Copyright © 2011 American Scientific Publishers All rights reserved Printed in the United States of America Nanoscience and Nanotechnology Letters Vol. 3, 240–245, 2011 Study of Silicon Dioxide Nanowires Grown via Rapid Thermal Annealing of Sputtered Amorphous Carbon Films Doped with Si Feng Ji Li1 , Sam Zhang1 ∗ , Jun Hua Kong2 , and Wa Li Zhang1 1 School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore 639798, Singapore 2 School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore Silica nanowires are usually synthesized by means of vapor liquid solid method with metal catalyst introduced at the top which will unambiguously affect the excellent light emission properties of silica nanowires in optoelectronic devices and by optical signal to: sensors. In this study, silicon dioxide Delivered Ingenta nanowires without traces of catalyst areTechnological grown via rapid thermal annealing of magnetron sputtered Nanyang University amorphous carbon film doped with silicon. These high density silicon dioxide nanowires were amorIP : 155.69.4.4 phous with a length longer than Thu, 20 m and a diameter of 30–140 nm. Detailed morphology and 18 Aug 2011 06:03:16 microstructure analysis are conducted with field emission scanning electron microscopy and high resolution transmission electron microscopy. Graphitization of carbon and oxidation of silicon during rapid thermal annealing were revealed by Raman and X-ray photoelectron spectroscopy. This study indicates that high growth rate of >6 m/min of high purity silicon dioxide nanowire is possible simply by sputtering followed by rapid thermal annealing and an additional heating treatment. Keywords: Magnetron Sputtering, Rapid Thermal Annealing, SiO2 Nanowire, Oxidation. 1. INTRODUCTION With the discovery of carbon nanotubes (CNTs),1 there has been tremendous thrust on the synthesis and characterization of one-dimensional (1-D) nanostructures such as nanowires and nanorods.2–6 The use of 1-D nanostructures for optoelectronic applications is under intensive study. SiOx nanowires are reported to emit blue,7–9 red,9 green10 and ultraviolet9 light. The possible reasons for red, blue, and ultraviolet light emissions could be attributed to nonbridging oxygen hole centers, oxygen deficient centers or neutral oxygen vacancies, and peroxy linages formed in the nanowires, respectively.9 11 In conclusion, silica nanowires with these light emissions may be used as effective optoelectronic devices and optical signal humid sensors. Different processing approaches will result in different SiOx nanowire structures using different catalysts such as Ga,12 13 Pd/Au,14 Sn,15 Pt.6 16 SiOx nanowire fabricated directly from transforming the silica layer into nanowires of ∼200 nm in diameter by annealing at 1100 C in an Ar/methane flow has also been demonstrated.17 Formation of SiO2 nanowires using reactive magnetron sputtering (RMS) and rapid thermal ∗ Author to whom correspondence should be addressed. 240 Nanosci. Nanotechnol. Lett. 2011, Vol. 3, No. 2 annealing (RTA) has not been reported. Growth of SiO2 naowire by means of RTA of amorphous carbon films in argon atmosphere is demonstrated in this study. There are two major merits of RTA: inert gas protected annealing environment and the rapid heating rate. These are the requirements for SiO2 nanowires to grow, whereas impossible in normal furnace. The use of the RMS-RTA combined technique provides a straightforward, convenient and cost-effective way possible to grow large quantities and areas of SiO2 nanowire directly onto silicon wafer. This has potential applications in Si-based optoelectronic devices. 