Artemis-Eniac-Eposs merge: A new
opportunity
Juha-Pekka Soininen
VTT Technical Research Centre of Finland
27/05/2013
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The European ‘‘ valley of death ’’
Knowledge
Market
The valley of death
From Gabriel Crean’s presentation
in Artemis Post-Brokerage Event
27/05/2013
3
Asia and US federal R&D funds mainly go to applied “Development”
whereas Europe has the highest share of Basic Research Funding
100
19%
90
Development
Applied
FP7
Basic
80
70
CIP - 6%
EIT - 2%
44%
58%
48%
46%
60
45%
50
40
30
32%
28%
24%
24%
22%
Korea
US
Japan
33%
32%
20
10
FP7
92%
36%
11%
0
China
Note : The selection of the 12 member states has been done dependant on the size and the availability of data. The result should not
differ much when the other 15 countries are added since the biggest R&D budgets are taken into account.
Note : For all countries are displayed the latest figures available.
Source: Key Science and Engineering Indicators, National Science Board, 2010 Digest, NSF, http://cordis.europa.eu/erawatch, OECD
“Research and Development Statistics”, Own analysis
Sum of Member
States
EU
From Gabriel Crean’s presentation
in Artemis Post-Brokerage Event
27/05/2013
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New Joint Undertaking ECSEL:
Electronic Components and Systems for European Leadership
 Three Private Partners (AENEAS, ARTEMIS-IA and EPoSS)
 Three connected and partially overlapping technology
areas
 Will start in 2014 (Q2?) and will organize its first call in 2014
 Projects
 Tri-partite with Commission and Member States (higher
TRL-levels?)
 Bi-partite with Commission (lower TRL-levels?)
 First two years will probably be continued as before
27/05/2013
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AENEAS / ARTEMIS-IA / EPoSS High Level SRIA 2012
Programmes
and Documents
AENEAS
Vision
Misson &
Strategy
ECSEL-JU
2014 MASP/RA* and AWP
H2020
Work Programme
EUREKA (CATRENE and ITEA3)
Vision 2030
Roadmap
National
/ Regional
Roadmaps?
ARTEMIS-IA
SRA 2011 +
Addendum
2013
EPoSS
SRA
with ITEA
* Starting points for AENEAS and ARTEMIS-IA will be the 2013 MASP/RA’s of
ENIAC-JU and ARTEMIS-JU respectively
27/05/2013
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Preliminary agreement with AENEAS and EPoSS
on ECSEL MASP/RA 2014
 The 2013 MASP/RA documents of the ENIAC-JU (157 pages) and ARTEMIS-JU (41+133
pages),
 that have been elaborated by AENEAS and ARTEMIS-IA, and
 which look out for five years
 are quality documents that might only need minor (?) revisions to become chapters in a
combined 2014 MASP/RA of the new ECS-JU.
 These chapters should remain the responsibility of the respective industry associations.
 EPoSS has its own responsibility to elaborate a chapter for their field of interest.
 An introduction-text that relates the chapters to each other and/or other mutual
linking/referencing elements should be a combined responsibility (JL tasked to take the lead)
(MASP/RAs are downloadable from the websites to the ENIAC-JU and ARTEMIS-JU)
NOW IS THE TIME TO PROPOSE IDEAS INTO THESE
27/05/2013
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Applications and technologies
in MASP/RA’s
The R&D&I work-areas that are described in the 2013 MASP/RA’s of
AENEAS/CATRENE and ARTEMIS-IA are partly technology-specific (horizontal
activities) and partly application-specific (vertical activities).
 The described application-areas of ENIAC of ARTEMIS are quite similar,
which is evident, because high-tech applications are built on a combination of
hardware (the center of gravity of AENEAS/CATRENE) and software (the
center of gravity of ARTEMIS-IA).
 The MASP chapters of AENEAS/CATRENE and, ARTEMIS-IA on applications
are, with a minimal overlap, essentially different, due to differences in
technologies.
 EPoSS will describe their content while adhering to the minimal overlap
principle.
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27/05/2013
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2013 MASP/RA of AENEAS/CATRENE
 ENIAC-JU described so far eight R&D&I areas, the first five are
application-specific, the last three are semiconductor-specific:
 E1. Automotive and transport
 E2. Communication & digital lifestyles
 E3. Energy efficiency
 E4. Health and the aging society
 E5. Safety and security
 E6. Design technologies
 E7. Semiconductor process and integration
 E8. Equipment, materials, and manufacturing
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27/05/2013
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2013 MASP/RA of ARTEMIS-IA
ARTEMIS described so far eight R&D&I areas, in which A1 and A5 are more
horizontal compared to the other, more application-oriented, areas
 A1. Methods and processes for safety-relevant embedded systems
 A2. Embedded Systems for Healthcare and Wellbeing
 A3. Embedded Systems in Smart Environments
 A4. Embedded Systems for Manufacturing and process automation
 A5. Computing platforms for Embedded Systems
 A6. Embedded Systems for Security and Critical Infrastructures Protection
 A7. Embedded Systems supporting sustainable Urban Life
 A8. Human-centered design of Embedded Systems
An extra condition for projects in ARTEMIS is a clearly described
contribution to three horizontal topics:
 Reference designs and architectures
 Seamless connectivity and interoperability
 Designs methods and tools
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27/05/2013
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Next steps
 ECSEL JU will have a big role in industry driven R&D in electronics systems
area
 If not yet involved, then get involved
 Artemis Summer Camp
 Artemis SRA renewal process
 VTT is deeply involved in writing this –> Industry needs are needed
 Outlining the ECSEL SRA ideas
 Needs of Finnish Industry should be included as early as possible
 Horizon 2020 work program (that will provide commission funding)
 Time for lobbying responsible head of unit, i.e. Rainer Zimmermann
 VTT can assist in putting your ideas into these documents that eventually
define possible operations and funding
27/05/2013
VTT creates business from technology
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