Equipment and services of
CEITEC BUT Core Facilities
available for 2013 call for
proposals
1. Nanolithography and
Nanofabrication
Core Facility contact: David Škoda, [email protected]
Core Facility Nanolithography and Nanofabrication and Core Facility Nanocharacterization form the
essential part of an instrumental base for materials science and advanced technology research
within the CEITEC project. To keep all related technologies and analysing methods close to each
other, the equipment of both Core Facilities is centralized into the one specially arranged laboratory.
Depending on the fabrication and analyzing process the laboratories are separated into isolated
rooms with appropriate cleanness (100 – 100 000).
Core Facilities are equipped with the wide spectrum of instruments divided to the three closely
related parts: nano/micronanolithography processes, special nano/microfabrication processes and
complex analysis of nano/microstructures (morphology, composition, structure and electrical,
magnetic, and optical properties generally).
Available instruments and techniques:
Lithography infrastructure:

Spincoater – Laurel 400 – up to 4 inch size, programmable, resist coating

Centrifuge – up to 100 ml volume, resist cleaning

Optical Microscope – Olympus MX 51 – up to 6 inch sample size, from 5x to 100x
magnification, bright and dark field option, Nomarski contrast, digital camera, sample
inspection

Spectroscopic Reflectometer – NanoCalc 2000, up to 6 inch sample size, visible to near
infrared spectral range, 200 m spot size, thin multilayer sample inspection – refractive
index, thickness

Wetbench – chemical wet etching and cleaning, lithographic process development, hot
plates, DI water, air conditioning,

Profilometer – Veeco Dektak – up to 6 inch sample size, fabricated structures and resist
height inspection

Scanning Electron Microscope – Tescan Vega – up to 2 inch sample size, 200 V - 30 kV,
sample inspection

Scanning Electron Microscope – Tescan Mira3 with an interferometric high resolution
lithographic table – up to 4 inch sample size, 200 V - 30 kV, electron beam lithography
process

Mask Photolithography – Perkin Elmer – 4 inch mask system, positive lithography process,
3 m linewidth
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Chemical and thermal processes:

QDs synthesis – synthesis of quantum dots from the liquid solution

MNPs synthesis – synthesis of magnetic nanoparticles from the liquid solution

Surface nanostructuring – anodic oxidation for nanocolumns and nanopores fabrication,
galvanic plating for nanocolumns and nanowires fabrication
Etching & Deposition:

ALD – Cambridge NanoTech Fiji 200, up to 8” sample size, capability to deposit thin films of
Al2O3, TiO2, TiN, AlN, MgO, HfO2, La2O3, Nb2O5, Ta2O5, thermal and plasma RF mode of
operation, process temperature range up to 400 °C

Ion Beam Assisted Deposition – up to 0.5 inch size, HV environment, Au, Fe, Al, Al2O3,
invar, Cu, Ti, Co, permalloy, TiO2, TiN programmable controlled deposition

Evaporation – up to 0.5 inch size, UHV environment, ultrathin films of Ga, Ge, Si, Cu, Fe, Ag,
Au, Co

Effusion cell – thermal hydrogen atom-beam source, up to 0.5 inch size, UHV environment

Thermal evaporation – Balzers – thin film deposition, liquid metal condensation principle
Packaging & Testing:

Wire Bonder Machine – TPT HB 16 wire bonder with two motorized axis, wedge bond
process, heating stage, Au wire, micro/macro electrodes contacting
Services provided:
Complete (photo)lithography process for laboratory size samples including all steps like coating,
developing, lift-off, etching, and inspection. Typical resolution:

lithographic structures (electron beam lithography, focus ion beam) up to tens of
nanometres,

photolithographic structures up to units of micrometres

anodic oxidation lithographic structures (Scanning probe microscopy technique) up to tens of
nanometres
The Core Facility Staff provides the users by training in operation of instruments, support in
experiments, and helps with data analysis.
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2. Nanocharacterisation
Core Facility contact: David Škoda, [email protected]
Available instruments and techniques:
Optical measurements:

