Universal
5781A
Part Number: GS-393-00A
Issued 26-Feb-99
General Surface Mount
Application Machine
(GSMxs™)
5781A
GS-393-00A
GS-393-00A
5781A
5781A
GS-393-00A
Advanced
Surface
IMC
Mount
ProductLine
Line
Product
General Surface Mount Application Machine
(GSMxs)
Machine Highlights
Incorporates a precision linear motor with Universal’s patented VRMTM technology.
Easily configurable to support surface mount assembly processes.
Includes a user-friendly, graphical interface complete with an on-line component
database, CAD translation, and a machine performance simulator.
GS-393-00A
5781A
GS-393-00A
Introduction ............................................................................................................... 1
Functional Description ............................................................................................. 1
Standard Features ..................................................................................................... 1
Fiducial Inspection ................................................................................................ 1
Base Frame .......................................................................................................... 1
Postitioning System .............................................................................................. 2
Universal Platform Software ................................................................................. 2
Machine Control System Architecture ................................................................... 2
CD-ROM Drive ...................................................................................................... 2
Optional Features ...................................................................................................... 3
Feeders ................................................................................................................ 3
General Application Placement Head .................................................................... 3
High Force Head ................................................................................................... 3
UFP300+ High Accuracy Head ............................................................................. 3
Gripper Nozzles .................................................................................................... 4
Nozzle Changer .................................................................................................... 4
Staged Board Handling ......................................................................................... 4
Vision ........................................................................................................................ 5
Vision On-the-Fly .................................................................................................. 5
Multi-pattern Find .................................................................................................. 5
Component Centering/Inspection Cameras ........................................................... 6
Front and Backlighting .......................................................................................... 6
Miscellaneous ........................................................................................................... 7
Transformer .......................................................................................................... 7
Uninterruptable Power Supply ............................................................................... 7
GEM ..................................................................................................................... 7
Basic Network Kit ................................................................................................. 7
Feeder Storage Cart ............................................................................................. 7
BOARDFLO® ....................................................................................................... 7
Component Reject Station .................................................................................... 7
Conveyor .............................................................................................................. 7
Vibratory Reject .................................................................................................... 7
Matrix Tray ............................................................................................................ 7
Advanced Surface Mount Options ........................................................................ 8
Supporting Documents ............................................................................................. 9
Technical Specification ............................................................................................ 9
Components (Front and Rear General Application Placement Heads) ................... 9
Feeder Input ....................................................................................................... 10
Positioning System Specifications ...................................................................... 10
Placement Specifications (General Application Placement Head) ....................... 11
Global and Local Fiducial Shapes and Dimensions ............................................. 12
Overall Fiducial Recommendations ..................................................................... 12
Board Specifications ........................................................................................... 13
Board Handling ................................................................................................... 14
Installation Considerations .................................................................................. 16
Machine Dimensions .......................................................................................... 16
Service Requirements ........................................................................................ 16
Environmental Requirements .............................................................................. 17
Appendix A, GSM Feeders .................................................................................. A-19
Platform Tray Feeder (PTF), model 4559A ....................................................... A-19
Stackable Matrix Tray Feeder, model 4556A .................................................... A-28
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Tape Feeders, model 4695A ............................................................................ A-30
Track Feeder, model 4696A ............................................................................. A-34
Stationary Matrix Tray Platform, model 4697A ................................................. A-37
Multi-tube Feeders, model 4698A .................................................................... A-38
Appendix B, Placement Heads ............................................................................ B-40
UFP300+ High Accuracy Head ........................................................................ B-40
Appendix C, Cameras .......................................................................................... C-42
Appendix E, Advanced Surface Mount Assembly (ASMA) ................................ E-43
Introduction ..................................................................................................... E-43
Applications ..................................................................................................... E-43
Application Summary ...................................................................................... E-45
Optional Features ............................................................................................ E-48
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GS-393-00A
5781A
All specifications are subject to periodic review and may be changed without
notice.
© Universal Instruments Corporation, 1999. All rights reserved.
The following are trademarks of Universal Instruments Corporation, registered
U.S. Patent and Trademark Office: P2PTM, UniversalTM, U-DesignTM. GSMxsTM is
a trademark of Universal Instruments Corporation.
EthernetTM is a trademark of Xerox Corporation. FluorowareTM is a trademark of
Fluoroware, Inc. IntelTM is a trademark of Intel Corporation. IBMTM and OS/2TM
are registered trademarks of International Business Machines Corporation.
SurftapeTM is a trademark of Tempo Electronics.
5781A
GS-393-00A
GS-393-00A
Page 1
Introduction
The General Surface Mount Application Machine (GSMxs) is an
ultra high accuracy placement system that handles a wide range
of surface mount components. It is a member of the Universal
Instruments GSMxs family of machines featuring precision linear
scales, linear motors, and advanced vision processing capabilities.
In consideration of essential health and safety requirements, the
GSMxs is CE marked.
Functional Description
Typically, four components are picked from various feeder locations, vision inspected on-the-fly, and placed on the board. See
Technical Specifications for details on the configuration options
currently available.
Standard Features
Fiducial Inspection - registers the board in the machine
and compensates for linear board distortions (stretch,
shrink and non-orthogonality). Local fiducials are used to
measure local board distortion. The downward-looking
(P.E.C., pattern error correction) fiducial inspection camera is mounted under the beam. See the Technical Specifications section for shapes, dimensions and overall specifications.
Base Frame - was designed to minimize tolerance accumulation from subassembly to subassembly and maximize
rigidity and stability. All major subassemblies are edge-justified and dowel-pin registered to precision-milled, datum
surfaces machined into the base frame. This ensures that
the positional relationships are held mechanically, not
through adjustment.
Page 2
GS-393-00A
Positioning System - is an overhead, gantry style utilizing
a single X-axis beam driven on both ends by linear motor
technology. One micron linear encoders are used.
Universal Platform Software - Universal's Platform Software (UPS) offers a common look for all platform applications. It features an intuitive graphical human interface,
data and control interfaces, including CAD import, comprehensive data import and GEM.
•
CAD data translation
•
feeder setup optimization
•
machine performance simulation
•
placement sequence optimization
•
feeder library
•
error recovery
•
on-line file manager
•
easily modified industry-standard surface mount component database
•
On-line Operation and Maintenance Manuals
Machine Control System Architecture
•
Intel 80486-based embedded P.C.
•
2.0 Gigabyte Hard Drive
•
Motorola 68030-based machine controller
•
Motorola 68000 series-based motion controllers
CD-ROM Drive - is available for installation in the VME
chassis next to the floppy disk drive. CD-ROM simplifies
and speeds up the installation of upgrades and access to
machine documentation from just one CD ROM.
GS-393-00A
Page 3
Optional Features
Feeders - include tape feeders, track feeders, multi-tube
feeders, and matrix tray feeders. Refer to appendix for
detailed information.
General Application Placement Head - general purpose
head (with 40mm spacing between each spindle) handles
the broadest range of surface mount components. This
head offers the best mix of accuracy and speed for most
surface mount applications.
General Application
Placement Head
Adding a second General Application Placement Head reduces the number of nozzle changes when building a
product. The GAPH head has four spindles with 40mm
spacing between each. These spindles can be driven individually or simultaneously in any combination to pick components prior to placement.
The GAPH head can be selected for the front or rear of
the beam.
High Force Head - General purpose four-spindle head
with 40mm spacing between each spindle. This head
handles the same broad range of surface mount components as the General Application Placement Head. In addition, the high force head expands the placement force to a
range of 175 to 2500 grams.
UFP300+ High Accuracy Head - the single spindle picks
ultra-fine-pitch components with a need for a high degree
of X, Y and theta (n) accuracy. The head installs on the
front or rear of the beam and accesses feeders on the
same side as the head installation.
See appendix for detailed information on the UFP300+
High Accuracy Head.
UFP300+
High Accuracy Head
Page 4
GS-393-00A
Gripper Nozzles - Gripper tooling is used for components
with no flat surface for vacuum picking. Ribbon cable connectors, inter-board headers, and potting forms are some
examples of the components handled by this tooling. The
gripping action is accomplished using the same vacuum and
air kiss as the standard nozzle tips. The gripper tooling is
not compatible with nozzle changers. Each application requires specific tooling. Contact your Universal Sales Engineer for evaluation of your application.
