Lab4MEMS
“LAB FAB for smart sensors and actuators MEMS”
ENIAC KET Pilot Line 2012
Alberto Corigliano
Politecnico di Milano
Lab4MEMS: an ENIAC KET Pilot Line
Duration: 30 months
Start:
January 2013
End:
June 2015
Budget: 28 M Euro (about 38 M $)
21 partners belonging to 10 Countries
Project Coordinator:
Roberto Zafalon, STMicroelectronics s.r.l. Italy
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Lab4MEMS: Consortium
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• Italy, France, Malta, The Netherlands, Finland, Belgium, Romania, Poland,
Norway, Austria.
Lead 1
STMicroelectronics srl (Coordinator)
ST-I
Italy
Ind
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3
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STP
PoliTO
IIT
PoliMI
Italy
Italy
Italy
Italy
Ind-Res
Uni
Res
Uni
IUNET
Italy
Uni
CEA
France
Res
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ST-POLITO s.c.a.r.l.
Politecnico di Torino
Istituto Italiano di Tecnologia
Politecnico di Milano
Consorzio Nazionale Interuniversitario per la
Nanoelettronica
Commissariat Energie Atomique Et Aux Energies
Alternatives
SERMA Technologies SA
STMicroelectronics Ltd.
SERMA
ST-M
France
Malta
Ind
Ind
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University of Malta
SolMateS BV
Cavendish KINETICS BV
Okmetic OYJ
VTT Technical Research Centre of Finland
PICOSUN OY
KLA-Tencor
University POLITEHNICA of Bucharest, CSSNT
Instytut Technologii Elektronowej, Warsaw
Stiftelsen SINTEF
Sonitor Technologies AS
Datacon Technology GmbH
UoM
SOL
CK
OKM
VTT
Picosun
KLA
UPB
ITE
SINTEF
SON
DCON
Malta
The Netherlands
The Netherlands
Finland
Finland
Finland
Belgium
Romania
Poland
Norway
Norway
Austria
Uni
Ind
Ind
Ind
Res
Ind
Ind
Uni
Res
Res
Ind
Ind
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Lab4MEMS: STMicroelectronics & MEMS
• ST is ideally placed to lead the Lab4MEMS research into next-generation
devices.
Over 800 MEMS-related patents, more than 3 billion devices shipped, extensive
in-house production capabilities currently producing more than 4 million MEMS
devices per day.
• ST is working with universities, research institutions and technology
businesses across ten European countries.
The project benefits from ST’s MEMS facilities in France, Italy and Malta to
establish a complete set of manufacturing competencies for next-generation
devices, spanning design and fabrication to test and packaging.
• The project will develop advanced packaging technologies and vertical
interconnections using flip-chip, through-silicon vias and through-mold vias,
enabling 3D-integrated devices for applications such as body area sensors and
remote monitoring. A key target is to perfect a PZT deposition process
compatible with mass production, enabling innovative actuators and sensors
on System-On-Chip.
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Lab4MEMS’s vision: key-enabling technologies and new
Application
application areas
areas
Actuation:
Fluid.: Ink-jet, micropumps
Acoustic: ultrasound trans.
Optics: tunable filters, lenses
RF: Switches
Piezoelectric
thin-films
(PZT)
Sensing & Energy
harvesting:
Low noise, low power
sensors: microphones,
accelerometers
Vibration energy
harvesters
+
Sensing:
Mech.: Accelerometer,
gyro, pressure, flow, tactile
Therm.: flow, temperature
Established
MEMS
technology
+
Anisotropic
magneto resistive
materials
(permalloy)
Sensing:
Magnetic field: electronic
compass
3D
heterogenous
packaging
+
System aspects:
Miniaturisation, compact
elements
New functionalities
Wireless sensor nodes
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Lab4MEMS: Scope & Mission
• Lab4MEMS will feature the Pilot Line for innovative technologies on
advanced piezoelectric and magnetic materials, including advanced
Packaging, expected to fuel the next generation’s smart sensors and
actuators based on MEMS.
• Micro-actuators, micro-pumps, sensors and electrical power generators,
integrated on silicon-based piezoelectric materials (PZT)
• for use in Data Storage, Ink Jet, Health Care, Automotive and Energy Scavenging
• Magnetic field sensors integrated on silicon-based Anisotropic Magneto
Resistance (AMR) materials.
• for use in consumer applications such as GPS platforms and mobile phones
• Advanced packaging technologies and vertical interconnections (flip chip,
Through Silicon Vias or Through Mold Vias) for full 3D integration.
