2015‐2016 PRODUCT CATALOG 1975‐2015 Since 1975, H‐Square has been providing tools and equipment of unparalleled excellence to the wafer fabrica on indus‐
try. Our products are the standard against which all others are measured in semiconductor manufacturing facili es throughout the world. Our products range from simple vacuum wands for wafer handling and tools for mask handling, to complex micropro‐
cessor controlled automa c systems. Our Custom Products Department will design tailor‐made products for your unique needs. H‐Square also produces handling tools and devices for the flat panel display (FPD), LED, medical device, solar, automo ve, and computer hard disk industries. At H‐Square, our philosophy has always been to provide products of unsurpassed quality developed with the highest degree of engineering excellence and manufactured with cra sman‐like workmanship. They are available worldwide through a network of manufacturers' reps and distributors. © 2015‐2016 H‐Square Catalog15‐16.1 1 www.h‐square.com WAFER ALIGNERS 22 WAFER MOVERS 32 WAFER TRANSFERS 34 WAFER PRESENTERS 42 POD OPENERS—FOUP/SMIF/RSP 47 WAFER CASSETTES 50 CASSETTE HANDLES 62 MOCK WAFERS 66 ERGOLIFT TRANSPORT CARTS 68 MECHANICAL WAFER PICKS 70 PHOTOMASK HANDLING 76 BERNOULLI HANDLING—BREEZE™ 84 FREEDOM WANDS 86 VACUUM WANDS 92 WANDS 96 HOLDERS AND COIL CORDS 101 TIPS 110 ACCESSORIES 129 DIE & PACKAGE HANDLING 136 MATERIALS 142 CARE & MAINTENANCE 146 SALES & SERVICE REPRESENTATIVES 148 INDEX 154 © 2015‐2016 H‐Square
2 WPR
AWM
BUMP TIP
LCT
scratch/defect reduction products
Many of H‐Square’s core products were developed to specifically reduce or eliminate operator manual handling movements, which can lead to defects on the wafers. The AWM Wafer Mover and the WPR Wafer Presenter with rota on eliminate the need for a vacuum wand or tweezer. The LCT Low Contact Transfer sta on takes the operator mo on out of a bulk transfer applica on and eliminates abrasion and par cles common with slide transfers. The vacuum p with a bump on the backside prevents the operator from inser ng the vacuum wand in between wafers. H‐Square invites you to review how our exis ng products can immediately help you reduce defects due to wafer handling errors. © 2015‐2016 H‐Square Catalog15‐16.1 3 www.h‐square.com H2BST
LCT
FB20A106
MISC1700
thin wafer handling
Thinning of an IC chip improves the total efficiency, as it allows a more efficient cooling, faster speed and, as an added benefit, the design of smaller form factor devices. H‐Square can build on its extensive experience in thin wafer handling technology to support its customer's requirements. Thin wafer handling capabili es generally enable the handling of wafers during and a er backside grinding, where the substrate Thinning of an IC chip improves the total efficiency, as it allows a more efficient cooling, faster speed and, as an added benefit, the design of smaller form factor devices. © 2015‐2016 H‐Square
4 MCF THIN
TAIKO HANDLING
MISC1400-006
AFEZ THIN
thin wafer handling
H‐Square can build on its extensive experience in thin wafer handling technology to support its customer's requirements. Thin wafer handling capabili es generally enable the handling of wafers during and a er backside grinding, where the substrate is thinned down to the single digit micrometer scale. H‐Square has developed thin wafer handling products for every type of substrate. Our unique thin wafer handling transfers, aligners, vacuum wands, presenters and casse es are in use at our customer sites around the globe. © 2015‐2016 H‐Square Catalog15‐16.1 5 www.h‐square.com FFTB1
FFTBAS
NF/MF
ANF/AF
wafer aligners
H‐Square wafer notch and flat aligners provide an inexpensive and accurate method of batch alignment of wafers to any angle. They are compa ble with SEMI standard casse es. EZ Guide models are constructed with advanced ESD safe materials and the open design stage is laminar flow compa ble. H‐Square Custom Products Department offers a wide range of customizable features for both standard and non standard substrates © 2015‐2016 H‐Square
6 AET FLAT
AET NOTCH
ETAS1
SQ21541
wafer escalators
Automa c and manual escalators li wafers incrementally when casse e are placed on the tool. Wafers are lted 25º to enhance ID readability and an op onal LED light bank is available. Plas c ESD safe construc on makes unit idea for all lot verifica on—lot integrity applica ons. © 2015‐2016 H‐Square Catalog15‐16.1 7 www.h‐square.com WB5L1
WP
WPR
HL
wafer presenters
H‐Square wafer presenta on systems provide an inexpensive and programmable method of removing/
replacing wafers contrac ng other wafers in the casse e or the circuit side of the li ed wafer. Presenta on systems are designed to allow safe access to wafers for handling lower wafers for inspec on or Iden fica on purposes, without the need for wafer where scratching and par culate contamina on must be avoided. © 2015‐2016 H‐Square
8 LCT1AS12
AWT
LCT
AVT
wafer transfers
As the industry moves from one technology genera on to the next in its drive to make smaller, faster and more func onal chips, H‐Square is always there – providing the leading‐edge technology to help make it happen. We are the world’s #1 provider of casse e to casse e wafer transfer equipment, offering both automa c and manual solu ons to state‐of‐the‐art manufacturing customers. Automa c Low Contact Transfers (LCT) and manual horizontal transfer (WT) are rou nely modified for thin wafer transfer applica ons. Contact your local H‐Square representa ve for more details. © 2015‐2016 H‐Square Catalog15‐16.1 9 www.h‐square.com AWM
WS300M
wafer mover
Economical, automa c single wafer transfer systems. Engineered for produc on, metrology, R&D, test‐
assembly‐packaging, and applica on labs. H‐Square offers a simple compact design for moving single wafers between two casse es in a RECIPE or MANUAL mode of opera on. A safe vacuum‐less low contact end‐effector includes a built‐in wafer mapping sensor which scans each casse e and detects wafers for safe accurate wafer movements. © 2015‐2016 H‐Square
10 AFO
FOMH
SMIFPO
SMIFMAN
pod openers
Standard Mechanical Inter Face (SMIF) pods and Front Opening Unified Pod (FOUP) carriers are based on an Isola on technology developed in the 1980s at Hewle ‐Packard. Today, this system is in used in many semiconductor wafer fabrica on and cleanroom environments throughout the world for both wafer handling and photomask re cle handling. H‐Square pod openers provide an inexpensive method of gaining access to a substrate storage pod carrier. H‐Square has a complete line of both automated and manual stand alone tools. Units are ideal for any applica on where par culate contamina on must be avoided. © 2015‐2016 H‐Square Catalog15‐16.1 11 www.h‐square.com 2851
MC1
MC12
MCF
SSC
metal wafer cassettes
H‐Square is the oldest and most experienced manufacturer of metal wafer casse es in the world. During the past 40 years H‐Square has manufactured the radically‐simple 2851 and MC1 designs that has proven to provide the best reliability, performance, service life, and value of all of the compe ve products that have come and gone in the industry. In addi on to the 2851 series casse e, H‐Square offers a full line of specialty metal wafer casse es, in both aluminum and stainless steel, for any applica on. Custom casse es can be manufactured for special substrate sizes and thicknesses. © 2015‐2016 H‐Square
12 PC
custom PTFE wafer cassettes
H‐Square offers a full line of specialty plas c wafer casse es for any applica on. Custom casse es can be "PC" series casse es are precision machined custom casse es for special applica ons where off‐the‐shelf injec on molded casse e varie es are either unavailable or under‐performing. The majority of H‐Square "PC" casse es are manufactured from PTFE Teflon® material, however, H‐Square also offers casse es manufactured from a selec on of advanced high performance plas cs, including an sta c Pomalux, PEEK, and an sta c polypropylene. © 2015‐2016 H‐Square Catalog15‐16.1 13 www.h‐square.com RSP OPENERS
BRIGHT
LIGHT
MASK PICKS
PM NITROGEN CLEAN
photolithography handling
H‐Square’s complete line of photomask handling tools is the result of years of work with semiconductor companies and mask shops to provide a non‐contamina ng secure means of handling re cles. Mask Picks can reduce contamina on by elimina ng direct contact of the mask by an operator’s hands. Masks are easily inserted and extracted from various fixtures and storage containers, and are securely gripped while loaded in the pick. With the stringent cleanliness requirements for sub‐micron applica ons today, mask picks have become indispensable. In addi on to mask picks, H‐Square has designs for many support tools for opening and closing re cle pods © 2015‐2016 H‐Square
14 H2BST
H2B
breeze Bernoulli handling
The Breeze™ provides a state‐of‐the‐art touch‐less solu on for manually transferring wafers while introducing li le to no stress to the substrate. H‐Square’s Breeze™ wand is a non‐contact wafer handling substrates. The handling tool uses compressed facility gases (typically Nitrogen ‐or‐ CDA ‐ clean dry air), to stream airflow from a center sparger cap or sparger tube to the perimeter of the wafer. configura on. Custom configura ons are also available through your local H‐Square representa ve. © 2015‐2016 H‐Square Catalog15‐16.1 15 www.h‐square.com vacuum handling
H‐Square manufactures an extraordinary number of different types of vacuum ps for many different sizes, shapes, weights and materials of wafers, substrates, dies and packages and applica ons/equipment, as well as for a complete range of temperature and chemical environments. H‐Square recommends carbon filled PEEK ps for most applica ons especially where ESD protec on is a must. Higher temperature requirements will be met by a range of p materials from Torlon® (polyamide‐imide) and Vespel® (polyimide) plas cs, aluminum, stainless steel, hybrid quartz with stainless steel/Invar tubes or 100% (all) quartz glass. H‐Square will design and fabricate vacuum ps to your specifica ons for your special requirements.. © 2015‐2016 H‐Square
16 FWCR3
FWCR2
FWA3
FWAH
Freedom Wands™
Self contained vacuum wands allow freedom from a house vacuum line sources. A rechargeable ba ery pack provides enough power for the FREEDOM WAND™ to operate con nually up to 2 to 5 hours without the need to recharge. Safe ‐ Low ba ery power warning indicator LED light. Versa le ‐ Accommodates most of H‐
Square’s ps and cups to handle all sizes of wafers and packages. Clean ‐ Filtra on system allows the FREEDOM WAND™ to be used in Class 1 cleanrooms without the fear of par culate genera on. All models include Normally OPEN wands; depress bu on to release wafer. Ba ery charger and wand p adapter also included. Order ps for specific applica ons separately. © 2015‐2016 H‐Square Catalog15‐16.1 17 www.h‐square.com ODP 3PT
MCP
ODP MPS
ODP MPH
mechanical wafer handling
H‐Square has over 30 years experience providing clean room mechanical handling tools to the Semiconductor, Automo ve, Photo Lithography and Medical industries. The ODP tool is a fully mechanical tool, which provides edge only handling of substrates using v‐groove profile grippers or edge clamp technology. The MCP tool was originally developed for MEMS wafer handling applica ons, however, many customers have found them to be useful for wafer sampling and removing wafers from a process tool. These tools are highly customized for specific applica ons and are available for all wafer sizes and thicknesses. © 2015‐2016 H‐Square
18 NU-TWEZER
ODP MPH
HDCP
mechanical handling
Advanced design, normally closed, mechanical handling tool for large die or small device. Each tool is custom designed for a specific device. Customiza on allow a constant force grip to eliminate edge damage. Base units are made from ESD safe Polypropylene materials. Customized features: Tips can be developed per applica on; color coding available; choice of spring tension; high temperature materials available; chemical resistant materials available. Please contact your local H‐Square representa ve for more informa on on custom H‐Square mechanical handling tools. Minimum order quan es (MOQ) apply. © 2015‐2016 H‐Square Catalog15‐16.1 19 www.h‐square.com FL
ergo lift handling carts
Ergoli ™ manual guided transport (MGV) carts provide safe handling of heavy objects around a Ergoli ™ manual guided transport (MGV) carts provide safe handling of heavy objects around a rated up to 200 lbs. (91 kg) of li and allows this versa le tool to pick‐up and place objects and carriers cleanroom area. The ba ery driven motorized electric lead screw Z‐Axis li and customized end‐effector is on load ports, tables, and storage racks. The light weigh‐Mobile EZ™ design allows the operator to make precise manual movements when transpor ng product around a fab area. A demountable remote control, elimina on of Workman's Compensa on claims contribute to higher profitability for your company. © 2015‐2016 H‐Square
20 H‐Square Product Videos h p://www.youtube.com/user/
HSquareVideos H‐Square Wafer Transfer Videos AWM Automa c Wafer Mover 4:01 AWT Auto Horizontal Wafer Transfer 1:42 AWT Auto 200mm Horizontal Wafer Transfer 1:24 AVT6 Auto 150mm Ver cal Transfer 2:09 AVT4 Auto 100mm Ver cal Transfer 2:28 AVT8 Auto 200mm Ver cal Transfer Tool 2:45 LCT1AS6 150mm ASM Low Contact Transfer 1:44 LCT1AS6 150mm Varian Low Contact Transfer 1:27 LCT1AS12 Auto 300mm Low Contact Transfer 1:38 LCT1AS4 Auto 100mm Low Contact Transfer 1:19 LCT1AS Low Contact Transfer 2:44 LCTAS12‐AC‐003 Auto 300mm Transfer 1:44 LCT1AS8 Auto Thin Wafer Transfer 1:32 WS300M Automa c 300mm Wafer Mover 1:38 WT Custom Horizontal Clamshell Transfer 0:48 WT300 Manual 300mm Horizontal Transfer 0:42 WT6HAS‐009 Manual Dual Arm Wafer Transfer 1:03 WT6HAS‐017 Selec ve Slot Horizontal Transfer 0:49 WT28HAS Horizontal Transfer System 1:42 WT Odd‐Even Horizontal Transfer 1:40 H‐Square Wafer Aligner Videos AFEZ Auto 75mm Custom Auto Aligner 0:10 AFEZ Auto 75mm Auto Aligner 0:13 AFEZ6 Auto 150mm Flat Aligner 1:23 ANFEZQ8 Auto 200mm Notch Aligner 1:13 ANFEZQ8‐AC‐005 Wafer Edge Inspec on Aligner 2:07 FFTB1 Manual Flat Aligner 2:14 NFEZQ8 Manual 200mm Notch Aligner 0:58 H‐Square Mechanical Pick Videos FPD Mechanical Pick 1:02 MCP Mechanical Wafer Picks 1:42 ODP Mechanical Wafer Picks 2:13 Photolithography Mask Handling Picks 3:07 Taiko Thin Wafer Handling 0:20 © 2015‐2016 H‐Square H‐Square Pod Opener Videos AFO Auto 300mm FOUP Opener 1:10 RSP200 Manual RSP200 Pod Opener 0:55 SMIFPO8 Automa c RSP200 Opener 0:54 SMIFPO8 Automa c SMIF Pod Casse e Opener 1:13 SMIFMAN8 Manual SMIF Pod Opener 0:59 H‐Square Wafer Presenter Videos AET Auto 200mm Wafer Aligner/Escalator 1:02 ETAS1 Manual Wafer Escalator 1:10 HL‐4 100mm Manual Single Wafer Presenter 1:36 HL‐6 Manual 150mm Wafer Presenter 1:20 WP Auto 150mm Wafer Presenter 1:56 WP‐4 100mm Automa c Wafer Presenter 1:40 WPR Auto 150mm Wafer Presenter 2:00 WPR8 200mm Auto Wafer Presenter 2:14 H‐Square Vacuum Wand Videos FWA3AS2 300mm Freedom Wand™ 1:49 FWCR Cordless Freedom Wand™ 1:37 Vacuum Wand 300mm Thin Wafer Handling 0:34 Vacuum Wand 300mm Wafer Handling Tool 1:56 Vacuum Wand Die Handling 1:40 Vacuum Wand Thin Wafer MISC1400 1:02 Vacuum Wand Tips 2:56 Miscellaneous H‐Square Videos FL‐006 Ergoli ™ 450mm Carrier Transport FL‐004 Ergoli ™ 450mm Carrier Transport 2:14 FS‐002 Manual 300mm FOUP / FOSB Stand 0:53 MISC2500 Automa c On / Off Bright Light Box 1:10 Catalog15‐16.1 21 www.h‐square.com EZ Guide™ Notch Aligners This fully automa c microprocessor controlled notch finder provides for wafer notch alignment with minimal operator involvement. To align wafer flats the operator places the carrier on the unit and pushes the “RUN” switch. All wafer notches are automa cally aligned to the bo om, and then relocated to one of the 16 posi ons as set by the operator. Accuracy is be er than plus or minus one degree. No manual opera on or override is available. All rota on is controlled at a constant speed for minimal par culate genera on. Final wafer 16‐posi on rotary switch control is located near the RUN switch. Standard adjustment points are 0°, 2°, 45°, 88°, 90°, 135°, 176°, 178°, 180°, 182°, 184°, 225°, 270°, 272°, 315° and 358° degrees. Open design allows increased laminar airflow and improves cleanliness while minimizing footprint. EZ GUIDE™ posi oners assure properly posi oned casse es. ESD protected by sta c‐dissipa ve plas cs. Proprietary sta c‐
