Thermal Conductive Fillers Brochure
Showa Denko K.K.
Ceramics Division
Issued ：7/18/2013
Thermal Conductive fillers Lineup
Showa Denko K.K.
 Showa Denko manufactures several kinds of Alumina and Hexagonal Boron Nitride. These have excellent
characteristics for rubber and resin-based thermal conductive fillers.
Low-soda Alumina (AL Series)
The AL series is α-alumina which has reduced soda content, controlled by our proprietary technology. The AL series has
several ultimate crystal sizes, shapes, and particle size distributions in production. Extra fine alumina particles are used
as an ingredient in resins alongside coarse ingredients.
Roundish Alumina (AS Series)
The AS series is a single-grain corundum with less crystal edges. Since the AS series has a large particle diameter and
broad particle size distribution, it excels at filling resin and producing compounds with low viscosity and good fluidity.
Spherical Alumina (Alunabeads™ CB Series)
Alunabeads™, also known as our CB series, is a spherical single-grained alumina. Alunabeads™ has similar
characteristics to the AS series. CB produces compounds with high filling rates and good viscosity. The CB series has
various particle sizes and particle distributions available.
Hexagonal Boron Nitride (SHOBN™ UHP Series)
SHOBN™, our UHP series is a high purity crystalized Hexagonal Boron Nitride. SHOBN™ has excellent thermal
conductivity, high thermal stability, corrosion resistance, and good electrical characteristics (high electrical insulation,
low dielectric constant). The UHP series is used for high heat radiation applications which require electrical insulation.
1μ ｍ
Low-soda (AL series)
Spherical CB Series
(Alunabeads™)
Roundish (AS series)
Hexagonal Boron Nitride
(UHP series)
Comparison of thermal filler properties
Filler
Shape
Mean particle size
Low soda Alumina (AL series)
Polygonal
0.5～5 μm
Flexibility、Low impurity (soda) property
Roundish Alumina (AS series)
Roundish
9～44 μm
High filling、High purity、Low abrasion、High fluidity
Spherical Alumina
(Alunabeads™ CB )
Spherical
2～71 μm
High filling、high purity、Low abrasion、High fluidity
Platelets
0.2～12 μm
Agglomerates
‐
Hexagonal Boron
Nitride( UHP series)
Features (filler or compound property)
Low specific gravity、Low abrasion、Electrical insulation、Low
dielectric constant, Thermal and Chemical stability
Platelets properties + High loading and High density
Application examples
 Thermal interface products (Sheets, Greases, Adhesives), IC circuits, etc., as an additive to various thermosetting,
thermoplastic resins, rubbers, etc.
 SHOWA DENKO K.K. has several Aluminum Hydroxide and Alumina products for thermal filler applications besides the
products in this documents. Please contact us for more information.
※The data shown above are representative figures. They are not guaranteed values.
SHOWA DENKO K.K. Ceramics Division , Marketing Department Ⅱ, Thermal Filler Group
13-9, Shiba daimon 1 Chome, Minato-ku, Tokyo 105-8518 JAPAN
TEL: +81-3-5470-3434 FAX: +81-3-3431-6924
Low-soda Alumina (AL series)
Showa Denko K.K.
Typical properties of common grades
Normal soda
type
Low-soda type
Grade
AL-47-H
AL-47-1
AL-160SG-3
AL-43-BE
A-42-2
Chemical composition
L.O.I. ※1
%
0.08
0.14
0.21
0.43
0.15
0.14
Fe2O3
%
0.02
0.01
0.01
0.01
0.01
0.01
SiO2
%
0.02
0.01
0.01
0.02
0.01
0.01
Na2O
%
0.03
0.05
0.05
0.06
0.03
0.27
MgO
%
‐
‐
‐
0.05
‐
‐
Al2O3
%
99.85
99.79
99.72
99.43
99.79
99.57
μm
4.6
2.1
0.9
0.5
1.9
4.7
m2/g
1.0
1.8
3.1
6.4
2.1
1.1
Loosed
g/cm3
1.4
0.8
0.9
0.7
0.7
0.8
Tapped
g/cm3
2.1
1.4
1.3
1.1
1.1
1.4
) ※2
Mean Particle Size(d50
BET Specific Surface Area
Bulk
Density
AL-43-KT
※1 Loss On Ignition
※2 LASER DIFFRACTION AND SCATTERING METHOD ANALYZER
Particle Size distribution
Properties
1. The AL series is α-alumina which has reduced soda
content. The AL series has several ultimate crystal sizes,
shapes, and distributions in production.
Cumulative weight (%)
100
80
2. Extra fine alumina particles are used as an ingredient
in resins alongside coarse ingredients.
60
3. AL-43-BE is an suitable grade which cuts coarse
particles. It is suitable for thin film applications.
40
※LASER DIFFRACTION
AND SCATTERING
METHOD ANALYZER
20
4. Showa Denko also has standard soda content grade
such as A-42-2.