Spectroscopic Ellipsometers – J. A. Woollam – up to 6 inch sample size, visible to middle
infrared spectral range (2 instruments), fully automated, sample optical characterisation

microRaman spectroscopy and photoluminescence with combination of SPM system – NTMDT NTegra Spectra system combined with a scanning confocal microRaman spectrometer
– independent SPM and microRaman units, reflection mode, UV+VIS+NIR lasers, white-light
laser supercontinuum source <420 nm; 2000 nm>, TERS option, information on topography
and chemical composition, and photoluminescence properties of samples

FT-IR Microscope – Bruker Vertex 80 + Hyperion 3000 – vacuum transmission reflection
system, near to middle infrared spectral range, array detector, sample optical
characterisation

Photoluminescence – up to 1 inch sample size, non-destructive optical measurement of
samples
(information
about
the
electronic
structure,
crystallinity
and
purity
of
semiconductors)

Optical spectroscopy - up to 1 inch sample size, optical characterization of samples
(dielectric properties, refractive index), from UV to FIR, reflectance, transmittance

Raman spectroscopy – Renishaw In-Via – microRaman spectroscopy, red and green laser
excitation, spectroscopic technique, study of vibrational, rotational, and other low-frequency
modes in a system (chemical composition information)

Magneto-optical Kerr effect measurement - up to 0.5 inch sample, magnetic properties of
materials (incl. magnetic anisotropy)
Microscopy / Analysis:

Scanning Near-field Optical Microscope – NTegra Solaris, fiber SPM tip systems,
transmission/reflection with illumination/collection SNOM modes, PMT detectors, information
about the sample topography and near-field light interaction

Scanning Near-field Optical Microscope – NTegra Spectra, aperture SPM tip systems,
reflection with illumination/collection SNOM modes, PMT detectors, information about the
sample topography and near-field light interaction

Scanning Near-field Optical Microscope – Nanonics MultiView 4000, fiber SPM tip systems,
transmission/reflection with illumination/collection SNOM modes, PMT and APD detectors,
information about the sample topography and near-field light interaction

Scanning Probe Microscope – Veeco AutoProbe CP-R (2 instruments) - up to 2 inch sample
size, 3D surface structure inspection up to nanometer resolution, magnetic and electrical
sample characterization
4

Scanning Probe Microscope – NTegra Prima - up to 2 inch sample size, 3D surface structure
inspection up to nanometer resolution, magnetic and electrical sample characterization

Scanning Electron Microscope –Tescan Mira II – up to 4 inch sample size, 200 V - 30 kV,
imaging at nanometre resolution, elementary analysis of organic, inorganic and biological
samples

X-ray Diffraction – Huber, Digital Instrument – up to 1 inch sample size, X-ray diffraction, Xray deflection, study of crystallinity

Coherence Controlled Holographic Microscope - Nikon A1R - transmission inverted

Confocal Microscope (inverted transmission) - Nikon A1R - confocal fluorescence, reflection
interference contrast, transmission mode

Cell cultivation instruments – Schoeller, Trigon Plus, Nikon - laboratory equipment for the cell
growth: incubator, flow-box, phase contrast imaging

Microtomographic station "v|tome|x L 240" from "GE Phoenix" (accelerating voltage up to
240kV, sample size 1-500 mm, max 50 kg weight)

Metrology SPM – Nanpositioning and Nanomeasuring system (NMM1, Sios) for SPM, optical
and tactile measurements at nanometer resolution up to the centimetre range.
Nanolithography /Nanomanipulation:

FIB/SEM system with nanomanipulators - Tescan Lyra3 XMH, system of 4 independent
nanomanipulators combined with scanning electron and ion microscopy (SEM + EBL, FIB),
up to 4 inch sample, Energy Dispersive X-ray Spectroscopy analysis, electric (4 probe)
measurement, sample modification
Electrical & magnetic measurements:

Semiconductor measurements – Keithley 4200 - V-A, C-V, resistance characteristics
In-situ Fabrication / Analysis:

Secondary Ion Mass Spectroscopy – up to 0.5 inch UHV compatible sample, surface
sensitive method, destructive elemental analysis of samples based on ion-beam sputtering
and secondary ion detection, depth resolution- tens of nanometres, smallest inspected area
below 1 cm

2
X-ray Photoelectron Spectroscopy – up to 0.5 inch UHV compatible sample, surface
sensitive method, non-destructive chemical analysis of samples based on X-ray radiation
and photoelectron detection, Mg, Al anode, smallest inspected area below 1 mm

