®
Lead free SOLUTIONS you can TRUST
Low Melting Point Lead Free Solder Paste
TB48 - M741
• Allows the use of a LOWER reflow profile than normally used for Tin/Lead solders.
• Greatly helps reduce the emissions of CO2. ANTI-GLOBAL WARMING solder paste.
• EXCELLENT WETTING and LOW VOIDING characteristics.
■ Increasing demand for LOW melting point solders
There are increasing demands for a high quality lower melting point alloy due
to;
• Continual use of heat sensitive components and thinner PC boards.
• Inferior solderability may require a Nitrogen atmosphere to be used because of the excessive oxidation caused
by the high temperature process.
• Need to reduce emissions of environmentally disruptive substances.
• Increased melting point of lead free solders requires higher heat energy and results in increased CO2 emissions.
Consequently, this low melting point solder alloy realizes an energy saving due to a lower thermal input
requirement and as a result, a significant reduction in CO2 emissions.
Power consumption (8 hrs/day)
12
Power
consumption(kwh)
Hot air reflow oven
10
25%
UP
43%
DOW
N
8
6
4
2
0
543t/year
(3.1kg/h)
700t/year
(4kg/h)
403t/year
(2.3kg/h)
SnPb
SnAgCu
SnBi
300
CO2 emission(kg) = kwh × 0.37
24h × 365days × 20 reflow ovens
Temp (ºC)
250
200
150
SAC solder paste
4kgw/h 700t/year
100
SnPb
50
SnAgCu
SnBi
0
0
100
200
Time (sec)
SnBi solder paste
2.3kgw/h 403t/year
300
43% reduction of CO2 emission
■ Printing (Laser cut stencil 120micron)
■ Tack time
250
continual print performance.
200
Tackines s (gf)
New flux formulation successfully prevents chemical
reaction between solder and ensures consistent
150
100
• Tester:
Malcom TK-1
• Temperature:
23±2ºC
• Stencil thickness: 0.2mm
50
0
0.4mm pitch
0.3mm diameter
- 1st print after 200 strokes -
■ Heat slump
0.3
0.2
0.5mm
0.2
0.4
0.3
0
10 Time (hr)
20
■ Solder wetting
0.4
0.5mm
Assures complete melting and a good wetting
meniscus to super fine pattern components under
air reflow.
0.7mm
1.5mm
3.0mm
3.0mm
• Heat profile : 120ºC× 5 min
• Test method : JIS Z 3284
0.25mm dia.
■ Voiding
0603 chip
■ Bonding strength
Power tr. (100Sn)
BGA (SAC305)
Bonding strength (kgf)
20
15
• Material :Glass epoxy FR-4, OSP
• Components : 0.65mm pitch QFP (SAC) ►Peel strength
3216R, 2012R,1608R chip (Sn100) ► Shear strength
SAC
SnBi
10
SnPb
5
0
QFP
■ Recommended reflow profile
Over 140°C > 30 sec.
180
(sec.)
240
Product
120
TB-M741
Composition (%)
Sn42.0、Bi58.0
Melting point (°C)
138 (eutectic)
Particle size (μm)
20 – 45
Halide content (%)
0.0
Flux type
ROL0
Flux content (%)
Ramp-up temp.
1.0~3.0°C /sec.
60
Flux
150
50
1608R
Printing - Stencil
Product
Alloy
Pre-heat temp.
110~130°C 60~120sec.
100
2012R
■ Specifications
Peak temp.
160~230°C
250
0
3216R-Au
Application
(°C )
200
3216R
*ANSI J STD-004A
11.0
Viscosity (Pa.S)
190
Copper plate corrosion
Passed
Tack time
> 16 hours
Shelf life (below 10°C)
6 months
*Specifications are subject to change.
32-1, Senju Asahi-cho, Adachi-ku, Tokyo 120-0026
Tel : (03) 5244-1521 Fax : (03) 5244-1525 www.ko-ki.co.jp
2009.3.10