0
0.1
1
10
Particle size (μm)
100
SEM images
AL-43-KT
AL-47-H
AL-160SG-3
※The data shown above are representative figures. They are not guaranteed values.
SHOWA DENKO K.K. Ceramics Division , Marketing Department Ⅱ, Thermal Filler Group
13-9, Shiba daimon 1 Chome, Minato-ku, Tokyo 105-8518 JAPAN
TEL: +81-3-5470-3434 FAX: +81-3-3431-6924
Roundish Alumina (AS series)
Showa Denko K.K.
Typical properties of common grades
Grade
AS-05
AS-10
AS-20
AS-30
AS-40
AS-50
AS-400
Chemical Composition
L.O.I※1
%
0.07
0.05
0.07
0.09
0.13
0.18
0.09
Fe2O3
%
0.04
0.04
0.06
0.07
0.06
0.05
0.02
SiO2
%
0.02
0.05
0.06
0.06
0.06
0.06
0.03
Na2O
%
0.03
0.03
0.03
0.03
0.04
0.03
0.03
Na+※2
ppm
2
3
3
3
50
7
32
Cl-※2
ppm
＜1
1
1
1
2
1
1
Al2O3
%
99.85
99.83
99.78
99.75
99.71
99.68
99.87
44
39
22
18
12
9
13
Mean Particle Size
(d50) ※3
μm
BET Specific Surface area
m2/g
0.5
0.5
0.8
1.0
1.2
1.9
1.2
Loosed
g/cm3
1.9
1.8
1.8
1.6
1.5
1.5
1.4
Tapped
g/cm3
2.5
2.4
2.4
2.2
2.1
2.0
2.0
Electric Conductivity※4
μS/cm
2
3
4
5
31
11
29
Bulk
Density
※1 Loss On Ignition ※2 Warm water extraction (100℃, 2Hr) ※3 LASER DIFFRACTION AND SCATTERING METHOD ANALYZER ※4 20g/100ml purified water
Properties
Particle Size Distribution
Cumulative weight (%)
100
1. Since the AS series has large particle sizes and broad
particle size distributions, AS series is capable of high
filling density in various resins.
80
2. The AS series is suitable as a thermal filler since it
has a roundish shape. Additionally the contact area
between particles is broad, allowing a high filling density.
60
40
3. AS-400 is a grade specifically designed for achieving
higher filling rates in resins.
※LASER DIFFRACTION
AND SCATTERING
METHOD ANALYZER
20
0
0.1
1
10
100
1000
Particle size (μm)
SEM images
25μ m
AS-10
10μ m
AS-40
※The data shown above are representative figures. They are not guaranteed values.
SHOWA DENKO K.K. Ceramics Division , Marketing Department Ⅱ, Thermal Filler Group
13-9, Shiba daimon 1 Chome, Minato-ku, Tokyo 105-8518 JAPAN
TEL: +81-3-5470-3434 FAX: +81-3-3431-6924
Spherical Alumina (Alunabeads™ CB Series )
Showa Denko K.K.
Typical properties of common grades
Grade
CB
-P02
CB
-P05
CB
-P07
CB
-P10
CB
-P15
CB
-P40
CBA20S
CBA30S
CB
-A40
CBA50S
CB
-A70
%
0.06
0.05
0.07
0.05
0.04
0.05
0.03
0.03
0.02
0.02
0.02
Fe2O3
%
0.04
0.02
0.01
0.01
0.02
0.01
0.01
0.01
0.01
0.01
0.02
SiO2
%
0.06
0.03
0.02
0.02
0.06
0.01
0.02
0.01
0.05
0.04
0.01
Na2O
%
0.02
0.01
0.19
0.07
0.06
0.07
0.03
0.01
0.01
0.01
0.06
Na+※2
ppm
5
4
17
5
6
20
10
8
7
6
30
Al2O3
%
99.82
99.89
99.71
99.85
99.82
99.86
99.91
99.94
99.91
99.92
99.89
Mean Particle Size(d50)
※3
μm
2
4
7
8
16
44
21
28
40
50
71
BET Specific Surface
Area
m2/g
1.1
0.7
0.6
0.6
0.3
0.2
0.2
0.2
0.2
0.1
0.1
Loosed
g/cm3
1.1
1.3
1.5
1.7
1.7
2.2
2.1
2.1
2.2
2.1
2.1
Tapped
g/cm3
1.9
2.2
2.4
2.5
2.5
2.5
2.3
2.3
2.3
2.3
2.4
Conductivity※4
μS/cm
8
9
11
6
8
74
7
6
7
4
24
Chemical Composition
L.O.I※1
Bulk
Density
Electric
※1 Loss On Ignition ※2 Warm water extraction (95℃, 5Hr) ※3 Coulter counter method ※4 20g/200ml purified water
Particle Size Distribution
Properties
100
1. Alunabeads™ has the proper features for high filling
into resin because of its spherical shape. It is especially
suitable for applications which require high fluidity.
