
0,0002
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0033
0,0016
0,0520
0,0081
0,0163
0,0033
0,0130
0,0862
0,0033
0,0065
0,0033
Fe
0,0012
0,0024
0,0032
Ni
0,0005
0,0004
0,0002
0,0000
0,0059
0,0044
0,0019
0,0001
0,0013
0,0002
0,0001
0,0032
0,0005
0,0021
0,0010
0,0002
0,0008
0,0053
0,0002
0,0004
0,0002
0,0002
0,0003
0,0006
0,0003
0,0014
0,0001
0,0000
0,0000
0,0024
0,0351
0,0006
0,0012
0,0008
0,0000
0,0000
0,0000
0,0003
0,0000
0,0000
0,0001
0,0000
0,0001
0,0004
0,0000
0,0000
0,0000
0,0000
0,0001
0,0002
0,0001
0,0363
0,0006
0,0003
0,0003
0,0245
0,0041
0,0082
0,0079
Mg
0,0080
0,0161
0,0080
0,1150
0,0005
0,0009
7,2090
0,0165
0,0052
0,0008
0,0371
0,0241
0,0269
0,0175
0,0030
0,0075
0,0022
0,0055
0,0413
0,0001
0,0003
0,0442
0,0016
0,0045
0,0005
0,0006
0,0012
0,0127
0,0063
0,0011
0,0005
0,0005
0,0006
0,0113
0,0226
0,0041
0,0017
0,0011
0,0023
0,0017
0,0017
0,0026
0,0009
0,0005
0,0002
0,0004
0,0090
0,0045
0,0003
0,0002
0,0002
0,0000 0,0002
0,0035
0,0070
0,0001 0,0014
0,0000 0,0006
0,0003
0,0006
0,0006
0,0006
0,0009
0,0003
0,0000
0,0000
0,0017
0,0009
0,0005
0,0011
0,0515
0,0258
0,0006
0,0004
0,0004
0,0005
0,0063
0,0126
0,0038
0,0016
0,0006
0,0012
0,0010
0,0010
0,0015
0,0005
81
10,2326
0,2390
0,0008
0,0061
0,0223
0,0447
3,3665
1,6832
0,0448
0,0289
0,0289
0,0223
0,4473
0,8945
0,1564
0,0670
0,0448
0,0896
0,0730
0,0730
0,1095
0,0365
0,0002
0,0005
0,0007
0,0007
0,0002
0,0002
0,0002
0,0016
0,0007
P
0,0000
0,0000
0,0000
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
Pb
Pd
0,0011
0,0008
0,0004
0,0000
0,0002
0,0000
0,0000
0,0006
0,0001
0,0003
0,0002
0,0000
0,0002
0,0010
0,0000
0,0001
0,0000
0,0000
0,0002
0,0001
0,0001
0,0000
0,0000 0,0001
0,0000
0,0000
0,0001
0,0000
0,0001 0,0001
0,0000
0,0000
0,0000
0,0001
0,0000
0,0000
0,0000
0,0000 0,0000
0,0007
0,0001
0,0000
0,0000
0,0027
0,0000
0,0006
0,0012
0,0004
1,0080
0,0002
0,0010
Ru
Sb
0,0007
0,0004
0,0004
0,0290
0,0003
0,0006
0,0010
0,0075
0,0016
0,0001
0,0003
0,0002
0,0005
0,0003
0,0001
0,0001
0,0138
0,0069
0,0002
0,0003
0,0003
0,0001
0,0016
0,0032
0,0005
0,0002
0,0002
0,0003
0,0002
0,0002
0,0004
0,0001
0,0011
0,0023
0,1082
0,0541
0,0030
0,0011
0,0316
0,0058
0,0079
0,0034
0,0030
0,0059
0,0048
0,0048
0,0073
0,0024
Component:
Si
LZF 083 204/3
LZF 083 256/1
REG 318 2368
REP 623 642/22
REP 623 642/33
REP 623 642/56
REP 623 642/82
REP 623 643/1
REP 623 643/12
REP 623 643/16
REP 623 643/22
REP 623 643/56
REP 623 644/1
REP 623 644/15
REP 623 644/18
REP 623 644/27
REP 623 645/1
REP 623 645/15
REP 623 645/27
REP 623 645/39
REP 623 646/1
REP 633 905/332
REP 633 906/1
REP 633 906/2
REP 670 441/2
RJC 464 3033/68
RJC 464 3034/1
RJC 464 3035/47
RJC 464 3036/1
RJC 516 3568/1T
RJC 543 4372/1
RJC 543 4372/47
RJC 544 3556/1
RJE 328 2632/68
RJE 584 3208/22
RKZ 120 16/1
0,0016
RKZ 123 05/2
0,0121
RKZ 223 485/68
RKZ 323 08/1
0,0002
RKZ 323 102/1 0,0005
RKZ 433 25/2
RNV 601 1111
ROP 101 897
0,0440
RPT 405 1119/40
RPV 421 1112
RTL 201 028/13 0,0010
RYT 101 122/C 0,0022
RYT 108 011/3C 0,0044
RYT 109 126/4C 0,3281
RYT 109 127/4C 0,1640
RYT 109 6048/2C 0,0056
RYT 113 036/3C 0,0031
RYT 113 6104/C 0,0031
RYT 118 044/2C 0,0022
RYT 118 072/6C 0,0587
RYT 119 6059/3 0,1174
RYT 329 0014/3C 0,0153
RYT 329 0125/2C 0,0066
RYT 329 1244/C 0,0056
RYT 329 1374/C 0,0112
RYT 331 0000/2C 0,0092
RYT 331 0004/C 0,0092
RYT 331 0027/C 0,0138
RYT 331 0086/C 0,0046
RYT 913 6010/1
Sn
Ta
0,0028
0,0021
0,0009
0,0000
0,0010
0,0001
0,0000
0,0015
0,0002
0,0015
0,0005
0,0001
0,0004
0,0025
0,0001
0,0002
0,0001
0,0001
0,0004
0,0009
0,0004
0,0142
0,0001
0,0000
0,0000
0,0028
0,0009
0,0008
0,0015
0,0010
Zn
TBBA Sb2O3 EP
0,0000
0,0000
0,0000
0,0000
Polyester PI
PTFE
2,0000
0,0900
PVC
SP-LCP PC
0,0023
0,0018
0,0008
0,0000
0,0003
0,0001
0,0000
0,0013
0,0002
0,0004
0,0004
0,0001
0,0003
0,0021
0,0001
0,0002
0,0001
0,0000
0,0009
0,0018
0,0009
0,0061
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
pol.
cer.