Gripper Nozzles
Nozzle Changer - allows programmed nozzle changes to
accommodate components with different vacuum requirements. Two changers with a total capacity of 13 nozzles
are standard for handling a wide range of components.
Staged Board Handling - buffers a board within the lane
while a board is being populated. Features automatic width
control based on programmed board parameters. Board
transfer capabilities include left-to-right, pass through, and
right-to-left. Mechanical board stops are standard and accommodate unique board shapes.
Staged Board Handling
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Page 5
Vision
Vision On-the-Fly - For components up to 1.25 inches
square (32mm), the GSMxs performs vision inspection onthe-fly. The head picks four components and passes over
the upward-looking (P2P®, Part-to-Pad-Matching) camera.
While the head passes over the camera, the vision system
captures all four component images. The head then places
the components at the vision-adjusted coordinates. For
components that do not fit into a single field of view, the
head stops over an upward-looking camera. The vision
system then captures multiple fields of view to acquire the
entire component image.
Multi-pattern Find - A vision algorithm that uses pattern
recognition to locate and center non-standard components
prior to placement. Non-standard components include
headers, connectors, shields, stampings, and others.
Page 6
GS-393-00A
Component Centering/Inspection Cameras - The
GSMxs supports two upward looking cameras, one in the
front feeder area and one in the rear. Two cameras reduce the travel distance to the camera and allow the
GSMxs to efficiently handle a greater range of components. Refer to appendix for information on selecting the
appropriate cameras.
Front and Backlighting - The GSMxs is available with
front and backlighting for component inspection. For front
lighting, the inner LED banks are strobed as the vision system captures the front image of the component. For
backlighting, the backlight towers strobe the two outer
LED banks, illuminating the special backlighting nozzle.
The vision system captures the silhouette of the component. Backlighting is recommended for components with
highly-reflective component leads, and any component that
does not image well. It cannot be used with components
that require multiple fields of view.
Front light LEDs
Lens
Camera
Mirrors
Field of View »
2" x 1.5"
Standard magnification
Front Lighting
Back light LEDs
Lens
Camera
Mirrors
Field of View »
2" x 1.5"
Standard magnification
Backlighting
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Page 7
Miscellaneous
Transformer - allows for the conversion of input power
sources to the machine requirements.
Uninterruptible Power Supply - Ensures precisely controlled, continuous power to the GSMxs for at least ten
minutes after losing the main power.
GEM - The Generic Equipment Model software license
provides a set of communication, data collection, command,
and control tools for GSMxs machines. Based on the
Semiconductor Equipment and Materials International standard, SEMI E30-93, this software opens the system architecture for integration into factory data collection and automation systems.
Basic Network Kit - includes Ethernet Network Card
and IBM OS/2 TCP/IP client software and a 16 MB RAM
upgrade to the GSMxs imbedded PC. With this option the
GSMxs is ready for connection to an Ethernet TCP/IP network, providing high speed, reliable communications and
data transfer to all computers connected to the network.
Feeder Storage Cart - features three shelves of off-line
storage for up to 132, 8mm tape feeders.
BOARDFLO® Conveyors - transport the board between individual machines within a system.
Component Reject Station - for components up to 2.0"
square:
Feeder Storage Cart
Conveyor - Two modes of operation move rejected components away from the GSMxs placement head:
•
Programmable indexing cycles components until the
sensor is interrupted stopping the machine.
•
The belt moves continuously moving components off
the end.
Vibratory Reject - moves the components away from the
GSMxs placement head for manual removal.
Matrix Tray - the stationary matrix tray feeder can be
used as a reject matrix for valuable components.
Page 8
GS-393-00A
Advanced Surface Mount Options - For even greater
flexibility covering a broader spectrum of components,
combine the GSMxs with Advanced Surface Mount
options.
fli
p
ch
ip
Advanced Surface Mount Assembly (ASMA) includes the
list below.
A
G
B
•
controlled collapse chip connection (C4)
•
direct chip attach (DCA)
•
ceramic ball grid array (CBGA)
•
ceramic column grid array (CCGA)
•
plastic ball grid array (PBGA)
•
tape ball grid array (TBGA)
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Page 9
Supporting Documents
Appendix A GSMxs Feeders, models 4556A, 4559A, 4695A,
4696A, 4697A, and 4698A
Appendix B Placement Heads
Appendix C Cameras
Appendix E Advanced Surface Mount Assembly (ASMA)
Technical Specification
Components (Front and Rear General Application Placement Heads)
Wi
dt
Xh
th
Yng
Le
Minimum
Maximum
Width/Diameter
0.04" (1.016mm)
2.5" (63.5mm) 1, 2
Length
0.02" (0.508mm)
2.0" (51mm) 1
Thickness
0.020" (0.508mm) 2
0.500" (12.7mm)
Weight
35 grams, maximum. Consult the factory for
heavier components.
Feature Pitch
0.010" (0.25mm) 3
Feature Width
See appendix for cameras
Feature Count
—
—
2
1000
1. Maximum component size for on-the-fly vision is 1.25"
(31.8mm).
2. The GSMxs can handle other size components. For example,
the GSMxs has placed a 5.75" x 0.510" (146.1mm x 12.95mm)
SMD connector device using specific head, camera, and
process applications. Consult your Universal Sales Engineer.
3. Requires the use of a high magnification camera. The GSMxs
can handle other pitches. For example, the GSMxs has placed
a 0.005" (0.13mm) pitch device using specific head, camera,
and process applications. Consult your Universal Sales
Engineer.
4. Maximum component size for front head to rear camera and
rear head to front camera is 2.0" (76.20mm)
Page 10
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Feeder Input
Number of Feeder Slots Used
(Total Available = 48)
Tape Feeder
8 & 12 mm
16 & 24 mm
32 & 44 mm
56mm
Track Feeder
Multi-tube Feeder
1
2
3
4
slot
slots
slots
slots
3 slots
40mm
50mm
2 slots
3 slots
Platform Tray Feeder (PTF)
9 slots
Stackable Matrix Tray
9 or 12 slots
Stationary Matrix Tray Feeder
8 or 9 slots
Component Reject Station
3 slots
Positioning System Specifications
X Axis Travel
18.97" (482mm)
Y Axis Travel
35.55" (903mm)
Resolution
0.000039" (0.001mm) (1 micron)
Bidirectional
Repeatability
<5 µm @ 6F
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Page 11
Placement Specifications (General Application Placement Head)
Mean
LSL
USL
Accuracy
Target
Placement Rate
4700 components per hour
Placement Tact
Time
0.77 seconds
Component
Placement Force
Low; Medium; High
(nominal reference values:
150 g to 350 g, to the nearest gram)
175 to 2500 grams, programmable
with C4 option
±1F
±2F
±3F
The Mean is the arithmetic
average of a set of measurements.
Accuracy is the distance between
the mean and the target value.
Standard Deviation is a measure
of the variability of a process
output.
Intrinsic Availability
98%
Placement Performance
with FX or HF head
on front of beam
X, Y:
±24µm@ ±6F
F < 4:m
CP > 2.0
Cpk > 1.5
(rotational):
±0.2° @ ±6F
F < 0.033°
CP > 2.0
Cpk > 1.5
±18µm@ ±6F
F < 3µm
CP > 2.0
Cpk > 1.5
±0.15° @ ±6F
F < 0.025°
CP > 2.0
Cpk > 1.5
with UFP head
on front of beam
Verified with all components of variation included: all spindles at
all rotations over entire placement area for multiple boards and for
each head and camera combination, using glass slugs placed on
glass plates. Data is analyzed on a per placement site basis and
pooled across all placement sites.
Repeatability is one standard
deviation.
Cp is a capability index which
compares the spread of the
process to the distance between
the upper and lower specifications.
Cp =
Upper Spec Limit - Lower Spec Limit
6F
where F = the standard deviation
(pooled) of the sample.
Cpk is the process capability index,
which is a measure of the process's
ability to produce product within
specifications.
CpK = min(x - Lower Spec Limit, Upper Spec Limit - x )
3F
where F = the standard deviation
(pooled) of the sample where x = the
sample mean.