• For use in CONSUMER and HEALTHCARE applications such as body area sensors and
remote monitoring
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Lab4MEMS: Relevance with ENIAC Grand Challenges
Lab4MEMS KET Pilot Line
Technological
development
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Expected Achievements/
Applications
Relevance with MASP Grand Challenge and priority research areas
7. Semiconductor
Process Integration
7.3.3 Opportunities in System in Package
Advanced substrates,
Focus on Advanced packaging technologies and vertical wafer and module level
integration. TSV and
interconnections (flip chip, Through Silicon Vias or
innovative assembly
Through Mold Vias) for full 3D integration. This is to
technology.
add value and flexibility to a wide range of new smart
sensors which will combine different sensing/actuation
features with an extensive analog and digital processing
on the single package.
. Equipment, materials and manufacturing
8.3.2 More than Moore
The over-arching goal of Lab4MEMS in this Grand
Challenge is to enable European E&M companies to
keep the leadership on MEMS sensors.
8.3.3 Manufacturing
Focus on highly flexible, high quality and cost
competitive, manufacturing line of MEMS sensors and
smart heterogeneous integrated products.
Piezoelectric and
magnetic materials at
the nanoscale and
associated enabling
compounds, for a new
class of integrated
MEMS sensors.
3D heterogeneous
integration and
packaging.
Manufacturing proven
quality and process
robustness, handling of
new material under
high
yield/low
defectivity constraints.
Highest automatization
and yield. Quality
inspection, failure
analysis,
characterization and
modeling. Innovative
and EU centric FrontEnd vs. Back-End value
chain.
Agile line production,
mainly driven by
Consumer and
Automotive markets.
Fab process control
flow, equipment and
tools for PZT epi
deposition and AMR
sputtering, metrology,
quality assurance and
defect inspection,
Lab4MEMS: Innovation
• Despite the presence of research centers in EU at the forefront of adv. material
research, there is still little industrial investment ready to push through.
• It is of paramount importance to increase the scientific know-how on those key
materials, but also the fast transferring of knowledge to production, by setting the
advanced infrastructure and R&D manufacturing Pilot Line.
• Lab4MEMS will be promoted as an add-on to the current facilities in Agrate and
Malta, aiming to implement and optimize the industrial processes and to validate
the demonstrators suitable to penetrate the market.
• 3D package integration for MEMS products will allow to integrate the ASIC die &
the MEMS sensors in a stacked configuration, thus
enhancing performance and reliability
while reducing size and cost.
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Lab4MEMS: Expected Impact
• The MEMS PL will be based in Agrate (IT), on 200 mm wafer scale and,
once in operation, it will process more than 600 wafers/week.
• ST-I will fit a new set of R&D equipments for PZT and AMR, as part of a larger
manufacturing facility already in place for high volume (i.e. >100M
devices/month) 3-axis MEMS accelerometers and gyroscope. This strategy
will allow increasing and maintaining the know-how on those very strategic
enabling technologies, combining scientific skills with the ability to design and
manufacture a wide range of smart systems on silicon.
• The Packaging PL will be based in Kirkop (Malta)
• ST-M will integrate a new set of R&D equipment for flip chip, vertical
interconnections (Through Silicon Vias and/or Through Mold Vias) and Wafer
Level Package, as part of a larger manufacturing facility already in place for
high volume MEMS products.
• Kirkop has a vast experience of BE technologies and assembly of 3 million
MEMS devices per day (Motion sensors, Microphones and Pressure
Sensors).
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Lab4MEMS: demonstration strategy
1. proof-of-concept : a suite of intermediate demonstration vehicles will
be delivered and assessed at midterm (i.e. D5.2 at M18), to prove the
actual feasibility of initial device solutions, wafer substrates, process
steps, tools or equipments.
2. Final Technology Demonstrators : from the "proof-of-concept", the
work-flow will then converge and optimize a set of four Tech
Demonstrators intended to become the main flagship vehicles to
demonstrate the KET Pilot Lines.
Technology Demonstrators:
a. Print-head for industrial printers, piezo actuated
b. Micro-electric scavenger, powered by mechanical/vibration energy
c. AMR magnetic sensor
d. 3D MEMS packaging
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Focus on: micro energy scavenger
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Basic concept
convert kinetic energy (e.g. from ambient vibration) into electric energy
Possible applications
- Bridge/Building Vibration Monitoring
Low frequencies, large displacements
- Human motion Power generation for sensors
Low frequencies, high accelerations (shoes inserts)
- Tires monitoring
- Vehicle vibration monitoring and power generation for sensors
High frequencies
- ….