dissipa ve polyurethane roller withstands more than 2,000,000 cycles with accuracy of be er than ±1°. Compa ble with most standard plas c wet/dry process casse es, shipping and storage casse es. US Patent No. 5,551,829 Unique quick disconnect roller feature allows mainte‐
nance staff to remove the roller assembly for cleaning or replacement. Replacement power supply for all automa c EZ‐Guide™ aligners: A000‐754‐1 USA (100‐120 VAC) A000‐754‐2 EUROPE (220‐240 VAC) A000‐754‐3 UK (220‐240 VAC) © 2015‐2016 H‐Square
22 Aligners A U T O M A T I C
N O T C H
150mm Notch Aligner– automa c EZ Guide™ ‐ 25 slot Automa c notch aligner for 150mm wafers in a 25‐slot casse e. Stage: An sta c Polypropylene Roller: An sta c Polyurethane SQ22143‐3 USA (100‐120 VAC) Replacement Drive roller: A000‐723 Replacement Notch Roller: A000‐1078 150mm Notch Aligner—automa c EZ Guide™ ‐ 12 slot Automa c notch aligner for 150mm wafers in a 12‐slot casse e. Stage: An sta c Polypropylene Roller: An sta c Polyurethane SQ21733‐8 Entegris 12 slot USA (100‐120 VAC) SQ21733‐10 ePak 12 slot USA (100‐120 VAC) Replacement Drive roller: A000‐723 Replacement Notch Roller: A000‐1078 200mm Notch Aligner– automa c EZ Guide™ ‐ 25 slot Automa c notch aligner for 200mm wafers in a 25‐slot casse e. Stage: An sta c Polypropylene Roller: An sta c Polyurethane ANFEZQ8 Replacement Drive roller: PRA8 Replacement Notch Roller : NFNRQ 300mm Notch Aligner– automa c EZ Guide™ ‐ 13 slot Automa c notch aligner for 300mm open bo om casse es (not FOUP or FOSB). Stage: An sta c Polypropylene Roller: An sta c Polyurethane Contact H‐Square for Ordering Part Numbers © 2015‐2016 H‐Square Catalog15‐16.1 23 www.h‐square.com US Patent No. 5,551,829 Ba ery Powered Motorized Top/Bo om Notch Aligners This ba ery powered notch finder is designed to align SEMI standard notched wafers. Similar in principal to flat finders, it uses a small diameter, nylon alignment roller to rotate the wafers. When the notch registers over the roller the wafers cease rota on, leaving the notches aligned at the bo om. This notch finder is compa ble with most standard plas c wet/
dry process carriers and shipping/storage containers. The Bo om‐Motorized Top model allows reloca on of aligned notches to any posi on. The drive roller consists of an elastomeric PVC (Tygon™) sheath over Acetal (Delrin™). The roller is a ached to a manual li ing mechanism. A er the notches have been aligned to the bo om using the motor drive, the operator presses a li bar, which raises the drive roller. The roller li s all wafers away from the notch alignment roller. The operator then manually rotates the spinner knob to relocate aligned notches to desired posi on. Notch finders are constructed of hard clear anodized 60621 T‐6 aluminum alloy for dimensional stability and durability. Base plates are lted for wafer separa on. Models use “D” cell style ba eries. EZ Guide™ Manual Top/Bo om Notch Aligners This manual notch aligner provides for top/bo om wafer notch alignments. To align wafer notches the operator places the carrier on the unit and rotates the manual knob. Unique wafer roller and alignment system gently captures and posi ons the notches to the bo om of the casse e. Operator can then rotate the roller alignment switch and manually rotate the wafer notch posi on to any posi on on the radius. Open design allows increased laminar airflow and improves cleanliness while minimizing footprint. EZ Guide posi oners assure properly posi oned casse es. ESD protected by sta c
‐dissipa ve plas cs. Proprietary sta c‐dissipa ve polyurethane roller withstands more than 2,000,000 cycles with accuracy of be er than 1° degree. Compa ble with most standard plas c wet/dry process casse es, shipping and storage casse es. 150mm Top/Bo om Notch Aligner Ba ery powered manual motorized assist 25‐slot notch aligner for GaAs and Sapphire notched 150mm wafers. Stage: Anodized Aluminum Rollers: Tygon / Nylon SQ22386‐2 150mm notch aligner Replacement Drive Roller : A000‐988 Replacement Notch Roller: NRA6 200mm Top/Bo om Notch Aligner Manual Motorized Assist Notch aligner for 200mm notched wafers. Stage: Anodized Aluminum Rollers: Tygon / Nylon NFBMT18 200mm notch aligner Replacement Drive Roller: NFNRM Replacement Notch Roller: NRA8 © 2015‐2016 H‐Square
24 Aligners M A N U A L
N O T C H
150mm Notch Aligner– manual EZ Guide™ ‐ Standard 25 Slot Manual notch aligner for 150mm wafers in a 25 slot casse e. Stage: An sta c Polypropylene Roller: An sta c Polyurethane SQ22143‐2 Replacement Drive Roller: A000‐723 Replacement Notch Roller: A000‐1078 150mm Notch Aligner—manual EZ Guide™ ‐ 12 Slot Manual notch aligner for 150mm wafers in a 12 slot casse e. Stage: An sta c Polypropylene Roller: An sta c Polyurethane SQ21733‐9 Entegris 12 slot Casse es SQ21733‐11 ePak EPB‐6/150‐12 200mm Notch Aligner ‐manual EZ Guide™ Manual notch aligner for 200mm wafers in a 25 slot casse e. Stage: An sta c Polypropylene Roller: An sta c Polyurethane NFEZQ8 Replacement Drive Roller: PRA8 Replacement Notch Roller: NFNRQ 200mm EZ Guide™ Edge Inspec on Notch Aligner Manual dual knob version of the standard NFEZQ8 manual EZ Guide™ aligner. Dual knob control allows both right and le handed operators to slowly rotate the knob control for perfect edge inspec on of 200mm wafers. ESD safe construc on. Stage: An sta c Polypropylene Roller: An sta c Polyurethane / Nylon NFEZQ8‐005 Manual 200mm Notch, 25 slot 300mm Notch Aligner (13 and 25 Slot) manual EZ Guide™ Manual notch aligner for 300mm wafer in a non‐standard open bo om casse e. Custom Product. Stage: An sta c Polypropylene Roller: An sta c Polyurethane Contact H‐Square for Ordering Part Number(s) © 2015‐2016 H‐Square Catalog15‐16.1 25 www.h‐square.com EZ Guide™ Flat Aligners This fully automa c microprocessor controlled flat finder provides for wafer flat finding with minimal operator involvement. To align wafer flats the operator places the carrier on the unit and pushed the “RUN” switch. All wafer flats are automa cally aligned to the bo om, and then relocated to one of the 16 posi ons as set by the operator. Accuracy is be er than plus or minus one degree. No manual opera on or override is available. All rota on is controlled at a constant speed for minimal par culate genera on. Final wafer flat a 16 posi on rotary switch mounted controls loca on near the RUN switch. Standard adjustment points are 0°, 2°, 45°, 88°, 90°, 135°, 176°, 178°, 180°, 182°, 184°, 225°, 270°, 272°, 315° and 358° degrees. (Custom firmware for other posi on maps is available for an addi onal charge.) These models are compa ble with most standard 4”, 5”, 6”, and 8” plas c wet/dry process casse es, shipping and storage containers. Units are NOT compa ble with metal casse es. Custom models are available for metal casse es, 50mm wafer casse es, 75mm wafer casse es and non‐standard carriers. Open design allows increased laminar airflow and improves cleanliness while minimizing footprint. EZ GUIDE™ posi oners assure properly posi oned casse es. ESD protected by sta c‐dissipa ve plas cs. Proprietary sta c‐dissipa ve polyurethane roller withstands more than 2,000,000 cycles with accuracy of be er than ±1°. Compa ble with most standard plas c wet/dry process casse es, shipping and storage casse es. Unique quick disconnect roller feature al‐
lows maintenance staff to remove the roller assembly for cleaning or replacement. Replacement power supply for all automa c EZ‐
Guide™ aligners: A000‐754‐1 USA (100‐120 VAC) A000‐754‐2 EUROPE (220‐240 VAC) A000‐754‐3 UK (220‐240 VAC) © 2015‐2016 H‐Square
26 Aligners A U T O M A T I C
F L A T
75mm EZ Guide™Flat Aligner Automa c flat aligner for 75mm wafers in a 25 slot casse e. ESD safe design. Stage: An sta c Polypropylene Roller: An sta c Polyurethane AFEZ‐3 UK (220‐240 VAC) Replacement Drive roller: A000‐723 100mm EZ Guide™ Flat Aligner Automa c flat aligner for 100mm wafers in a 25 slot casse e. ESD safe design. Stage: An sta c Polypropylene Roller: An sta c Polyurethane AFEZ‐4 Replacement Drive roller: A000‐723 150mm EZ Guide™ Flat Aligner Automa c flat aligner for 150mm wafers in a 25 slot casse e. ESD safe design. Stage: An sta c Polypropylene Roller: An sta c Polyurethane AFEZ‐6 Replacement Drive roller: A000‐723 200mm EZ Guide™Flat Aligner Automa c flat aligner for 200mm wafer in a standard 25 slot casse e. ESD safe design. Stage: An sta c Polypropylene Roller: An sta c Polyurethane AFEZ‐8 Replacement Drive roller: A000‐724‐1 © 2015‐2016 H‐Square Catalog15‐16.1 27 www.h‐square.com An ‐Sta c Plas c Top/Bo om Manual Flat Finder The “FFTBAS‐456” model is for use in applica ons where metallic contamina on or chemical a acks are concerns. It is constructed from black sta c‐dissipa ve polypropylene, which has been custom manufactured to H‐Square specifica ons. This material has excellent chemical resistance and toughness. Since it is conduc ve, it will not build up sta c charge, which can lead to circuit damage or act as a par culate magnet. Its proprietary conduc ve polyurethane roller provides a path from wafers to ground (ground wire included) for ESD protec on. In addi on to the posi ve material a ributes of this tool, many mechanical features have been incorporated into its simple design. The roller li s out for cleaning and is reversible for le or right‐handed operators. To minimize fric on and abrasion between moving parts, the roller if li ed by support pylons from below the base plate. A single rigid li bar is provided for easy access by the operator and for long
‐term dimensional stability. A single screw located beneath the base plate controls sta c roller height and total roller li . Limi ng total li minimizes abrasion of the carrier slots by the wafers. Four fixed pylons accurately locate the carrier over the roller. Side plates are unequal length in order to maintain good wafer separa on. All components have been designed to reduce sharp edges and par cle traps where possible. The footprint of the “FFTBAS‐456” has been minimized while retaining the durability and rigidly of thick plate material. This single model is compa ble with most standard 4, 5, and 6‐inch plas c wet/dry process carriers, storage and shipping containers. Unit is NOT compa ble with metal casse es. Custom models are available for metal casse es and non‐
standard carriers. The “FFTBAS‐456” is a manual, non‐motorized model. All wafer flats are first aligned to the bo om posi on by rota ng the spinner knob. Pressing the li bar and rota ng the spinner knob may then rotate the aligned flats. Please specify casse e model number when ordering. EZ Guide™ Flat Aligners This manual flat aligner provides for top/bo om wafer flat alignments. To align wafer flats the operator places the carrier on the unit and rotates the manual knob. Unique wafer roller and alignment system gently captures and posi ons the flats to the bo om of the casse e. Operator can then rotate the roller alignment switch and manually rotate the wafer flat posi on to any posi on on the radius. Open design allows increased laminar airflow and improves cleanliness while minimizing footprint. EZ Guide posi oners assure properly posi oned casse es. ESD protected by sta c‐dissipa ve plas cs. Proprietary sta c‐dissipa ve polyurethane roller withstands more than 2,000,000 cycles with accuracy of be er than 1 degree. Compa ble with most standard plas c wet/dry process casse es, shipping and storage casse es. An sta c Mul ‐Size Flat Aligner Mul ple size flat finder for 100mm, 125mm, and 150mm wafers. Manual top/bo om all plas c flat aligner. ESD safe design construc on. Stage: An sta c Polypropylene Roller: An sta c Polyurethane FFTBAS456 Mul ple Size Flat Aligner Replacement Roller: A000‐379‐2 © 2015‐2016 H‐Square
28 Aligners M A N U A L
F L A T
75mm Flat Aligner– EZ Guide™ Manual an sta c flat aligner for 75mm wafers in a 25 slot casse e. ESD safe design. Stage: An sta c Polypropylene Roller: An sta c Polyurethane MFEZ3 75mm Replacement Drive Roller: A000‐723 100mm Flat Aligner– EZ Guide™ Manual an sta c flat aligner for 100mm wafers in a 25 slot casse e. ESD safe design. Stage: An sta c Polypropylene Roller: An sta c Polyurethane MFEZ4 100mm Replacement Drive Roller: A000‐723 150mm Flat Aligner– EZ Guide™ Manual an sta c flat aligner for 150mm wafers in a 25 slot casse e. ESD safe design. Stage: An sta c Polypropylene Roller: An sta c Polyurethane MFEZ6 150mm Replacement Drive Roller: A000‐723 200mm Flat Aligner– EZ Guide™ Manual an sta c flat aligner for 200mm wafers in a 25 slot casse e. ESD safe design. Stage: An sta c Polypropylene Roller: An sta c Polyurethane MFEZ8 200mm Replacement Drive Roller: PRA8 © 2015‐2016 H‐Square Catalog15‐16.1 29 www.h‐square.com METALLIC FLAT FINDERS The “FFTB1” model is the base model top/bo om manual flat finders. They provide an efficient method of aligning prima‐
ry or secondary wafer flats without removal of wafers from the carrier. They are constructed of precision‐machined, hard clear anodized, 6061 T‐6 aluminum alloy for durability and long‐term dimensional stability. Aluminum also adds mass to the system, which improves stability during use. Motorized versions are available through the Custom Products depart‐
ment and u lize industrial quality “D” cells (one per motorized flat finder) and 9‐volt transistor ba eries (one per semi‐