Page 12
GS-393-00A
Global and Local Fiducial Shapes and Dimensions
Shape
D1
Disc
Min=.24" (.61mm)
—
Max=.250" (6.35mm)
D1
Swiss
Cross
D2
D2
Min=.040" (1.02mm) Min=.020" (.508mm)
Max=.250" (6.35mm) Max=.230"(5.84mm)
D1
Min=.030" (.762mm) Min=.030" (.762mm)
Max=.250" (6.35mm) Max=.250" (6.35mm)
D1
Min=.030" (.762mm) Min=.040" (1.02mm)
Max=.250" (6.35mm) Max=.250" (6.35mm)
D1
Rectangle
(Square)
D2
Double
or Right
Box Left
D2
Diamond
Min=.050" (1.27mm) —
Max=.175" (4.45mm)
D1
Plus
D1
Min=.030" (.762mm) Min=.030" (.762mm)
Max=N/A
Max=N/A
D2
Doughnut
D2
Min=.050" (1.27mm) Min=.020" (.51mm)
Max=.250" (6.35mm) Max=.220" (5.59mm)
D1
Overall Fiducial Recommendations
Universal recommends that a minimum of three global fiducials be
used for boards assembled on the GSMxs—two to six fiducials
depending on the process. Although the GSMxs handles a range of
fiducial types, the most reliable fiducial recommendations follow:
Shape
Solid, filled circle
Size
Minimum -- 0.024" (0.61mm)
Maximum -- 0.118" (3.00mm)
Tolerance
0.001" (0.025mm)
Clearance
The fiducial clearance area must be at least two
times the diameter of the fiducial
Material
Bare copper or copper covered with either clear
anti-oxidation coating, nickel plating, tin plating,
hot air leveled solder coating, or gold.
Flatness
The fiducial surface should be flat within 0.0006"
(0.015mm)
Mask
Solder resist coatings should not cover a fiducial
mark or its clearance area.
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Page 13
Board Specifications
Staged Board Handling
Thickness
Length
Edge Clearance
3mm
Min
Width
Edge
clearance
Bottom
side
clearance Top side
clearance
Width
2.00"
2
5mm
Max
Min
Max
9.84"
2.00"
10.00"
(50.8mm) (249.94mm) (50.8mm) (254.00mm)
Length
2.00"
13.00"
2.00"
13.00"
(50.8mm) (330.20mm) (50.8mm) (330.20mm)
Allowable
warp
Thickness2
Weight3
0.020"
0.200"
0.020"
0.200"
(0.508mm)(5.08mm)
(0.508mm)(5.08mm)
N/A
N/A
6 lbs
N/A
0.500"
6 lbs
(2.72 kg)
Top Side Clearance N/A
0.500"
(2.72 kg)
(12.7mm)
(12.7mm)
Bottom Side
Clearance
See illustration below.
Allowable Warp
Reference ANSI/IPC-D-300G, Printed Board
Dimensions and Tolerances.
Thick Board Handling
Edge Clearance
3mm
Min
Width
2.50"
5mm
Max
2
9.84"
Min
2.50"
Max
2
10.00"
(63.50mm)(249.94mm) (63.50mm)(254.00mm)
Length
2.50"
13.00"
2.50"
13.00"
(63.50mm)(330.20mm) (63.50mm)(330.20mm)
Thickness2
Weight3
0.020"
0.50"
0.020"
0.50"
(0.508mm)(12.70mm)
(0.508mm)(12.70mm)
N/A
N/A
6 lbs
(2.72 kg)
Top Side Clearance N/A
0.500"
6 lbs
(2.72 kg)
N/A
(12.7mm)
0.500"
(12.7mm)
Bottom Side
Clearance
See illustration below.
Allowable Warp
Reference ANSI/IPC-D-300G, Printed Board
Dimensions and Tolerances.
1. For other sizes, contact your Universal Sales Engineer.
2. Requires the removal of mechanical board stops.
3. Represents the sum of all board weights within the GSMxs
board handling system.
Page 14
GS-393-00A
Board Handling
Minimum
Maximum
Transfer Height
35.4" (899mm)
38.00" (965.2mm)
Transfer Time
2.5 seconds
Board Support - minimizes the effects of board warp, sag, and/
or flex by supporting the board during component placement.
The board support uses a grid pattern containing removable pins.
Rear rail
Fixed front rail
P.C. board
section
P.C. board
rails
1.0" (25.4mm)
clearance under
board
component
component
1.0" (25.4mm)
Maximum underboard clearance area
0.5" (12.7mm)
clearance under
board
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Page 15
Beam
Rear
Feeder Bank
GSMxs
Nozzle Changers
Front
Feeder Bank
1549mm
(61")
P
E
76mm
(3.0")
558.8mm
(22.0")
1407.16mm
(55.4")
2134mm
(84")
P Pneumatic Connection
E Electrical Connection
E
686mm
(27")
P
254mm
(10")
GSMxs Views
Page 16
GS-393-00A
Installation Considerations
Machine Dimensions
Length1
Depth
Height
Weight
55"
(1397mm)
61"
(1549mm)
84"
(2134mm)
5150
(2336kg)
Domestic
Shipping
71"
(1803mm)
87"
(2210mm)
73" 2
(1854mm)
5600
(2540kg)
Air Freight
72"
(1829mm)
88"
(2235mm)
73" 2
(1854mm)
5800
(2631kg)
Sea Freight 72"
(1829mm)
88"
(2235mm)
73" 2
(1854mm)
5800
(2631kg)
GSMxs
Floor Space
A minimum clear area of three feet (one meter)
around the machine perimeter is recommended for
machine operation and servicing.
1. Length is in the direction of board flow.
2. Machine light tower and monitor shipped separately.
Service Requirements
Electrical
230 VAC, nominal
Frequency
50 or 60 Hz (49-51 or 59-61 Hz).
Frequency must be stated at time of order.
Phases
3
Number of
wires
4 (three phase lines and ground)
Service
configuration
Service must be grounded Delta
Branch circuit
size
30 amps
Distortion
<10% total harmonic distortion
Average power
5000 watts
Electrical
connection
3" (76.2mm) from front
27" (686mm) from floor
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Page 17
Service Requirements (continued)
Pneumatics
Air consumption for base
machine 1
9.9 scfm (280.3 Nliters/minute)
Air flow required 10.73 cfm at 90psi
to base
(303.8 liters/minute at 6.21 bar)
machine 2
Clean air
Clean air is defined as: dew point must be 20° F.
(11° C.) below ambient temperature; oil at 0.08
ppm at 82° F. (28° C.); input air filtered to 5
microns particle size.
Pneumatic
connection
20" (508mm) from front, 10" (254mm) from
floor. Internal thread connection is 3/8" NPT and
provided with the machine.
Equipment is adequately protected against
ingress of solid and liquid contaminants.
1. Air consumption is air used by the base machine during a
normal machine cycle and measured in standard cubic feet per
minute (Nliters/min).
2. Air flow value is used to calculate the input air line which might
supply several machines. The flow value is measured in cubic
feet per minute (cfm) or liters per minute (liters/min).
Environmental Requirements
Minimum
Maximum
Operating
Temperature Range
40° F (4.4° C)
95° F (35° C)
Storage
Temperature
-4° F (-20° C)
149° F (65° C)
Operating Humidity
10% non-condensing
90% non-condensing
Operating Altitude
—
8202 feet (2500
meters)
Noise level
70 dbA in accordance with National Machine
Toolbuilders Assoc. Noise Measurement
Technique Standard — June 1986.
Operating
Environment
For optimum placement performance
Universal's linear motor machines are designed
to work in an environmentally-controlled setting.
Page 18
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Appendix A, GSMxs Feeders - GS-393-00A
A - 19
Appendix A, GSM Feeders
Platform Tray Feeder (PTF), model 4559A
Introduction
The optional Platform Tray Feeder (PTF) is designed to complement the strengths of Universal’s platform family of placement
solutions while reinforcing the GSMxs attributes of reliability,
flexibility, ease of use, and high throughput.
The Platform Tray Feeder (PTF) can present up to 58 different
part numbers of most leaded and area array components to the
Universal family of platform machines for placement. The PTF
can be loaded with stacks of matrix trays without stopping component placement in the GSMxs.
In consideration of essential health and safety requirements, the
Platform Tray Feeder is CE marked.
Platform Tray Feeder (PTF)
GS-393-00A - Appendix A, GSMxs Feeders
A - 20
Functional Description
The primary function of the PTF is to provide components from
matrix trays for gang-picking at the GSMxs. To accomplish this,
the PTF is configured at setup, then the components and matrix
trays are defined using the feeder and component databases in
the Product Editor of the GSMxs. The Universal Platform Software (UPS) can optimize and assign component positions within
individual pallets to create a valid product.
