Magnetic anisotropy in antiferromagnetic layers affecting exchange bias of Ni-Fe/Mn-Ir bilayers 著者 journal or publication title volume number page range year URL 角田 匡清 Journal of applied physics 87 9 4930-4932 2000 http://hdl.handle.net/10097/35368 doi: 10.1063/1.373206 JOURNAL OF APPLIED PHYSICS VOLUME 87, NUMBER 9 1 MAY 2000 Magnetic anisotropy in antiferromagnetic layers affecting exchange bias of Ni–FeÕMn–Ir bilayers Kojiro Yagami,a) Masakiyo Tsunoda, and Migaku Takahashib) Department of Electronic Engineering, Tohoku University, Sendai 980-8579, Japan The magnetic anisotropy of antiferromagnetic layers (K AF) was estimated for Ni–Fe 50 Å/Mn–Ir cr ⫽J Ks /K AF), where J Ks is the saturation value of the d AF bilayers using Mauri’s method (d AF unidirectional anisotropy constant (J K ). The critical thickness of the antiferromagnetic layers cr ), at which J K took half the value of J Ks , was determined from the dependence of J K on d AF . (d AF cr was found to be almost constant (35⫾2 Å) independent of J Ks . Thus, the relation of J Ks The d AF ⬀K AF was derived, suggesting that the variation in J Ks is due to a change in the value of K AF . J Ks , however, was found to vary considerably for various Mn–Ir films possessing an almost identical Ir content, and thus probably the same value of K AF . In addition, studies by x-ray diffraction, transmission electron microscopy, and electron diffraction revealed that the change in J Ks was independent of the microstructure and phase of the antiferromagnetic 共AF兲 Mn–Ir films, both of which control K AF . Thus, J Ks was found to be independent of K AF contradicting the relation, J Ks ⬀K AF . This contradiction results from the assumption by Mauri that the coupling energy 共J兲 is equal to J Ks even in the polycrystalline exchange-coupled bilayers. A model that took account of the distribution of K AF axes of AF grains in the plane of the AF film successfully explained the behavior of J K . J Ks was found to change independent of both J and K AF , and furthermore, it has been shown that the dependence of J Ks on the sputtering conditions for Mn–Ir films is probably due to the effective temperature of the films during deposition. © 2000 American Institute of Physics. 关S0021-8979共00兲35908-4兴 I. INTRODUCTION in a range of values of J K . K AF was estimated from the dependence of J K on d AF using Mauri’s method10 for polycrystalline exchange-coupled bilayers. The suitability of this method was examined in connection with the microstructure of the AF layers. It is quite important to improve the reliability of the dynamic response of spin valve heads to external magnetic fields. One method is to enhance the exchange field 共⬀ the unidirectional anisotropy constant, J K 兲 between the ferromagnetic 共F兲 layer and the adjacent antiferromagnetic 共AF兲 layer. Mn–Ir is a promising candidate for the AF layer of spin valve heads, because it induces the strong exchange field, even when the AF layer is very thin,1–5 and the corrosion resistance of Mn–Ir is acceptable.6 The present authors have studied the relation between J K and sputtering conditions for Mn–Ir films using Ni–Fe/Mn–Ir bilayers.1 The films were fabricated in an ultraclean atmosphere, because impurities present in the atmosphere may change the microstructure or the magnetic properties of the films.7–9 As a result, it was found that J K increased monotonously with increasing Ir content and decreasing deposition rate.1 However, x-ray diffraction revealed no remarkable changes in the microstructure of Mn–Ir films corresponding to the variation in J K . 