automa c flat finder). Several significant improvements have been made to these models, including:  Elastomeric PVC feet have durability, chemical resistance.  Legs are unequal length to force good wafer separa on during flat finding.  Two spinner knobs are provided to more easily allow le /right handed opera on.  Delrin roller and roller extension knob have machined flats for more posi ve locking of spinner knob to roller with set screws.  Fasteners used for legs, li ‐plate hinges and li ‐lever pivot have an added plas c locking patch to resist loosening.  Aluminum parts are hard clear, rather than hard black anodized, for be er abrasion resistance, lower surface porosi‐
ty and elimina on of dyes and sealers used with black anodize that could discolor and outgas.  Li ‐lever spacers are precision machined to prevent metal‐to‐metal contact between lever and base plate.  Roller height adjustment requires no tools; a knurled plas c knob allows quick manual adjustment if required.  UHMW wafer supports have a top radius rather than angular support surface to prevent nicking and provide easier casse e loading.  Motor drive system allows a free‐floa ng mo on to reduce motor and ba ery loads.  Roller sheaths on 4, 5 and 6 inch models have been converted to custom molded Polyurethane for be er chemical, sta c and abrasion resistance. Sheaths for 2 and 3 inch models are clear PVC (Tygon) tubing. These models are com‐
pa ble with most standard plas c wet/dry process casse es. Please specify casse e model when ordering. Top/Bo om Metal Flat Aligner Manual flat aligner for 50mm, 75mm, 100mm, 125mm, 150mm, or 200mm wafers in a 25 slot casse e. Top/Bo om Manual, non‐motorized model. All wafer flats are first aligned to the bo om posi on by rota ng the spinner knob. To relocate the aligned flats to any other posi on, the li lever is depressed, and the spinner knob is rotated again to move the flats to the desired loca on. Stage: Anodized Aluminum Roller: Virgin Polyurethane FFTB1‐2 50mm FFTB1‐3 75mm FFTB1‐4 100mm FFTB1‐5 125mm 150mm FFTB1‐6 FFTB1‐8 200mm Replacement Polyurethane Roller Sheaths 100mm (FFTB1‐4, FFTB1M‐4, FFTB1MSA‐4) PRS4 125mm (FFTB1‐5, FFTB1M‐5, FFTB1MSA‐5) PRS5/6 150mm (FFTB1‐6, FFTB1M‐6, FFTB1MSA‐6) PRS5/6 © 2015‐2016 H‐Square
30 Aligners Automa c EZ Guide™ Wafer Aligner‐Escalator This table top space conscious aligner escalator automa cally notch or flat aligns the wafers and then automa cally escalates the wafers to view for manual ID mark reading. The unit features a joys ck to allow the operator to selected the perfect lt angle for enhanced ID readability. H‐Square's EZ Guide™ patented alignment mechanisms result in excep onal aligning accuracy. The user‐friendly simple control panel and mechanical and so ware build in safeguards make this tool easy to use. The cost‐effec ve design and operator visual reading provides wafer tracking at a frac on of the cost of fully automated OCR systems. The tool is designed with an ESD safe construc on and is Class 1 cleanroom compa ble. Each unit can be ordered with an op onal LED light bank lamp with op mizes laser scribe reading without exposing photoresist. Automa c EZ Guide™ Wafer Aligner/Escalator 100mm, 150mm or 200mm wafer notch or flat aligners with special wafer escala on for wafer/lot ID verifica on. An sta c Construc on. Custom designs features include LED ligh ng , 12 or 13 slot designs, and AET units with thin wafer li combs. Please contact H‐Square for informa on. AETWFA4 100mm Flat AETWFA6 150mm Flat AETWNA6 150mm Notch AETWFA8 200mm Flat AETWNA8 200mm Notch Special Applica on Aligners H‐Square Custom Product Department has designed numerous applica on specific aligners, including: wafer edge inspec on tools, custom non‐SEMI standard casse e aligners, operator ergonomic solu on aligner tools, special flat or notch size aligners, wet bench bulk aligner modules, and many more. Please contact your H‐Square representa ve for more informa on or to request a quote. © 2015‐2016 H‐Square Catalog15‐16.1 31 www.h‐square.com H‐Square’s Automa c Wafer Mover™ (AWM) is an electromechanical stand‐alone tabletop automa on system designed to move single wafers between two process casse es. The automa on pla orm is controlled by use of a storable touchscreen display. The AWM can be ordered from the factory adjusted to handle either 75mm, 100mm, 150mm or 200mm wafers. Each system can be uniquely setup to handle customer specific wafer casse e(s), wafer thickness or unique wafer a ributes. Wafer Movers are designed to alleviate the need for manual wafer handling methods, reduce scratching and wafer breakage. An H‐Square Wafer Mover pla orm will effec vely replace the need for a vacuum wand, wafer tweezers, or an expensive sorter pla orm. User friendly FPD touch screen so ware allows an operator to easily select Recipe Mode or Manual Mode. Recipe Mode allows operator to select preprogrammed recipes wafer movements between two carriers. Manual Mode allows opera‐
tor to choose on the screen which wafers to move and where they should be placed. A safe vacuum‐less low contact end‐
effector includes a wafer mapping sensor which maps wafer loca ons in each casse e and detects wafers presence for safe accurate movements. This system does not offer OCR /alignment capabili es. Facili es—120V/220V power. AWM—Wafer Mover™ ‐ Single Wafer Transfer System AWM3 75mm AWM4 100mm AWM6 150mm AWM8 200mm Single wafer transfers Lot split applica ons Merge applica ons Fill applica ons Pitch change applica ons © 2015‐2016 H‐Square
32 Tra n s fe r s W A F E R
M O V E R ™
300mm Wafer Mover™ ‐ Single Wafer FOUP to FOSB Transfer For moving single 300mm wafers between two SEMI standard FOUP, FOSB or H‐Square MC12‐25HC metal bake‐
out casse es. This system does not offer OCR /alignment capabili es. Facili es—120V/220V power. WS300M 300mm → Economical Targeted for cost sensi ve applica ons: R&D, Test‐Assembly‐Packaging, & Applica on Labs. Low Selling Price. → Simple Compact Portable Design for sor ng wafers between two SEMI standard FOUP, FOSB or Met‐
al Bake‐out Carriers. Operator opens FOUP man‐
ually, rotates into posi on. User‐friendly FPD touch screen so ware ‐ select recipe or manual mode to move a single or mul ple wafers be‐
tween carriers. → Safe 300mm edge contact grip end‐effector includes wafer mapping sensor which detects wafers and checks for double stack & cross slo ng. Dimensions Height: 48.4” (1229.3mm) Depth: 35.8” (909.3mm) Width: 88.6” (2250.4mm) Edge grip end effector Facili es—120V/220V AC Power © 2015‐2016 H‐Square Catalog15‐16.1 33 www.h‐square.com Open‐Casse e Low Contract Transfer System Low contact transfer machines provide a safe means of mass transferring wafers from casse e to casse e. Wafers are gently li ed midpoint in the casse e slots before extrac ng or loading them to minimize contact with the casse e which could cause abrasion, par cula on or wafer edge chipping. Op cal and mechanical sensors combined with so ware logic guard against opera on errors such as trying to transfer wafers into a casse e which is already loaded with wafers. User‐
friendly fail‐safe opera on features simple one‐bu on actua on. Sturdy construc on assures high reliability and robustness required in high throughput fabs. Small footprint saves valuable cleanroom space. FOUP Low Contact Transfer System 300mm and 450m low contact transfer machines provide safe means of mass transferring wafers from carrier to carrier. Wafers are gently li ed midpoint in the casse e slots before extrac ng or loading to minimize contact with the casse e which could cause par cula on. Safety sensor detects wafers in the pod. Wafer mapper detects cross slo ed, double stack and double cross slot wafer posi ons. User‐friendly fail‐safe opera on features include simple one‐bu on reset, one‐bu on run actua on and EMO switch incase of emergency. The table top small footprint saves valuable cleanroom space. Sturdy construc on assures high reliability and robustness required in high throughput fabs. Unit is compa ble with SEMI standard FOUP, FOSB and metal bake casse es. Class 1 cleanroom compa ble. ESD safe construc on. 100mm‐200mm LCT1 Applica ons Plas c to Plas c, Plas c to Metal, Metal to Plas c, Mass Transfers Thin wafer transferring Compound (fragile) wafer transferring Wafer inver ng (180° reorienta on), H‐Bar up or down Class 1 transfer applica ons Transferring between two casse es with different D1 dimensions 300mm‐450mm LCT1 Applica ons FOSB to FOUP, mass transfers FOUP to FOUP, mass transfers FOUP to Metal Casse e, mass transfers Transfer Rods: EP 316 stainless steel rods with PVDF (Kynar®) coa ng. It is recommended to use LCT1AS12 and AFO (auto FOUP door opener) together as a set © 2015‐2016 H‐Square
34 Tra n s fe r s L O W
C O N T A C T
LCT1 Series Low Contact Transfers— 100mm, 150mm, 200mm mass wafer transfer system for standard, thin wafer and compound semiconductor wafer handling applica ons. LCT1AS4 100mm LCT1AS6 150mm LCT1AS8 200mm Dimensions Height: 12.0” (304mm) Depth: 23.0” (584mm) Width: 10.0” (254mm) LCT1 Series Low Contact Transfers— 300mm and 450mm mass wafer transfer systems for FOUP, FOSB and metal casse es transfer applica ons. Special custom rota ng base models are available. Standard 300mm Dimensions LCT1AS12 300mm Height: 20.0” (508mm) Custom 300mm with Rota ng Base Depth: 35.0” (889mm) LCT1AS12‐AC‐003 300mm USA (100‐120 VAC) Width: 16.0” (406mm) LCT1 © 2015‐2016 H‐Square LCT1 w/ Stage Rota on Catalog15‐16.1 35 www.h‐square.com AVT—Automa c Ver cal Wafer Transfer System Table top ver cal transfer machine safely mass transfers wafers between various combina ons of plas c, metal, silicon carbide and quartz casse es. Small footprint saves valuable cleanroom space. Proprietary wafer li er minimizes alignment problems. Casse es move, rather than wafers, for safer, cleaner transfer. Absence of comb pivot point above wafer ensures cleanliness. Single bu on opera on makes unit very user‐friendly. Simple design for reliability and low maintenance. Class 1 cleanroom compa ble. Plas c to Metal Metal to Plas c Plas c to Plas c Plas c to Quartz/SiC Quartz/SiC to Plas c AVT4 AVT4‐KIT AVT6 WPR6‐KIT AVT8 AVT8‐KIT 100mm Wafer 100mm Casse e and Power Supply AC, E or UK 150mm Wafer 150mm Casse e and Power Supply AC, E or UK 200mm Wafer 200mm Casse e and Power Supply AC, E or UK Dimensions Height: 29.4” (748.4mm) Depth: 17.5” (446.1mm) Width: 26.4” (672.4mm) © 2015‐2016 H‐Square
36 Tra n s fe r s v e r t i c a l
Program 1 LEFT CASSETTE ↑ LEFT CASSETTE Program 2 LEFT CASSETTE → RIGHT CASSETTE Program 3 LEFT CASSETTE ← RIGHT CASSETTE © 2015‐2016 H‐Square Catalog15‐16.1 37 www.h‐square.com AWT ‐Automa c Horizontal Wafer Transfer System Automa c wafer transfer machines safely mass transfers wafers between casse es. Small footprint design minimizes valuable work bench space required for opera on. Color‐coded posi oning dots make correct casse e placement easy for operators. Heavy‐duty construc on and high‐quality internal components assure long life and con nued accuracy. Casse e posi on sensors allow opera on only when casse es are properly posi oned to assure safe wafer transfers. Added safety provided by circuitry which stops transfer when excessive force is detected. ESD safe construc on. Please specify casse e model number(s) when placing the order. Class 1 cleanroom compa ble. Stage: Natural Polypropylene, H‐Bar Rails and Transfer Arm: An sta c Polypropylene AWT2HL4 100mm AWT2HL6 150mm AWT4HL8 200mm Replacement power supply for all automa c AWT transfers: A000‐754‐1 USA (100‐120 VAC) A000‐754‐2 EUROPE (220‐240 VAC) A000‐754‐3 UK (220‐240 VAC) 50mm—150mm Dimensions Height: 8.2” Depth: 24.0” Width: 7.0” 200mm Dimensions Height: 10.1” Depth: 26.2” Width: 9.25” © 2015‐2016 H‐Square
38 Tra n s fe r s H O R I Z O N T A L
S L I D E
50mm—150mm Dimensions Height: 8.2” Depth: 24.0” Width: 7.0” 200mm Dimensions Height: 10.1” Depth: 26.2” Width: 9.25” WT ‐ Manual Horizontal Wafer Transfer System H‐Square’s horizontal wafer transfer machines are a safe and prac cal way to mass transfer wafers from casse e to casse e. These economical units are designed to transfer wafers between plas c and/or standard high profile H‐Square metal casse es. Chemical resistant materials and manual opera on make these units ideal for all applica ons, including wet areas. ESD safe models u lize sta c dissipa ve materials to both protect against damage from sta c electricity and minimize par cle a rac on. Models are available for HIGH wall to HIGH wall and HIGH wall to LOW wall casse e designs. Please specify casse e model number(s) when placing the order. Class 10 cleanroom compa ble. Stage: Natural Polypropylene, Arm: An sta c Polypropylene WT2HAS 50mm High Wall Casse es Only WT3HAS 75mm High Wall Casse es Only WT4HAS 100mm High Wall Casse es Only WT4HLAS 100mm High Wall and Low Wall Casse es WT5HAS 125mm High Wall Casse es Only WT5HLAS 125mm High Wall and Low Wall Casse es WT6HAS 150mm High Wall Casse es Only WT6HLAS 150mm High Wall and Low Wall Casse es WT28HAS 200mm High Wall Casse es Only WT28HLAS 200mm High Wall and Low Wall Casse es WT3456AS Mul ‐Size 75mm,100mm,125mm,150mm High Wall Casse es* * Note that the standard WT3456AS will not accept metal casse es, all other versions will support metal casse e usage. © 2015‐2016 H‐Square Catalog15‐16.1 39 www.h‐square.com WT Series Custom Horizontal Transfer System—Odd/Even Split Applica on A custom version of H‐Square's standard WT horizontal slide transfer with special 13 rod transfer arm that allows the operator to switch a cam mechanism aligning the transfer arm to the ODD or EVEN wafers in a 25 wafer casse e. Dimensions are similar to standard WT transfer tools. An sta c construc on. 13 wafers ← ODD → 25 wafers 12 wafers ← EVEN → 25 wafers Please contact your H‐Square representa ve for ordering part numbers and addi onal op ons and informa on. WT Series Custom Horizontal Transfer System—180° Wafer Flipping Applica on A custom version of H‐Square's standard WT horizontal slide transfer with special stage modifica ons to allow for one casse e to be loaded h‐bar DOWN and one casse e to be loaded h‐bar UP (or both UP, or both DOWN). Dimensions are similar to standard WT transfer tools. An sta c construc on. 1 2 3 ↓ ← INVERT → 25 24 23 ↓ ↑ ↑ 23 3 24 2 25 1 Please contact your H‐Square representa ve for ordering part numbers and addi onal op ons and informa on. © 2015‐2016 H‐Square
40 Wa fe r Tra n s fe r s S P E C I A L T Y
T R A N S F E R S