Transfer Shuttle
to GSMxs
Door to access
elevator and
refill pallets with
matrix trays
After setup configuration, the operator loads matrix trays in the
defined pallets of the elevator using the feeder load procedure.
During loading, matrix trays can be stacked to the top of the pallet, then the pallet is easily pushed into place in the magazine slot.
When all pallets are loaded, the feeder door is latched and the
start button is pushed to begin operation.
During operation, the feeder uses six axes of servo control to accurately move matrix trays and components to the pick points of
the PTF and the GSMxs. The GSMxs software signals the servocontrolled tray transport to extend the selected pallet out of the
magazine. While the pallet is extended, the feeder head assembly,
also servo-controlled, picks the component from the matrix tray.
Up to four components are selected from the same pallet or any
other pallet in the elevator. The presence of a component is
sensed, then placed on the transfer shuttle. The components on
the servo-controlled transfer shuttle are spaced at 40mm and
moved for gang-picking to the GSMxs pick point.
As each matrix tray is emptied, the feeder head assembly automatically removes the matrix tray from the pallet to a customersupplied empty tray bin. When an empty stack or pallet is determined by the Universal Platform Software, the corresponding
LED illuminates on the magazine indicating which pallet to refill.
The operator loads the pallet or pallets as required, and returns
the PTF to the run sequence without pausing the GSMxs placement process.
Appendix A, GSMxs Feeders - GS-393-00A
A - 21
Standard Features
Pallets - Small, medium, or large-depth pallets accommodate most of the leaded and area-array components packaged in matrix trays. Pallets are selected separately or in a
standard configuration, and hold one or two unique component IDs for up to a total of 58 matrix tray component IDs.
The various depths of the pallets allow small to large stacks
of matrix trays, optimizing production needs. The standard
configuration includes five small pallets, three medium pallets, five large pallets, and one small purge pallet. An operator can load a stack of matrix trays within 20 seconds,
and pallets easily slide into any one of the 29 magazine
slots without delaying GSMxs placement.
Medium Pallet with full
Matrix Trays
Tray Transport - The tray transport automates the pallet
selection and matrix tray disposal. The GSMxs software
signals the servo-controlled tray transport to move the selected pallet out of the magazine. While the pallet is extended, the feeder head assembly, also servo-controlled,
picks the component from the matrix tray and places it on
the transfer shuttle moving it into the GSMxs. When the
matrix tray is empty, the feeder head assembly automatically removes the matrix tray from the pallet to a customer-supplied empty tray bin. If the user does not want
automatic disposal of empty matrix trays, the UPS can be
configured to force manual removal.
Tray Transport
Transfer Shuttle - The servo-controlled transfer shuttle
moves components (spaced 40mm apart) from the feeder
to the precise pick point of the GSMxs for placement.
Transfer time of four components from one tray to the pick
point is only six seconds. Transfer shuttle movement is parallel to board transfer in the GSMxs.
PTF
Components
GSMxs
Transfer Shuttle Assembly
GS-393-00A - Appendix A, GSMxs Feeders
A - 22
Technical Specifications
Configuration
Feeders
PTF
Transfer GSMxs software
Shuttle
➦
Board flow
GSMxs Platform front
Transfer
Shuttle
➦
36" PTF
Conveyor
Configuration
Feeders
The PTF is controlled by Universal Platform
Software (UPS). The UPS processes diagnostic
messages, and optimization of one product.
Included is a graphic interface for defining
components, matrix trays, magazine slots and
feeder configuration from the feeder and
component database.
The base platform has side entrance holes for
installing the PTF transfer shuttle in the right
rear, left rear, left front, and right front. The
GSMxs supports one PTF.
A manual slide-width 36" (914mm) PTF
Conveyor is supplied with the PTF.
PTF
Board flow
Required feeder
slots
9 feeder slots when installed in side entrance
holes.
Empty tray bin
Use to collect empty matrix trays, customer
supplied.
22"
36" PTF
Conveyor GSMxs Platform front Conveyor
Component Pick and Transfer Specifications
Feeders
Tact time
1.5 seconds per component
Transfer time
6 seconds, 4 components from one tray to
9 seconds, 4 components from pallets in
magazine slots 2, 3, 4, and 5 or four other
contiguous magazine slots to the pick
position of the GSMxs.
Shuttle transfer
height
35.4" to 38.00" (899mm to 965.2mm)
36" PTF
Conveyor
Board
flow
➦
Transfer
GSMxs Platform front
Shuttle
PTF
Feeders
36" PTF
Conveyor
Board
flow
➦
GSMxs Platform front PTF
Transfer
Shuttle
Allowable configurations
for a PTF installation on the
feeder bank of the GSMxs.
Note: Maximum of one PTF
per machine.
Appendix A, GSMxs Feeders - GS-393-00A
A - 23
Components Fed From PTF
Type
Leaded and area-array
Dimensions
0.25" to 2.0" (6.4 to 51mm) square, manual
nozzle change may be required for a full range
of component picking.
Thickness
0.04" to 0.50" (1.0 to 12.7mm), flat and smooth
surface for vacuum retention. See Nozzle
Requirements.
Weight
Up to 50 grams each. See Nozzle Requirements.
Matrix tray
Dimensions
•
4" x 4" x 0.1" (102 x 102 x 3mm), minimum
•
13.0" x 11.5" x 0.5" (330 x 292 x 12.7mm),
one component ID, or
13.0" x 5.5" x 0.5" (330 x 140 x 12.7mm) for
one or two component IDs (two matrix trays)
in one pallet.
•
Height
Height of trays and components cannot exceed
the top of the pallet.
Weight, maximum
10 pounds (4.54 kg) total combined weight of
matrix trays and components per pallet.
300 grams maximum empty weight. Trays that
do not meet JEDEC standards can be manually
removed.
Pick area, empty
The pick area of a matrix tray is a smooth
surface that allows vacuum retention and
therefore, removal of an empty matrix tray.
Reference IEC specifications for requirements.
GS-393-00A - Appendix A, GSMxs Feeders
A - 24
Pallets
Small
Pallet depth
Medium
Large
0.50" (12.7mm) 1.05" (26.7mm) 2.55" (64.8mm)
Pallet capacity
Number of stacks
Component ID
Component ID
number one
number two
Partially full matrix trays
1 magazine slot
1 or 2
1 or 2
1 or 2
Number of trays
per stack
2
4
8
Magazine slots
required per pallet
1
2
4
Load time
20 to 30 seconds to load a stack of trays and
clamp each stack flush with the pallet leading
edge.
Pallet weight
16 pounds (7.26 kg), maximum combined weight
of pallet and full matrix trays.
Small size pallet
Component ID
number one
Component ID
number two
Magazine
Magazine capacity
Partially full matrix trays
Full matrix trays
29 pallet slots
Standard magazine package includes 5 small, 3
medium, and 5 large pallets plus one purge
pallet. A large pallet is placed in the bottom
magazine slot to accommodate this pallet mix.
2 magazine slots
Small pallet, 29 at 0.50" (12.7mm) deep, maximum
Medium pallet, 15 at 1.05" (26.7mm) deep, maximum
Large pallet, 8 at 2.55" (64.8mm) deep, maximum
Medium size pallet
Capacity
135 pounds (61.3 kg), including pallets, matrix
trays, and components
Component ID
number one
Component ID
number two
Partially full matrix trays
Full matrix trays
Full matrix trays
Full matrix trays
4 magazine slots
Large size pallet
Appendix A, GSMxs Feeders - GS-393-00A
584mm (23")
A - 25
584mm (23")
Platform
Tray
Feeder
(PTF)
GSMxs
610mm (24")
Platform
Tray
Feeder
(PTF)
32"
(813mm)
914mm (36")
914mm (36")
Board flow
PTF Conveyor
PTF Conveyor
E
Platform
Tray
Feeder
(PTF)
2134mm
(84")
Platform
Tray
Feeder
(PTF)
P
279mm (11")
229mm (9")
E
584mm (23.0") GSMxs
1397mm (55.0")
876mm
(34.5")
2273mm (89.5")
P Pneumatic Connection
E Electrical Connection
PTF shown installed on General Surface Mount Application Machines (GSMxs)
(platforms with side entrance holes)
GS-393-00A - Appendix A, GSMxs Feeders
A - 26
Installation Considerations
Length 1
Depth
Height
Weight
32"
(813mm)
58"
(1473mm)
62"
(1575mm)
1155 pounds
(524 kg)
Domestic
Shipping
42"
(1067mm)
69"
(1753mm)
67"
(1702mm)
1250 pounds
(568 kg)
Air Freight
43"
(1092mm)
69"
(1753mm)
69"
(1753mm)
1355 pounds
(615 kg)
Sea Freight 43"
(1092mm)
69"
(1753mm)
69"
(1753mm)
1375 pounds
(624 kg)
Overall
Floor Space
A minimum clear area of three feet (one meter)
around the machine perimeter is recommended for
machine operation and servicing.