2. EXPERIMENTAL DETAILS 2.1. Film Deposition A thin nickel layer of about 30 nm was first deposited on silicon N -type (100) substrates (100 mm diameter, 475 m thickness and 0.5 nm in Rq using RF E303A magnetron sputtering system (Penta-Vacuum, Singapore). Subsequently, silicon and graphite were co-sputtered to cover the nickel layer to form the a-C:Si/Ni film on Si wafer. All the sputtering targets were 100 mm in diameter and placed 70 mm away from the substrate. The 1941-4900/2011/3/240/006 doi:10.1166/nnl.2011.1163 Li et al. Study of Silicon Dioxide Nanowires Grown via RTA of Sputtered Amorphous Carbon Films Doped with Si deposition was carried out in 0.35 Pa chamber pressure with 50 sccm argon (99.999%) gas flow at room temperature. The sputtering details are summarized as follows: On nickel (99.99%) target, RF power 150 W, sputtering time 5 min, on graphite target (99.999%), DC power 990 W, sputtering time 60 min, on silicon target (99.999%), RF power 200 W, sputtering time 60 min. The as-deposited a-C:Si/Ni film underwent rapid thermal annealing (RTA, Jipelec Jetfirst rapid thermal processor) in argon ambient at 1100 C for 180 s, at a ramping rate of 87.2 C/s, argon flow rate of 2000 sccm and chamber pressure of higher than 0.1 MPa. 2.2. Characterization Silicon a-C/Ni/Si film Fig. 1. Cross-sectional image of the as-deposited a-C:Si/Ni film. The thickness of the as-deposited film and the surface morVapor-phase synthesis is probably the most extensively phology were examined by field emission scanning elecexplored approach in formation of one-dimensional nanotron microscopy (FESEM, JEOL JBM-7600F). Structure structures such as whiskers, nanorods, and nanowires.18 In of the film was investigated with a Renishaw Raman specDelivered by Ingenta to: synthesis of the nanowire, the initial startvapor phase troscope at a wavelength of 633 nm radiation excited with Nanyang Technological University ing reactants are gas phase species. The concentrations a He-Ne laser. The microstructure of the as-grown film IP : 155.69.4.4 of the gaseous reactants must be carefully regulated for was examined by high resolution transmission electron Thu, 18 Aug 2011 06:03:16 nanowire synthesis to allow the nanowire growth mechmicroscope (HRTEM, JEOL 2010) operated at 200 kV anism to predominate and suppress secondary nucleation and X-ray photoelectron spectroscopy (XPS, Kratos) using events. Among all vapor-based methods, the formation a Kratos AXIS spectrometer with monochromatic Al K mechanism of nanowire was mostly explained by the vapor (1486.71 eV) radiation (15 kV and 10 mA) and hemiliquid solid (VLS) model in generating large quantities of spherical electron energy analyzer at a scanning step size nanowires with single crystalline structures.19 20 A typical of 0.1 eV after argon ion etching to remove surface conVLS process starts with the dissolution of gaseous reactamination. A pair of sharp stainless tweezers was used tants into nanosized liquid droplets of a catalyst metal, folto scratch off the film into a small plastic container of lowed by nucleation and growth of single-crystalline rods acetone. The container was then subjected to ultrasonic and then wires. The one-dimensional growth is induced vibration to disperse the film scraps to be scooped up with and dictated by the liquid droplets, whose sizes remain a copper grid for HRTEM study. Finally, energy dispersive essentially unchanged during the entire process of wire X-Ray spectroscopy (EDS, JEOL 2010) was used to detect growth. Each liquid droplet serves as a virtual template to the chemical composition of the as-grown nanowires after strictly limit the lateral growth of an individual wire. The heating up to 600 C in air for 10 min. establishment of the symmetry-breaking solid–liquid interface is the key step for the one-dimensional nanocrystal 3. RESULTS AND DISCUSSION growth in this process. However, in this study, it is impossible for the nickel layer to contact the vapor gas in the 3.1. Morphology chamber and act as the direct catalyst because it is covered Figure 1 shows the representative cross-sectional image by solid a-C:Si film. The XPS depth profile also showed of the as-deposited a-C:Si/Ni film. As seen, the film has no Ni 2p peaks were detected as shown in Figure 3. a thickness of about 345 nm. The low and high magnification FESEM images of the nanowires after rapid 3.2. Chemical Composition thermal annealing are shown in Figures 2(a and b). After a total of 230 min etching with etching rate of Figures 2(c and d) show the HRTEM structures of as∼1.2 nm/min on the as-deposited