SiO2
0,0012
0,0020
0,0002
0,0008
0,0016
0,0008
0,1017
0,0055
0,0027
0,0027
0,2239
0,0004
0,0008
0,0001
0,0385
0,0770
0,0492
0,6120
0,0014 0,2218
0,0038
0,2587
0,0200
0,0708
0,0005
0,0012
0,0025
0,0063
0,0010
0,0576
0,0072
0,0180
0,6566
10,7280
0,0015
0,0003
0,0007
0,0675
0,0338
0,0006
0,0017
0,0017
0,0003
0,0063
0,0126
0,0023
0,0010
0,0006
0,0013
0,0010
0,0010
0,0014
0,0005
0,0000
0,0000
0,1573
0,0008
0,0008
1,2560
0,0001
0,0523
0,1045
4,9985
2,4992
0,0958
0,0107
0,0107
0,0523
1,0192
2,0384
0,3658
0,1568
0,0958
0,1917
0,1562
0,1562
0,2343
0,0781
0,0030
0,0308
0,0308
82
Component:
Al2O3
LZF 083 204/3
LZF 083 256/1
REG 318 2368
REP 623 642/22
REP 623 642/33
REP 623 642/56
REP 623 642/82
REP 623 643/1
0,0286
REP 623 643/12
REP 623 643/16
REP 623 643/22
REP 623 643/56
REP 623 644/1
0,0464
REP 623 644/15
REP 623 644/18
REP 623 644/27
REP 623 645/1
REP 623 645/15
REP 623 645/27
REP 623 645/39
REP 623 646/1
0,0036
REP 633 905/332 0,0069
REP 633 906/1
0,0139
REP 633 906/2
0,0069
REP 670 441/2
RJC 464 3033/68
RJC 464 3034/1
RJC 464 3035/47
RJC 464 3036/1
RJC 516 3568/1T
RJC 543 4372/1
RJC 543 4372/47
RJC 544 3556/1
RJE 328 2632/68
RJE 584 3208/22
RKZ 120 16/1
RKZ 123 05/2
RKZ 223 485/68
RKZ 323 08/1
RKZ 323 102/1
RKZ 433 25/2
RNV 601 1111
ROP 101 897
RPT 405 1119/40
RPV 421 1112
RTL 201 028/13
0,1250
RYT 101 122/C
RYT 108 011/3C
RYT 109 126/4C
RYT 109 127/4C
RYT 109 6048/2C
RYT 113 036/3C
RYT 113 6104/C
RYT 118 044/2C
RYT 118 072/6C
RYT 119 6059/3
RYT 329 0014/3C
RYT 329 0125/2C
RYT 329 1244/C
RYT 329 1374/C
RYT 331 0000/2C
RYT 331 0004/C
RYT 331 0027/C
RYT 331 0086/C
RYT 913 6010/1
TiO2
MgO
CaO
BO
FeO
given
other
product
weigt
BaTiO3 materials sum
2,0000
2,0000
0,0900
0,1500
0,0001
0,0002
0,0001
0,1640
6,0300
0,0479
83
0,1127
0,0841
0,0363
0,0019
0,0334
0,0038
0,0019
0,0611
0,0096
0,0542
0,0191
0,0038
0,0153
0,1013
0,0038
0,0076
0,0038
0,0042
0,0176
0,0353
0,0176
0,2756
0,0070
0,0035
0,0035
0,2853
0,2000
0,0470
0,0939
0,0637
14,8590
0,6242
0,1280
0,1243
0,1175
0,0876
0,0378
0,0020
0,0342
0,0040
0,0020
0,0637
0,0100
0,0556
0,0199
0,0040
0,0159
0,1055
0,0040
0,0080
0,0040
0,0043
0,0191
0,0382
0,0191
0,2760
0,0070
0,0035
0,0035
0,2870
0,2000
0,0472
0,0944
0,0640
15,0300
0,6546
0,1280
0,1280
0,0160
0,0400
0,0160
0,0400
21,6416
1,7529
21,6744
1,7529
0,1301
0,0799
0,1598
8,9576
4,4788
0,1520
0,0782
0,0782
0,0799
1,5858
3,1141
0,5592
0,2397
0,1520
0,3040
0,2478
0,2478
0,3717
0,1239
0,1512
0,0800
0,1600
9,0400
4,5200
0,1520
0,0780
0,0780
0,0800
1,5860
3,1720
0,5600
0,2400
0,1520
0,3040
0,2480
0,2480
0,3720
0,1240
18,6800
Component:
Ag
Al
Au
Bi
Br
Cd
Cr
Cu
Fe
Mg
Ni
SBA 120025/0080
2,0000
0,8000
24/SBF 370 025/00
SXA 123 0509/5
SXA 123 0538/1
0,0610
0,2700
0,0250
SXA 1230632/1
3,7800
SXA 123 0681/1
SXA 2100020/3
55,6800
1,1600
SXA 2100021/3
17,4600
0,5400
SXK 1180106/11
0
TVJ 807 056
90,2100
0,2344 25,0685 0,0375 0,0067 0,1172 0,0014 0,0618 111,7366 58,9704 0,5420 1,3185
Component:
Si
SBA 120025/0080
24/SBF 370 025/0
SXA 123 0509/5
SXA 123 0538/1
SXA 1230632/1
SXA 123 0681/1
SXA 2100020/3
SXA 2100021/3
SXK 1180106/11
0
TVJ 807 056
0,8236
Sn
Ta
Zn
TBBA Sb2O3 EP
Polyester PI
PTFE
PVC
P
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
0,0002
Pb
Pd
Ru
Sb
2,5700
0,4234
4,0426 0,0334 0,0002 0,2566
SP-LCP PC
pol.
cer.
SiO2
1,5300
2,2200
0,5000
1,1600
10,0000
4,3800
0,4642
6,4871
40,4676
6,8398 0,2218 2,2215 6,4886 0,0016 53,3200
0,0687 0,3000 41,7030
2,0000 0,0900 0,0010 0,6120 10,7280 12,0300 0,0687 2,0606 41,8536
other
Component:
Al2O3 TiO2 MgO CaO
BO
FeO
BaTiO3 materials sum
SBA 120025/0080
2,0000
24/SBF 370 025/0
0,8000
SXA 123 0509/5
1,5300
SXA 123 0538/1
0,3560
SXA 1230632/1
6,0000
SXA 123 0681/1
0,5000
SXA 2100020/3
58,0000
SXA 2100021/3
18,0000
SXK 1180106/11
10,0000
0
6,9500
TVJ 807 056
10,8189 0,3089 2,3168 15,4456 6,1782 0,1544
215,3468
11,0502 0,3092 2,3647 15,4456 6,1782 0,1544 0,1640
6,0300 383,5069
84
given
product
weigt
2,0000
0,8000
1,7000
0,3700
6,0000
0,5000
58,0000
18,0000
10,0000
6,9500
215,3550
402,9131
Appendix VI
Materials declaration of ROJ 212 206
85
86
Materials declaration of ROJ 212 206/1
Component:
(RON 109 167)
(RON 109 168)
(RON 109 169)
(RON 109 170)
(RYS 107 359)
LZF 083 204/1L
LZF 083 204/3
LZF 083 260/1
REG 608 102
REG 709 232/1
REG 709 531/1
REG 709 531/22
REP 623 441/47
REP 623 642/12
REP 623 642/27
REP 623 642/33
REP 623 642/56
REP 623 642/68
REP 623 643/1
REP 623 643/15
REP 623 643/2
REP 623 643/47
REP 623 644/1
REP 623 644/15
REP 623 644/33
REP 623 644/75
REP 623 645/15
REP 623 645/22
REP 623 645/47
REP 623 646/1
REP 623 646/12
REP 623 646/22
REP 623 646/33
REP 623 646/47
REP 670 441/39
RJC 464 3047/1
RJC 543 4065/1
RJC 543 4582/22
RJC 544 3056/47
RJC 544 3556/1
RJC 544 3575/1
RJC 544 3584/22
RJC 544 3676/1
RJE 584 3208/68
RKZ 123 02/1
RKZ 123 05/2
RKZ 433 25/2
RKZ 433 25/3
RKZ 433 622/1
RMD 943 01/01
RMF 350 01/04
RNV 620 1111
RNV 621 1111
RPV 391 03/110
RTL 201 012/01
RTM 486 003/02
RYN 120 15/1
RYN 120 16/2
RYN 121 36/1
Ag
Al
Au
Bi
Br
Cd
Co
Cr
Cu
Fe
Mg
Ni
1,0000
0,2536
0,1063
0,2126
0,0001
0,0001
0,0003
0,0008
0,0015
0,0001
0,0012
0,0003
0,0004
0,0005
0,0008
0,0003
0,0055
0,0003
0,0001
0,0001
0,0004
0,0004
0,0001
0,0001
0,0002
0,0001
0,0181
0,0016
0,0033
0,0065
0,0195
0,0374
0,0033
0,0000
0,0000
0,0000
0,0000
0,0001
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0003
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0065
0,0098
0,0130
0,0081
0,1415
0,0065
0,0033
0,0033
0,0098
0,0016
0,0033
0,0049
0,0000
0,0000
0,0000