1 This work failed to address the origin of the change in J K . It is generally accepted that J K changes due to a change in the magnetic anisotropy of the AF layer (K AF), the coupling energy between F/AF layers 共J兲, etc. Thus, the experimental evaluation of K AF should reveal further information about the origin of the change in J K . In the present study, Ni–Fe 50 Å/Mn–Ir d AF bilayers were fabricated under typical sputtering conditions resulting II. EXPERIMENTAL PROCEDURE Multilayers with the substrate/Ta 50 Å/Ni–Fe 50 Å/Mn–Ir d AF /Ta 50 Å were fabricated on thermally oxidized Si wafers using the extremely clean sputtering process.7,8 A magnetic field of 30 Oe was applied parallel to the film plane during deposition. The substrates were displaced 200 mm from the 4 in. sputtering targets. Seventeen at. % Ir–Mn alloy targets were used. Twelve Ir chips 共size 5⫻5 mm, purity 99.9%兲 were arranged on the target surface. The sputtering conditions for the Ni–Fe films were fixed at 0.75 mTorr and 300 W for the gas pressure and the applied power, respectively. Those for Mn–Ir films were changed as shown in Table I. Five typical conditions 共a兲–共e兲 were chosen to obtain various saturation value of J K (J Ks ) for each of the Ni–Fe/Mn–Ir bilayers.1 The resultant deposition rate and Ir content of the Mn–Ir films is shown in Table I as well. Conditions 共a兲 and 共b兲 were selected, as they had very different Ir content, but a similar deposition rate. On the other hand, conditions 共c兲 and 共d兲 were selected, as they had a very different deposition rate, but similar Ir content. J Ks reached the maximum when the Mn–Ir film was fabricated under condition 共e兲 in the examined range of the deposition rate 共0.04–2.6 Å/s兲 and Ir content 共8–32 at. %兲.1 a兲 Permanent address: MSCo., CNC, SONY Corp., Tagajyo 985-0842, Japan. Author to whom correspondence should be addressed; electronic mail: [email protected] b兲 0021-8979/2000/87(9)/4930/3/$17.00 4930 © 2000 American Institute of Physics Downloaded 28 Oct 2008 to 130.34.135.83. Redistribution subject to AIP license or copyright; see http://jap.aip.org/jap/copyright.jsp J. Appl. Phys., Vol. 87, No. 9, 1 May 2000 Yagami, Tsunoda, and Takahashi 4931 TABLE I. Sputtering conditions of Mn–Ir films. 共a兲 共b兲 共c兲 共d兲 共e兲 Gas pressure 共mTorr兲 Power 共W兲 Depo rate 共Å/s兲 Ir content 共at. %兲 1 10 1 10 20 50 100 200 30 50 0.49 0.47 2.59 0.04 0.06 9.0 26.9 15.6 15.4 25.1 The microstructural analysis and the identification of the phase of the Mn–Ir films were made by electron diffraction, transmission electron microscopy 共TEM兲, and x-ray diffraction 共XRD兲 with Co K ␣ source. M-H loops were measured with a vibrating sample magnetometer 共VSM兲. The measurements were carried out on the as-deposited samples at room temperature. J K was calculated using M s •d F •H ex , where M s is the saturation magnetization of Ni–Fe films, d F is the thickness of Ni–Fe films, and H ex is the exchange-coupling field determined from the shift of the center of the M-H loop along the field axis. III. RESULTS AND DISCUSSION cr FIG. 2. The critical thickness of the AF layer, d AF , as a function of the saturation value of J K (J Ks ). change in K AF induces a change in J Ks . The difference in K AF for the Mn–Ir films fabricated under various sputtering conditions is now considered. J Ks for conditions 共c兲 and 共d兲 differ by a factor of 2. According to the above result, it is expected that K AF will also differ by this amount. The Ir content of these two samples is, however, almost the same 共⬃15.5 at. %兲 as shown in Table I. Thus, other physical factors besides Ir content, such as a microstructure, were investigated for the variation of K AF . A. Dependence of J K on thickness of Mn–Ir films Figure 1 shows the dependence of J K on d AF . When the Mn–Ir films were fabricated under condition 共e兲, J K rises sharply at d AF⫽30 Å, and becomes almost constant 共0.14 erg/cm2兲 at d AF⭓50 Å. Using Mauri’s method,10 the critical cr ) was determined to be 37 Å, thickness of the AF layer (d AF cr where d AF is defined as