WT Series Custom Dual Arm Horizontal Transfer System—Offset D1 Casse e Applica on A custom dual transfer arm version of H‐Square’s WT horizontal slide transfer for transferring wafer between two casse es with same pitch but with different D1 dimensions (distance from bo om of h‐bar to first slot). An sta c construc on. Please contact your H‐Square representa ve for ordering part numbers and addi onal op ons and informa on. WT300 Series Custom 300mm Horizontal Transfer A custom H‐Square WT horizontal slide transfer for transferring 300mm wafers between two open‐bo om process casse es. Some models feature a transfer bridge. An sta c models available. Please contact your H‐Square representa ve for ordering part numbers and addi onal op ons and informa on. © 2015‐2016 H‐Square Catalog15‐16.1 41 www.h‐square.com Automa c EZ Guide™ Wafer Aligner‐Escalator This table top space conscious aligner escalator automa cally notch or flat aligns the wafers and then automa cally escalates the wafers to view for manual ID mark reading. The unit features a joys ck to allow the operator to selected the perfect lt angle for enhanced ID readability. H‐Square's EZ Guide™ patented alignment mechanisms result in excep onal aligning accuracy. The user‐friendly simple control panel and mechanical and so ware build in safeguards make this tool easy to use. The cost‐effec ve design and operator visual reading provides wafer tracking at a frac on of the cost of fully automated OCR systems. The tool is designed with an ESD safe construc on and is Class 1 cleanroom compa ble. Each unit can be ordered with an op onal LED light bank lamp with op mizes laser scribe reading without exposing photoresist. Custom designs features include LED ligh ng , 12 or 13 slot designs, and AET units with thin wafer li combs. Please contact H‐Square for informa on. AETWFA4 AETWFA6 AETWNA6 AETWFA8 AETWNA8 100mm Flat 150mm Flat 150mm Notch 200mm Flat 200mm Notch Custom modified with integrated red LED light bank: AETWFA6AC‐002 150mm Flat USA (100‐120 VAC) AETWFA6E‐003 150mm Flat EUROPE (220‐240 VAC) AETWFA8E‐001 200mm Flat EUROPE (220‐240 VAC) AETWNA8AC‐001 200mm Notch EUROPE (220‐240 VAC) AETWNA8E‐003 200mm Notch EUROPE (220‐240 VAC) AETWNA8UK‐002 200mm Notch UK (220‐240 VAC) Custom modified for thin wafers (light not included): AETWFA6AC‐001 150mm Flat USA (100‐120 VAC) AETWFA6E‐001 150mm Flat EUROPE (220‐240 VAC) AETWFA6UK‐001 150mm Flat UK (220‐240 VAC) AETWNA8UK‐001 200mm Notch UK (220‐240 VAC) AETWNA8E‐001 200mm Notch EUROPE (220‐240 VAC) AETWNA8AC‐002 200mm Notch USA (100‐120 VAC) Custom modified for 26 slot casse es (light not included): AETWNA8AC‐004 200mm Notch USA (100‐120 VAC) AETWNA8E‐002 200mm Notch EUROPE (220‐240 VAC) © 2015‐2016 H‐Square
42 Presenters W A F E R
E S C A L A T O R S
ETAS1 Series Manual Wafer Escalator Manual escalator li s wafers incrementally when casse e is placed on unit. Wafers are lted 25º to enhance ID readability. Plas c ESD safe construc on makes unit idea for all applica ons. Construc on materials are ESD safe and natural polypropylene and a grounding strap is provided. ETAS1‐3‐001 75mm ETAS1‐4 100mm ETAS1‐5 125mm ETAS1‐6 150mm ETAS1‐8 200mm ETAS8‐003 200mm for 26 slot casse es* ETAS1‐8‐007 200mm with H‐BAR out * * check casse e compa bility prior to ordering SQ21541 Series Manual Escalator SQ21541 is a popular custom product manual wafer escalator line where the front guide plate is eliminated. Operator slides wafer casse e h‐bar side against back guide of escalator. Construc on materials are ESD safe and natural polypropylene. Contact H‐Squarer’s Custom Product Department for more informa on about custom wafer escalators, including designs for thin wafers, thick wafers, wafer backside reading (h‐bar out) or escalators for custom or unique casse es. SQ21541‐13 100mm SQ21541‐2 150mm SQ21541‐10 200mm © 2015‐2016 H‐Square Catalog15‐16.1 43 www.h‐square.com HL Series Manual Wafer Presenter A manual wafer presenter sta on for removing/replacing wafers to/from a casse e or for 100% inspec on or iden fica on of individual wafers. Special v
‐groove saddle gently li s wafers without contac ng others in the casse e. Tool can be used with vacuum wands or outside diameter mechanical edge picks. Class 10 cleanroom compa ble. Ergonomically designed for ease‐of‐use and safe wafer handling. Small tabletop footprint saves valuable cleanroom space. Constructed of plas cs selected to provide ESD safety, chemical resistance, and clean opera on. Models available to accommodate most SEMI standard wafer sizes and casse es. HL‐2 50mm HL‐3 75mm HL‐4 100mm HL‐6 150mm HL‐8 200mm WP Series Automa c Wafer Presenter Programmable semiautoma c presenta on sta on li s wafers out of casse es. Applica ons include removing/replacing wafers to/from a casse e or 100% visual inspec on or iden fica on of individual wafers. Special v‐groove saddle gently li s wafers without contac ng others in the casse e. Units can be used with vacuum wands or outside diameter mechanical edge picks. These systems have been tested to 1.2 million cycles without failure. Basic dimensions of unit are 10”HX 13”W X 13”D (254mm X 330mm X 330mm). Class 1 cleanroom compa ble. WP4 100mm WP6 150mm WP18 200mm © 2015‐2016 H‐Square
44 Presenters W A F E R
L I F T E R S
WPR Series Automa c Wafer Presenter with Rota on The WPR wafer presenta on system provides a fully programmable method for inspec ng and/or removing and replacing wafers from process casse es with a vacuum wand or an outside diameter mechanical pick. A single ESD safe PEEK li blade gently engages the wafer and li s it fully above casse e without scratching or contac ng other wafers in the casse e. The operator uses the touch screen display to either run a preprogrammed recipe or create a wafer selec on rou ne manually. The WPR system allows for 360° degrees wafer rota on – providing for both front and backside macro inspec on by an operator from a sta onary posi on; or the system can be programmed to “flip” all or some wafers 180° degrees in the casse e for special wafer processes. Class 1 Clean room Compa ble; Models of opera on: Program Automa c and Manual Selec on Modes. Available for all dedicated wafer sizes and casse es up to 200mm. WPR WPR4‐KIT WPR6‐KIT WPR8‐KIT Base unit 100mm Casse e and Power Supply AC, E or UK 150mm Casse e and Power Supply AC, E or UK 200mm Casse e and Power Supply AC, E or UK WB5L Series 5‐Wafer Li er Elevates 5‐wafers simultaneously to allow easy and safe access to wafers with vacuum wand or for wafer inspec on. Unique posi on indicator provides clear visual iden fica on of which 5 wafers will be elevated. Ergonomically designed for ease‐of‐use and safe wafer handling. Small tabletop footprint saves valuable cleanroom space. Constructed of plas cs selected to provide ESD safety, chemical resistance, and clean opera on. Models available to accommodate most SEMI standard wafer sizes and casse es. WB5L1‐456 100mm, 125mm, or 150mm (adjusted for one wafer size) WB5L1‐8 200mm © 2015‐2016 H‐Square Catalog15‐16.1 45 www.h‐square.com Casse e Stand Access to wafers with vacuum wands can be significantly improved with casse e stands. Stands present the wafers in a lted posi on, thereby reducing the amount of operator wrist rota on and associated discomfort. Room temperature plas c or metal casse es are compa ble with these stands which are constructed of durable white polypropylene, heat‐
formed to finished shape. Casse es can be placed with wafers in a ver cal posi on, or with H‐bar down. Please contact H
‐Square for addi onal custom product versions. FOUP / FOSB Stand Stand alone stainless‐steel floor‐mounted manual FOUP stand provides ergonomic safe means to gain access to wafers off
‐line. Operator‐friendly design aligns FOUP, FOSB, or open bo om 300mm casse e, with the operator’s body and line‐of‐
sight. The 360° degree rota on with posi ve stop points allows any operator to find a comfortable posi on for safely handling 300mm wafers to/from the specified carrier. The FS‐002 features a telescoping stand for ergonomically adjus ng the height of the FOUP for tall or short operators. Table‐top designs are also available through H‐Square’s Custom Products Department. Simple design for reliability and low maintenance. CS‐6S 100mm, 125mm, or 150mm Single CS‐8S 200mm Single FS‐002 300mm FOUP / FOSB Rota ng © 2015‐2016 H‐Square
46 POD Openers F O U P
AFO ‐ 300mm Automa c FOUP Opener Automa c door opener provides clean and easy access to wafers in a SEMI standard 300mm FOUP. Interlocked load port turntable stage allows for 360 degree FOUP rota on to give operators access to the open FOUP. When open, the FOUP door is kept clean. Simple design for reliability and low maintenance. Unique low profile design ideal for tabletop applica ons and FOUP wash sta ons. Small footprint saves valuable cleanroom space. AFO Automa c 300mm FOUP Door Opener Dimensions Height: 20.0” (506mm) Depth: 35.0” (889mm) Width: 16.0”(406mm) FOMH ‐ Manual 300mm / 450mm FOUP Door Opener Manual ergonomic dual‐pistol grip design allows for FOUP doors to easily opened. Unique design allows the removed FOUP door to be propped upright on the table when removed from the FOUP body. This effec vely keeps the inside face of the door clean—unlike the key style FOUP door openers. One pistol grip handle rotates, turning the FOUP door opening mechanism. Simple designs for reliability and low maintenance Handle: Delrin®, Case: Delrin® and Polycarbonate FOMH 300mm FOUP FOMH450 450mm FOUP © 2015‐2016 H‐Square Catalog15‐16.1 47 www.h‐square.com SMIFMAN6 150mm Manual Re cle SMIF Pod Opener Tabletop manual swing arm pod opener provides clean, easy access to photomasks in any RSP150 re cle storage single‐mask and mul ‐mask pod casse es. The SMIFMAN6 allows the operator to manually open the 4 lever mechanism on the pod, lowering the base and releasing the lid. This allows access to the inner mask tray. H‐Square’s design features a clean pin raised storage area for the lid to be stored while pod is open. Unit also features a mask pick holder. An sta c materials are used to insure ESD safety and cleanliness. SMIFMAN6 Manual RSP150 Opener Dimensions Height: 6.0” (152mm) Depth: 10.8” (274mm) Width: 19.0” (482mm) SMIFPO6 ‐ Automa c 150mm RSP Pod Opener Semi‐automa c SMIF pod opener provides easy access to pho‐
tomask storage POD casse es with minimal operator involve‐
ment. Units are compa ble with most standard RSP150 and MSP150 SMIF pod designs. Smooth, reliable li automa on for reliability and cleanliness. Class One Cleanroom compa ble. ESD protec on insured by sta c dissipa ve plas cs. SMIFPO6 RSP150 150mm Re cle Pod Opener © 2015‐2016 H‐Square
48 POD Openers S M I F
SMIFMAN8 ‐ 200mm Manual SMIF Pod Opener An economical means to gain access to the interior of a 200mm SMIF pod process casse e. Units are compa ble with standard M2000 200mm SMIF pod designs. Features pod lid storage pla orm to keep the lid base clean when accessing the pod. ESD safe design. Small tabletop footprint. May also be used to open/close RSP200 re cle SMIF pods. Stage: Aluminum and ESD safe Polypropylene SMIFMAN8 200mm SMIF and RSP200 Dimensions Height: 4.0 (101.6mm) Depth: 10.8” (274.3mm) Width: 15.5” (393.7mm) SMIFPO8 ‐ Automa c 200mm SMIF Pod Opener Semi‐automa c SMIF pod opener provides easy access to wafer casse es with minimal operator involvement. Units are compa ble with most standard 200mm SMIF pod designs. Smooth, reliable li automa on for reliability and cleanliness. Class One Cleanroom compa ble. ESD protec on insured by sta c dissipa ve plas cs. Designs available for two different wafer casse e orienta ons. SMIFPO8 M2000 200mm Wafer Casse e Pod Opener SMIFPO8‐E‐002 RSP200 Re cle Pod Opener Dimensions Height: 26.9” (683.2mm) Depth: 14.1” (358.1mm) Width: 12.9” (327.6mm) © 2015‐2016 H‐Square Catalog15‐16.1 49 www.h‐square.com FOR APPLICATIONS UP TO 250° C Aluminum Side Plates PTFE Teflon® Wafer Stops 316 Stainless Steel Spacer Rods and Fasteners 2851 Series Aluminum Wafer Process Casse es 2851 series casse es are conven onal 25 slot metal casse es used in semiconductor manufacturing opera ons. They are typically used in areas where wafer posi oning is important or where elevated temperatures cause warpage to other carriers. 2851 series casse es are direct replacements for many OEM metal carriers used with wafer track/elevator systems, photo resist bake systems, and robo c loading systems for CVD and etch processes. This series has been incorporated as the original equipment carrier provided by similar OEM’s. The 2851 series is manufactured from T6063 aluminum alloy for precision and high strength. Slots feature an 8º angle to reduce front and backside wafer contact. Stainless steel spacer bars and fasteners are used to precisely secure the side plates to each other. Two solid PTFE rods are used to support the wafers in the slots. Aluminum 2851 series casse es are compa ble with the CH handle. WAFER SIZE HARD BLACK ELECTROLESS HARD CLEAR ANODIZED NICKEL PLATED ANODIZED PFA COATING ORDERING PART NUMBERS DIMENSIONS HEIGHT WIDTH LENGTH 2” (50mm) 2851‐2B 2851‐2HC 2.52” 2.37” 5.64” 3” (75mm) 2851‐3B 2851‐3EN 2851‐3HC 2851‐3PFA 3.52” 3.75” 5.64” 4” (100mm) 2851‐4B 2851‐4EN 2851‐4HC 2851‐4PFA 4.52” 4.25” 5.64” 5” (125mm) 2851‐5B 2851‐5EN 2851‐5HC 2851‐5PFA 5.51” 5.25” 5.64” 6” (150mm) 2851‐6B 2851‐6EN 2851‐6HC 2851‐6PFA 6.49” 6.25” 5.64” 8” (200mm) 2851‐8B 2851‐8EN 2851‐8HC 2851‐8PFA 8.50” 8.56” 8.00” © 2015‐2016 H‐Square
50 Casse
es A L U M I N U M
MC1 Series Aluminum Wafer Process Casse es MC1 series casse es are based on the popular 2851 series, but it includes a solid end wall in place of the stainless steel spacer bars on the end opposite the H‐bar. Six #6‐32 TPI flat head screws secure the end wall. All other features (including PTFE rod stops) of the 2851 series are incorporated in the MC1 series. The solid end wall is machined from 6061 T‐6 aluminum alloy, and receives the same surface treatment as the carrier side plates. Two stainless steel rods fit into reliefs machined in the outside face of the plate. The rods provide a mechanical interface for the CHMC, CHMCL, CHMCDH8 style casse e handles. The solid end wall significantly increases the shock resistance and durability of the casse e, allowing it to remain ght and in alignment for a longer period of me compared to the spacer bar style. The end wall also acts as an effec ve par cle shield for the top wafer in applica ons where the casse e is used in an H‐bar down (wafer horizontal) posi on. WAFER SIZE HARD BLACK ANO‐ ELECTROLESS DIZED NICKEL PLATED HARD CLEAR ANODIZED PFA COATING ORDERING PART NUMBERS DIMENSIONS HEIGHT WIDTH LENGTH 4” (100mm) MC1‐4B MC1‐4EN MC1‐4HC MC1‐4PFA 4.52” 4.25” 5.64” 5” (125mm) MC1‐5B MC1‐5EN MC1‐5HC MC1‐5PFA 5.51” 5.25” 5.64” 6” (150mm) MC1‐6B MC1‐6EN MC1‐6HC MC1‐6PFA 6.49” 6.25” 5.64” 8” (200mm) MC1‐8B MC1‐8EN MC1‐8HC MC1‐8PFA 8.50” 8.56” 8.00” FOR APPLICATIONS UP TO 250° C Aluminum Side and End Wall Plates PTFE Teflon® Wafer Stops 316 Stainless Steel Spacer Rods and Fasteners © 2015‐2016 H‐Square Catalog15‐16.1 51 www.h‐square.com MC12‐25 / MC18‐25 Aluminum Series Process Casse es SEMI standard, lightweight (6.2 lbs.) ergonomic casse es for thermal processing of 300mm or 450mm wafers. Unique design minimizes weight and has proven performance over me and usage. The 300mm MC12 series is made from all welded aluminum construc on to provide dimensional stability over me and temperature changes. Maximum usable temperature is 350° C. Features SEMI standard kinema c coupling posi oners and info pad. The casse e is automa on compa ble with all industry standard FOUPs and FOSB carriers. Casse e features wafer retaining lock‐bar for safe transporta on. Overhead OHT flange available. 25 standard and 13 slot thin wafer designs are available. The design of the casse e is only 6.2 lbs. (2.81 Kg) which is lighter weight than a FOUP. A higher temperature all welded stainless steel version model is also available (SSC300) for thermal applica ons up to 550°C. The 450mm MC18 series is made from aluminum and stainless steel to provide dimensional stability over me and temperature changes. Maximum usable temperature is 275° C. Features SEMI standard kinema c coupling posi oners and info pad. The casse e is automa on compa ble with all industry standard MAC, FOUPs and FOSB carriers. Casse e features wafer retaining lock‐bar for safe transporta on. Overhead OHT flange is standard. MODEL 450mm MC18‐25HC Weight 23.0 lbs. (10.4kg) Height 15.8” (401mm) Depth 18.6” (472mm) Width 19.4” (492mm) SIZE MATERIAL MC12‐25HC1 300mm Aluminum MC12‐13HC1 300mm Aluminum SSC300 300mm Stainless Steel MC18‐25HC 450mm Aluminum / Stainless Steel 300mm MC12‐25HC1 Weight : 6.2 lbs. (2.8kg) Height 12.5” (317mm) Depth 12.0” (304mm) Width 15.6” (397mm) 300mm SSC300 Weight : 19 lbs. (8.6kg) Height 12.5” (317mm) Depth 12.0” (304mm) Width 15.6” (397mm) © 2015‐2016 H‐Square