0,0001
0,0002
0,0000
0,0000
0,0000
0,0001
0,0001
0,0000
0,0000
0,0007
0,0000
0,0000
0,0000
0,0001
0,0000
0,0000
0,0000
0,0000
0,0000
0,0575
0,0028
0,0080
0,0022
0,0083
0,3038
0,0094
0,0016
0,0059
0,0330
0,0001
0,0019
0,0006
0,0007
0,1236
0,0038
0,0006
0,0028
0,0001
0,0007
0,0003
0,0001 0,0001
0,0001
0,0104
0,0003
0,0001
0,0742
0,0112
0,0902
0,0271
0,0541
0,0001
0,0002
0,0004
0,0012
0,0023
0,0002
0,0021
0,0004
0,0006
0,0008
0,0013
0,0005
0,0087
0,0004
0,0002
0,0002
0,0006
0,0007
0,0001
0,0002
0,0003
0,0002
0,0007
0,0034
0,0010
0,0003
0,0006
0,0321
0,0010
0,0002
0,0007
0,0538
0,0081
0,0413
0,0025
0,0004
0,0046
0,0003
15,3490
2,5582
0,0002
0,0030
0,0255
0,0114
0,0000
0,0000
0,0001
0,0002
0,0000
87
0,0011
0,0002
0,3318
0,0717
0,0168
0,0010
0,0007
0,0025
0,0074
Component:
(RON 109 167)
(RON 109 168)
(RON 109 169)
(RON 109 170)
(RYS 107 359)
LZF 083 204/1L
LZF 083 204/3
LZF 083 260/1
REG 608 102
REG 709 232/1
REG 709 531/1
REG 709 531/22
REP 623 441/47
REP 623 642/12
REP 623 642/27
REP 623 642/33
REP 623 642/56
REP 623 642/68
REP 623 643/1
REP 623 643/15
REP 623 643/2
REP 623 643/47
REP 623 644/1
REP 623 644/15
REP 623 644/33
REP 623 644/75
REP 623 645/15
REP 623 645/22
REP 623 645/47
REP 623 646/1
REP 623 646/12
REP 623 646/22
REP 623 646/33
REP 623 646/47
REP 670 441/39
RJC 464 3047/1
RJC 543 4065/1
RJC 543 4582/22
RJC 544 3056/47
RJC 544 3556/1
RJC 544 3575/1
RJC 544 3584/22
RJC 544 3676/1
RJE 584 3208/68
RKZ 123 02/1
RKZ 123 05/2
RKZ 433 25/2
RKZ 433 25/3
RKZ 433 622/1
RMD 943 01/01
RMF 350 01/04
RNV 620 1111
RNV 621 1111
RPV 391 03/110
RTL 201 012/01
RTM 486 003/02
RYN 120 15/1
RYN 120 16/2
RYN 121 36/1
P
Pb
Pd
Ru
Sb
Si
Sn
Ta
Te
Zn
TBBA
Sb2O3 EP
Polyester PTFE
UP
0,3000
0,0500
2,0000
0,0340
0,0504
0,0178
0,0356
0,0001
0,0000
0,0001
0,0002
0,0004
0,0000
0,0003
0,0001
0,0001
0,0002
0,0002
0,0001
0,0016
0,0001
0,0000
0,0000
0,0001
0,0001
0,0000
0,0000
0,0001
0,0000
0,0001 0,0004
0,0010
0,0003
0,0006
0,0174
0,0005
0,0001
0,0004
0,0003
0,0003
0,0328
0,0055
0,0164
0,0049
0,0098
0,0000
0,0000
0,0000
0,0000
0,0001
0,0000
0,0001
0,0000
0,0000
0,0000
0,0000
0,0000
0,0002
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0009
0,0002
0,0067
0,0395
0,0012
0,0002
0,0006
0,0001
0,0001
0,0000
0,0000
0,0234
0,0117
0,0234
0,0001
0,0001
0,0002
0,0006
0,0011
0,0001
0,0015
0,0002
0,0003
0,0004
0,0010
0,0002
0,0041
0,0002
0,0001
0,0001
0,0003
0,0005
0,0000
0,0001
0,0001
0,0001
0,0071
0,0008
0,0013
0,0004
0,0006
0,0395
0,0012
0,0002
0,0009
0,0000
0,0151
0,0029 0,4435
0,0005 0,0037 0,0010
0,0121
0,1722
0,0517
0,1033
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0100
0,0050
0,0100
0,0001
0,0002
0,0005
0,0009
0,0001
0,0004
0,0002
0,0002
0,0003
0,0003
0,0002
0,0035
0,0002
0,0001
0,0001
0,0002
0,0001
0,0000
0,0001
0,0001
0,0000
0,0030
0,0007
0,0002
0,0007
0,0025
0,0001
0,0000
0,0001
0,5175
0,0433
0,0708
0,9850
0,1642
0,0049
0,0099
0,0002
0,0013
0,0001 0,0002
0,0003 0,0007
0,0001 0,0001 0,0002
0,0000
0,0030
0,0204
0,0051
0,0154
0,0008
88
0,0019
Component:
(RON 109 167)
(RON 109 168)
(RON 109 169)
(RON 109 170)
(RYS 107 359)
LZF 083 204/1L
LZF 083 204/3
LZF 083 260/1
REG 608 102
REG 709 232/1
REG 709 531/1
REG 709 531/22
REP 623 441/47
REP 623 642/12
REP 623 642/27
REP 623 642/33
REP 623 642/56
REP 623 642/68
REP 623 643/1
REP 623 643/15
REP 623 643/2
REP 623 643/47
REP 623 644/1
REP 623 644/15
REP 623 644/33
REP 623 644/75
REP 623 645/15
REP 623 645/22
REP 623 645/47
REP 623 646/1
REP 623 646/12
REP 623 646/22
REP 623 646/33
REP 623 646/47
REP 670 441/39
RJC 464 3047/1
RJC 543 4065/1
RJC 543 4582/22
RJC 544 3056/47
RJC 544 3556/1
RJC 544 3575/1
RJC 544 3584/22
RJC 544 3676/1
RJE 584 3208/68
RKZ 123 02/1
RKZ 123 05/2
RKZ 433 25/2
RKZ 433 25/3
RKZ 433 622/1
RMD 943 01/01
RMF 350 01/04
RNV 620 1111
RNV 621 1111
RPV 391 03/110
RTL 201 012/01
RTM 486 003/02
RYN 120 15/1
RYN 120 16/2
RYN 121 36/1
SP-LCP PC
pol.
cer.
SiO2
Al2O3
TiO2
MgO
CaO
BO
FeO
BaTiO3 sum
0,0001
0,0020
0,0464
0,0012
0,0286
0,0007
0,0161
0,0002
0,0509
0,0340
0,0640
0,0209
0,0003
1,8997
0,0591
0,0098
0,0427
0,0036
0,0506
0,0958
16,0920
2,6820
0,0125
0,0100
0,0022
89
given
product
weigt
1,3000
0,0500
2,0000
0,0340
1,5000
0,0500
2,0000
0,0340
0,6162
0,2245
0,4490
0,0021
0,0038
0,0076
0,0229
0,0439
0,0038
0,0542
0,0076
0,0115
0,0153
0,0334
0,0096
0,1662
0,0076
0,0038
0,0038
0,0115
0,0188
0,0019
0,0038
0,0057
0,0042
0,1378
0,0410
0,0796
0,0255
0,0693
2,4580
0,0764
0,0127
0,0539
1,2484
0,0686
0,1243
1,5400
0,5960
1,1920
0,0021
0,0040
0,0080
0,0239
0,0458
0,0040
0,0556
0,0080
0,0119
0,0159
0,0342
0,0100
0,1732
0,0080
0,0040
0,0040
0,0119
0,0193
0,0020
0,0040
0,0060
0,0043
0,1380
0,0410
0,0800
0,0256
0,0667
2,4704
0,0768
0,0128
0,0542
1,3092
0,0733
0,1280
32,4624
5,4104
32,5116
5,4186
0,1228
0,4034
0,0093
0,0239
0,0051
0,9500
0,6047
0,0080
0,0240
0,0051
Component:
RYT 109 099/C
RYT 109 106/2C
RYT 109 107/2C
RYT 109 127/4C
RYT 110 015/3C
RYT 113 013/4C
RYT 113 044/2C
RYT 113 7604/C
RYT 118 044/2C
RYT 121 159/2C
RYT 123 064/2C
RYT 304 0109/C
RYT 306 2024/C
RYT 329 0125/C
RYT 329 0244/C
RYT 329 1827/2C
RYT 329 2002/C
RYT 331 0000/C
RYT 331 0002/C
RYT 331 0014/C
RYT 331 0032/C
RYT 331 0074/C
RYT 913 101/4C
RYT 913 101/8C
SBA 120025/0060
SBA 120025/0080
SBF 340025/0100
SXA 123 0509/2
SXA 1230599/1
SXA 1230620/51
SXA 1230626/2
SXA 1230632/1
SXA 1230820/51
SXA 1239681/1
SXK 1180106/11
0
TVJ 812 206
Ag
Al
0,0006 0,0000
0,0047 0,0006
0,0047 0,0006
0,0063 0,0009
0,0935 0,0009
0,0009
0,0005
0,0009
0,0006 0,0000
Au
Bi
0,0002