Paradiso et al., 2006, Design
Automation Conference
Focus on: micro energy scavenger
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From Mechanical to Electric Energy
KINETIC
ENERGY
•
•
ELASTIC
ENERGY
Large seismic Mass
Low frequency energy
•
•
ELECTRIC
POTENTIAL
Transduction at MEMS scale
High frequency energy
ELECTRIC
ENERGY
•
Electric Circuit
Contrasting needs
Seismic Mass:
large mass vs. size reduction
Frequency mismatch:
high MEMS natural frequencies vs. low frequency of external signals
Focus on: micro energy scavenger
ELECTROSTATIC: Mobile plate capacitors
Easy integration in silicon MEMS, low power generation, need to pre-charge the plates
MAGNETIC: Induction in coils
High power generation, need for big magnets and difficult integration in MEMS
PIEZOELECTRIC: Material strain
High power density, possible integration in MEMS.
Functional Requirements:
- Power density, size, operational frequency, bandwidth
Goals:
- small scale (< < 0.5 cm3)
- power generation ~100 μW continuous
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Focus on: micro energy scavenger
Cantilever beam with piezoelectric layer
piezoelectric layer
e.g. Pb(Zr,Ti)O3 (PZT)
Roundy et al., 2005, IEEE Pervasive Computing
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•
•
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inertial force on the tip mass
flexural vibration of the composite beam
non-zero strain rate in the PZT layer
generation of electric potential on the electrodes
Remarks
• mass-proportional power generation
• importance of piezoelectric coupling coefficient
• possible optimization of the mechanical scheme for maximum energy generation
• optimal behavior at resonance
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Focus on: micro energy scavenger
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Possible MEMS design for optimal power generation
L = 1000 µm
b = 200 µm
Mass = 400x200x200 µm3
Acc. = 10 g
Q = 1000
P = 7.11 µW
u = 510 µm
u/L = 0.51
Ropt = 11 kΩ
f0 = 1562 Hz
power obtained for
resonance driven device
Problems:
• vibrations e.g. from human movements are in the range 2-10 Hz
• power generation is negligible for such a low excitation frequency!
• small bandwidth
Question 1: how can we harvest energy with high mismatch between
source and MEMS frequency?
FREQUENCY UP CONVERSION
Question 2: how can we increase the bandwidth?
NONLINEAR RESONANCE
Frequency-up conversion
Forced
vibration
Impulsive
phenomenon
Free
oscillation
Frequency-up conversion
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Bistable beams
- Easy MEMS integration
- In-plane mechanism
- Complex compatibility with piezoelectricity
Piezo works out of plane (process constraints)
- Electrostatic transduction
Cottone et al., 2013, Proc. IEEE MEMS
- Low power generations
Magnetic loading
- Difficult MEMS integration
- Reliability issues
- Compatible with piezoelectric transduction
- Need for high acceleration
Impact loading
Kulah et al., 2008, IEEE Sensors Journal
- Easy MEMS integration
- Reliability issues
- Compatible with piezoelectric
transduction
- Need for high acceleration
Zorlu et al., 2011, IEEE Sensors Journal
Frequency-up conversion
fEXT = 2 Hz
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Size = 1x1x1 mm3
fmems = 52 kHz
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Peak Power generation = 43.18µW
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Sine Excitation
Impulsive Excitation
Big Mass motion (to “capture” kinetic energy)
Big Mass
CONTACT
(Transfer of energy)
Small Beam
Small Beam motion
(to convert elastic energy into electric energy)
ST-Polimi Patent pending
Nonlinear resonance
Non linear resonance helps increasing the bandwidth
Geometric non linearity:
Hard spring effect, Duffing oscillator
- Bridge shape beam
- Only 33- mode
- Still too high natural frequency
- Need for a technique to avoid
jump-down phenomenon
3rd gen. UWB-PMPG
Micro/Nano systems laboratory
Hajati and Kim, 2008, Proceedings of SPIE - The
International Society for Optical Engineering
fmems = 359 Hz
Size = 1x1x1 mm3
MIT-Polimi collaboration
Peak Power generation = 21.95 µW
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Closing remarks
Lab4MEMS
- Large ENIAC Pilot Line project focusing on KET
- Enabling technology for terrific exploitation of MEMS in the short future
- Major Technology demonstrators
Energy scavengers
- Piezoelectric energy harvesters
- Resonant harvesters: for specific frequency and accelerations
- Frequency up conversion: to overcome the frequency mismatch
- Nonlinear harvesters: to increase the bandwidth
- Introduce new heavy materials to increase the weight of the seismic mass
- Find new mechanical schemes to optimize the conversion of energy
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Thank you for your attention!