a-C:Si/Ni film (total grown nanowires. As seen from these images, the length of etching depth ∼276 nm is smaller than thickness of asthe as-grown amorphous nanowires is longer than 20 m. deposited a-C:Si film (∼315 nm)) and 75 min etching on The diameter of the nanowires ranges from 30 nm to the as-annealed film, the XPS depth profiling results were 140 nm. The dark end is not attributed to the nickel plotted in Figure 3. Si 2p, O 1s and C 1s varied greatly particle but to the overlapping of nanowire and the condue to RTA: before RTA, the C 1s concentration (9004 ± sequence of defocusing. The amorphous structure of the 12 at.%) was ultra high in comparison with Si 2p (521 ± as-grown nanowires was confirmed by the HRTEM and 04 at.%) and O 1s (475±097 at.%). After RTA, however, haze rings in the selected area electron diffraction (SAED) in Figure 2(d). there was a tremendous decrease in C 1s concentration Nanosci. Nanotechnol. Lett. 3, 240–245, 2011 241 Study of Silicon Dioxide Nanowires Grown via RTA of Sputtered Amorphous Carbon Films Doped with Si (a) (b) (c) (d) Li et al. Delivered by Ingenta to: Nanyang Technological University IP : 155.69.4.4 Thu, 18 Aug 2011 06:03:16 Fig. 2. (a) low magnification (b) high magnification FESEM surface morphology (c) low resolution and (d) high resolution HRTEM images with selected-area electron diffraction pattern (SAED pattern) in the inset of SiO2 nanowires grown at 1100 C for 180 s. (1833 ± 458 at.%) and sharp increase in O 1s (3409 ± 222 at.%) and Si 2p (4746 ± 349 at.%). Note that there was no Ni 2p signal detected during the whole depth profiling, indicating that Ni didn’t move during RTA process. Fig. 3. XPS depth profiling of the as-deposited and RTA-processed a-C:Si/Ni film. 242 The additional oxygen may have come from the leak of the RTA system and the residual oxygen in the reaction chamber. Even if the chamber pressure is higher than the outside atmosphere (101 × 105 Pa), a small amount of oxygen could still be introduced into the chamber. In addition, the RTA system is not a high vacuum device thus the presence of residual oxygen is unavoidable. Owing to the presence of the additional oxygen and the high temperature at annealing, the nanowire is further oxidized and finally the chemical characterization shows all Si4+ or SiO2 structure as shown in Figure 5. Surface morphology of as-grown nanowires after 600 C 10 min isothermal heating treatment is shown in Figure 4. The residual carbon was further burnt out. The EDS analysis reveals that the as-grown nanowires consist of Si and O elements in an atomic ratio of approximately 1:2 confirms that the chemical composition of the as-grown nanowire is silicon and oxygen. Moreover, lots of cracks are shown up on the nanowire surface indicating the disappearance of residual carbon and the thermal strain during the rapid thermal annealing process. Nanosci. Nanotechnol. Lett. 3, 240–245, 2011 Li et al. Study of Silicon Dioxide Nanowires Grown via RTA of Sputtered Amorphous Carbon Films Doped with Si (a) Cracks (b) Element Weight % Atomic % Compd % Formula Si K O Totals 46.74 53.26 100.00 33.33 66.67 100.00 SiO2 (c) Fig. 4. (a) Surface morphology (b) EDS spectrum and (c) Element stoichiometry analysis of as-grown SiO2 nanowire after 600 C 10 minute isothermal heating treatment. Si4+ in the film. However, after RTA, all silicon bonds have beento: completely converted to Si4+ ,21–24 indicating silDelivered by Ingenta The deconvoluted Si 2p XPS peaks for the as-deposited icon inUniversity a-C:Si/Ni film has been totally oxidized into silicon Nanyang Technological and RTA films are shown in Figure 5. Big difference dioxide. The deconvoluted C 1s XPS peaks for the asIP : in 155.69.4.4 the Si 2p was observed between the as-deposited deposited and post-RTA a-C:Si/Ni films are demonstrated Thu,and 18 postAug 2011 06:03:16 RTA films. Before RTA, there are silicon bonds Si2+ , Si3+ , in Figure 6(b).25 As seen from the plot, the sp3 /sp2 ratio changes from 0.67 to 0.52 meaning there is a conversion of sp3 C–C bonds into sp2 C C bonds during RTA process. After RTA, the Raman peak of the