0,0034
0,0034
0,0045
0,0376
0,0004
0,0002
0,0004
0,0002
Br
Cd
0,0005
0,0193
0,0193
0,0258
0,0625
0,0008
0,0004
0,0008
0,0005
0,0134
0,0009
0,0006
0,0006
0,0023
0,0113
0,0906
0,0012
0,0009
0,0041
0,0009
0,0009
0,0112
0,0003
0,0002
0,0002
0,0006
0,0035
0,0280
0,0004
0,0003
0,0014
0,0003
0,0003
0,0005
0,0005
0,0005
0,0012
0,0063
0,0506
0,0011
0,0005
0,0038
0,0005
0,0005
0,0000
0,0000
0,0000
0,0001
Co
Cr
Cu
Fe
0,0223
1,2624
1,2624
1,6832
4,1090
0,0577
0,0289
0,0577
0,0223
Mg
0,0014
0,0007
0,0014
Ni
0,0002
0,0005
0,0002
0,0005
0,0002
1,1657
0,0365
0,0223
0,0223
0,0896
0,4473
3,5780
0,0447
0,0365
0,1564
0,0365
0,0365
0,0002
0,0002
0,0005
0,0016
0,8000
2,0000
0,8000
0,3740
1,6500
21,3400
0,1540
0,6600
4,0000
3,7800
61,4400
1,2800
99,6352
0,7850 21,6261 0,1422 0,1341 0,2829 0,0010 0,0115 0,3776 142,5198 71,1692 0,6615 1,8236
90
Component:
P
RYT 109 099/C
RYT 109 106/2C
RYT 109 107/2C
RYT 109 127/4C
RYT 110 015/3C
RYT 113 013/4C 0,0000
RYT 113 044/2C 0,0000
RYT 113 7604/C 0,0000
RYT 118 044/2C
RYT 121 159/2C
RYT 123 064/2C
RYT 304 0109/C
RYT 306 2024/C
RYT 329 0125/C
RYT 329 0244/C
RYT 329 1827/2C
RYT 329 2002/C
RYT 331 0000/C
RYT 331 0002/C
RYT 331 0014/C
RYT 331 0032/C
RYT 331 0074/C
RYT 913 101/4C
RYT 913 101/8C
SBA 120025/0060
SBA 120025/0080
SBF 340025/0100
SXA 123 0509/2
SXA 1230599/1
SXA 1230620/51
SXA 1230626/2
SXA 1230632/1
SXA 1230820/51
SXA 1239681/1
SXK 1180106/11
0
TVJ 812 206
0,0384
Pb
Pd
0,0001
0,0052
0,0052
0,0069
0,0297
0,0006
0,0003
0,0006
0,0001
0,0135
0,0001
0,0001
0,0001
0,0003
0,0016
0,0126
0,0001
0,0001
0,0005
0,0001
0,0001
Ru
Sb
0,0011
0,0406
0,0406
0,0541
0,3377
Si
0,0022
0,1230
0,1230
0,1640
0,1576
0,0062
0,0031
0,0062
0,0011 0,0022
Sn
Ta
0,0003
0,0253
0,0253
0,0338
0,0507
0,0034
0,0017
0,0034
0,0003
0,1543
0,0024
0,0011
0,0011
0,0059
0,0029
0,0230
0,0023
0,0024
0,0079
0,0024
0,0024
0,0571
0,0005
0,0003
0,0003
0,0013
0,0063
0,0506
0,0007
0,0005
0,0023
0,0005
0,0005
0,0585
0,0046
0,0022
0,0022
0,0112
0,0587
0,4696
0,0044
0,0046
0,0153
0,0046
0,0046
Te
Zn
0,0001
0,0000
0,0001
0,0031
TBBA
Sb2O3 EP
Polyester PTFE
0,0523
1,8744
1,8744
2,4992
12,1058
0,0016
0,0214
0,0008
0,0107
0,0016
0,0214
0,0523
UP
5,8615
0,0781
0,0523
0,0523
0,1917
1,0192
8,1534
0,1045
0,0781
0,3658
0,0781
0,0781
2,2200
1,2800
2,5700
4,3800
0,8320
0,9116
14,1366
89,8342
3,6341 0,0499 0,0003 0,7651 1,9493 8,1978 0,4435 0,0000 2,5577 14,1366 0,0039 137,6985
91
2,0000 0,0019 0,0840
given
product
weigt
0,0800
3,3900
3,3900
4,5200
17,0084
0,1560
0,0780
0,1560
0,0800
Component:
SP-LCP PC
pol.
cer.
SiO2
Al2O3 TiO2 MgO CaO
BO
FeO
BaTiO3 sum
RYT 109 099/C
0,0799
RYT 109 106/2C
3,3591
RYT 109 107/2C
3,3591
RYT 109 127/4C
4,4788
RYT 110 015/3C
16,9850
RYT 113 013/4C
0,0615
0,1565
RYT 113 044/2C
0,0308
0,0782
RYT 113 7604/C
0,0615
0,1565
RYT 118 044/2C
0,0799
RYT 121 159/2C
RYT 123 064/2C
7,3381
7,5000
RYT 304 0109/C
0,1239
0,1240
RYT 306 2024/C
0,0799
0,0800
RYT 329 0125/C
0,0799
0,0800
RYT 329 0244/C
0,3040
0,3040
RYT 329 1827/2C
1,5571
1,5860
RYT 329 2002/C
12,4565 12,6880
RYT 331 0000/C
0,1598
0,1600
RYT 331 0002/C
0,1239
0,1240
RYT 331 0014/C
0,5592
0,5600
RYT 331 0032/C
0,1239
0,1240
RYT 331 0074/C
0,1239
0,1240
RYT 913 101/4C
18,6800
RYT 913 101/8C
18,6800
SBA 120025/0060
0,8000
0,8000
SBA 120025/0080
2,0000
2,0000
SBF 340025/0100
0,8000
0,8000
SXA 123 0509/2
1,5300
1,5300
1,7000
SXA 1230599/1
2,1780
2,2000
SXA 1230620/51
22,0000 22,0000
SXA 1230626/2
4,0000
4,0000
SXA 1230632/1
6,0000
6,0000
SXA 1230820/51
64,0000 64,0000
SXA 1239681/1
1,0000
1,0000
1,0000
SXK 1180106/11
10,0000
10,0000 10,0000
0
6,9500
6,9500
TVJ 812 206
0,3328 0,6700 90,8800 23,5600 0,6700 5,0500 33,6600 13,4600 0,3400
373,9724 373,9750
18,7740 12,5300 0,3328 2,8680 91,0460 23,6546 0,6700 5,1458 33,6600 13,4600 0,3400 0,0506 613,6273 655,4992
92
Appendix VII
Materials declarations of the components in the studied equipment
practise
93
94
Materials declarations for components in BYB 501 180/1
24/SBF 228 040/0100SCREW/SCREW MRT 8
24/SBF 228 060/0120SCREW/SCREW MRT
24/SBF 228 060/0200SCREW/SCREW MRT 36
24/SBF 228 060/0400SCREW/SCREW MRT 24
24/SBF 370 040/0120SCREW/SCREW RTK
LYB 250 01/141
WRIST STRAP/ESD W 1
LZV 102 01
SET OF DOCUMENTS
MPB 132 02/1
RUBBER TUBE/RUBB
MPL 107 02/1
PACKING STRIP/POLY
MPP 126 03
SEALING TAPE2/
MPP 301 01/700
CORRUGATED FIBRE
NSV 907 02
EXPANDER SCREW/E
RTK 164 82/1
BOX3/FOR BYB 501 D
RTK 164 82/2
BOX3/FOR BYB 501 S
RTK 164 82/4
PACKAGE/FOR BYB 5
RTK 191 105
BOX3/for roj 237 452*2
RTK 810 22
HOSE/HOSE/HOSE/
RTK 833 76
HOSE/HOSE/HOSE/
RTK 835 09
BAG/BUBBLE FOIL BA
RTK 943 274/1
FITMENT/FOR DOOR
RTK 943 274/2
FITMENT/FOR DOOR
RTK 943 274/3
FITMENT/inlägg till dör
SAE 221 050/0120 TUBULAR PIN/TUBUL 8
SAM 523 032/0080 RIVET/RIVET KN-GES 2
SBF 128 279/24
SCREW/SCREW RTK
SBM 154 160/03
NUT/NUT ML6M M 16 4
SCA 118 170/78
WASHER/WASHER B
SCA 118 210/78
WASHER/WASHER B
SCL 100 165/24
CONTACT WASHER/C 2
1
2
EARTHQUAKE PROOF SET
BACK PLATE
SIDE PLATE
Component:
(1/RTK 815 03)
BAG/ANTISTATIC 150
00/SBA 221 080/0100SCREW/SCREW MSK
03/SBA 186 080/0120SCREW/SCREW M6S 2
03/SBA 186 160/0250SCREW/SCREW M6S
1/RTK 815 07
BAG/antistat blixtlås 20
1/RTK 817 10
BAG/BAG/BAG/BAG/
1/RTK 907 0288
FITMENT/FITMENT/
1/RTK 907 0289
FITMENT/FITMENT/
122 861122 861
SECTION2/
DOOR SET
Aluminium
Chromium
Copper
Zinc
Vinyl chloride
Polymethylene, Polyacetal
Polybuthyleneterephtalate
Polyehtylene
Polycarbonate
remaining polymers
Stainless Steel
unspecified Steel
CABINET
Abbreviations:
Al
Cr
Cu
Zn
PVC
PDM
PBT
PE
PC
pol.
