www.thales-nederland.com
Investing for the future
Our investment policy is aimed at adopting the latest
innovations in the field of complex and RF PCB’s for high
reliability and mission critical applications. For it is our
sophisticated machines, in combination with our in-house
expertise, that enables us to manufacture products with
high complexity. In the 2012-2013 timeframe, more than
2014 capital
the newly
built 3800into
m² manufacturing
facility
aIn dozen
investments
new equipment
havehas
been
opened
and
put
into
operation.
been realized to further strengthen our PCB production
capabilities. In 2014 the newly built 3800 m2 PCB
production facility will be opened.
Thales Group Competence Centre
PRINTED CIRCUIT BOARDS
Safety and environment
With respect to quality control and assurance the centre
holds QPL-listing for MIL-PRF- 55110 and MIL 31032,
ISO 14001 and ISO 9001 certifications and is a member of
the IPC. Inspection is performed in compliance with
IPC 6012 class 2 and 3 requirements.
All personnel is IPC-A-600 certified. Moreover, we are
used to manufacture in accordance with customer specific
requirements. In-house reliability testing and
Environmental Stress Screening (ESS) facilities are
available. A continuous Improvement program is based on
the principles of lean manufacturing.
Besides the ISO 14001 certified Environment
Management System, within the framework of
sustainable enterprise and safety, programs are running
which go beyond the current legal requirements.
THALES
Thales Nederland P.O. Box 42 7550 GD Hengelo,
The Netherlands. Tel: +31 74 248 3570
www.thalesgroup.com/nl
This information carrier contains propietary information which shall not be used, reproducd or disclosed to third parties without prior written
authorization by THALES NEDERLAND B.V. and/or its supplies, as applicable. Data on this sheet may be subject to change without notification.
Quality
GCC-PCB mission
Manufacturing Capabilities
Technical capabilities
The Thales Group Competence Centre-PCB (GCC-PCB)
ensures a strategically important supply chain of complex
printed Circuit Boards within the Thales Group, used for
demanding applications such as Radar and Optronics in
Land based, Naval, Airborne and Space applications.
Panel sizes
•
Rigid up to 48” x 24” [1219.2 x 609.6mm].
•
Flexible layers up to a length of 10 m
Materials
•
(Filled) epoxy glass, Polyimide glass, Ceramic
filled hydrocarbons, Cyanate esters, PTFE,
Ceramic filled PTFE, Flexible metal clad
Polyimide, LCP
Metal cores:
•
Aluminium, Be/BeO, AlSi and copper
Drilling
•
Mechanical and UV/CO2 dual-source micro via
laser drilling
Photo process
•
Laser direct Imaging
End finish:
•
ENIG, ENEPIG, HAL (PbSn), selective electrolytic
PbSn, selective electrolytic Ni and hard-or soft Au
and their possible combinations
Solder mask
•
Both Liquid or Dry Solder Mask are available
Registration
•
State-of-the-Art mechanical drilling and routing
equipment in order to fulfil demanding
registration requirements
Fine line technology
•
State-of-the-art fine-line capabilities of 50/50μm
inner layers and 75/75μm outer layers
Interconnection techniques
•
Via hole filling and over plating,
•
Z-interconnect technology
The Group Competence Center has been created in 2012
around the existing PCB activity in Hengelo founded in
1969 who since then realizes the same (corresponding)
mission within Thales Netherlands for their Radar systems.
Besides maintaining a state-of-the art production portfolio
there is a continuous effort to introduce and qualify cuttingedge innovative technologies to support the Thales Group’s
own product innovation roadmaps, but which can also be
made available to third-party customers.
Another distinguishing capability is the ability to manufacture mixed material boards on outsize panels as
large as 48” x 24” [1219.2 x 609.6mm].
Core activity:
Typical Product and Service categories
Upstream design and process development for:
Printed Circuit Boards form the backbone of advanced
electronic systems. Product categories include mixed material
multilayers, non-standard outsize panels, HDI multi layers,
strip lines, extremely long flex and flex rigid structures.
Application areas are power modules, analogue and mixed
signal boards, RF, high speed digital and antenna panels.
Small series and prototyping are particular strengths.
Services offered include:
•
•
•
•
•
•
Complex build-up requiring multiple press
and plating cycles
Mixed materials
Exceptionally large panel sizes
Any via layer interconnection
Thermal management solutions
Embedded/ buried components
The GCC-PCB’s advanced capability is demonstrated by
the pioneering development of mixed Signal, mixed
material Printed Circuit Boards, as early as 2000.
This technology, marrying digital and high frequency
layers into a single board greatly enhances functionality
and yields a significant reduction in size and weight
compared to conventional packaging technologies.
•
•
•
•
•
•
•
•
Technology- and process innovation
Consultancy
Design-for-manufacturing analysis
Engineering support
Prototyping
New product introduction
Small series production
Support with respect to technology transfer and
Sourcing
Additional features like cavities, back drilling,
embedded resistors and thermal management are also
part of the technology portfolio. Advanced AOI, flying
probe bare board testing, impedance control and cross
section analysis are used.
Organisation
The GCC-PCB consists of the departments work preparation, technology, logistics, quality management and
production. Overall, GCC-PCB employs about 50 staff
members.
The PCB facility operates as an independent company with
its own management for business to business relations,
to be in direct contact with customers. This enables us to
swiftly respond to your needs with respect to prototypes
and small series of high-end printed circuit boards.
This form of concurrent engineering, in close co-operation
with the customer, facilitates an efficient development
process and a swift transition to production. The GCC
PCB has extendedly proven to be a reliable, involved and
capable.r.