2
Thermal Desorption Spectroscopy – up to 0.5 inch UHV compatible sample, surface
sensitive method, destructive elemental analysis of samples based on sample heating and
residual gas mass analysis

Low Energy Electron Diffraction – up to 0.5 inch UHV compatible sample, surface sensitive
method, non-destructive analysis of surface atomic structure based on low energy electron
bombardment of sample surfaces and their diffraction
5

Reflected High Energy Electron Diffraction (RHEED) – up to 0.5 inch sample size UHV
compatible, surface sensitive method, non-destructive analysis of surface atomic structure
based on high energy electron bombardment and their diffraction

Low Energy Ion Scattering – up to 0.5 inch UHV compatible sample, surface sensitive
method, elemental surface composition analysis based on interaction between incoming low
energy ions and surface particles
Services provided:
The wide spectrum of instruments enables characterisation and measurement of functional
properties of nano- and microstructures. The complex UHV apparatus (in-situ techniques) provides
preparation and in-situ analysis of surfaces, ultrathin films and nanostructures.
The Core Facility Staff provides the users by training in operation of instruments, support in
experiments, and helps with data analysis.
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3. Structural Analysis Laboratory
Core Facility contact: Ondřej Man, [email protected]
The Core Facility of Structural Analysis Laboratory is equipped with top-class instruments for
transmission and scanning microscopy, microanalysis, and X-ray diffraction analysis. The research
proceeds in close relation to the activities of the Advanced Ceramic Materials, Advanced Polymers
and Composites and Materials for Sensors and Technological Processes Control Systems research
groups.
Its priority is to focus on the study of the microstructure, submicrostructure and local
chemical analysis of new advanced ceramic and polymer materials and composites based on those
materials. Another research area is nanocrystalline thermal barrier coating prepared by thermal
spray processing and materials with ultra-fine grain obtained via SPD (Severe Plastic Deformation),
in particular by the ECAP method.
Available instruments and techniques:

X-Ray Powder diffractometer Rigaku SmartLab 3kW with attachments (high temperature
chamber up to 1600°C, low temperature chamber down to -190°C and high temperature
reactive chamber up to 900°C)

X-Ray diffractometer (with rotating Cu anode) for thin films measurements, Rigaku SmartLab
9kW with attachments (high temperature C-dome chamber up to 1100°C, software for
qualitative and quantitative analysis, crystallite size and lattice strain analysis, texture and
stress analysis, etc.).
Services provided:

Phase Identification and Structure analysis (quantitative and qualitative analysis, lattice
constants and crystal structure refinement from measurement of sample in Bragg-Brentano
(BB) geometry; precious analysis in Parallel Beam (PB) geometry)

Film thickness measurement – X-ray reflectivity (roughness, density and thickness of layers;
medium resolution in PB, high and ultra high resolution 2- and 4- bounce germanium
monochromator)

Crystal quality analysis – rocking curve and reciprocal space mapping, evaluated crystallinity
of thin film formed on substrate (medium resolution in PB, high and ultra high resolution with
2- and 4- bounce monochromator)

Texture measurement – pole figure and in-plane pole figures (preferred orientation of
sample)

Nano-structure analysis – small angle x-ray scattering (SAXS) and ultra small angle x-ray
scattering (USAXS) in transmission and reflection mode (size distribution of particles, pores,
thin films and superlattice; 1nm-1μm)
7

Residual Stress measurement - (40 x 40 x 10 mm sample)