St.St.
Steel
Comments
Al
Cr
Cu
Zn
1
4
1
1
2
1
1
4
12
8
0,0020
0,0030
14
4
2
1
1,713
2 0,6 1,5
1
1
4
1
1
1
1
0,2 0,251
0,85
2
1
1
1
18
0,0010
4
4
95
Component:
PVC
(1/RTK 815 03)
00/SBA 221 080/0100
03/SBA 186 080/0120
03/SBA 186 160/0250
1/RTK 815 07
1/RTK 817 10
1/RTK 907 0288
1/RTK 907 0289
122 861122 861
PDM
PBT
PE
PC
pol
St.St.
Steel
3,8000
2,3000
9,6000
70,0000
6,5000
24/SBF 228 040/0100
24/SBF 228 060/0120
24/SBF 228 060/0200
24/SBF 228 060/0400
24/SBF 370 040/0120
LYB 250 01/141
LZV 102 01
MPB 132 02/1
MPL 107 02/1
MPP 126 03
230,0000
MPP 301 01/700
NSV 907 02
RTK 164 82/1
RTK 164 82/2
RTK 164 82/4
RTK 191 105
RTK 810 22
RTK 833 76
RTK 835 09
RTK 943 274/1
RTK 943 274/2
RTK 943 274/3
SAE 221 050/0120
SAM 523 032/0080
SBF 128 279/24
SBM 154 160/03
SCA 118 170/78
SCA 118 210/78
SCL 100 165/24
1,5000
5,6000
6,6000
9,5000
1,6000
1,1000
1,5000
20,1000
22,0000
32,0000
0,8000
96
sum
3,8000
2,3000
9,6000
70,0000
6,5000
0,0000
0,0000
0,0000
0,0000
1,5020
5,6030
6,6000
9,5000
1,6000
0,0000
0,0000
0,0000
0,0000
230,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
0,0000
1,1000
0,0000
1,5010
20,1000
22,0000
32,0000
0,8000
given
product
weigt
3,8000
2,3000
9,6000
70,0000
6,5000
1,5020
5,6030
6,6000
9,5000
1,6000
230,0000
1,1000
1,5010
20,1000
22,0000
32,0000
0,8000
PUSH-BUTTON/PUCH 2
FLAT PIN SLEEVE/FLA
LABEL/Earth bounding 1
DESIGNATION LABEL 2
INSULATING BUSHIN
PIN/PIN/PIN/PIN/PIN/ 4
DOOR PLATE/
DOOR PLATE/LEFT
DOOR STUD/
BAR/BAR/BAR/BAR/
2
FOOT BRACKET/
2
FOOT BRACKET/
2
SPACER/SPACER/
16
MOUNTING PLATE4/ 2
TUBE/TUBE/TUBE/
2
TUBE/TUBE/TUBE/
2
BACK PLATE/DJUP 40
SIDE PLATE/
HOLDER/HOLDER/
TAP/TAP/TAP/TAP/
SPACER/SPACER/
SUPPORT/
4
FOOT/FOOT/FOOT/
4
INSULATION/
4
PANEL/PANEL/
PANEL/PANEL/
SPACER/SPACER/
ANGLE/ANGLE/
BUSHING/BUSHING/
BAR/BAR/BAR/BAR/
LOCKING ROD/SKÅP
LOCKING ROD/
LATCH/LATCH/
HANDLE2/HANDLE2/
SUPPORT/
LOCKING ANGLE/
LOCKING ANGLE/
WASHER/WASHER/
4
FIXING IRON/
BAR/BAR/BAR/BAR/
COASTER/
NUT BAR/NUT BAR/
4
NUT BAR/L=430.4
4
NUT BAR/SKENA TILL 1
EARTHING PLATE/EA
EARTHING PLATE/EA 4
BRACKET/JORDNING 1
CONNECTION WIRE2
4
EARTHQUAKE PROOF SET
BACK PLATE
SIDE PLATE
DOOR SET
CABINET
Component:
SKY 117 01/4
SND 225 01/2
SVB 129 16
SVH 290 51/2
SXA 106 0093/2
SXA 106 7098/1
SXA 123 0301/3
SXA 123 0301/4
SXA 123 0303/2
SXA 123 0308/1
SXA 123 0309/1
SXA 123 0309/2
SXA 123 0310/1
SXA 123 0311/2
SXA 123 0312/2
SXA 123 0313/1
SXA 123 0316/4
SXA 123 0317/2
SXA 123 0322/1
SXA 123 0323/1
SXA 123 0325/1
SXA 123 0326/1
SXA 123 0360/1
SXA 123 0361/1
SXA 123 0363/1
SXA 123 0363/2
SXA 123 0364/1
SXA 123 0365/1
SXA 123 0366/1
SXA 123 0369/2
SXA 123 0370/2
SXA 123 0370/3
SXA 123 0371/1
SXA 123 0372/1
SXA 123 0373/1
SXA 123 0374/1
SXA 123 0375/1
SXA 123 0379/1
SXA 123 0380/1
SXA 123 0381/1
SXA 123 0382/1
SXA 123 0387/1
SXA 123 0556/1
SXA 123 0757/1
SXA 123 0759/1
SXA 123 0760/1
SXA 123 0798/1
TFL 102 06/08
4
Comments
Al
Cr
suppose copper alloy =copper
suppose copper alloy =copper
Cu
Zn
1,3000
1,5000
1
4
1
1
1
0,0020
3933,5000
3933,5000
1770,0000
983,0000 0,2250
783,0000 0,0900
784,0000 0,0900
33,0000
0,9900
st. or Al?
st. or Al?
Cr6+, sfm incl.
Cr6+, sfm incl.
Cr6+, sfm incl.
sfm incl.
1
0,0800
59,5000
59,5000
51,0000
11252,0000
2635,0000
32,0000
2
2
2
sfm incl., Cr6+
0,0030
0,1400
1
sfm incl.
1
1
coating?
smf incl.
smf incl.
6
4
0,5000
439,0000
435,8000
0,0200
0,1700
2
1
1
1
2
1
other?coating
other?
rem.pol
1021,0000
198,0000
134,0000
5,4000
1
1
1
coating
sfm incl.
sfm incl.
sfm incl.
4
2
16,0000
28,6000
0,2000
2,0000
2,0000
4
4
2
4
0,4
0,85
97
Cr6+, sfm incl.
sfm incl.
sfm incl.
suppose Al-alloy
0,0030
0,0027
some sfm incl.
