ALPHA® EF-2100 LIQUID SOLDERING FLUX
ALPHA® EF-2100 is Alpha’s latest VOC-free,
halide-free flux designed to meet current
REACH and RoHS legislation.
Drop-In replacement for users of EF-2210,
EF-2202, WB-400 and NR-300 who wish to
use a non-toxic product.
•Stable performance compared to EF-2210
•Equivalent solderability in hole-fill, solder
balling and bridging
•Good solder joint cosmetics
•Evenly spread, tack-free residue
Key Attributes
Average Hole Fill (%)
100
•VOC-Free
ALPHA® EF-2100
ALPHA® EF-2201
80
•Halide-Free
65
•Zero Rosin
40
•Low Solids
•No-Clean Chemistry
20
•Bellcore and SIR Compliant
0
40 mil Hole Fill
30 mil Hole Fill
40 mil Hole Fill
Average Hole Fill (%)
100
ALPHA® EF-2100
Leading Competitor
ALPHA® EF-2100 exhibits superior hole
fill for the most popular hole sizes using
ALPHA® SACX® Plus 0307.
80
65
40
20
0
20 mil Hole Fill
15 mil Hole Fill
10 mil Hole Fill
ALPHA® EF-2100 LIQUID SOLDERING FLUX
TECHNICAL SPECIFICATIONS: EF-2100
ITEM
TYPICAL VALUES
ITEM
TYPICAL VALUES
Appearance
Clear, colorless liquid
Flash Point (T.C.C.)
None
Solids Content, wt/wt
4.0
Recommended Thinner
DI Water
Specific Gravity @ 25°C (77°F)
1.015 ± 0.003
Shelf Life
18 months
Acid Number (mg KOH/g)
31.5 ± 2.0
IPC J-STD-004(B) Designation
ORL0
PROCESSING PARAMETERS: EF-2100
OPERATING PARAMETERS
TYPICAL LEVEL
Amount of Flux Applied
Spray: <2000 µg/in of solids
Top-Side Preheat Temperature
95–115°C (203–240°F)
Bottom-Side Preheat Temperature
0 to +22°C (0 to 70°F) vs. Top-Side
Recommended Preheat Profile
Straight ramp to desired top-side temperature
Maximum Ramp Rate of Topside Temperature
(to avoid component damage)
2°C/second (3.5°F/second) maximum
Conveyor Angle
5–8°C (6° most common)
Conveyor Speed
1.0–6.5 feet/minute
Contact Time in the Solder
(includes Chip Wave and Primary Wave)
2–7 seconds (3–5 seconds most common)
2
SOLDER POT TEMPERATURE
Sn63/Pb37 Alloy
235–260°C (460–500°F)
Lead-Free Alloys
(99.3Sn/0.7Cu, 96.5/3.5Ag, SAC305. SAC405, SnCX and SACX)
260–270°C (500–520°F)
These are general guidelines which have proven to yield excellent results; however, depending upon your equipment, components,
and circuit boards, your optimal settings may be different. In order to optimize your process, it is recommended to perform a design
experiment, optimizing the most important variables (amount of flux applied, conveyor speed, topside preheat temperature, solder
pot temperature and board orientation).
For more information about ALPHA® EF-2100 Liquid Soldering Flux, please contact your
Alpha Representative.
AlphaAssembly.com
Global Headquarters
300 Atrium Drive
Somerset, NJ 08873
USA
Tel: +1-814-946-1611
©2017 Alpha
Issued 01/17
SM1395
European Headquarters
Unit 2, Genesis Business Park
Albert Drive, Woking, Surrey, GU21 5RW
UK
Tel: +44 (0) 1483 758400
Asia/Pacific
8/F, Paul Y. Centre, 51 Hung To Road
Kwun Tong, Kowloon
Hong Kong
Tel: 852-3190-3100