1. Length is in the direction of board flow.
PTF Service Requirements
Electrical
230 VAC, provided by the GSMxs
Electrical interface is needed for existing GSMxs
installations. Consult your Universal Sales
Engineer.
Pneumatic
Provided by the Platform
Vacuum
Generated internally by PTF feeder
PTF Conveyor Service Requirements
100 to 130 VAC, 50/60 Hz, 7.5 amperes
200 to 260 VAC, 50/60 Hz, 7.5 amperes.
Separate drop required.
Environmental Requirements
Minimum
Maximum
Operating
Temperature
40° F (4.4° C)
95° F (35° C)
Operating
Temperature
Change Tolerance
—
10.8° F/hour
(6° C/hour)
Storage
Temperature
-4° F (-20° C)
149° F (65° C)
Operating Humidity 10% non-condensing
90% non-condensing
Operating Altitude
—
8202 feet (2500 meters)
Noise
70 dbA in accordance with National Machine
Toolbuilders Assoc. Standards.
Appendix A, GSMxs Feeders - GS-393-00A
A - 27
Supporting Documents
International Electrotechnical Commission (IEC) Standards,
286-5, revision 1995-02 for Packaging of Components for
Automatic Handling
SMEMA Software/Communications Interface Standard 2.0
GS-393-00A - Appendix A, GSMxs Feeders
A - 28
Stackable Matrix Tray Feeder, model 4556A
Introduction
Lift
The model 4556A, Stackable Matrix Tray Feeder moves a stack
of matrix trays all loaded with components of one part number to
the pick position of the GSMxs. Empty trays are discarded.
Vacuum pickup requires trays with a smooth surface and solidbacked pockets near the center of the tray.
GSMxs
9" (228.6mm)
Lift
SA
VA 0
35-s
- 142
Elevator Assy
Interface Plate
on GSMxs
Height
Electrical Enclosure Assy 2
Length 1
14" (355.6mm)
Standard Features
The simple, compact feeder will move up to a 3.75 inch, 15.0
pound stack of matrix trays to the GSMxs pick position. Two
size feeders are available. For other than stated matrix tray
sizes, consult your Universal Sales Engineer.
•
6.1 Feeder, 5.35 to 6.10 inches (135.9 to 154.9mm) wide by
10.5 to 13 inches (266.7 to 330.2) long matrix trays. Total
feeder width, 7.00" (177.8mm).
•
8.3 Feeder, 5.35 to 8.38 inches (135.9 to 212.9mm) wide by
10.5 to 13 inches (266.7 to 330.2) matrix trays. Total feeder
width, 9.37" (238.0mm).
Floor
Notes:
1 Approximate, may vary with machine setup.
2 Remove the Electrical Enclosure Assy
before picking up the Feeder.
Functional Description
A stack of matrix trays is presented to the GSMxs for component
pickup. The GSMxs picks from the top tray. When the top tray
is empty, the stack moves to the discard position. The empty tray
is picked, uncovering the next full matrix tray. The remaining
loaded stack returns to the pick area, while the empty tray is discarded, manually or automatically. A full stack of matrix trays is
manually loaded as needed.
Appendix A, GSMxs Feeders - GS-393-00A
A - 29
Technical Specifications
Length
Width
Height
Weight
Overall
36.62"
(930mm)
7-9.37"
(177.8238.0mm)
31.50"
(800.2mm)
50 pounds
(22.7 kg)
Elevator
NA
NA
16.25"
(412.8mm)
35 pounds
(15.9 kg)
Electrical
Enclosure
Assembly
NA
NA
15.25"
(387.4mm)
15 pounds
(6.8 kg)
Floor Clearance
14" (356.6mm), approximately
Altitude
Up to 1000m above mean sea level
Ambient Air
+5°C to +40°C
Temperature Range
Average Ambient
Air Temperature
Range
Not to exceed +35°C in 24 hours
Free Air Operating
Temperature
+5°C to +55°C
Average Free Air
Operating
Temperature
Not to exceed +50°C in 24 hours
Humidity Range
30% to 95%, non-condensing
Noise
65 dbA
Transportation
and Storage
-25°C to +55°C, up to +70°C in 24 hours
Store in shipping carton, Universal # M00067900
or mounted on Feeder Cart Assembly,
Universal # 45577701.
Required Feeder
Positions
6.1 Feeder, 9 feeder slots
8.3 Feeder, 12 feeder slots
Service Requirements
Electrical
Power is provided by the GSMxs. IEC-type
connector, 120VAC, 50-60 Hz., 1.6 ampere.
Voltage fluctuation, 10%.
Pneumatic
Air is provided by the GSMxs at 3 cfm at 80 psi
(84.95 liters/minute at 5.52 bar) with a 0.25"
(6.35mm) hose.
Vacuum
Generated internal to the feeder.
Safety
Bottom panel provided.
Moving
60 pound pallet jack, and 15 minutes to uncrate.
To lift uncrated Feeder, disassemble and use lift
points shown in illustration.
GS-393-00A - Appendix A, GSMxs Feeders
A - 30
Tape Feeders, model 4695A
Introduction
The model 4695A tape feeder is available to process a wide
range of punched or embossed component tapes. Reel loaded
feeders can be kept in readiness for installation on the GSMxs.
Machine Concept
12mm Feeder
Each feeder is dedicated to a tape width and index pitch. The
electrical and pneumatic connections are engaged when the
feeder is mounted to the GSMxs.
Modular design of the feeder permits quick feeder changeover on
the GSMxs while the machine is cycling.
Standard Features
Select a dedicated tape feeder for the following tape sizes and index.
8mm
Carrier Tape
32mm
Embossed Carrier
•
8mm (2 or 4mm index)
•
12mm (4, 8, or 12mm index)
•
16mm (4, 8, 12, or 16mm index)
•
24mm (4, 8, 12, 16, 20, or 24mm index)
•
32mm (4, 8, 12, 16, 20, 24, 28, or 32mm index)
•
44mm (4, 8, 12, 16, 20, 24, 28, 32, 36 or 40mm index)
•
56mm (4, 8, 12, 16, 20, 24, 28, 32, 36 or 40mm index)
Feeder design is based on EIA-481-1, EIA-481-2, and EIA-481-3
standards. Punched carrier, embossed carrier tapes, reels and
components meeting the above standards are processed by these
feeders. Reference Technical Specifications section where limitations apply.
Appendix A, GSMxs Feeders - GS-393-00A
A - 31
This End to the GSMxs
Component Pick Up 4
Position
Peeler Blade 5
2
Mylar Cover Tape
Take-up Reel
Handle
3
Latch
Component
Reel Holder
1
6
Manual Feeder
Index Tool
5a Scrap Carrier
Tape Exit
Functional Description
The following sequence of events describe the tape feeder functions. The numbers in parenthesis relate to the callouts on the
tape feeder.
(1) A component tape reel is mounted on the component reel
holder.
(2) The component tape is routed beneath the take-up reel to the
index wheel.
(3) The component tape is advanced through the feeder using
the feeder index tool.
(4) Pins on the index wheel engage holes in the component tape
advancing components to the pickup position.
(5) The top mylar cover tape is threaded back over the peeler
blade to the take-up reel while the empty component carrier
tape is routed out through the carrier tape scrap guide.
(6) The latch locks and releases the feeder on the GSMxs.
Supporting Documents
EIA-481A Electronic Industries Association Standard - Taping
of Surface Mount Components for Automatic Placement.