0,2100
0,1600
0,6000
0,3400
0,0016
0,4500
18,8100
Component:
SKY 117 01/4
SND 225 01/2
SVB 129 16
SVH 290 51/2
SXA 106 0093/2
SXA 106 7098/1
SXA 123 0301/3
SXA 123 0301/4
SXA 123 0303/2
SXA 123 0308/1
SXA 123 0309/1
SXA 123 0309/2
SXA 123 0310/1
SXA 123 0311/2
SXA 123 0312/2
SXA 123 0313/1
SXA 123 0316/4
SXA 123 0317/2
SXA 123 0322/1
SXA 123 0323/1
SXA 123 0325/1
SXA 123 0326/1
SXA 123 0360/1
SXA 123 0361/1
SXA 123 0363/1
SXA 123 0363/2
SXA 123 0364/1
SXA 123 0365/1
SXA 123 0366/1
SXA 123 0369/2
SXA 123 0370/2
SXA 123 0370/3
SXA 123 0371/1
SXA 123 0372/1
SXA 123 0373/1
SXA 123 0374/1
SXA 123 0375/1
SXA 123 0379/1
SXA 123 0380/1
SXA 123 0381/1
SXA 123 0382/1
SXA 123 0387/1
SXA 123 0556/1
SXA 123 0757/1
SXA 123 0759/1
SXA 123 0760/1
SXA 123 0798/1
TFL 102 06/08
PVC
PDM
PBT
PE
PC
pol
St.St.
Steel
0,0500
5,0000
16,3000
144,0000
144,0000
49,0000
6605,0000
7454,0000
1939,0000
115,0000
30,0000
402,0000
95,0000
18,0000
0,2000
1,0000
234,0000
136,0000
4,6000
14,5000
1,0000
16,0000
0,6000
31,0000
2,9000
0,2300
11,0000
37,5000
786,0000
436,0000
19,5000
21,3000
42,9000
68,4000
2,7000
2,6000
37,2000
9,0000
98
given
product
weigt
sum
1,3000
1,3000
1,5000
1,5010
0,0500
0,0500
0,0000
5,0000
5,0000
16,3820
16,3820
4137,0000 4137,0000
4137,0000 5255,4000
1819,0000 1819,0000
983,2250
983,3000
783,0900
783,1200
784,0900
784,1200
33,0000
33,0000
6656,9900 6657,0000
7569,0000 7569,0000
1969,0000 1969,0000
11654,0000 11654,0000
2730,0000 2730,0000
32,0000
32,0000
18,1430
18,1500
0,2000
0,2000
235,0000
235,0000
136,5000
136,5000
4,6000
4,6000
453,5000
453,5000
435,8000
450,2000
1,0200
1,0200
16,1700
16,1700
0,6000
0,6000
1052,0000 1052,0000
198,0000
198,0000
134,0000
134,0000
2,9000
2,9000
5,6300
5,6300
11,0000
11,0000
16,0000
16,0000
28,6000
37,7000
37,7000
788,0000
788,0000
438,0000
438,0000
19,5000
19,5000
21,4630
21,5000
43,5000
43,5000
68,7400
68,7400
2,7043
2,7027
2,6000
2,6000
37,8600
37,8600
27,8100
28,0000
Appendix VIII
Materials declarations of cabinet, doors, back plate, side plate and
earthquake proof set.
99
100
Materials declaration of cabinet
Component:
Al
03/SBA 186 080/0120
24/SBF 228 040/0100
24/SBF 228 060/0200
24/SBF 228 060/0400
LYB 250 01/141
SAE 221 050/0120
SAM 523 032/0080
SBM 154 160/03
SCL 100 165/24
SKY 117 01/4
SVB 129 16
SVH 290 51/2
SXA 106 7098/1
SXA 123 0308/1
1 966,000
SXA 123 0309/1
1 566,000
SXA 123 0309/2
1 568,000
SXA 123 0310/1
528,000
SXA 123 0311/2
SXA 123 0312/2
SXA 123 0313/1
SXA 123 0326/1
SXA 123 0360/1
SXA 123 0361/1
SXA 123 0379/1
SXA 123 0387/1
SXA 123 0556/1
SXA 123 0757/1
SXA 123 0760/1
SXA 123 0798/1
0,210
5 628,210
Cr
Cu
Zn
PVC PDM PBT PE PC
pol.
0,016
St. St. Steel
19,200
12,000
237,600
228,000
sum
19,200
12,016
237,600
228,000
given
product
weigt
19,200
12,016
237,600
228,000
8,800
8,800
8,800
80,400
1,600
2,600
0,050
80,400
1,600
2,600
0,050
80,400
1,600
2,600
0,050
0,008
0,450
0,180
0,180
0,320
1,980
102,000
65,200
65,528
1 966,450
1 566,180
1 568,180
528,000
13 210,000 13 313,980
230,000
14 908,000 15 138,000
60,000
3 878,000 3 938,000
4,000
936,000
940,000
544,000
546,000
18,400
18,400
150,000
150,800
85,200
85,852
171,600
174,000
68,400
68,740
10,400
10,400
37,200
37,860
18,400 294,000 19,200 34 632,400 40 706,636
2,000
0,012
0,800
0,640
2,400
0,340
0,450
2,810 2,600 108,966 0,050
65,528
1 966,600
1 566,240
1 568,240
528,000
13 314,000
15 138,000
3 938,000
940,000
546,000
18,400
150,800
86,000
174,000
68,740
10,400
37,860
40 707,074
Materials declaration of back plate
Component:
Al
Cr Cu
(1/RTK 815 03)
24/SBF 228 040/0100
LZV 102 01
MPL 107 02/1
MPP 126 03
RTK 164 82/4
RTK 833 76
SND 225 01/2
6,000
SXA 123 0316/4
11 252,000
SXA 123 0759/1
0,005
SXA 123 0760/1
TFL 102 06/08
15,989
11 252,005
21,989
Zn
PVC
PDM PBT PE
PC pol.
3,800
0,016
given
product
weigt
3,800
12,016
St. St. Steel
sum
3,800
12,000 12,016
230,000
230,000
6,000
11 654,000
5,400 5,409
10,400
10,400
7,650
23,639
409,650 10,400 17,400 11 945,263
402,000
0,003
0,019 230,000
3,800
230,000
6,004
11 654,000
5,405
10,400
23,800
11 945,425
Materials declaration of side plate
Component:
Al
Cr Cu Zn
PVC PDM PBT PE
PC pol.
St. St. Steel
1/RTK 815 07
6,500
1/RTK 907 0288
1/RTK 907 0289
122 861
24/SBF 228 060/0120
0,042
78,400
MPL 107 02/1
RTK 164 82/2
RTK 810 22
SXA 123 0317/2
5 270,000
190,000
SXA 123 0364/1
0,120
6,000
SXA 123 0365/1
0,680
64,000
5 270,000
0,842
6,500
190,000
148,400
101
sum
6,500
given product
weigt
6,500
78,442
78,442
5 460,000
6,120
64,680
5 615,742
5 460,000
6,120
64,680
5 615,742
Materials declaration of door set
Component:
Al
Cr
(1/RTK 815 03)
00/SBA 221 080/0100
1/RTK 815 07
24/SBF 228 040/0100
24/SBF 228 060/0200
24/SBF 370 040/0120
MPB 132 02/1
MPL 107 02/1
MPP 126 03
RTK 164 82/1
RTK 810 22
RTK 835 09
RTK 943 274/1
RTK 943 274/2
RTK 943 274/3
SBF 128 279/24
SND 225 01/2
SVH 290 51/2
SXA 123 0301/3
3 933,500
SXA 123 0301/4
3 933,500
SXA 123 0303/2
1 770,000
SXA 123 0322/1
64,000
SXA 123 0323/1
0,006
SXA 123 0325/1
SXA 123 0363/1
439,000
SXA 123 0363/2
435,800
SXA 123 0366/1
SXA 123 0369/2
1 021,000
SXA 123 0370/2
198,000
SXA 123 0370/3
134,000
SXA 123 0371/1
SXA 123 0372/1
5,400
SXA 123 0373/1
SXA 123 0374/1
16,000
SXA 123 0375/1
28,600
SXA 123 0760/1
TFL 102 06/08
0
11 978,800 0,006
Cu
Zn
PVC
PDM PBT PE
3,800
PC
pol.