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SSC Series Stainless Steel Casse e For high temperature wafer bake applica ons or specialty applica ons, including megasonic and cleaning processes. All welded 316SST electro‐polished construc on. Outside dimensions are similar to SEMI standard plas c process carriers. Transfer and automa on compa ble. Light Weight: Standard SST 200mm casse e ~2.5lbs. Temperature: maximum recommended con nuous opera ng temperature without causing distor on is 550º Celsius. Corrosion Resistance: 316SST offers be er resistance than 302 and 304 SST; resists many industrial chemicals and solvents including: sodium and calcium brines, hypo chlorite solu ons, phosphoric acid, sulfite liquors, and sulfurous acids. Standard casse es are designed for 50mm, 75mm, 100mm, 125mm, 150mm, 200mm, and 300mm wafer configura ons. Standard casse es are designed for 75mm, 100mm, 125mm, 150mm and 200mm, 25‐slot wafer configura ons. Non standard 10‐slot, 12‐slot, 13‐slot, 26‐slot and 28‐slot casse es, as well as carriers for square substrates and other non‐standard diameters and wafer thicknesses are available upon request. Please contact our Custom Products Department for more informa on. FOR APPLICATIONS UP TO 550° C All Welded 316 Stainless Steel Construc on MODEL Size Material SSC050‐25‐SSNSS 2” (50mm) Electro‐Polished 316SST 25 Slot, Open Side Walls SSC075‐25‐SSNSS 3” (76mm) Electro‐Polished 316SST 25 Slot, Open Side Walls SSC100‐25‐SSNSS 4” (100mm) Electro‐Polished 316SST 25 Slot, Shielded Sides SSC125‐25‐SSNSS 5” (125mm) Electro‐Polished 316SST 25 Slot, Shielded Sides SSC150‐25‐SSHSS 6” (150mm) Electro‐Polished 316SST 25 Slot, Shielded Sides SSC150‐25‐SSNSS 6” (150mm) Electro‐Polished 316SST 25 Slot, Open Side Walls SSC150‐13‐CCSSS 6” (150mm) Electro‐Polished 316SST 13 Slot, End Wall Handle SSC200‐25‐SSHSS 8” (200mm) Electro‐Polished 316SST 25 Slot, Shielded Sides SSC200‐25‐SSNSS 8” (200mm) Electro‐Polished 316SST 25 Slot, Open Sides SSC200‐13‐CCSSS 8” (200mm) Electro‐Polished 316SST 13 Slot Thin Wafer, End Wall Handle SSC200‐25‐SCNSS 8” (200mm) Electro‐Polished 316SST 25 Slot, Open Side Wall, End Wall Handle SSC300‐25 12” (300mm) Electro‐Polished 316SST 25 Slot, Kinema c Couplings, Side Handles © 2015‐2016 H‐Square Type, Features Catalog15‐16.1 53 www.h‐square.com FOR APPLICATIONS UP TO 350° C All Aluminum Construc on 316 Stainless Steel Fasteners MCF Series Process Casse es A popular all metal casse e replacement for plas c casse es. 150mm or 200mm all aluminum solid side wall metal casse e is designed for use in place of standard process plas c casse es where temperature or dimensional stability of the plas c casse e is in ques on. SEMI standard MCF casse e features include robo c flanges, aluminum wafer support combs and vented screws. Construc on is T6061 aluminum with stainless steel screws. MODEL SIZE MATERIAL TYPE MCF6EN 6” (150mm) Electro‐less Nickel Plated Aluminum MCF (SQ21140‐2) MCF6HC 6” (150mm) Hard Clear Anodized Aluminum MCF (SQ21140‐1) MCF6HV 6” (150mm) High Polished Aluminum High Vacuum MCF (SQ21140‐3) MCF8EN 8” (200mm) Electro‐less Nickel Plated Aluminum MCF MCF8HC 8” (200mm) Hard Clear Anodized Aluminum MCF MCF8HV 8” (200mm) High Polished Aluminum High Vacuum MCF Common Custom Versions MODEL SIZE TYPE SQ22093‐8 6” (150mm) 12 Slot MCF8EN‐001 8” (200mm) 25 slot, With Side Handles MCF8EN‐002 8” (200mm) 12 Slot MCF8EN‐003 8” (200mm) 25 slot, With End Wall Handle MCF8HC‐005 8” (200mm) 13 slot, DUAL H‐Bar Minimum order quan ty apply © 2015‐2016 H‐Square
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Notched Aluminum Stops 2851 Style SQ22766 MC1 Style SQ22766 SQ22766 Series High Temperature Casse es This all aluminum construc on casse e is designed for high temperature applica ons (up to 325º C). Aluminum wafer support cradles wafer from the bo om to prevent the pinching of wafers caused by casse e expansion and contrac on at high temperatures. The all aluminum plated notched wafer support is available for either open end wall (2851) or solid end wall designs (MC1). Please contact the Custom Products Department for addi onal SQ22766 wafer casse e op ons. MODEL FOR APPLICATIONS UP TO 325° C Aluminum Side Plates Aluminum Wafer Stops 316 Stainless Steel Spacer Rods and Fasteners © 2015‐2016 H‐Square SIZE MATERIAL FINISH TYPE SQ22766‐23HC 3” (75mm) (HC) Hard Clear Anodized 2851 SQ22766‐23EN 3” (75mm) (EN) Electro‐less Nickel Pla ng 2851 SQ22766‐31 3” (75mm) (B) Black Anodized 2851 SQ22766‐24HC 4” (100mm) (HC) Hard Clear Anodized 2851 SQ22766‐24EN 4” (100mm) (EN) Electro‐less Nickel Pla ng 2851 SQ22766‐39HC 4” (100mm) (HC) Hard Clear Anodized MC1 SQ22766‐25HC 5” (125mm) (HC) Hard Clear Anodized 2851 SQ22766‐25EN 5” (125mm) (EN) Electro‐less Nickel Pla ng 2851 SQ22766‐1HC 6” (150mm) (HC) Hard Clear Anodized 2851 SQ22766‐2EN 6” (150mm) (EN) Electro‐less Nickel Pla ng 2851 SQ22766‐26P 6” (150mm) (P) Bare Polished Aluminum 2851 SQ22766‐37HC 6” (150mm) (HC) Hard Clear Anodized MC1 SQ22766‐4E 8” (200mm) (HC) Hard Clear Anodized 2851 SQ22766‐17E 8” (200mm) (EN) Electro‐less Nickel Pla ng 2851 Catalog15‐16.1 55 www.h‐square.com Custom 2851SL and MC1SL Series Casse es “SL” Casse es are designed for ver cal mass transferring wafers from a metal casse e. The PFA Teflon® notched wafer support stop centrally locates the wafers in each slot at 0.187” (3/16”) center posi ons and will aid in precision wafer presenters/li ers and ver cal mass transfer systems. Wafer support stops are held in posi on with stainless steel screws. The SL notched wafer support style is available for both open end wall (2851) and solid end wall (MC1) casse es for wafer sizes at 100mm, 125mm and 150mm. Addi onal wafer sizes are available. Contact H‐Square for more informa on. Notched PTFE Teflon® Stops Contact your local H‐Square representa ve for more informa on and ordering part numbers
Custom MC1HV Series High Vacuum Aluminum Metal Casse es For use with Varian M2000 Series 4”,5”,6” and 8” spu ering equipment or other applica ons where metal casse e are to be used in vacuum chambers. High polished bare aluminum and stainless steel eliminates possible contamina on from the introduc on of materials used in pla ng and anodizing. Slot cradle wafer stops reduce both wafer vibra on and wafer pinching during high temperature processing. Cradle Slo ed Metal Stops Contact your local H‐Square representa ve for more informa on and ordering part numbers
© 2015‐2016 H‐Square
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SQ20501 and SQ20206 Series— Long Term Cycle Bake Casse e SQ20501 Series—All welded open construc on, chem‐cleaned bare aluminum casse e for long term wafer bake applica ons with laminar flow. 325° C Maximum. For use with AVT—ver cal transfer system. SQ20206 Series Asher Casse e—Rivet fastened, all 316 stainless steel construc on, (EP) Electro Polished finish, long term cycle bake wafer casse e. 550° C Maximum. For use with AVT—ver cal transfer system. Contact your local H‐Square representa ve for more informa on and ordering part numbers. SQ20501 Series SQ20206 Series Aluminum Stainless Steel Contact your local H‐Square representa ve for more informa on and ordering part numbers
Customized Metal Casse es Customers o en ask for special features to be added to an exi ng design. These include custom handles, finish or coa ngs, unique pitch, or sizing customiza on due to wafer/substrate a ributes. H‐Square’s Custom Product Department is uniquely qualified to provide engineered solu ons for any casse e requirements. Please contact your local H‐Square representa ve for more informa on. Customized 2851 Series—standard H‐Square aluminum casse e modified with a 12‐slot bi‐pitch configura on design and side handle bars. Customized SSC Series—standard H‐Square stainless steel casse e modified to have only 12‐slots and include an end‐wall handle. Contact your local H‐Square representa ve for more informa on and ordering part numbers
© 2015‐2016 H‐Square Catalog15‐16.1 57 www.h‐square.com Bi‐Pitch 13 slot Thin Wafer Plas c Casse es An sta c injec on molded Fuji Bakelite plas c casse es—Cyclic Olefin Co‐Polymer material for excellent wear resistance from sharp wafers as thin as 120µ. Extended slot profile shelves keep wafers flat for storage or produc on purposes. Storage cases and 25‐slot casse e versions are available. Contact H‐Square for more informa on. FB15A101H01 150mm 13 slot Thin Wafer with handle FB15A101H02 150mm 13 slot Thin Wafer no handle FB20A106H01 200mm 13 slot Thin Wafer with handle FB20A106H02 290mm 13 slot Thin Wafer no handle 25 and 26 slot Plas c Casse es An sta c injec on molded Fuji Bakelite plas c casse es—Cyclic Olefin Co‐Polymer material for excellent wear resistance from sharp wafers as thin as 180µ. Storage cases casse e versions are available. Contact H‐Square for more informa on. © 2015‐2016 H‐Square
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PC Series PTFE Teflon® Process and Cleaning Casse es H‐Square designs and manufactures custom plas c casse es and inserts for use in handling unique substrates, photomask cleaning applica ons, and wafer/ large die/ components storage and shipping applica ons. Most PC casse e designs u lize PTFE grade and PFA grade Teflon® parts for excellent chemical and wear resistance. H‐Square also manufactures custom PC casse es with PEEK, Polypropylene and An sta c Acetal materials. Designs are offered with either fixed or detachable PTFE handles. Many PTFE casse e designs are SRD and wet‐bench automa on compa ble (flange interface). H‐Square Custom Product Department designs and manufactures these PC series products for a reasonable cost, lead me and minimum quan ty order (five pieces per order). Contact your local H‐Square representa ve for more informa on. © 2015‐2016 H‐Square Catalog15‐16.1 59 www.h‐square.com Tegal Varian Varian Process Replacement Casse es For more than 30 years, H‐Square metal process casse es have been incorporated as the original equipment carrier provided by many industry leading equipment makers. In addi on to OEM casse es, H‐Square’s Custom Product Department offers many a ermarket replacement casse es manufactured to original specifica ons, or customized for today’s unique requirements. Replacement casse es are available for many toolsets including equipment manufactured by Applied Materials, Novellus, Varian, Tegal, Spu ered Films, Ma son, Yield Engineering, ASM, and many others. Please contact your local H‐Square representa ve for more informa on. Varian AMAT, Novellus, Ma son, Spu ered Films, ASM YES AMAT, Novellus ASM © 2015‐2016 H‐Square
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MISC1700 Series ‐ Thin Wafer FOUP Insert Kits and Stand Alone Thin Wafer Wire Casse es. Custom FOUP insert kits for suppor ng 300mm thin wafers in a FOUP. Unique all welded stainless steel wire design is available for several industry standard FOUP carriers. Available with either an sta c PEEK coa ng or PFA Teflon® coa ng. These thin wafer casse es provide an efficient and economical method of handling thin wafers without damage to the wafer or to the exis ng carrier. They are constructed of precision welded 316 stainless steel for weight a ributes, cleanli‐
ness, durability and long‐term dimensional stability. The MISC1700 series design is also the basis for H‐Square’s ultra thin wafer stand alone casse es for 100mm, 150mm and 200mm wafer handling below 180µ. Contact H‐Square for more informa on. 300mm Thin Wafer FOUP Insert Kit 200mm Thin Wafer Casse e SQ22758 and FOUPACC Series 300mm FOUP Conversion Kits—US Patent 6,095,335 H‐Square FOUP conversion kits allow customers to process 200mm or 150mm wafers inside an exis ng 300mm FOUP. Ideal for pilot lines, pre‐produc on and mul ‐wafer size facili es. Quick and easy installa on without damage to the FOUP. Kit materials, pitch and wafer placement need to specified. Aluminum, PEEK and an sta c Acetal materials are typical. Please contact your local H‐Square representa ve for more product informa on. Exploded view of SQ22758 conversion inset kit—plates and moun ng hardware prior to installa on. © 2015‐2016 H‐Square Customer specifies wafer slot pitch at 0.187”, 0.250”, or 10mm Catalog15‐16.1 61 www.h‐square.com Metal Casse e Handles These tools provide a safe, reliable means to handle hot metal casse es without contact by the operator’s hands. They are constructed of a plas c handle, type 304 electro‐polished stainless steel plate (except for CHMCLDH8 and CHMCLDH12 which have hard PPS plates) and stainless steel fasteners. CH Series—for 285 and 2851 casse es CH style handles are compa ble with 285 and 2851 style open end wall casse es and simply engages the upper and lower spacer bar for pick up. Handle length is 5.8” (147mm). Note that each handle is wafer size specific. Please specify casse e model number when placing an order. Custom product versions available for special applica ons. CH‐2 50mm casse e handle Acetal handle / stainless steel plate CH‐3 75mm casse e handle Acetal handle / stainless steel plate CH‐4 100mm casse e handle Acetal handle / stainless steel plate CH‐5 125mm casse e handle Acetal handle / stainless steel plate CH‐6 150mm casse e handle Acetal handle / stainless steel plate CH‐8 200mm casse e handle Acetal handle / stainless steel plate CHMC and CHMCL Series— for MC and MC1 casse es The CHMC handles are compa ble with MC and MC1 style solid end wall casse es and simply engage with the casse e handle interface loca on on the center of the solid end wall. Handle length is 5.8” (147mm). The CHMCL handle is an upgrade version of CHMC and includes a spring loaded Torlon® latch (normally closed) that posi vely locks the handle in place to the solid end wall of the MC and MC1 style casse e designs. Handle length is 8.1” (205mm). Please specify casse e model number when placing an order. Custom product versions available for special applica ons. CHMC456 All 100mm, 125mm and 150mm MC or MC1 casse es Acetal / handle stainless steel plate CHMCL456 All 100mm, 125mm and 150mm MC or MC1 casse es Acetal / handle stainless steel plate © 2015‐2016 H‐Square