Microdiffraction and mapping – X-ray beam focused down to area of 0.5x0.5 mm

In-situ measurements - high temperature chamber up to 1600°C (vacuum, inert gases;
powder and thin samples), low temperature chamber down to -196°C (small bulk samples),
high temperature reactive chamber up to 900°C (reactive atmosphere; small bulk samples)
The Core Facility Staff offers the users a support for the experiments, and helps with data analysis,
provides the training courses for chosen instruments.
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Overview of technologies and equipment of CEITEC BUT within CEITEC open access project
Core Facility
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Technology
Lithography
Lithography
Lithography
Lithography
Lithography
Lithography
Lithography
Lithography
Lithography
Microscopy/Analysis
Microscopy/Analysis
Microscopy/Analysis
Microscopy/Analysis
Microscopy/Analysis
Microscopy/Analysis
Microscopy/Analysis
Microscopy/Analysis
Microscopy/Analysis
Microscopy/Analysis
Microscopy/Analysis
Microscopy/Analysis
Microscopy/Analysis
Microscopy/Analysis
Microscopy/Analysis
Microscopy/Analysis
Nanofabrication/Nanomanipulation
Nanofabrication/Nanomanipulation
Chemical and thermal processes
Chemical and thermal processes
Equipment
Optical Microscope
Spectroscopic Reflectometer
Scanning Electron Microscope/e-beam writer
Scanning Electron Microscope/e-beam writer
Spincoater
Centrifuge
wetbench
Profilometer
Mask Photolithography
Scanning probe microscope (AFM)
Scanning probe microscope (AFM)
Scanning probe microscope (AFM)
Metrology Scanning Probe Microscope
Scanning Near-Field Optical Microscope
Scanning Near-Field Optical Microscope
Scanning Near-Field Optical Microscope
Coherence Controled Holographic Microscope
Confocal Microscope
cell cultivation instruments
X-ray diffractometer
X-ray diffractometer
X-ray reflection
X-ray reflection
X-ray microtomographic station
Scanning Electron Microscope
Focused Ion Beam/Scanning Electron Microscope DualBeam™
Focused Ion Beam/Scanning Probe Microscope
quantum dots synthesis
magnetic nanoparticles synthesis
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Chemical and thermal processes
surface nanostructuring
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Etching and Deposition
Etching and Deposition
Etching and Deposition
Etching and Deposition
Etching and Deposition
Packaging and Testing
Optical measurements
Optical measurements
Optical measurements
Optical measurements
Optical measurements
Optical measurements
Optical measurements
Optical measurements
Optical measurements
Electromagnetic measurements
In-situ Fabrication/Analysis
In-situ Fabrication/Analysis
In-situ Fabrication/Analysis
In-situ Fabrication/Analysis
In-situ Fabrication/Analysis
In-situ Fabrication/Analysis
Ion Beam Assisted Deposition
Evaporation
Effusion cell
Thermal evaporation
Atomic Layer Deposition
Wire bonder Machine
NIR/VIS/UV (VUV) spectroscopic ellipsometers
NIR/VIS/UV/(VUV) spectrometers
TERS+microRAMAN+photoluminiscence
Vacuum FTIR, microscope, accessories
Magneto-optical Kerr effect measurement
Ellipsometry
Photoluminescence
Optical spectroscopy
microRaman spectroscopy
Semiconductor measurements
Secondary Ion Mass Spectroscopy
X-ray Photoelectron Spectroscopy
Thermal Desorption Spectroscopy
Low Energy Electron Diffraction
Reflected High Energy Electron Diffraction
Low Energy Ion Scattering
Specification
Olympus MX 51
SAFIBRA NanoCalc 2000
Tescan Mira3
Tescan Vega
Laurel 400
Veeco Dektak
Perkin Elmer
NTegra Prima
Veeco AutoProbe CP-R
Veeco AutoProbe CP-R
Sios
NT-MDT NTegra Spectra
NT-MDT NTegra Solaris
Nanonics MV 4000
CCHM
Nikon A1R
Schoeller, Trigon Plus, Nikon
Rigaku SmartLab 3kW
Rigaku SmartLab 9kW
Huber
Digital Instrument
GE Phoenix v|tome|x L 240
Tescan Mira II
FEI Quanta 3D 200i
TESCAN LYRA 3 XMH
synthesis of quantum dots from the liquid solution
synthesis of magnetic nanoparticles from the liquid solution
anodic oxidation for nanocolumns and nanopores fabrication,
galvanic plating for nanocolumns and nanowires fabrication
Au, Fe, Al, Al2O3, invar, Cu, Ti, Co, permalloy, TiO2, TiN, HV
environment
ultrathin film of Ga, Ge, Si, Cu, Fe, Ag, Au, Co, UHV environment
thermal atom hydrogen source, UHV environment
Balzers - thin layer deposition, liquid metal condensation principle
Cambridge NanoTech Fiji 200
TPT HB16
J. A. Woollam
Bruker
NT-MDT NTegra Spectra
Bruker Vertex80v + Hyperion 3000
UV to NIR wavelength range, from room temperature to 400°C
Renishaw In-Via
Keithley 4200