Provided by GSMxs
13" (330mm)
One
Punched and
Embossed Carrier
8" (203mm)
1500" of 0.004"
(3810cm of 0.10mm)
0.078 to 0.157"
(2mm to 4mm)
in 0.079"
increments
Pneumatic
Maximum Reel Size
Required number
of feeder positions
Tape Type
Tape Leader
Take-up Capacity
Indexing Increment
0.70
—
—
—
—
—
—
—
—
—
4mm
8mm
12mm
16mm
20mm
24mm
28mm
32mm
36mm
40mm
Notes: See next table.
0.70
2mm
Tape Index
Index Rate in Seconds 1 :
Provided by GSMxs
Provided by GSMxs
0.70
0.70
0.70
0.157 to 0.314"
(4mm to 8mm)
in 0.157"
increments
1500" of 0.004"
(3810cm of 0.10mm)
8" (203mm)
Embossed Carrier
One
13" (330mm)
12mm
Provided by GSMxs
8mm
Electrical
Technical Specifications
16mm and 24mm
—
—
—
—
2.0
1.0
1.0
1.0
1.0
1.0
—
2
0.157 to 0.787"
(4mm to 24mm)
in 0.157" increments
1500" of 0.004"
(3810cm of 0.10mm)
8" (203mm)
Embossed Carrier
Two
14.17" (360mm)
Provided by GSMxs
Provided by GSMxs
2.02
2.02
2.02
2.02
2.0 2
2
2
2.0
2.0
2.0
2.02
1.0
1.0
1.0
1.0
1.0
—
0.157 to 1.574"
(4mm to 40mm)
in 0.157" increments
One reel of cover tape
8" (203mm)
Embossed Carrier
Four
23.98" (609mm)
Provided by GSMxs
2
2.0
56mm
Provided by GSMxs
2
1.0
1.0
1.0
1.0
1.0
—
0.157 to 1.574"
(4mm to 40mm)
in 0.157" increments
One reel of cover tape
8" (203mm)
Embossed Carrier
Three
14.17" (360mm)
Provided by GSMxs
Provided by GSMxs
32mm and 44mm
A - 32
GS-393-00A - Appendix A, GSMxs Feeders
Appendix A, GSMxs Feeders - GS-393-00A
A - 33
Tape Pocket Depth Limitations:
Tape size
Pocket length 3
Pocket depth
8mm
N/A
0.098" (2.49mm)
12 to 24mm
N/A
0.394" (10mm)
32 to 56mm
Up to 1.140" (28.9mm)
Between 1.140" and 1.378"
(28.9mm and 35mm)
0.394" (10mm)
0.360" (9.14mm)
Notes:
1.
The feeder index cycle begins when the Z axis (spindle) reaches the up position. The default time to index
the next part to the pick position is 0.70, 1.0, or 2.0 seconds dependent on the feeder model.
2.
Indicates a double stroke cylinder.
3.
Tapes with pocket lengths longer than 1.378" (35mm) must be evaluated by Universal.
Pocket length
Component
Tape
Pocket
0.23" (5.8mm)
Shown is the maximum distance
from the top of the tape to the top of
the component.
GS-393-00A - Appendix A, GSMxs Feeders
A - 34
Track Feeder, model 4696A
Introduction
The Track Feeder supports and positions component tubes for
component transport to the pick position for GSMxs presentation.
Tracks and feeder bases are sold separately. Consult your Universal Sales Engineer for the Track Application Listing. The
Track Application Listing contains the component types and dimensions that can be used on the track feeder.
Machine Concept
The track assembly and the feeder base assembly make up the
track feeder.
The component specific track accommodates a maximum of four
tubes. Track assemblies, with or without isolator assemblies, can
be installed on the base assembly.
Modular design of the track feeder permits quick feeder changeover on the GSMxs.
Standard Features
Track Assembly
The component track assembly, with or without an isolator assembly, is application specific. Tracks are available for SOIC,
LCC, PLCC, SOJ, and MOD DIP components. Select the required track from the Track Application Listing. Tracks with isolators are used for the most common component packages. A
track load assembly or wireform supports the component tubes.
Feeder Base Assembly
The feeder base assembly, with GSMxs mounting, includes the
interface and shutter assembly.
Appendix A, GSMxs Feeders - GS-393-00A
1
A - 35
Component
Tube
2 Track Assembly with
Isolator Assembly
3 Interface Assembly (Used
with isolator equipped
track assembly. Removed
when installing all others.)
3a Shutter
Feeder Base
Functional Description
The following sequence of events describes the track feeder
functions. The numbers in parenthesis relate to the callouts on
the track feeder.
(1) Components are loaded:
•
Automatically from component tube.
•
Manually from a component tube. Nonstandard tubes may
require a manual method.
(2) The components move through the track assembly to the
pickup position. An isolator relieves component back-pressure for ease of component pickup.
(3) The interface, between the track and the feeder base, includes a shutter. Components remain in the track, captured
by the shutter until the component is picked.
GS-393-00A - Appendix A, GSMxs Feeders
A - 36
Technical Specifications
Required Feeder
Positions
3 feeder slots
Service Requirements
Electrical
Power is provided by the GSMxs.
Pneumatic
Air is provided by the GSMxs.
Appendix A, GSMxs Feeders - GS-393-00A
A - 37
Stationary Matrix Tray Platform, model 4697A
Introduction
The stationary matrix tray platform is a base for up to 7 x 13 inch
matrix trays. The matrix tray platform requires no power and
has no options.
Functional Description
The matrix tray support clamp assembly secures matrix trays for
component pickup by the GSMxs.
Technical Specifications
Maximum
component and
tray height
1.0" (25.4mm)
Weight
26 pounds (11.8 kg)
Required feeder
positions
8 feeder slots
Service
requirements
None is required.
GS-393-00A - Appendix A, GSMxs Feeders
A - 38
Multi-tube Feeders, model 4698A
Introduction
The model 4698A Multi-tube Feeder delivers a variety of components from tubes to the pick position on the GSMxs. The feeder
is loaded with multiple tubes of the same component type and
part number. It automatically ejects empty tubes and continues
feeding components. The feeder can be manually loaded with
full tubes while the GSMxs is operating.
The General Application Placement Head can gang-pick from
the Multi-tube feeders that require two feeder slots.
Standard Features
Each feeder is dedicated to a component style. Universal Instruments offers the following multi-tube feeders for integration to
the GSMxs.
·
16 pin SOIC
·
28 pin PLCC
·
32 pin PLCC
·
44 pin PLCC
·
52 pin PLCC
·
68 pin PLCC
Appendix A, GSMxs Feeders - GS-393-00A
A - 39
Functional Description
1
4
2
3
The following sequence of events describe the multi-tube feeder
functions. The numbers in parenthesis relate to the callouts on
the Multi-tube Feeder illustration.
(1) Tubes are stacked, one on top of the other and at an angle,
for gravity feed of components to the singulator/track assembly.
(2) The singulator retains the second component in line, while allowing the first component in line to advance to the conveyor.
When the singulator returns, the line of components advance
by one component length.
(3) The conveyor indexes the component to the end stop for pick
up by the GSMxs. head.
(4) An empty tube ejects from the bottom of the feeder and the
next one in the stack drops into position for feeding to the
singulator
Technical Specifications
Electrical
Power is provided by the GSMxs.
Pneumatic
Air is provided by the GSMxs.
Required feeder
positions
2 feeder slots
Tube length
19.75 to 22.00" (501.6 to 558.8mm)
Tube stack height
4.00" (101.6mm), maximum
Index rate
Programmable in feeder library. Recommended
minimum setting is 1.300 seconds.
GS-393-00A - Appendix B, GSMxs Placement Heads
B - 40
Appendix B, Placement Heads
UFP300+ High Accuracy Head
Compatible Features and Options
Configuration
The UFP300+ High Accuracy Head can be
installed on the front or rear of the beam on the
GSMxs.
The UFP300+ head accesses the camera,
feeders, and nozzle changer on the same side as
the head installation.
Components are picked from feeder slot
positions 8 to 29 and 44 to 65.
Compatible/
Optional
Features
Flux Dispenser
General Application Placement Head
Dispense Head
Nozzle Changers
High Force 4 Spindle Head
Components (UFP300+ head)
Minimum
Maximum
Width (X)
0.04" (1.016mm)
2.0" (51mm) 1, 2
Length (Y)
0.02" (0.508mm)
2.0" (51mm) 1
Thickness
0.020" (0.508mm)
0.500" (12.7mm)
Feature pitch
0.006" (0.15mm)
—
Feature width
See camera appendix
Total feature count
—
1.
2.