the value of d AF at which J K took cr was determined half of its saturation value. The value of d AF in the same manner for the other films. Figure 2 shows the cr as a function of the saturation value of change of d AF s J K (J K ). Here, J Ks is defined as the value of J K at d AF ⫽100 Å. The sputtering conditions for points 共a兲–共e兲 are cr has approximately the listed in Table I. It is clear that d AF same value, 35⫾2 Å, for conditions 共a兲–共e兲, even though the deposition rate and Ir content of the Mn–Ir films fabricated under these conditions is quite different. Taking account of cr ⫽J Ks /K AF , derived by Mauri et al.,10,11 the the formula, d AF data in Fig. 2 imply that J Ks is proportional to K AF , namely a FIG. 1. Dependence of J K on d AF for as-deposited Ni–Fe 50 Å/Mn–Ir d AF bilayers fabricated under the various sputtering conditions for Mn–Ir films listed in Table I. B. Structural analysis The microstructure and the phase of the AF layers were investigated. The Mn–Ir 共111兲 planes were found to be highly oriented parallel to the film plane.1 No remarkable differences were detected between the microstructure of the Mn–Ir films fabricated under conditions 共c兲 and 共d兲, by both XRD analysis1 and observation of the film cross section by TEM. K AF is expected to change when the ordered phase Mn3Ir12 appears in disordered Mn–Ir. Electron diffraction analysis was carried out for 200 Å Mn–Ir films fabricated on Ta 50 Å/Ni–Fe 50 Å underlayers under conditions 共c兲 and 共d兲. Figure 3 shows a TEM plane view and an electron diffraction pattern for the Mn–Ir film fabricated under condition 共d兲. This figure reveals Mn–Ir grains 100–200 Å in diameter. They have no preferred orientation in the film plane 共the sheet texture is random in two dimensions兲. The detected diffraction rings of Mn–Ir were identified as corresponding to the 共220兲, 共422兲, and 共440兲 planes, all of which are fundamental. Superlattice lines 关e.g., 共110兲兴 were not detected. This indicates the absence of the ordered phase. The same results were obtained for the Mn–Ir films fabricated under condition 共c兲. These results imply that there is little difference in the microstructure and phase of the Mn–Ir films, upon which changes in K AF are expected to be dependent. Consequently, it is assured that J Ks changed independently of K AF , contradicting the relation, J Ks ⬀K AF . This contradiction is a result of the assumption by Mauri that regarded J as being equal to J Ks . J⫽J Ks is true only when both the magnetization of the F layer and that of the AF layer are treated as being homogeneous. In the actual polycrystalline bilayers, however, it is impossible to regard the magnetization of the AF layer as such. Downloaded 28 Oct 2008 to 130.34.135.83. Redistribution subject to AIP license or copyright; see http://jap.aip.org/jap/copyright.jsp 4932 J. Appl. Phys., Vol. 87, No. 9, 1 May 2000 FIG. 3. 共a兲 TEM plane view and 共b兲 electron diffraction pattern of a 200 Å thick Mn–Ir film fabricated on a Ta 50 Å/Ni–Fe 50 Å underlayer. Ni–Fe and Mn–Ir 共111兲 planes are oriented highly parallel to the film plane. The Mn–Ir film was fabricated under condition 共d兲. The incident electron beam is perpendicular to the 共111兲 plane of the Mn–Ir film. All of the diffraction rings for Mn–Ir are assigned to fundamental lines 共f 兲. C. Effect of the distribution of K AF axes on J K As shown in Fig. 3, the crystallographic axes of the AF grains are randomly oriented in the film plane. It is followed naturally that the magnetic anisotropy of the AF layer originates in the magnetocrystalline anisotropy of AF grains. The AF layer in the polycrystalline F/AF bilayer, therefore, should be treated as an aggregate of AF grains whose magnetic anisotropy axes are distributed in the film plane 共single spin ensemble model13兲. Based up on this