St. St. Steel
4,600
6,500
0,024
18,000
26,400
3,200
230,000
0,018
27,000
6,000
59,500
59,500
sum
3,800
4,600
6,500
18,024
26,400
3,200
given
product
weigt
3,800
4,600
6,500
18,024
26,400
3,200
230,000
230,000
27,018
6,000
27,018
6,004
144,000
144,000
49,000
0,280
0,200
1,200
7,524
13,524 119,322 230,000 1,400
4 137,000
4 137,000
1 819,000
64,000
36,000 36,286
0,200
14,500
453,500
435,800
1,200
31,000
1 052,000
198,000
134,000
5,800
5,800
0,230
5,630
11,000
11,000
16,000
28,600
10,400
10,400
3,600
11,124
10,300 16,800 386,330 10,400 115,200 12 882,082
4 137,000
5 255,400
1 819,000
64,000
36,300
0,200
453,500
450,200
1,200
1 052,000
198,000
134,000
5,800
5,630
11,000
16,000
10,400
11,200
13 986,376
Materials declaration of earthquake proof set
Component:
Al Cr Cu Zn
PVC PDM PBT PE PC
pol. St. St.
03/SBA 186 160/0250
1/RTK 817 10
NSV 907 02
RTK 191 105
SCA 118 170/78
SCA 118 210/78
SXA 106 0093/2
20,00
SXA 123 0380/1
8,00
SXA 123 0381/1
4,00
SXA 123 0382/1
78,00
12,00
20,00
78,00
102
Steel
280,00
88,00
128,00
sum
280,00
88,00
128,00
20,00
3 144,00 3 152,00
872,00 876,00
78,00
4 512,00 4 622,00
given
product
weigt
280,00
88,00
128,00
20,00
3 152,00
876,00
78,00
4 622,00
Appendix IX
Material contents of the studied products
103
104
Metals
Material
Silver
Aluminium
Arsenic
Gold
Barium
Bismuth
Beryllium
Cadmium
Cobalt
Chromium
Copper
Iron
Mercury
magnesium
Nickel
Lead
Palladium
Ruthenium
Antimony
Tin
Tantalum
Tellurium
Titanium
Zinc
Unspecified
Steel
Stainless steel
Total
ROJ 204 03
weight, g weight%
0,167
0,08
1,815
0,88
0,000
0,00
0,047
0,02
0,127
0,06
0,022
0,01
0,000
0,00
0,001
0,00
0,000
0,00
0,173
0,08
25,383
12,36
2,428
1,18
0,000
0,00
0,000
0,00
0,178
0,09
1,386
0,67
0,020
0,01
0,000
0,00
0,069
0,03
2,574
1,25
0,044
39,905
74,34
ROJ 207 056
ROJ 212 206
BYB 501 180
weight, g weight% weight, g weight% weight, g weight%
0,234365
0,05
0,685
0,10
25,06845
5,49
21,626
3,08 34 129,015
44,39
0
0,001
0,00
0,037527
0,01
0,099
0,01
0
0,006737
0,00
0,139
0,02
0
0,000
0,00
0,001421
0,00
0,002
0,00
0
0,011
0,00
0,061814
0,01
0,378
0,05
2,816
0,00
111,7366
24,46 123,517
17,57
38,113
0,05
58,97036
12,91
66,869
9,51
0
0,000
0,00
0,54205
0,12
0,662
0,09
1,318472
0,29
1,822
0,26
4,042591
0,89
3,661
0,52
0,033413
0,01
0,055
0,01
0,00022
0,00
0,000
0,00
0,256637
0,06
0,756
0,11
6,839757
1,50
6,973
0,99
0,22176
0,05
0,444
0,06
0
0,000
0,00
0,02
0
19,44 2,221455
0,49
2,558
0,36
241,149
0,31
36,21
211,59
46,32
230,26
39 425,400
40,000
32,75 73 876,49
51,28
0,05
96,10
Ceramics
Material
unspecified
glass/ceramics
SiO2
Al2O3
TiO2
MgO
CaO
BO
FeO
BaTiO3
Total
ROJ 204 03
ROJ 207 056
ROJ 212 206
BYB 501 180
weight, g weight% weight, g weight% weight, g weight% weight, g weight%
0,52
18,77
0,25 2,060594
9,14 41,85358
0,45
9,16
2,87
91,05
0,41
12,95
4,86
2,37 11,05018
2,42
23,65
3,36
0,13
1,04
6,94
2,77
0,07
0,05
35,16
0,06 0,309219
0,51 2,36468
3,38 15,4456
1,35
6,1782
0,03
0,1544
0,02
0,164
17,12
79,58
0,07
0,52
3,38
1,35
0,03
0,04
17,42
0,67
5,15
33,66
13,46
0,34
0,05
170,89
0,10
0,73
4,79
1,91
0,05
0,01
24,31
105
0,00
0,00
Plastics
Material
Epoxy(EP)
Polyester
Polyetheretherke
tone (PEEK)
Polyimide (PI)
Polytetrafluoroet
hylene (PTFE)
Vinyl
chloride(PVC)
Unsaturated
polyester (UP)
Liquid crystalline
polymers
of
polyestertype
(SP-LCP)
Polycarbonate
(PC)
Polymethylene,
Polyacetal
(PDM)
Polybuthyleneter
ephtalate (PBT)
Poyethylene
(PE)
remaining
polymers
Total
ROJ 204 03
ROJ 207 056
ROJ 212 206
BYB 501 180
weight, g weight% weight, g weight% weight, g weight% weight, g weight%
20,97
10,21
53,32
11,67
125,47
17,85
2,00
0,97
2
0,44
2,00
0,28
0
0,09
0,02
0,00095
0,00
0,612
0,13
0,08
0,04
0
6,71
3,27
10,728
2,35
7,00
3,41
11,53
2,52
0,07
36,82
17,90
0,0687
78,35
0,02
17,15
0,00
0,00
0,08
0,01
12,53
1,78
0,33
140,42
19,92
460,05
0,60
113,20
0,15
1,40
0,00
20,00
0,03
20,60
0,03
1268,73
1 883,98
1,65
2,45
Other
Material
Bromine
Phosphorus
Silicon
Tetrabromobisph
enol (TBBA)
Antimonytrioxide
Other
Total
ROJ 204 03
ROJ 207 056
ROJ 212 206
BYB 501 180
weight, g weight% weight, g weight% weight, g weight% weight, g weight%
0,024
0,01
0,117
0,03
0,207
0,03
0,014
0,01
0,022
0,00
0,000
0,00
0,409
0,20
0,824
0,18
1,245
0,18
2,913
1,42
3,36
1,64
6,489
0,002
6,030
13,48
1,42
0,00
1,32
2,95
106
14,137
0,004
2,01
0,00
15,59
2,22
0,00
0,00
Appendix X
Calculations of reference levels for the printed board assemblies.
107
108
Material
ROJ 204 03
ppm of material in product
ppm of As in material
ppm of Be in material
ppm of Bi in material
ppm of Cd in material
ppm of Hg in material
ppm of Pb in material
ppm of Sb in material
ROJ 207 056
ppm of material in product
ppm of As in material
ppm of Be in material
ppm of Bi in material
ppm of Cd in material
ppm of Hg in material
ppm of Pb in material
ppm of Sb in material
ROJ 212 206
ppm of material in product
ppm of As in material
ppm of Be in material
ppm of Bi in material
ppm of Cd in material
ppm of Hg in material
ppm of Pb in material
ppm of Sb in material
Total
Silver
Ag
Aluminium
Al
Arsenic
As
891,2823 10 831,7003
19,07
1,08
13,63
2,00
0,09
4,25
64,24
93,1387
0,0008
0,0622
0,4355
0,1244
0,1244
1,0701
0,0622
0,0006
0,0001
0,0001
0,0012
0,0003
0,0533
0,1015
0,0051
0,0711
0,1269
16,7212
3,5263 53 427,4200
0,3366
0,0561
0,1069
0,0053
0,0748
0,1336
216,9376 204,5223
0,0018
0,0330
0,2309
0,0660
0,0660
0,5675
0,0330
0,0012
0,0001
0,0001
0,0024
0,0006
2,1100 50 760,9160
0,3198
0,0005
0,0001
0,0000
0,0002
0,0002
1 197,5845 32 991,7324
23,41
1,03
12,11
1,19
0,15
1,20
65,38
Beryllium Cadmium Copper
Be
Cd
Cu
0,0014
0,0003
0,0000
0,0006
0,0006
581,6761 62 218,0077
23,82
1,11
15,35
1,40
0,20
1,91
74,29
Bismuth
Bi
275,8563 114,7559
0,0023
0,0108
0,0758
0,0217
0,0217
0,1863
0,0108
0,0009
0,0001
0,0001
0,0018
0,0004
Gold
Au
1,5695 65 422,8672
0,4122
0,0011
0,0002
0,0000
0,0004
0,0004
0,0687
0,1308
0,0065
0,0916
0,1636
Continued….