as-deposited a-C:Si/Ni film changed into two isolated peaks at ∼1580 cm−1 (G peak) and 1350 cm−1 (D peak) with broadened Raman cross-section, as demonstrated in Figure 7. The G peak is the stretching vibration of any pair of sp2 sites, either in C C chains or in aromatic rings characterized as the fingerprint of amorphous diamond carbon films. The D peak is related to the breathing mode of those sp2 sites only in rings, not in chains.26 The Raman spectra of the as-deposited a-C:Si/Ni film could be deconvoluted into two peaks termed D band and G band with ID as the intensity of D band and IG as the intensity of G band.27 The results indicated that annealing at 1100 C resulted in an increase in ID /IG (from 0.94 to 1.29). Though the ID /IG ratio is not a direct measure of sp3 or sp2 bonding fraction, the ID /IG ratio is inversely proportional to sp3 /sp2 ratio.28 Thus, an increase in ID /IG ratio implied a decrease in sp3 hybridization confirmed by XPS characterization where the sp3 /sp2 ratio decreased from 0.67 to 0.52 after annealing (c.f., Fig. 6(b)). The broadening of the total Raman spectra could be attributed to growing sp2 clusters and the conversion from sp3 to sp2 binding configuration. The big distinction in Raman spectra results before and after annealing has also indicated the presence of medium range order of clustering in the annealed films on a lateral length scale exceeding 1 nm.29 In principle, there might be several significant factors involved in the broadening of the G peak, namely Fig. 5. Si 2p peak deconvolution for (a) as-deposited and (b) 180 s the crystallinity and disordering, the sp2 cluster size and 1100 C RTA process a-C:Si/Ni film (The corresponding bonding con2+ 3+ 4+ figurations are Si (∼101.6 eV), Si (∼102.5 eV), Si (∼103.4 eV)). distribution, and the intrinsic stress of the film. Once the 3.3. Bonding Structure Nanosci. Nanotechnol. Lett. 3, 240–245, 2011 243 Study of Silicon Dioxide Nanowires Grown via RTA of Sputtered Amorphous Carbon Films Doped with Si Li et al. of the D peak and the conversion of bonds from C–C to C C. In addition, the disordering and increase of aromatic bonding also led the carbon signature peak to upshift as evidenced in the shifting of both D and G peaks to higher wave numbers with respect to their as-deposited peak positions (c.f., Fig. 7). 4. CONCLUSION Pure silicon dioxide nanowires (without traces of metallic catalyst) can be easily fabricated via magnetron sputtering of amorphous carbon doping with silicon followed by rapid thermal annealing. The diameter distribution of the resultant silicon dioxide nanowire is affected by the uniformity of the sputtered. In the as-deposited state, Si has all possible chemical states. During annealing, these states all converted to Si4+ . Even annealed at 1100 C, the resultant wires still remain amorphous. Delivered by Ingenta to: Acknowledgment: Nanyang Technological University This work was supported by the Ministry of Education’s Research Grant T208A1218 IP : 155.69.4.4 ARC4/08. Thu, 18 Aug 2011 06:03:16 References and Notes Fig. 6. C 1s peak deconvolution for (a) as-deposited and (b) 180 s 1100 C RTA process a-C:Si/Ni film (The corresponding bonding configurations are C–C (∼285.2 eV), C = C (∼284.6 eV), C–O (∼286.5 eV)). annealing temperature is raised to surpass a certain point, the graphitization inclination is dramatically accelerated and the crystallinity is apparently strengthened. In conclusion, the sudden huge increase of temperature of 1100 C led to a further sp2 clustering and eventual graphitization. The graphitization resulted in an increase in the intensity Fig. 7. Raman spectra of a-C:Si/Ni films before and after 180 s annealing. 244 1. S. Iijima and T. Ichihashi, Nature 363, 603 (1993). 2. X. Duan and C. M. Lieber, Adv. Mater. 12, 298 (2000). 3. H. Dai, E. W. Wong, Y. Z. Lu, S. Fan, and C. M. Lieber, Nature 375, 769 (1995). 4. W. Han, S. Fan, Q. Li, W. Liang, B. Gu, and D. Yu, Chem. Phys. Lett. 265, 374 (1997). 5. A. M. Morales and C. M. Lieber, Science 279, 208 (1998). 6. Y.-S. Lai, J.-L. 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