Cumulative weight (%)
※
Coulter
counter
method
80
2. CB-A20S and CB-A50S grades have a sharp particle
size distribution, while CB-A40, CB-A70, CB-P02, and CBP40 grades have a broad particle size distribution.
60
40
3. Alunabeads™ (CB Series) has good properties for
special abrasives in addition to insulation and thermal
filler applications.
20
0
1
10
Particle Size (μm)
100
SEM images
CB-P40
CB-A20S
※The data shown above are representative figures. They are not guaranteed values.
SHOWA DENKO K.K. Ceramics Division , Marketing Department Ⅱ, Thermal Filler Group
13-9, Shiba daimon 1 Chome, Minato-ku, Tokyo 105-8518 JAPAN
TEL: +81-3-5470-3434 FAX: +81-3-3431-6924
Hexagonal Boron Nitride (SHOBN™ UHP Series)
Showa Denko K.K.
Typical properties of common grades
Shape
Platelet Type
Grade
Agglomerated Type
UHP-S1
UHP-1K
UHP-2
UHP-EX
%
0.17
0.03
0.04
0.37
CaO
%
0.02
0.01
0.02
0.48
C
%
0.02
0.02
0.02
0.01
BN
%
99.8
99.9
99.9
99.1
(d50) ※1
μm
0.5
8
11
‐
BET Specific Surface Area
m2/g
10-15
3-5
3-5
3-5
Bulk Density (Vibration)
g/cm3
0.35
0.22
0.30
0.71
Chemical
Composition
B2O3
Mean Particle size
※1 LASER DIFFRACTION AND SCATTERING METHOD ANALYZER
Particle size distribution: Platelet Type
Properties
Cumulative weight (%)
100
1. SHOBN™, our UHP Series, offers superior thermal
conductivity, high thermal stability, corrosion resistance,
and strong electrical characteristics ( high electrical
insulation, low dielectric constant ).
80
60
40
2. SHOBN™ has 2 different particle types, Platelet type
and Agglomerated type.
※LASER
DIFFRACTION
& SCATTERING
METHOD
ANALYZER
20
3. SHOBN™ UHP is suitable for applications which require
lubricity and mold-release efficiency.
0
0.1
1
10
100
Particle size (μm)
Particle size distribution: Agglomerated Type
Cumulative
weight (%)
106μm
75μm
53μm
45μm
38μm
UHP-EX (-75μm)
0
2
17
23
27
※Sieve method
※Top size of sieve mesh can be adjusted according to customer request.
SEM images
1μm
10μm
UHP-S1
UHP-1K
10μm
UHP-2
※The data shown above are representative figures. They are not guaranteed values.
SHOWA DENKO K.K. Ceramics Division , Marketing Department Ⅱ, Thermal Filler Group
13-9, Shiba daimon 1 Chome, Minato-ku, Tokyo 105-8518 JAPAN
TEL: +81-3-5470-3434 FAX: +81-3-3431-6924
Comparison of fillers
Showa Denko K.K.
Basic properties
SiO2
Fillers
Al2O3
Crystal
h-BN
AlN
BeO
MgO
Crystalline
Fused
Hexagonal
Hexagonal
Hexagonal
Hexagonal
Cubic
Trigonal
Amorphous
Density
g/㎝3
3.98
2.27
3.27
3.02
3.58
2.65
2.21
Specific heat
(Room
temperature)
J/kg ・℃
750
810
700
1090
960
740
770
CTE
×10-6/ ℃
6
1
4.5
6.4
13
15
0.5
Volume
Resistivity
Ω/cm
1015
1014
＞1014
＞1014
1017
1015
＞1017
Dielectric
constant
‐
8.5
3.6~4.2
8.5
‐
‐
‐
‐
Hardness
Mohs
9
2
8
9
5.5
7
7
hydrophilic
toxicity
Notes
Thermal conductivity
Material
Thermal
conductivity
(W/m ・ k)
Notes
Diamond
(C)
2000
Silicon
Carbide
(SiC)
270
Semiconduction
Beryllia
(BeO)
250
Aluminum
Nitride
(AlN)
70～270
Hexagonal
Boron
Nitride
(h-BN)
①＞200
② 60
Silicon
Nitride
Magnesium
Oxide
(Si3N4)
30～80
Silica
(MgO)
Aluminum
Oxide
(Al2O3)
Crystalline
Fused
40
20~36
10
1.3
(SiO2)
① Both
direction
Toxicity
②
Compact
W/m・k
Source; TECHNICAL INFORMATION INSTITUTE.CO.LTD
※The data shown above are representative figures. They are not guaranteed values.
SHOWA DENKO K.K. Ceramics Division , Marketing Department Ⅱ, Thermal Filler Group
13-9, Shiba daimon 1 Chome, Minato-ku, Tokyo 105-8518 JAPAN
TEL: +81-3-5470-3434 FAX: +81-3-3431-6924