The halogen free polyamide for demanding applications Halogen-free flame retardants for a brighter future Our mission at DSM is to create brighter lives for people today and for generations to come. In the consumer electronics industry, the market requires elimination of hazardous substances, as well as strong consumer demand for materials and processes that are more environmentally responsible. A key focus area is the elimination of halogenated flame retardants. Innovation The 3C industry – computer, consumer Halogen free substances Stanyl ForTii entirely eliminates the use of and communication electronics – is an enormous and growing sector based on constant innovation, short design cycles, and a trend of decreasing size while increasing functionality. At the same time, regulatory requirements are becoming more demanding. halogens, and is one of the products in DSM’s portfolio of Brighter Living solutions. In addition to an extensive halogen-free portfolio, the DSM portfolio includes recycle-based materials, bio-based high-performance polymers, hazardoussubstance-free materials, as well as materials that extend a product’s serviceable lifetime, provide signicant reductions in weight or friction, and help to deliver a low or neutral carbon footprint. Stanyl® ForTii™ is a high temperature Polyamide 4T, available in halogen-free and red phosphorous free UL94-V0 flame retardant grades, that delivers exceptional high temperature performance, high stiffness and low moisture absorption. Partnership We developed Stanyl ForTii in close cooperation with the leading electronics Original Equipment Manufacturers (OEMs) and Tier 1 connector and socket manufacturers. This industry has a strong need for high-quality engineering plastics that can withstand the increased heat and mechanical requirements placed on them due to the integration and thinnovation trends driving the industry. DSM is uniquely positioned to support these customers. In addition to creating sophisticated engineering plastics that provide them with greater design freedom, we also support our customers with complete application development support. Flame retardant plastics are essential in today’s electrical and electronics applications, but how can they be made more sustainable? Stanyl ForTii delivers UL94-VO flame retardance down to 0.2 mm in combination with exceptional high temperature performance, high stiffness, low moisture absorption for good dimensional stability. Additionally it meets the Glow Wire Ignitability Temperature (GWIT) specifications, and also supports lead-free soldering. It helps our customers to comply with the EU’s Restriction of Hazardous Substances (RoHS) and the Waste Electrical and Electronic Equipment (WEEE) regulations, and also supports lead-free reflow soldering. Stanyl ForTii entirely eliminates the use of halogens, and is one of the products in DSM’s portfolio of Brighter Living solutions. Beyond electronics Stanyl ForTii’s balanced profile enhances design and performance of key applications in the automotive, white goods, lighting and medical segments, as well as in electrical & electronics. Consumer electronics - Excellent dimensional stability, stiffness and toughness - Supports most demanding SMT applications - High flow for thin-wall molding - Rapid crystallization for increased cycle times Automotive - Weight reduction - High thermal and mechanical performance - Low moisture absorption - Chemical resistance - Best in class CTE matching aluminum and steel. Stanyl ForTii: a proven halogen-free perfomance plastic for demanding applications. High Performance Stanyl ForTii is a high-performance polyamide ideal for use in injection-molded consumer electronics parts. Applications where the material has already proven its reliability include connectors and sockets for e.g. DDR DIMM and SODIMM, card connectors, SATA or backplane, i/o and FPC, desktop and server SMT DDR3 or LED packaging. Stanyl ForTii offers a unique balance of high melt temperature (325°), high glass transition temperature (125°), high stiffness and very low moisture absorption. It combines exceptional toughness and stiffness with high strength before and aer reflow, providing higher application reliability values than PPS and liquid crystal polymers (LCP). Properties Stanyl For Tii’s exceptional material properties outperform the traditional plastic materials used in electrical and electronics applications. Its flexural strength and toughness solve the mechanical issues associated with LCPs, while its high strength at weld lines resolves issues associated with cracking. Medical devices - Low moisture absorption - Excellent temperature, mechanical and electrical performance White Goods - High dimensional stability - Supports high temperatures in SMT - No cracking at weld lines - Easy and robust processing - Glow wire performance Lighting - Excellent heat aging - High initial reflectivity - Strong UV and light resistance Stanyl ForTii withstands even the most demanding SMT applications. Industry trends It supports the industry trends of miniaturization and thinnovation with outstanding reflow capability, and can withstand even the most demanding warpage requirements to surface mount technology (SMT) applications. CTI Halfree feasibility Flow Stress at Break (Weldline) HDT Elongation at Break (Weldline) Solderability Co-planarity Stanyl ForTii Stanyl LCP PPA High stiffness, lower moisture absorption Low warpage At reflow temperatures, its stiffness and low warpage outperform PPA, PPS, LCP as well as LCP/PPS blends. Stanyl ForTii also provides excellent electrical performance, including a comparative tracking index (CTI) of 600V (performance level category 0), a low and stable dielectric constant, and no ionic migration at DC currents Electronics manufacturers face increasing regulatory requirements for environmentally responsible materials and processes Transition from halogenated to halogen free PCBs CTE at Tg PA4T a Halogen free PCB Halogenated PCB b a’ b’ LCP Warpage outperform LCP Average warpage after Reflow around 0.5 mm (Flip in warpage direction) Warpage outperform PA4T Average warpage after Reflow around 0.03 mm (Identical warpage direction) Graph above shows the warpage and in specific how this differs between PAs and LCPs. Especially when going from halogenated PCBs to halogen free PCBs this warpage at reflow temperatures of 260˚C becomes crucial. The CTE delta a & a’ of PA4T to PCBs is lowest. High stiffness, low moisture absorption Stanyl ForTii is well-suited to the requirements of electronics. Its high stiffness and low moisture absorption classies it in the second best moisture level for any application according to IPC/JEDEC J-STD 020D. Several customer products in moisture level one have also past this test. Partnering for a brighter future At DSM, we actively seek to partner with customers to improve the environmental impact of their applications in a costcompetitive way. Our portfolio includes a wide offer of grades with best-in-class performance at extreme operating temperatures, while considerably extending service lifetimes. We back all of our material sales with extensive research and development, as well as a collaborative partnership where we support you through grade selection, design and testing. With manufacturing facilities on three continents, we offer a security of stock that buys our customers peace of mind, comfortable in the knowledge that supply will never be an issue with DSM. Contact us today to learn how DSM can help improve the carbon footprint of your designs: DSM Engineering Plastics For further information, please see: www.dsm.com, www.stanylfortii.com or contact: Europe Tel +31 46 47 73796 [email protected] Americas Tel +1 800 333 4237 [email protected] Asia Pacific Tel +86 21 6141 8188 [email protected] ©DSM 2012 All information, advice and/or samples (“information”) are provided by or on behalf of DSM Engineering Plastic on an “as is” basis, without any further warranties as to the accuracy, usefulness, correctness or completeness thereof. Use or disclosure of or reliance on such information shall be for your own sole risk, account and responsibility and you will indemnify and hold DSM Engineering Plastics and its affiliates harmless from and against any and all damages or claims from third parties in respect of your receipt, use or disclosure of or reliance on the information. The disclosure of information shall not be construed as granting you a license or any other intellectual property rights relating to such information. The obtaining of such license or rights shall be subject to seperate negotiations. 12.001
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