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CHMCLDH8 Series— for MC8 and MC1 –8 200mm casse es The CHMC handles are compa ble with MC8 and MC1‐8 style solid end wall casse es and simply engage with the casse e handle interface loca on on the center of the solid end wall. The CHMCLDH8 includes a spring loaded PPS latch (normally closed) that posi vely locks the handle in place to the solid end wall of the MC and MC1 style casse e designs. Dual handle pistol grip handle length is 5.6” (142mm). CHMCLDH8 All 200mm MC and MC1 casse es Natural Polypropylene handle/ PPS plate and trigger CMAD Series—for SSC stainless steel casse es Dual pistol grip casse e handles for loading and unloading SSC style casse es from a process tool or oven. Pistol grip version CMAD handles are natural polypropylene with stainless steel interface plate and fasteners. Custom locking latch versions are also available. Handle length is 5.8” (147mm). Extended reach CMAD handles are 25” long are all welded stainless steel with T‐handle end for operator comfort. Note that each handle is wafer size specific. Addi onal custom product versions are available for special applica ons. CMAD3‐001 75mm SSC extended reach 25” (635mm) straight handle CMAD4‐001 100mm SSC extended reach 25”(635mm) straight handle CMAD4‐002 100mm SSC casse e handle 8” straight handle CMAD5‐001 125mm SSC extended reach 25” (635mm) straight handle CMAD6 150mm SSC casse e handle CMAD6‐001 150mm SSC casse e handle with locking latch 150mm SSC extended reach 25” (635mm) straight handle CMAD6‐004 CMAD8 200mm SSC casse e handle CMAD8‐001 200mm SSC casse e handle with locking latch © 2015‐2016 H‐Square Catalog15‐16.1 63 www.h‐square.com Plas c Casse e Handles These tools provide a safe, reliable means to handle plas c casse es without contact by the operator’s hands. Machined totally from chemical resistant polypropylene and assembled with PVC fasteners to allow use in aggressive cleaning applica ons. Most models all securely hold casse es by their robo c flanges. Please specify plas c casse e model numbers when ordering. CPA Series Natural Polypropylene construc on pistol grip handle for holding 150mm plas c casse es from the end wall flange. Fasteners are PVC screws for chemical resistance. Please specify casse e model number when placing an order. Custom product versions available for special applica ons. CPA6 150mm casse e handle Natural Polypropylene CPH Series Natural Polypropylene construc on straight handle for holding 150mm plas c casse es from the end wall flange. Fasteners are PVC screws for chemical resistance. Please specify casse e model number when placing an order. Custom product versions available for special applica ons. CPH6 150mm casse e handle Natural Polypropylene CPV Series Natural Polypropylene construc on ver cal handle for holding 150mm plas c casse es from the end wall flange. Fasteners are PVC screws for chemical resistance. Please specify casse e model number when placing an order. Custom product versions available for special applica ons. CPV6 150mm casse e handle Natural Polypropylene © 2015‐2016 H‐Square
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CPAD Series Natural Polypropylene construc on dual pistol grip handle for holding 200mm plas c casse es from the end wall flange. Compa ble with A192‐80M and A192‐81M Teflon® casse es with handle. Fasteners are PVC screws for chemical resistance. Please specify casse e model number when placing an order. Custom product versions available for special applica ons. CPAD8 200mm casse e handle Natural Polypropylene SRD Series Natural Polypropylene construc on pistol grip handle for holding 150mm or 200mm plas c casse es from the end wall flange to/from an SRD applica on. Low profile 316 stainless steel li pins allow easy access to a Teflon casse e loaded in a spin rinse dryer rotor. Fasteners are stainless steel. Please specify casse e model number when placing an order. CPA6‐003 150mm SRD casse e handle Natural Polypropylene CPAD8‐004 200mm SRD casse e handle Natural Polypropylene Custom Mechanical Plas c Casse e Handles Custom spring mechanism plas c casse e handles safely secure casse es by side wall flanges or top lip. Please contact your H‐Square representa ve for more informa on. © 2015‐2016 H‐Square Catalog15‐16.1 65 www.h‐square.com Mock Wafers Mock Aluminum Wafers Used as durable, sha erproof replacements for semiconductor wafers in training, robo c calibra on, par cle shielding, iden fica on, equipment demonstra on and promo onal applica ons, mock wafers are precision manufactured from 6061 T‐6 aluminum alloy. Each wafer is chemically etched and heat treated to improve flatness and surface finish prior to anodiza on. Each wafer is approximately 10%‐15% heavier than a silicon wafer of similar size and profile. Dimensions of diameters, flats and notches are within SEMI standards. Mock wafers can include silk screened artwork, engraving, color or other modifica ons on a custom basis. MW‐2HC MW‐2NP MW‐3HC MW‐3NP MW‐4HC MW‐4NP MW‐5HC MW‐5NP MW‐6HC MW‐6NP MW‐8FHC MW‐8FNP MW‐8NHC MW‐8NNP MW‐12NHC MW‐12NNP MW‐18NHC MW‐18NNP 50mm Flat 50mm Flat 75mm Flat 75mm Flat 100mm Flat 100mm Flat 125mm Flat 125mm Flat 150mm Flat 150mm Flat 200mm Flat 200mm Flat 200mm Notch 200mm Notch 300mm Notch 300mm Notch 450mm Notch 450mm Notch Hard Clear Anodized Bare Aluminum Hard Clear Anodized Bare Aluminum Hard Clear Anodized Bare Aluminum Hard Clear Anodized Bare Aluminum Hard Clear Anodized Bare Aluminum Hard Clear Anodized Bare Aluminum Hard Clear Anodized Bare Aluminum Hard Clear Anodized Bare Aluminum Hard Clear Anodized Bare Aluminum SEMI STANDARDS DIAMETER FLAT LENGTH THICKNESS SIZE MIN MAX MIN MAX MIN MAX 2” (50.8mm) 1.985” 2.015” 0.560” 0.690” 0.0100” 0.0120” 3” (76.2mm) 2.795” 3.025” 0.750” 1.000” 0.0140” 0.0160” 100mm 3.918” 3.956” 1.181” 1.377” 0.0237” 0.0255” 125mm 4.902” 4.940” 1.575” 1.771” 0.0237” 0.0255” 150mm 5.875 " 5.936 " 2.166 " 2.362 " 0.0256 " 0.0275 " 200mm 7.855 " 7.893 " 2.166 " 2.362 " 0.0276 " 0.0295 " 300mm 11.792 " 11.830 " N/A N/A 0.0290 " 0.0300 " 450mm 17.713” N/A N/A 0.0354” 17.720” 0.0374” © 2015‐2016 H‐Square
66 © 2015‐2016 H‐Square Catalog15‐16.1 67 www.h‐square.com Ergoli ™ Ba ery Powered Ergonomic Li Carts Ergoli ™ manual guided transport (MGV) carts provide safe handling of heavy objects around a cleanroom area. The ba ery driven motorized electric lead screw Z‐Axis li and customized end‐effector is rated up to 200 lbs. (91 kg) of li and allows this versa le tool to pick‐up and place objects and carriers on load ports, tables, and storage racks. The light weight‐Mobile EZ™ design allows the operator to make precise manual movements when transpor ng product around a fab area. A demountable remote control, adjustable height handle bar, foot operated central brake system, mechanical slip clutch, and integrated travel limit stop make the Ergoli ™ easy for the operator to use without risk of product damage or operator strain and injury. The use of ergonomic li ers can contribute to lower medical claims, reduced personnel replacement and lower or eliminate your lost produc on costs. These costs along with the reduc on or elimina on of Workman's Compensa on claims contribute to higher profitability for your company. Key Features: Light weight‐mobile easy opera on, easy movement in all direc ons with full load Single Li Mast Provides Clear View for safe opera on Foot operated central brake‐accessible from all sides of the li er Enclosed Li Screw‐No Pinch Points Aluminum and stainless steel construc on Modular construc on design ‐ easily customized for ideal load balance and height li requirements De‐mountable operator remote control with adjustable height handle bar Enclosed electric li screw mechanical with slip clutch, adjustable load capacity and current limit travel stop Rechargeable / exchangeable gel cell power pack Custom Ergoli s™ Custom Product Department will design custom Ergoli s for any material han‐
dling applica on including Semiconduc‐
tor, Flat Panel Display and Biomedical cleanroom applica ons. Single mask li ers can be designed to li up to 275 lbs. (includes weight of load and end‐
effector). Contact your local H‐Square representa‐
ve for more informa on. © 2015‐2016 H‐Square
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FL Series FOUP transport Cart Load port compa ble MGV li carts designed for handling SEMI standard FOUP, FOSB, MAC and metal casse es around a cleanroom. Aluminum and stainless steel versions available. End effectors are designed to interface with overhead transport flanges. 450mm versions feature a lock pin device for securing the carrier to the Ergoli ™ during transport. FL‐003 300mm Aluminum—legs wrap around load port FL‐004 450mm Aluminum—legs wrap around load port FL‐005 450mm Stainless Steel—legs wrap around load port FL‐006 450mm Stainless Steel, pneuma c vibra on dampening wheels, front docking to load port Total Li Capacity • Maximum 200‐lbs (includes weight of load and end‐effector) Cer fica on • CE Marked Material • Intermediate Sec on: Aluminum — Anodized • Legs: Steel — Powder Coated or Stainless Steel • Li Mast: Aluminum — Anodized • End‐Effector: Anodized aluminum 3‐posi on wheel direc onal lock system 450mm Casse e Transport FL‐006 © 2015‐2016 H‐Square Catalog15‐16.1 69 www.h‐square.com MCP ‐ Mechanical Edge Grip Picks These custom‐fit, normally closed, ergonomic, outside diameter wafer edge handling tools are a fully mechanical tool which provides clean constant ‐ force handling from the edge exclusion zone of a substrate. The using high performance plas cs and Kalrez® touch pads. These tools are highly customized for specific applica ons and are available for substrates of all sizes, materials and thicknesses. Please contact H‐Square’s Custom Products Department or inquire through your local H‐Square sales representa ve. Ordering informa on to supply to H‐Square Engineering 1. Wafer size (diameter or dimensions) 2. Wafer thickness 3. Edge exclusion area FRONT 4. Edge exclusion area BACK 5. Stage / platen interface considera ons 5a. Chemical considera ons 5b. Thermal temperature considera ons 5c. An sta c considera ons 5d. End‐effector profile (knife edge, angled, extended support) Minimal backside contact Straight handle profile MCP Materials: An sta c PEEK Natural PEEK Natural Polypropylene An sta c Polypropylene An sta c Acetal PTFE Teflon® Backside support (thin wafer) Angled handle profile © 2015‐2016 H‐Square
70 Mechanical Wafer Picks E D G E
200mm G R I P
150mm 100mm 75mm 50mm Recommended MCP P/N Wafer Diameter Material Front Contact Back Contact MCP‐2‐002 50mm An sta c PEEK, An sta c Acetal 0.10” (2.5mm) 0.19” (4.8mm) MCP‐3‐001 75mm An sta c PEEK, An sta c Acetal 0.10” (2.5mm) 0.20” (5.0mm) MCP‐4‐008 100mm An sta c PEEK, An sta c Acetal 0.08” (2.0mm) 0.17” (4.3mm) MCP‐6‐019 150mm An sta c PEEK, An sta c Acetal 0.07” (1.7mm) 0.16” (4.0mm) MCP‐8‐014 200mm An sta c PEEK, An sta c Acetal 0.12” (3.0mm) 0.30” (7.6mm) MCP‐12‐001 300mm An sta c PEEK, An sta c Acetal 0.30” (7.6mm) 0.65” (16.5mm) © 2015‐2016 H‐Square Catalog15‐16.1 71 www.h‐square.com ODP Mechanical Wafer Picks The ODP tool is a fully mechanical tool, which provides edge only handling of substrates using v‐groove profile grippers. These tools are highly customized for specific applica ons and are available for all wafer sizes and thicknesses. Picks are lightweight, economical and easy to use. ESD safe versions available. Custom designs with special angles, customized grippers, locking triggers, custom materials or other non‐standard features are also available Please contact H‐Square’s Custom Products Department or inquire through your local H‐Square sales representa ve. P/N Wafer Size Gripper Material Orienta on ODP‐3 75mm Black Acetal Straight ODP‐4 100mm Black Acetal Straight ODP‐5 125mm Black Acetal Straight ODP‐6 150mm Black Acetal Straight ODP‐6‐004 150mm Black Acetal 3.0” Offset ODP‐6‐012 150mm Natural PEEK 1.7” Offset ODP‐8 200mm Black Acetal Straight ODP‐8‐006 200mm Natural PEEK 1.7” Offset ODP‐8‐007 200mm ESD safe PEEK 1.7” Offset ODP‐12‐006 300mm Black Acetal Straight P/N ODP Hoop Style Mechanical Wafer Pick ODP 3‐PT Style Mechanical Wafer Pick Wafer Size Gripper Material Gripper Length Locking Latch ODP‐3‐001 75mm Natural PEEK 2.0” No ODP‐3‐003 75mm Natural PEEK 2.0” Yes ODP‐3‐004 75mm ESD‐safe PEEK 2.0” No ODP‐3‐006 75mm Teflon® PTFE 2.0” No ODP‐4‐001 100mm Natural PEEK 2.0” Yes ODP‐4‐005 100mm ESD‐safe PEEK 2.2” No ODP‐5‐001 125mm Teflon° PTFE 3.54” No ODP‐5‐002 125mm Teflon® PTFE 3.54” Yes ODP‐6‐003 150mm Natural PEEK 2.0” Yes ODP‐6‐008 150mm Teflon® PTFE 2.0” Yes ODP‐6‐009 150mm Teflon® PTFE 3.54” Yes ODP‐6‐010 150mm Teflon® PTFE 2.0” No ODP‐8‐002 200mm Natural PEEK 2.0” Yes ODP‐8‐016 200mm Teflon® PTFE 2.0” Yes ODP‐12‐001 300mm Natural PEEK 2.0” Yes ODP‐18‐001 450mm ESD safe PEEK 2.0” Yes © 2015‐2016 H‐Square
72 Mechanical Wafer Picks O U T S I D E
ODP MPS Style Mechanical Wafer Pick D I A M E T E R
P/N Wafer Size Gripper Material Handle Angle ODP‐4‐008 100mm Natural PEEK 15° ODP‐6‐002 150mm Natural PEEK 15° ODP‐6‐011 150mm ESD safe PEEK 15° ODP‐8‐001 200mm ESD safe PVDF 15° ODP‐8‐003 200mm Torlon® 15° ODP‐8‐009 200mm Natural PEEK 15° ODP‐8‐011 200mm Natural Polypropylene 15° ODP‐8‐017 200mm Natural PEEK 0° ODP‐12‐003 300mm Natural PEEK 15° P/N Wafer Size Gripper Material ODP‐3‐005 75mm Natural Polypropylene 3.0” ODP‐4‐006 100mm Natural Polypropylene 3.0” ODP‐6‐005 150mm Natural Polypropylene 3.0” ODP‐8‐004 200mm Natural Polypropylene 3.0” ODP‐8‐010 200mm Natural PEEK ODP‐12‐005 300mm Horizontal Offset ODP MPH Style Mechanical Wafer Pick 3.0” Natural Polypropylene 3.1” ODP Mechanical Pick Holders Keeps your picks safe, contamina on free and dy. Made from electro‐
polished stainless steel to ensure cleanliness and durability. Available in three models: Single, Triple or Quadruple. All models can be secured to bench top. Compa ble with all H‐Square mechanical picks. HMP1 Single HMP3 Triple HMP4 Quadruple © 2015‐2016 H‐Square Catalog15‐16.1 73 www.h‐square.com Nu‐twEZer™ Custom Mechanical Die and Small Device Pick Advanced design, normally closed, mechanical handling tool for large die or small device. Each tool is custom designed for a specific device. Customiza on allow a constant force grip to eliminate edge damage. Base units are made from ESD safe Polypropylene materials. Customized features: Tips can be developed per applica on; color coding available; choice of spring tension; high temperature materials available; chemical resistant materials available. Please contact your local H‐Square representa ve for more informa on on custom Nu‐twEZer tools. Minimum order quan es (MOQ) apply. Contact your H‐Square representa ve for more informa on and ordering part numbers. Horizontal Ver cal © 2015‐2016 H‐Square
