Advanced Bonding Application
SPT PART NUMBER RECOMMENDATION : ULTRA FINE PITCH ≤ 50µm BPP
VER. 1/08-1
Bond Pad Pitch
µm
Useable
Wire Diameter
µm
H
µm
CD
µm
FA
°
T
µm
Recommended SPT Part Number
50
23
28
33
11
63
PI-28063-331F-ZP34T
20
25
30
11
63
PI-25063-301F-ZP34T
18
23
28
11
63
PI-23063-281F-ZP34T
20
25
29
11
55
PI-25055-291F-ZP34T
18
23
29
11
55
PI-23055-291F-ZP34T
18
22
27
11
50
PI-22050-271F-ZP34T
15
19
26
11
50
PI-19050-261F-ZP34T
35
15
19
23
11
45
PI-19045-231F-ZP34T
30
12
15
18
11
38
PI-15038-181F-ZP34T
25
10
15
18
11
35
PI-15035-181F-ZP34T
45
40