X
Y
1000
Maximum component size for on-the-fly vision is 1.25"
(31.8mm) with standard magnification.
The GSMxs can handle other size components. Consult
your Universal Sales Engineer.
Appendix B, GSMxs Placement Heads - GS-393-00A
B - 41
Placement Specifications (UFP300+ head)
Placement rate
800 components per hour
Component
placement force range
150 to 10,000g
Final placement
performance
50 defects per million (dpm)
Intrinsic availability
98%
Placement performance
X&Y
±17.5 microns @ 5.
CP 1.67
. 3.5 microns
Performance based on placement of 140 lead, 25 mil pitch glass
components on a glass substrate using global fiducials. Data
analyzed on a per placement site basis (n = 30).
GS-393-00A - Appendix C, GSMxs Cameras
C - 42
Appendix C, Cameras
Technical Specifications
Camera Specifications
Magnification
Standard magnification
Medium magnification
High magnification
1 pixel = 0.004" (0.102mm)
1 pixel = 0.0026" (0.066mm)
1 pixel = 0.0013" (0.033mm)
Minimum lead width with inspection
Standard magnification
Medium magnification
High magnification
0.010" (0.254mm)
0.0065" (0.165mm)
0.00325" (0.083mm)
Minimum lead width without inspection
Standard magnification
Medium magnification
High magnification
0.008" (0.203mm)
0.0052" (0.132mm)
0.0026" (0.066mm)
Maximum component size in a single field of view (F.O.V.)
Standard magnification
Medium magnification
High magnification
1.25" (31.75mm)
0.779" (19.79mm)
0.389" (9.88mm)
Required pixels for
Centering, lead width and space between leads
Inspection, lead width and space between leads
Bumped components, per feature and spacing
between features
2.0 pixels
2.5 pixels
5.0 pixels
Appendix E, GSMxs Advanced Surface Mount Assembly - GS-393-00A
E - 43
Appendix E, Advanced Surface Mount Assembly (ASMA)
Introduction
The flexibility of the GSMxs makes it readily adaptable to assembling bare die to the next level package; either a component level
package or a board level substrate. To focus on these particular
assembly requirements, Universal Instruments established the
Advanced Surface Mount Assembly Product Team to work
closely with customers and develop the appropriate application
solutions using the GSMxs, typically in a GSMxs Placement Machine configuration. This document outlines typical applications
and the GSMxs options developed by the Advanced Surface
Mount Assembly Product Team to meet the assembly requirements.
Applications
This Appendix covers any application involving the placement of
bare die, in either an active circuitry up or die attach configuration for subsequent wire bonding or an active circuitry down or
flip chip configuration. Applications include the assembly of components, such as pin grid array (PGA) and ball grid array (BGA)
packages, as well as direct attachment of the die to a printed circuit board or substrate.
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GS-393-00A - Appendix E, GSMxs Advanced Surface Mount Assembly
Flip Chip Application
Die
Au
Die
Glass epoxy
board
3Sn/97Pb solder ball
Reflow Temp 316°C
Ceramic
substrate
3Sn/97Pb
solder ball
63Sn/37Pb solder pad
Reflow temp 183°C
There are many interconnection schemes for flip chip applications, where the bare die is placed with the active surface facing
the next level package, thus creating the shortest possible interconnect path. Bare die for flip chip applications have an array of
interconnects across the active surface, either along the periphery or distributed across the entire surface. The most common
flip chip interconnection scheme uses solder as the interconnection material. The interconnection structures on the die, referred
to as bumps, are typically made of solder, 4 to 5 mils in diameter
on a 8 to 10 mil pitch, although larger and smaller bump diameters
and coarser pitches are also used. The composition of the solder
can be either 63Sn/37Pb (eutectic) or 3Sn/97Pb depending on the
application.
Flip chip die can be attached to various types of substrate media,
including FR-4, ceramic, copper/polyamide, and flex cables. The
typical flip chip attachment process includes picking the die from
the appropriate input feeder, fluxing, and placement, followed by
a mass reflow. It should be noted that solder paste deposition
does not typically precede the placement process, since the interconnect pitches are finer than typically supported by the solder
printing process. All the solder needed to form the solder joint is
provided by either the bump on the die or the pad on the substrate
depending on the application. For flip chip die, flux is used to mechanically hold the die in place until reflow in addition to cleansing
the solderable surfaces. The die along with any other standard
surface mount components can be soldered in a single mass
reflow process.
Die Attach Application
For die attach applications, the die is fabricated in the traditional
manner with wire bond pads located along the periphery in either
a single or staggered double row. Prior to placement of the die
onto the next level package, epoxy or solder paste is screened or
dispensed onto the placement site. The die is then placed with the
active circuitry facing upward or away from the surface of the
printed circuit board or substrate. After placement, the assembly
is reflow soldered or the epoxy is cured, preparing it for the wire
bonding process.
Appendix E, GSMxs Advanced Surface Mount Assembly - GS-393-00A
E - 45
Application Summary
Advanced Surface Mount Assembly Product Team has configured the GSMxs to handle a wide variety of component and
board level assembly processes. The following applications are a
partial listing of the assembly solutions developed to date:
CBGA
G Building CBGA (ceramic ball grid array) and CCGA (ceramic column grid array) components. In fact, the GSMxs is
used for two aspects of this application. First, the GSMxs is
used to flux and place a flip chip onto the small ceramic substrate. For some applications which also include surface
mount capacitors, solder paste is dispensed and the capacitors placed in a single assembly run with the flip chip. The
assembly is then mass reflowed. Second, arrays of solder
balls or columns are put into a graphite boat/carrier and then
are screen printed with solder paste prior to entering the
GSMxs. The assembled ceramic substrate from the first process step is placed on the arrays, and mass reflowed a second time. Solders used in each assembly process are carefully chosen to ensure that each solder joint is not melted during each assembly step.
G Building PBGA (plastic ball grid array) components. The
GSMxs is used either to dispense flux and place a flip chip
die or dispense conductive epoxy and place a bare die for
subsequent wire bonding onto a strip of small laminate (FR-4)
substrates. As in the CBGA and CCGA components, capacitors may also be assembled in a single assembly run. This assembly is then reflowed or cured.
G Building PGA (pin grid array) components. The GSMxs is
used to place bare die into conductive epoxy in ceramic PGA
PBGA
cavity package. For this application, an upline dispensing system was used for the dispensing operation to maximize the
throughput of the GSMxs, however, the epoxy could have
been dispensed within the GSMxs
G Building silicon on silicon multi-chip modules. A silicon wafer
substrate is loaded into the GSMxs in a pallet. The wafer has
PGA
E - 46
GS-393-00A - Appendix E, GSMxs Advanced Surface Mount Assembly
been stenciled with a special formulation of solder paste in a
bump pattern. Silicon chips without bumps are placed in a
flipped configuration on the wafer. The assembly is mass
reflowed, and the paste reflows to form a bumped interconnect.
G Building hybrid circuits. Thick film ceramic substrates are
stenciled with conductive epoxy or solder paste. SMT components and bare die are placed into the epoxy by the
GSMxs. Bare die from 0.38mm square (15 mils square) have
been successfully assembled.
Silicon on silicon
multi-chip modules
G Building a PCMCIA format PCB with SMT components including resistors, capacitors, TSOPs, QFPs, and flip chips.
The SMT components are placed into screened solder paste.
On the flip chip site, the board has pre-deposited with eutectic solder, so the machine dispenses no clean flux on the
board and then places the flip chip component. With this
GSMxs as the fine pitch placement machine, the entire product can be built on a standard SMT line.
G Building PCBs and flex cables with COB technology. The
PCB or flex cable enters the GSMxs where conductive epoxy is dispensed and the bare die is placed. In addition to the
PCMCIA
GSMxs, Universal has integrated complete COB lines, including cure ovens, plasma cleaners, and wire bonders.
Bare die on flexible circuits
Appendix E, GSMxs Advanced Surface Mount Assembly - GS-393-00A
E - 47
C4 Option
To assemble flip chip die on a GSMxs, the C4 Option must be
added. The C4 Option consists of:
G a high or ultrahigh magnification upward looking camera with
low angle circular lighting for optimal illumination of the
bumps on the flip chip die.
fli
p
ch
ip
G unique vision algorithms for reliably processing interconnect
arrays (bumps) of a specific pattern at high speed, in a high
performance vision system.