74 Mechanical Wafer Picks S M A L L
D E V I C E
H A N D L I N G
HDCP Style Custom Mechanical Wafer, Op cs, and Small Device Picks HDCP picks reduce contamina on by elimina ng direct contact of substrates with hands. Grippers are designed for edge grip contact with minimal contact to front or back sides of wafer/substrate. Picks are lightweight, economical and easy to use. ESD safe versions available. Custom designs with special angles, customized grippers, locking triggers, custom materials or other non‐standard features are also available. Contact your H‐Square representa ve for more informa on and ordering part numbers. Small Device Custom Mechanical Picks Mechanical picks reduce contamina on by elimina ng direct contact of substrates with hands. Grippers are designed for edge grip contact with minimal contact to front or back sides of device. Picks are lightweight, economical and easy to use. ESD safe versions available. Custom designs with special angles, customized grippers, locking triggers, custom materials or other non‐standard features are also available. Contact your H‐Square representa ve for more informa on and ordering part numbers. © 2015‐2016 H‐Square Catalog15‐16.1 75 www.h‐square.com Mask Picks H‐Square’s line of photomask picks is the result of years of work with semiconductor companies and mask shops to provide a non‐contamina ng secure means of handling photomasks. With the advent of larger and thicker masks, which make manual handling very difficult, H‐Square picks have become a necessary tool. With the stringent cleanliness requirements for sub‐micron applica ons today, mask picks have become indispensable. Features  Tangen al edge‐grip only; no front or back face contact.  Compa ble with most pellicized square re cles and round masks with flats.  Minimal moving parts for simple cleaning and low par cle genera on.  Lightweight, economical and easy‐to‐use with trigger‐type gripping mechanism.  V‐type grippers allow masks with beveled edges to be loaded from flat surfaces.  Various gripper widths and V‐groove depths allow customizing for each applica on. Mask Picks can reduce contamina on by elimina ng direct contact of mask by operator’s hands. Masks are easily inserted and extracted from various fixtures and storage containers, and are securely gripped while loaded in the pick. Custom mask picks are available for applica ons requiring special handle angles, locking triggers, high temperature grippers or heavier li ing capacity. Contact H‐Square Custom Products department for more informa on. MPS1 Series Photomask Picks Side Grip Mask Pick, Side (MPS1) clamp pick tool designed with a 15° angle handle allows the removal from and placement into a storage container of a sin‐
gle mask, mask with pellicle or other types of substrates. The tool is capable of picking up sub‐
strates weighing up to two pounds. Mask Size P/N Material 5" x 5" x 0.090" MPS1‐50‐014 ESD‐safe Polypropylene 6" x 6" x 0.250" SQ21457‐25 ESD‐safe Polypropylene 7" x 7" x 0.120" MPS1‐71‐001 ESD‐safe Polypropylene 7" x 7" x 0.150" SQ21457‐9 ESD‐safe Polypropylene 9” x 9” x 0.120” MPS1‐001 ESD‐safe Polypropylene 14” x 14” x 0.189” MPS1‐14‐001 ESD‐safe Polypropylene An sta c © 2015‐2016 H‐Square
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MPH1 Series Photomask Picks Horizontal Grip Mask Pick, Horizontal (MPH1) is compa ble with most single and mul ple plate containers, and many vacuum chucks, microscope stages and other fixtures. A 90° handle is available for MPH1 models for special applica ons An sta c Mask Size P/N Material 5" x 5" x 0.090" MPH151DW‐005 ESD‐safe Polypropylene 6" x 6" x 0.250" SQ21457‐6 7" x 7" x 0.120" MPH172DW‐003 ESD‐safe Polypropylene 7" x 7" x 0.150" MPH172DW‐003 ESD‐safe Polypropylene 9” x 9” x 0.120” MPH3‐92‐001 ESD‐safe Polypropylene ESD‐safe Polypropylene MPH1 90° Series Photomask Picks Horizontal 90° Grip An sta c Mask Size P/N 5" x 5" x 0.090" MPH151DW90‐005 ESD‐safe Polypropylene 6" x 6" x 0.250" MPH163VO90‐001 ESD‐safe Polypropylene 7" x 7" x 0.120" MPH172DW90‐001 ESD‐safe Polypropylene 7" x 7" x 0.150" MPH172DW90‐001 ESD‐safe Polypropylene © 2015‐2016 H‐Square Material Catalog15‐16.1 77 www.h‐square.com MPV Series Mask Handling Picks ‐ Ver cal Grip Mask Pick, Ver cal (MPV1) allows easy loading and unloading of square masks from mul ple plate casse es and storage boxes for transfer or visual inspec on purposes. MPV1 models are used almost exclusively for loading the unloading plates from mul ple plate carriers. The MPV1 can access any plate in most carriers; sequen al handling is not usually required. Mask Size P/N Material 5" x 5" x 0.090" MPV1‐5‐002 ESD‐safe Polypropylene 6" x 6" x 0.250" SQ21457‐4 ESD‐safe Polypropylene 7" x 7" x 0.120" MPV1‐7 Natural Polypropylene 7" x 7" x 0.150" MPV1‐7 Natural Polypropylene 9” x 9” x 0.120” MPV1‐005 Natural Polypropylene MPH ‐ MPC Series Custom Horizontal Offset Mask Handling Picks J‐Spring™ Technology An sta c Mask Size P/N 6" x 6" x 0.250" MPH3‐63AS‐001 ESD‐safe Polypropylene 3.1” 7" x 7" x 0.120" MPH3‐72AS‐001 ESD‐safe Polypropylene 3.1” 9” x 9” x 0.120” MPH3‐92‐001 3.1” Material ESD‐safe Polypropylene Offset * * Models available from 1.7” to 7.0” offset heights. Contact your local H‐Square representa ve for addi onal ordering part numbers. © 2015‐2016 H‐Square
78 Photolithography M A S K
P I C K S
SQ21518 Series Mask Handling Mechanical Picks ‐ Nikon Cartridge Box Mask picks reduce contamina on by elimina ng direct contact of mask with hands. The four gripper horizontal offset SQ21518 mask pick is designed to load and unload masks from a NIKON Stepper mask cartridge or other ght space horizontal offset applica on. Picks are lightweight, economical and easy to use. Designs feature a locking latch trigger to safe guard the premature release of a valuable photomask and all designs are ESD safe. SQ21518‐1 6”x6”x0.250” ESD‐safe Polypropylene (A)4.65” (B)4.96” (C)3.80” (D)4.28” SQ21518‐16 6”x6”x0.250” ESD‐safe Polypropylene (A)4.70” (B)5.00” (C)4.70” (D)5.19” SQ21518‐32 6”x6”x0.250” ESD‐safe Polypropylene (A)4.66” (B)4.96” (C)4.64” (D)4.97” SQ21518‐40 5”x5”x0.090” ESD‐safe Polypropylene (A)3.25” (B)4.25” (C)3.25” (D)4.25” INSIDE GRIPPER A B OUTSIDE GRIPPER C D Extreme Ultraviolet Lithography Mask Mechanical Picks (EUV) ‐ J‐Spring™ Technology Mask picks specially designed to handle EUV masks from the side using tension to hold the mask—without contact of the bo om tangen al edge. Grippers should be placed at the midpoint of the mask when handling. An sta c Polypropylene and 316 stainless steel construc on with Kalrez® o‐rings. Features advanced316 SST flat J‐Spring™ tensioner. PM Nota on: J‐Spring™ should be replaced every six months. MPS3‐63AS‐002 6”x6”x0.250” ESD‐safe Polypropylene 403387 Replacement Flat J‐Spring, EP 316 SST © 2015‐2016 H‐Square Catalog15‐16.1 79 www.h‐square.com Mask Pick Holders Keeps your mask picks safe, contamina on free and dy. Made from electro‐
polished stainless steel to ensure cleanliness and durability. Available in three models: Single, Triple or Quadruple. All models can be secured to bench top. Compa ble with all H‐Square mechanical picks. HMP1 Single HMP3 Triple HMP4 Quadruple ISM Series Photo‐mask Inspec on & Cleaning Sta on X, Y and theta movement mask inspec on stand facilitates hands off visual inspec on, Nitrogen or CDA clean off applica ons, or transi on pla orm to change to a second style mask pick. Mul ple size mask supports give an overall compact tabletop design. Cost efficient alterna ve to automa c /semiautoma c inspec on tools. Made from an sta c materials to insure ESD safety and overall cleanliness. ISM567 – X, Y, Tilt and Theta movement for 5”x5”, 6”x6” and 7”x7” photomasks (any thickness) IM56‐001 – fixed stage for handling 5”x5” and 6”x6” masks (any thickness) SQ21408 Series Photo‐mask Inspec on & Cleaning Sta on Mask preven ve maintenance inspec on stand designed to facilitate hands off visual inspec on and Nitrogen or CDA clean‐off applica ons. Operator loads the tool with another mask pick. Two 360° degree theta mo ons allow for easy posi oning of masks under bright light. Smooth opera on makes it easy to scan for and pinpoint par cles. Compact tabletop design saves expensive cleanroom space. Cost efficient alterna ve to automa c/
semiautoma c inspec on tools. Made from ESD safe cleanroom materials to insure cleanliness. SQ21408‐1 6”x6”x0.250” ESD‐safe Polypropylene SQ21408‐3 5”x5”x0.090” ESD‐safe Polypropylene SQ21408‐10 9”x9”x0.120” ESD‐safe Polypropylene © 2015‐2016 H‐Square
80 Photolithography M A S K
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T O O L S
PC Series PTFE Teflon® Photomask Cleaning Casse es All PTFE casse es hold photo masks in a ver cal posi on for easy cleaning in various processing baths. Photomask cleaning casse es are available in a variety of sizes and either incorporate a handle or wet bench automa on flanges. Li er blocks can be incorporated to li the mask up to interface with mechanical mask picks. MISC2500 and SQ20999 Series Mask Casse e Li er Blocks Li er blocks are designed to provide easy access to masks. Masks are li ed out of casse es, providing access to mask edges for removal with the appropriate style mask pick. Mask li er blocks are available in a variety of sizes and materials, many of which are ESD safe. Please contact your local H‐Square representa ve for more informa on on these mask handling products. © 2015‐2016 H‐Square Catalog15‐16.1 81 www.h‐square.com MISC2500 Series Tabletop Macro Bright Light Inspec on Sta on Table top bright light reflec on containment chamber with a 250 wa halogen full spectrum light source. The system includes an integrated automa c on/off mo on sensor switch and an oversized aluminum heat sink which keep the lamp cool without the need of a cooling fan. Substrates are manually placed into the black anodized light absorbing chamber and viewed under the concentrated light source. The enclosed table‐top design provides the operator with a controlled macro light inspec on while capturing and diffusing most deflected light. The small, lightweight but sturdy design allows for placement in an already crowded produc on area. Electrical power is required. This is a fast and inexpensive way to examine a surface for par cles, haze, scratches and surface defects. MISC2500‐007 5x5, 6x6 masks USA (100‐120 VAC) MISC2500‐018 5x5, 6x6 masks E or UK (220‐240 VAC) MISC2500‐015 7x7, 9x9, 14x14 masks USA (100‐120 VAC) MISC2500‐016 7x7, 9x9, 14x14 masks E or UK (220‐240 VAC) MISC2500‐007 / ‐018 Height: 16.0”(406mm) Depth: 12.0” (304mm) Width: 12.0” (304mm) MISC2500‐015 / ‐016 Height: 30.0”(762mm) Depth: 24.0” (609mm) Width: 24.0” (609mm) Automa c RSP Re cle SMIF Pod Openers Semi‐automa c RSP200 and RSP150 re cle SMIF pod opener provide easy access to photomasks stored inside single and mul ple stack re cle storage pod casse es with minimal operator involvement. Units are compa ble with standard RSP200 and RSP150/MSP150 pod designs. Smooth, reliable li automa on for reliability and cleanliness. Class One Cleanroom compa ble. ESD protec on insured by sta c dissipa ve plas cs. SMIFPO8‐E‐002 RSP200 Automa c Opener SMIFPO6 RSP150 Automa c Opener Dimensions Height: 26.9”(683mm) Depth: 15.4” (391mm) Width: 14.0” (355mm) © 2015‐2016 H‐Square
82 Photolithography R E T I C L E
P O D
O P E N E R S
SMIFMAN6 150mm Manual Re cle SMIF Pod Opener Tabletop manual swing arm pod opener provides clean, easy access to photomasks in any RSP150 re cle storage single‐mask and mul ‐mask pod casse es. The SMIFMAN6 allows the operator to manually open the 4 lever mechanism on the pod, lowering the base and releasing the lid. This allows access to the inner mask tray. H‐Square’s design features a clean pin raised storage area for the lid to be stored while pod is open. Unit also features a mask pick holder. An sta c materials are used to insure ESD safety and cleanliness. SMIFMAN6 Manual RSP150 Opener Dimensions Height: 6.0” (152mm) Depth: 10.8” (274mm) Width: 19.0” (482mm) SMIFMAN8 200mm Manual Re cle SMIF Pod Opener Tabletop manual swing arm pod opener provides clean, easy access to photomasks in any RSP200 re cle storage single‐mask pod casse es (or 200mm wafer SMIF Pod unit). The SMIFMAN8 allows the operator to manually open the center mechanism on the pod to release the lid and gain access to the inner mask tray. H
‐Square’s design features a clean storage area for the lid to be stored while pod is open. An sta c materials are used to insure ESD safety and cleanliness. SMIFMAN8 Manual RSP200 or SMIPOD 200mm Casse e Opener Dimensions Height: 6.0” (152mm) Depth: 10.8” (274mm) Width: 20.0” (508mm) © 2015‐2016 H‐Square Catalog15‐16.1 83 www.h‐square.com The Breeze™ provides a state‐of‐the‐art touchless solu on for manually transferring wafers while introducing li le to no stress to the substrate. H‐Square’s Breeze™ wand is a non‐contact wafer handling system that em‐
ploys Bernoulli li ing principles ‐ for wafer handling of thin, warped, thick, SEMI standard, or many other sizes and shapes of substrates. The handling tool uses compressed facility gases (typically Nitrogen ‐or‐ CDA ‐ clean dry air), to stream air flow from a center sparger cap or sparger tube to the perimeter of the wafer. Wafers are manually li ed from a surface, platen, casse e, or shipping container without contact on the top or bo om surfaces of the wafer. In accordance with Bernoulli's principle pressure differen al , the wafer is “floated” on the wand apparatus at approximately 200µ (microns) from the surface of the Breeze plate. Corral pins limit sideway movement of a retained wafer. H‐Square offers two standard models of Breeze handling systems ‐ the H2B ‐ a 90 degree perpendicular handle apparatus, and the H2BST ‐ a horizontal offset handle configura on. Custom configura ons are also available through your local H‐Square representa ve. H2BST‐4 H2BST‐6 H2BST‐8 H2BST‐12 100mm 150mm 200mm 300mm Horizontal Offset Handle Horizontal Offset Handle Horizontal Offset Handle Horizontal Offset Handle H2B‐4 H2B‐6 H2B‐8 H2B‐12 100mm 150mm 200mm 300mm Perpendicular Handle Perpendicular Handle Perpendicular Handle Perpendicular Handle © 2015‐2016 H‐Square
84 Bernoulli Handling B r e e z e ™
Materials ‐ Handle ‐ Copolymer acetal, sta c dissipa ve Surface resis vity: E10 –E12 W /sq Plate: transparent ESD‐safe Polycarbonate Corral pins: Copolymer acetal, sta c dissipa‐
ve Trigger/lever: 316 Stainless steel Connec on ‐ connector for grip and seal connec on to external OD tubing of 0.250" (6.4mm) +/‐ 0.010" Facility Requirements ‐ Filtered air (CDA) or Nitrogen (N2) Input ‐ 10‐60 PSI 1.0‐1.5 CFM A pressure regulator may need to be in‐