model, it is possible to calculate the dependence of J K on d AF . Figure 4 shows the change of J K /J as a function of K AFd AF /J for various values of JS/kT, where k is Boltzmann’s constant, T is the temperature at which the magnetic states of AF grains, concerning their spin alignments, attained thermal equilibrium, S is the contact area of each AF grain with the F layer, regarded as a constant for all AF grains. When JS/kT⫽⬁, J K /J exhibits a sharp rise at K AFd AF /J⫽1, and is almost saturated at K AFd AF /J⭓5. The saturation value, J Ks , decreases with decreasing JS/kT. This figure reveals that the value of J Ks for the polycrystalline F/AF bilayers changes independently of the microstructure of the AF layers or the intrinsic physical quantities, such as K AF and J. Prior to comparing the results of this model to the experimental data shown in Fig. 1, the meaning of the parameter JS/kT is FIG. 4. J K calculated as a function of K AF d AF for various JS/kT, based upon the single spin ensemble model 共see Ref. 13兲. All values are normalized to J. Yagami, Tsunoda, and Takahashi FIG. 5. Cross sectional TEM image. The 100-Å thick Mn–Ir film was fabricated under condition 共a兲, growing epitaxially on the 50-Å thick Ni–Fe film. considered, provided that K AF and J are constant. S is also constant for all the samples fabricated under the various sputtering conditions. This is because the Mn–Ir grains grew by epitaxy on the Ta/Ni–Fe underlayer which was fabricated under the same conditions. The epitaxial growth of the Mn–Ir films on Ni–Fe films was confirmed by TEM cross sectional analysis 共Fig. 5兲. Consequently, the parameter JS/kT only reflects a variation in T. Regarding T as the effective temperature of the films during the deposition process, it is possible to explain qualitatively the dependence of J Ks up on the sputtering conditions for the Mn–Ir films: J Ks increased with increasing sputtering gas pressure and decreasing applied power.1 Both of these sputtering conditions decrease the kinetic energy of sputtering atoms incident on the substrate. As a result, the temperature of the films during the deposition process decreased, thus increasing JS/kT. J Ks thereby increased. In conclusion, the dependence of J K on d AF for polycrystalline Ni–Fe/Mn–Ir bilayers fabricated under various sputtering conditions is explained qualitatively by a model that takes into account the distribution of the K AF axes of the AF grains within the film plane. 1 K. Yagami, M. Tsunoda, S. Sugano, and M. Takahashi, IEEE Trans. Magn. 35, 3919 共1999兲. There were some mistakes about Ir content in this paper. An error term is to be issued. In the present work, correct Ir content is used. 2 K. Hoshino, R. Nakatani, H. Hoshiya, Y. Sugita, and S. Tsunashima, Jpn. J. Appl. Phys. Part 1 35, 607 共1996兲. 3 H. N. Fuke, K. Saito, Y. Kamiguchi, H. Iwasaki, and M. Sahashi, J. Appl. Phys. 81, 4004 共1997兲. 4 A. J. Devasahayam, P. J. Sides, and M. H. Kryder, J. Appl. Phys. 83, 7216 共1998兲. 5 A. J. Devasahayam and M. H. Kryder, IEEE Trans. Magn. 35, 649 共1999兲. 6 M. Lederman, IEEE Trans. Magn. 35, 794 共1999兲. 7 M. Takahashi, A. Kikuchi, and S. Kawakita, IEEE Trans. Magn. 33, 2938 共1997兲. 8 K. Okuyama, T. Shimatsu, S. Kuji, and M. Takahashi, IEEE Trans. Magn. 31, 3838 共1995兲. 9 M. Tsunoda, K. Uneyama, T. Suzuki, K. Yagami, and M. Takahashi, J. Appl. Phys. 85, 4919 共1999兲. 10 D. Mauri, E. Kay, D. Scholl, and J. K. Howard, J. Appl. Phys. 62, 2929 共1987兲. 11 W. H. Meiklejhon, J. Appl. Phys. 33, 1328 共1962兲. 12 T. Yamaoka, J. Phys. Soc. Jpn. 36, 445 共1974兲. 13 M. Tsunoda and M. Takahashi, J. Appl. Phys. 共these proceedings兲. Downloaded 28 Oct 2008 to 130.34.135.83. Redistribution subject to AIP license or copyright; see http://jap.aip.org/jap/copyright.jsp
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