Universal has developed extensive flip chip process and applications expertise. In addition to providing the machine upgrade, Universal will provide the technical support necessary to ensure a
smooth implementation of this advanced assembly technology.
C4 Retrofit Kit
A GSMxs without the factory installed C4 option kit can be retrofitted with the C4 Option in the field. It requires minor
reconfiguration of the machine and hardware replacement.
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GS-393-00A - Appendix E, GSMxs Advanced Surface Mount Assembly
Optional Features
Feeders for Silicon Die
Precision Slide Top Matrix Tray Feeders
Precision slide top matrix tray feeders are designed to securely
locate multiple Fluoroware type matrix trays within the pick up
area of the GSMxs placement machine. For loading and unloading of matrix trays the operator releases the latch and slides the
top plate in or out of the machine. Applications using this type of
feeder are subject to some restrictions, and it is recommended
that the factory be consulted for complete applications discussion.
Precision matrix tray feeders are available for both 2 x 2 and
4 x 4 matrix trays.
Tape Feeders
Silicon die for standard die attach or flip chip applications can be
input into the placement machine in conventional tape and reel
format. For applications where the die are packaged in this manner, standard Universal Instruments tape feeders can be used.
(see appendix A for details)
Silicon die can also be packaged in coverless tape format. Coverless tape uses a tacky film fixed along the bottom of a punched
carrier tape. The die is placed onto the tacky film, holding it in
place, thus requiring no cover tape. Unlike conventional tape and
reel, this input format does not require a specific pocket size to
contain the die. Currently, coverless tape is not covered by any
industry standard and is sometimes referred to as Surftape.
Appendix E, GSMxs Advanced Surface Mount Assembly - GS-393-00A
E - 49
Coverless Tape Feeder for Flip Chip
Applications
When packaged in coverless tape, die for flip chip applications
must be inverted prior to placement, which is accomplished within
the tape feeder via an internal flip mechanism. The back side of
the die is ejected from the tacky tape with a die ejector mechanism and transferred to the flip mechanism. The flip mechanism
inverts the die, and presents it to the placement machine with the
active circuitry facing downward.
Coverless Tape Feeder for COB Attach
Applications
When packaged in coverless tape, die for COB applications do
not need to be inverted prior to placement. The back side of the
die is ejected from the tacky tape with a die ejector mechanism
and presented directly to the placement machine with the active
circuitry facing upward.
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GS-393-00A - Appendix E, GSMxs Advanced Surface Mount Assembly
Wafer Handling Option
Die for either flip chip or die attach applications can be presented
to the placement machine in wafer format. Wafers are available
in various diameters up to 8 inches. Frames are used to hold the
wafer during the dicing process. These same frames can be used
for presentation of the wafer to the placement machine. Multiple
wafers and multiple part numbers can be resident in the wafer
handler at the same time, and can be presented to the machine as
needed for a particular assembly. The quantity of individual die
within a wafer will vary with respect to the size of the wafer and
the size of the individual die.
Once wafers in frames have been loaded into the wafer handler,
the frame is automatically removed from the wafer magazine,
loaded onto an X-Y table and precisely located. A die ejector
mechanism is located under the die to be picked, and is raised to
lift the die from the tacky tape in the wafer ring. The die is then
picked up with a vacuum collet and transported to a four spindle
transfer shuttle. This process is repeated up to four times before
the transfer shuttle indexes these die for pickup by the placement
machine. For flip chip applications where the die require inverting
prior to placement, the vacuum collet transports the die to an inverter instead of the four spindle transfer shuttle. The inverter
has four placement locations. Once loaded with die, the inverter
rotates 180°, and places the die on the four spindle transfer
shuttle which then indexes the die for pickup.
Unlike other input media which, in principal, contain only good
components, the wafer will contain both functional and defective
die. To avoid using the defective die in an assembly, they must be
sorted during the testing process. The results of the sorting process can either be downloaded from the testing equipment via a
wafer map, or the defective die can be marked with an ink dot in
the test equipment , which can later be identified by the vision
system in the wafer handler. Both defective die identification
scenarios can be accommodated.
Appendix E, GSMxs Advanced Surface Mount Assembly - GS-393-00A
E - 51
Fluxing Options
For applications requiring flux, there are options for applying flux
to either the substrate or the component just prior to placement.
The type of fluxing mechanism will be dictated by material properties of the flux.
Micro-Dispense Fluxer
The Micro-Dispense Fluxer has been designed to allow for precise dispensing of low solids flux onto the center of the placement
site. This fluxer consists of a positive displacement pump programmable in 0.1 microliter increments. The pump forces flux
down a capillary tube which is lowered to the substrate during the
dispensing process. A sealed container of flux which feeds the
pump is mounted within the machine, incorporating low level and
pressurization sensing which signals the operator when flux needs
replenishing or if the container is not properly sealed. When
mounted in the machine, the Micro-Dispense Fluxer occupies one
of the two available head positions in the Universal Platform.
Thin Film Applicator
Note—This assembly uses an imbedded class II laser for sensing low flux conditions.
The Thin Film Applicator has been designed to apply flux directly
to an array of bumps or solder balls on the underside of a component. The flux is applied by dipping the component into a thin film
of flux immediately prior to placement. Components can be
dipped either individually or up to three at once depending on the
component size. The flux film thickness is adjustable with a doctor blade on a rotating disk. During non-fluxing, the disk rotates
continuously. During component fluxing, the disk is stopped momentarily, the bumps are lowered into the flux and raised, and
then the disk begins rotating again. Sensors, mounted within the
Thin Film Applicator automatically sense when flux needs to be
applied to the disk. A container of flux is mounted within the Thin
Film Applicator and incorporates low material sensing which signals the operator when the flux needs replenishing by the operator.
The Thin Film Applicator can also be used for materials other
than flux, such as epoxy, grease, etc. For these special applications, please consult an applications engineer.
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GS-393-00A - Appendix E, GSMxs Advanced Surface Mount Assembly
C4 Option
minimum
maximum
Die size
0.020" square
2.000" square
Bump size
0.003" diameter
0.005" diameter
N/A (ultrahigh magnification)
(high magnification)
Bump pitch
0.005" diameter
0.009" diameter
N/A (ultrahigh magnification)
(high magnification)
Placement
performance
The nominal placement capability for flip chip
components placed on a GSMxs with the C4
option installed follows:
GAPH/C4
Placement Head:
±30 microns @ 5F
CP 1.67
F 6 microns
(HD Front)
N: ±0.2° @ ±5F (cp 1.67)
N Repeatability 0.04°
x, y, N 1.50 Cpk
UFP300+
Placement Head
±17.5 microns @ 5F
CP 1.67
F 3.5 microns
The nominal placement capability for bare die in
die attach applications is the same as for
standard surface mount components as outlined
in the GSMxs General Specification.
Cycle Time
For flip chip components, the placement rate will
vary widely depending on size, number of bumps
imaged, type of feeding method selected, the
type of fluxer, and whether fluxing is required for
each placement. The cycle time can vary
between 1 and 5 seconds. For bare die, the
placement rates are less variable, and are
roughly equivalent to those for standard surface
mount components as outlined in the GSMxs
General Specification. When the C4 Option is
installed on the GSMxs, the cycle time for
standard surface mount components remains
unaffected.
Placement pressure 175 g to 2500 g (GAPH/C4 Head)
150 g to 10,000 g (UFP300+ Head)
Consult factory for placement forces less than
150 grams.
Service requirements
Electrical
Pneumatic
Vacuum
Provided by the GSMxs
Provided by the GSMxs
Provided by the GSMxs
Appendix E, GSMxs Advanced Surface Mount Assembly - GS-393-00A
E - 53
Coverless Tape Feeder
Configuration
8mm, 12mm, 16mm, 24mm
Custom tape widths and formats are available
Required feeder
positions
2 feeder slots are required for 8 through 24mm
feeders
Service requirement
Provided by the GSMxs
Provided by the GSMxs
Generated within the feeder
Electrical
Pneumatic
Vacuum
Precision Slide Top Matrix Tray Feeders
Configuration
Common base with interchangeable top plates
Top Plate
Configuration
12 - 2 x 2 Fluoroware type trays
3 - 4 x 4 Fluoroware type trays
Custom top plate are available upon request
Required feeder
positions
6 slots
Service requirements
Electrical
Pneumatic
Vacuum
Not required
Not required
Not required