Material
ROJ 204 03
ppm of material in product
ppm of As in material
ppm of Be in material
ppm of Bi in material
ppm of Cd in material
ppm of Hg in material
ppm of Pb in material
ppm of Sb in material
ROJ 207 056
ppm of material in product
ppm of As in material
ppm of Be in material
ppm of Bi in material
ppm of Cd in material
ppm of Hg in material
ppm of Pb in material
ppm of Sb in material
ROJ 212 206
ppm of material in product
ppm of As in material
ppm of Be in material
ppm of Bi in material
ppm of Cd in material
ppm of Hg in material
ppm of Pb in material
ppm of Sb in material
Mercury
Hg
Nickel
Ni
Lead
Pb
1 060,6700 1 992,1543
0,0021
0,0040
0,0299
0,0002
0,0002
0,0011
0,0011
0,0020
Antimony
Sb
Tin
Sn
Zinc
Zn
331,7669 4 909,6246 238 120,7035 16 588,7347
0,0069
0,4762
3,3177
0,4762
0,0014
0,4762
8,2944
0,0069
0,9049
0,4977
0,0048
0,0550
3,8099
0,0137
0,4762
29,0303
3 272,3474 3 654,8599
0,0065
0,0073
636,9547 6 104,9319
0,0085
0,0548
0,0004
0,0004
0,0017
0,0085
0,0033
0,0033
0,0684
0,0171
0,0037
2 782,0271 1 623,3677 1 167,2554 5 824,3187
0,0056
0,0032
0,0082
0,0244
0,0002
0,0002
0,0028
0,0028
Solder
Sn63Pb37
0,0016
0,0082
0,0652
0,0163
0,0016
109
Steel
carbon steel
Printed board
laminate
426 882,4456
14,9409
0,5976
4,6957
0,4696
0,0555
0,1231
34,5775
5 513,4850 17 249,3774 143 951,6384 534 494,9152
0,0110
3,4499
1,2956
18,7073
0,0110
0,2879
0,7483
0,0110
8,6247
0,2879
5,8794
0,0210
0,5175
0,0288
0,5879
0,0001
0,0029
0,0695
0,0882
0,2879
0,3135
0,0110
30,1864
0,5758
43,2941
3 901,8499 10 602,6059
0,0078
2,1205
0,0078
0,0078
5,3013
0,0148
0,3181
0,0001
0,0624
0,0078
18,5546
97 635,5075 570 519,3582
0,8787
19,9682
0,1953
0,7987
0,1953
6,2757
0,0195
0,6276
0,0020
0,0742
0,1953
0,2128
0,3905
46,2121
110
Appendix XI
Calculations of reference levels for the equipment practice.
111
112
Material
Zinc
Stainless steel
unspec. Steel
signal value Aluminium Copper
Cabinet (99,2%)*
ppm of material in product
992244,64
138261,23
63,87
2676,83
471,66
850771,05
ppm of As in material
7,76
0,00
0,00
0,01
0,09
7,66
ppm of Be in material
1,85
0,14
0,00
0,01
0,00
1,70
2,68
ppm of Bi in material
0,97
0,00
0,01
0,00
1,70
0,46
ppm of Cd in material
0,28
0,00
0,01
0,00
0,17
ppm of Hg in material
0,29
0,28
0,00
0,00
0,00
0,02
ppm of Pb in material
4,13
2,38
0,00
0,04
0,00
1,70
ppm of Sb in material
3,59
0,14
0,00
0,01
0,05
3,40
Earthquake proof set (97,9%)*
ppm of material in product
978797,06
0,00
0,00
2596,28
0,00
976200,78
8,79
ppm of As in material
0,00
0,01
0,00
8,79
ppm of Be in material
1,96
0,00
0,01
0,00
1,95
ppm of Bi in material
1,96
0,00
0,01
0,00
1,95
0,21
ppm of Cd in material
0,00
0,01
0,00
0,20
ppm of Hg in material
0,02
0,00
0,00
0,00
0,02
ppm of Pb in material
1,99
0,00
0,04
0,00
1,95
ppm of Sb in material
3,91
0,00
0,01
0,00
3,90
Door set (87,5%)*
ppm of material in product
874940,44
856462,03
966,94
8531,30
743,58
8236,59
0,25
ppm of As in material
0,00
0,01
0,02
0,15
0,07
ppm of Be in material
0,90
0,86
0,00
0,02
0,01
0,02
ppm of Bi in material
6,03
6,00
0,00
0,02
0,00
0,02
1,75
ppm of Cd in material
1,71
0,00
0,03
0,00
0,00
1,71
ppm of Hg in material
1,71
0,00
0,00
0,00
0,00
ppm of Pb in material
14,89
14,73
0,00
0,14
0,01
0,02
0,98
ppm of Sb in material
0,86
0,00
0,02
0,07
0,03
Side plate (96,5%)*
ppm of material in product
965009,08
938433,43
0,00
149,94
0,00
26425,72
0,24
ppm of As in material
0,00
0,00
0,00
0,24
0,99
ppm of Be in material
0,94
0,00
0,00
0,05
ppm of Bi in material
6,62
6,57
0,00
0,00
0,05
ppm of Cd in material
1,88
1,88
0,00
0,00
0,01
1,88
ppm of Hg in material
1,88
0,00
0,00
0,00
ppm of Pb in material
16,20
16,14
0,00
0,00
0,05
1,04
ppm of Sb in material
0,94
0,00
0,00
0,11
Back plate (94,6%)*
ppm of material in product
946120,61
941951,00
1840,75
1,61
870,63
1456,62
7,84
ppm of As in material
0,00
0,01
0,00
0,17
7,66
2,65
ppm of Be in material
0,94
0,00
0,00
0,01
1,70
ppm of Bi in material
8,30
6,59
0,00
0,00
0,00
1,70
ppm of Cd in material
2,06
1,88
0,00
0,00
0,00
0,17
1,90
ppm of Hg in material
1,88
0,00
0,00
0,00
0,02
17,91
ppm of Pb in material
16,20
0,00
0,00
0,01
1,70
4,44
ppm of Sb in material
0,94
0,00
0,00
0,09
3,40
Total (82,6%)*
ppm of material in product
825571,00
366132,26
209,74
2991,44
385,03
455852,52
ppm of As in material
4,19
0,00
0,00
0,01
0,08
4,10
1,29
ppm of Be in material
0,37
0,00
0,01
0,00
0,91
3,48
ppm of Bi in material
2,56
0,00
0,01
0,00
0,91
ppm of Cd in material
0,84
0,73
0,00
0,01
0,00
0,09
0,74
ppm of Hg in material
0,73
0,00
0,00
0,00
0,01
7,26
ppm of Pb in material
6,30
0,00
0,05
0,00
0,91
2,23
ppm of Sb in material
0,37
0,00
0,01
0,04
1,82
* % of declared material for which background levels are available
113
114
Appendix XII
Ericsson internal: Code letters for component manufacturers
115
116
Code letters for component manufacturers
a
b
c
d
e
f
g
h
i
j
k
l
m
n
o
p
q
r
s
t
u
v
w
x
y
z
å
AMD
Grafokett
Zebra Technologies
Toko Inc.
MTC
Philips Export
KOA Corporation
BC Components Beyschlag
VISHAY
Bourns laboratories Inc.
Epcos (Siemens)
Taiyo Yuden co.
Syfer Technology
Kemet Electronics
Nichicon Corporation
AVX Ltd
ON Semiconductor
General Semiconductor Europe
Berg Electronics
Texas Instruments
Saronix
Maxim integrated products
Motorola Semiconductor
Integrated Device Technology
Ericsson Microelectronics
Bayer
Segerström &Svensson, Salo
117