stalled at the Breeze connec on point in order to op mally adjust the amount of gas (air) flow. Weight ‐ 0.6lbs (0.28kg) Table‐Top Holders for Breeze units— weighted moveable base assembly HBH‐001 H2B style—horizontal offset handle H‐H2BST H2BST style—perpendicular handle HBH‐001 © 2015‐2016 H‐Square H‐H2BST Catalog15‐16.1 85 www.h‐square.com Table Top Freedom Wands™ Heavy‐duty self‐contained portable Freedom Wand™ vacuum system. Allows operators to take a clean vacuum handling system anywhere in a fab. Systems are compa ble with all H‐Square vacuum ps. Sturdy standard tabletop produc on unit is designed to provide 22" ‐ 24" Hg vacuum. A smart charger LED illuminates 20 minutes before ba ery is fully discharged. Class 1 cleanroom compa ble. Features: Photo electric sensor ‐ turns off vacuum pump when wand is replaced in holder. Auto shut‐off conserves ba ery power. Heavy duty micro‐pumping mechanism. 22”‐24” Hg vacuum strength. Sturdy base (approx. 2 1/2 lbs.) provides stability for tabletop applica ons. Small footprint (4 3/8” x 9 1/4”). Spring reinforced, non‐kinking, 6‐foot reach vacuum cord. Normally OPEN/vacuum ON wand. Class 1 cleanroom compa ble. 450mm FWA450AS ESD Safe Portable Freedom Wand™ SGI ‐ Safe Grip Heavy‐duty, self‐contained portable Freedom Wand™ vacuum system. Sturdy custom tabletop produc on unit is de‐
signed for portable 450mm wafer handling. Compa ble with all H‐Square vacuum ps up to 450mm. Unit is designed to provide 22" ‐ 24" Hg vacuum for over 2 hours of con nuous opera on. SGI ‐ Safe Grip Indicator light illuminates at 16" Hg to show operator it is safe to li substrate. Two rechargeable and interchangeable NiMH ba ery packs and charger sta‐
on are included. Smart charger LED illuminates 20 minutes before discharge, allowing for ba ery change out. Tool is ESD safe and comes with grounding cord. Class 1 cleanroom compa ble. 450mm vacuum p T450PKA1 included. FWA450AS Replacement 10V nickel hydride ba ery: 602526 US Patent No. 5,217,273 Class 1 Cleanroom Cer fied © 2015‐2016 H‐Square
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200mm FWAHAS2 ESD Safe Portable Freedom Wand™ SGI ‐ Safe Grip Heavy‐duty self‐contained portable Freedom Wand™ system. System is compa ble with all H‐Square vacuum ps up to 200mm. Sturdy standard tabletop produc on unit is designed to provide 22" ‐ 24" Hg vacuum for over 2 hours of con nu‐
ous opera on. Shut‐off holder automa cally turns system off when vacuum wand handle is placed in holder. SGI ‐ Safe Grip Indicator light illuminates at 16" Hg to show operator it is safe to li substrate. Two rechargeable and interchangea‐
ble NiMH ba ery packs and charger sta on are included. Smart charger LED illuminates 20 minutes before discharge, allowing for ba ery change out. The FWAHAS2 tool is ESD safe and comes with a grounding cord. Class 1 cleanroom com‐
pa ble. Vacuum ps are sold separately. FWAHAS2 Replacement 10V nickel hydride ba ery: 602526 US Patent No. 5,217,273 Class 1 Cleanroom Cer fied 300mm FWA3AS2 ESD Safe Portable Freedom Wand™ SGI ‐ Safe Grip Heavy‐duty, self‐contained portable Freedom Wand™ vacuum system. Sturdy custom tabletop produc on unit is de‐
signed for portable 300mm wafer handling. Compa ble with all H‐Square vacuum ps up to 300mm. Unit is designed to provide 22" ‐ 24" Hg vacuum for over 2 hours of con nuous opera on. SGI ‐ Safe Grip Indicator light illuminates at 16" Hg to show operator it is safe to li substrate. Two rechargeable and interchangeable NiMH ba ery packs and charger sta‐
on are included. Smart charger LED illuminates 20 minutes before discharge, allowing for ba ery change out. Tool is ESD safe and comes with grounding cord. Class 1 cleanroom compa ble. 300mm vacuum p T3PKA1 included. FWA3AS2 Replacement 10V nickel hydride ba ery: 602526 US Patent No. 5,217,273 Class 1 Cleanroom Cer fied © 2015‐2016 H‐Square Catalog15‐16.1 87 www.h‐square.com FWTTA1 Table Top Portable Freedom Wand™ Auto Shutoff Heavy‐duty self‐contained portable Freedom Wand™ vacuum system. System is compa ble with all H‐Square vacuum ps up to 200mm. Sturdy standard tabletop produc on unit is designed to provide 22" ‐ 24" Hg vacuum for over 4 hours of con nuous opera on. White polypropylene base construc on with press‐fit NOPPF1 wand handle. FWTTA1 features LED shut‐off holder to automa cally turn system off when the vacuum wand handle is placed in holder. Internal ba ery pack with "smart" charger system keeps ba ery at full charge when a ached to the power supply. Smart charger LED illumi‐
nates 20 minutes before discharge. Class 1 cleanroom compa ble. Vacuum ps are sold separately. FWTTA1 Replacement Power Supply/Charger: A000‐754‐1 USA (100‐120 VAC) A000‐754‐2 EUROPE (220‐240 VAC) A000‐754‐3 UK (220‐240 VAC) US Patent No. 5,217,273 Class 1 Cleanroom Cer fied Die and Package Auto Shutoff FWTTA1 Table Top Portable Freedom Wand™ A custom version of the standard FWTTA1 pla orm. The FWTTA1‐AC‐005 has all the standard features of the FWTTA1 but includes DPNOAS2LA wand, CC‐4SDS coil cord, CTA06 grounding adapter, two (2) bent BCHN hub needles (BCHN‐16S and BCHN‐18), and two (2) vacuum cups (VCAS125 and MBNCSD‐12) to make a complete die and package Freedom Wand™ starter package. FWTTA1‐AC‐005 Die and Package Freedom Wand USA (100‐120 VAC) US Patent No. 5,217,273 Class 1 Cleanroom Cer fied © 2015‐2016 H‐Square
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300mm Auto Shutoff FWTTA1 Table Top Portable Freedom Wand™ A popular custom version of the standard FWTTA1 pla orm. The FWTTA1‐AC‐004 has all the standard features of the FWTTA1 but includes a 300mm shutoff holder and NO3T3PKAS1 vacuum wand assembly. FWTTA1‐AC‐004 300mm Freedom Wand USA (100‐120 VAC) Replacement Power Supply/Charger: A000‐754‐1 USA (100‐120 VAC) US Patent No. 5,217,273 Class 1 Cleanroom Cer fied SQ22949 Belt Clip Portable Freedom Wand™ Auto Shutoff Custom heavy‐duty self‐contained portable Freedom Wand™ vacuum system. System is compa ble with all H‐Square vacuum ps up to 300mm. Wafer rescue opera on belt clip mounted produc on unit is designed to provide 22" ‐ 24" Hg vacuum for over 4 hours of con nuous opera on. White polypropylene base construc on with press‐fit NO3AS1 300mm wand handle. FWTTA1 features LED shut‐off holder to automa cally turn system off when the vacuum wand handle is placed in holder. Internal ba ery pack with "smart" charger system keeps ba ery at full charge when a ached to the power supply. Smart charger LED illuminates 20 minutes before discharge. Class 1 cleanroom compa ble. 300mm T3PKAS1 p included. The SQ22949 series has mul ple ordering part numbers. Please contact your H‐Square representa ve for informa on and op ons on this custom portable vacuum wand. SQ22949‐XXX Contact H‐Square for ordering part numbers Replacement Power Supply/Charger: A000‐754‐1 USA (100‐120 VAC) A000‐754‐2 EUROPE (220‐240 VAC) A000‐754‐3 UK (220‐240 VAC) Replacement clip on nylon belt: FWCOB US Patent No. 5,217,273 Class 1 Cleanroom Cer fied © 2015‐2016 H‐Square Catalog15‐16.1 89 www.h‐square.com FWCR Portable Cordless Freedom Wand™ Compact (Rechargeable) Patent # 5,217,273 Self‐contained cordless ba ery powered vacuum wands allows freedom from vacuum lines. 100% increased run me to 180 minutes. Direct connect to power supply allows use with discharged ba eries. Ergonomically designed with finger contours for comfort – fits in to palm of operator’s hand. Charger stand safely stores wands out of the way while recharging the ba ery. Smart charger system keeps ba ery fully charged without worry of damage from overcharging. Recommended p IS included. Replacement ps may be purchased separately, using part number “T693PKAS3” for 200mm. Class 1 cleanroom compa ble. Filter replacement kit may be purchased separately using part number “FWCR2FA” Features:  Self‐contained cordless ba ery powered vacuum wands allows freedom from vacuum lines.  Run me to 180 minutes.  Direct connect to power supply allows use with discharged ba eries.  Ergonomically designed with finger contours for comfort – fits in to palm of operator’s hand.  Charger stand safely stores wands out of the way while recharging the ba ery.  Smart charger system keeps ba ery fully charged without worry of damage from overcharging.  Recommended p IS included.  Replacement ps may be purchased separately, using part number “T693PKAS3” for 200mm FWCR2 and “T3PK1” for 300mm FWCR3.  Class 1 cleanroom compa ble. US Patent No. 5,217,273 © 2015‐2016 H‐Square
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200mm FWCR Portable Cordless Freedom Wand™ Compact (Rechargeable) ‐ for Wafer Rescue Ships with: T693PKAS3 PEEK vacuum p, FWCR base unit, charging stand, power supply/cord. FWCR2‐AC USA (100‐120 VAC) FWCR2‐E EUROPE (220‐240 VAC) FWCR2‐UK UK (220‐240 VAC) Replacement Filter Assembly: FWCR2FA Class 1 Cleanroom Cer fied 300mm FWCR Portable Cordless Freedom Wand™ Compact (Rechargeable) ‐ for Wafer Rescue Ships with: T3PK1 PEEK vacuum p, FWCR base unit, charging stand, power supply/cord. FWCR3 Replacement Filter Assembly: FWCR2FA Class 1 Cleanroom Cer fied © 2015‐2016 H‐Square Die and Package FWCR Portable Cordless Freedom Wand™ Compact (Rechargeable) Ships with: AASPFLLHNF Luer‐adapter, FWCR base unit, charging stand, power supply/cord, BCHN‐16 hub needle, SCHN‐16 hub needle, VCC‐020 Vespel p, VCAS125 and VCAS246 vinyl vacuum cups. FWCR‐4 Catalog15‐16.1 91 www.h‐square.com US Patent No. 5,511,840 H‐Square vacuum wands provide a safe means of handling wafers, die and packages. They are designed to operate at 22‐
24” hg of vacuum*. We are o en asked to recommend a complete setup for Wafer Handling. Below are the most up‐to‐
date sets for these applica ons. These sets incorporate our newest products and materials. They are ESD protected to ensure wafer and component safety while elimina ng par cle a rac on due to sta c changes. Tips are made off ESD safe peek and wands are made from chemical resistant conduc ve PVDF. *Vacuum flow at 22” Hg is approximately 0.5cfm (0.24 liters/sec) for the standard size wand with tubing, no p. 450mm Wafer Handling T450PKAS1 TIP NO3AS1 HANDLE CC11SDS CORD HSU3PT HOLDER CTA12 GROUND 300mm Wafer Handling T3PKAS1 TIP NO3AS1 HANDLE CC11SDS CORD HSU3 HOLDER CTA12 GROUND © 2015‐2016 H‐Square
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200mm / 150mm Wafer Handling T693PKAS3 TIP NOASPF2 HANDLE CC11SDS CORD HSU HOLDER CTA12 GROUND 150mm / 125mm Wafer Handling T694PKAS TIP NOASPF2 HANDLE CC11SDS CORD HSU HOLDER CTA12 GROUND 100mm Wafer Handling T691PKAS TIP NOASPF2 HANDLE CC9SDS CORD HSU HOLDER CTA12 GROUND © 2015‐2016 H‐Square Catalog15‐16.1 93 www.h‐square.com 50mm / 75mm Wafers T75035PKAS NOASQ2 CC9SDS HSU CTA12 US Patent No. 5,511,840 TIP HANDLE CORD HOLDER GROUND Die and Package Devices (Size variable) CUP/TIP (Size Variable) HUB NEEDLE DPNOAS2LA HANDLE CC4SDS CORD HSU HOLDER CTA06 GROUND High Temperature Wafer Handling (Size Variable) TIP NOASQ2 HANDLE CC11SDS CORD HSU HOLDER CTA12 GROUND © 2015‐2016 H‐Square
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200mm / 150mm Thin or Compound Semi* T693PKAS3‐001 TIP NOASPF2 HANDLE CC11SDS CORD HSU HOLDER CTA12 GROUND *GaAs, Ge, SiGe, InP, etc. 150mm / 100mm Thin or Compound Semi* T794PKAS TIP NOASPF2 HANDLE CC9SDS CORD HSU HOLDER CTA12 GROUND *GaAs, Ge, SiGe, InP, etc. 75mm / 100mm Thin or Compound Semi* T791PKAS TIP NOASPF2 HANDLE CC9SDS CORD HSU HOLDER CTA12 GROUND *GaAs, Ge, SiGe, InP, etc. © 2015‐2016 H‐Square Catalog15‐16.1 95 www.h‐square.com VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND HANDLES HOLDERS CORDS TIPS ACCESSORIES PAGE 96‐100 PAGE 101‐105 PAGE 106‐109 PAGE 110‐128 PAGE 129‐135 DIE HANDLING PRODUCTS PAGE 136‐141 Press Fit Vacuum Wand Handle The latest and most popular model vacuum wand handle. Designed to be used with ESD safe PEEK molded press‐fit vacuum ps. The design allows the operator to adjust the PEEK p at any angle for comfort and control. The conduc ve PVDF versions provide safety from ESD events and eliminate par cle a rac on caused by sta c charges. MODEL MATERIAL VALVE SPECIAL NOASPF2 ANTISTATIC PVDF NORMALLY OPEN NOPPF1 PEEK NORMALLY OPEN NOSPPF1 PEEK NORMALLY OPEN SLIDE SWITCH NCASPF2 ANTISTATIC PVDF NORMALLY CLOSED NCPPF1 PEEK NORMALLY CLOSED US Patent No. 5,511,840 Quick Lock Vacuum Wand Handle The latest design handle for handling stainless steel tubing mount vacuum ps. The Quick‐Lock handle incorporates the latest materials and locking mechanism to securely hold all specialty vacuum ps. The conduc ve PVDF versions provide safety from ESD events and eliminate par cle a rac on caused by sta c charges. MODEL MATERIAL VALVE SPECIAL NOASQ2 ANTISTATIC PVDF NORMALLY OPEN NOSASQ2 ANTISTATIC PVDF NORMALLY OPEN SLIDE SWITCH NOPQ1 PEEK NORMALLY OPEN NOSPQ1 PEEK NORMALLY OPEN SLIDE SWITCH NCASQ2 ANTISTATIC PVDF NORMALLY CLOSED © 2015‐2016 H‐Square
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Conven onal Vacuum Wand Handle H‐Square’s original design which Acetal versions have been enhanced with a slightly longer body, improved vacuum valve and Quick‐Lock feature. Teflon versions remain shorter. NOTE: Acetal and Teflon® wand handles are not an sta c. Acetal wands are not chemical resistant. MODEL MATERIAL VALVE SPECIAL NOQ1 DELRIN® ACETAL NORMALLY OPEN NOSQ1 DELRIN® ACETAL NORMALLY OPEN SLIDE SWITCH NOTQ PTFE TEFLON® NORMALLY OPEN NOSTQ PTFE TEFLON® NORMALLY OPEN SLIDE SWITCH NCTQ PTFE TEFLON® NORMALLY CLOSED Down‐Size Vacuum Wand Handle A design with a smaller diameter handle grip to reduce wand mass for more delicate opera ons. Down‐sized diameter is some mes more suitable for smaller hands in many opera ons. Acetal wand handles are not an sta c or chemical resistant. MODEL MATERIAL VALVE SPECIAL DSNOQ1 DELRIN® ACETAL NORMALLY OPEN DSNOSQ1 DELRIN® ACETAL NORMALLY OPEN SLIDE SWITCH DSNCQ1 DELRIN® ACETAL NORMALLY CLOSED Heavy Substrate Vacuum Wand Handle These products are specially designed to be used with heavy substrates including photo plates, flat panel displays and read/write head disks. Tips are substan ally thicker and more rigid than common wafer handling ps. Tubes are 3/16” diameter electro polished stainless steel (ST19xx series), and are twice the size of standard tubes. Wands are specially modified to accept the 3/16” diameter tubes and have a set screw to secure connec on. Wands are available in ESD safe PVDF and natural PEEK materials. MODEL MATERIAL VALVE SQ21557‐3 ANTISTATIC PVDF NORMALLY OPEN NOP191 PEEK NORMALLY OPEN NCP191 PEEK NORMALLY CLOSED © 2015‐2016 H‐Square Catalog15‐16.1 97 www.h‐square.com VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND HANDLES HOLDERS CORDS TIPS ACCESSORIES PAGE 96‐100 PAGE 101‐105 PAGE 106‐109 PAGE 110‐128 PAGE 129‐135 DIE HANDLING PRODUCTS PAGE 136‐141 300mm& 450mm Vacuum Wand Handles Larger diameter wand handle for general handling of 300mm and 450mm wafers from casse es, single wafer compacts and tool fixtures and stages. Interfaces with most 300mm and 450mm vacuum ps. For straight assemblies, unique press‐
fit p/wand adapters allow the vacuum p to be posi oned at 0°,90°,180° and 270° degrees for maximum convenience for right or le handed operators. Wands also accommodates standard press‐fit PEEK ps for smaller wafers and substrates. 300mm / 450mm (Handle Only)—NO3AS / NO3 MODEL MATERIAL PROFILE ASSEMBLY NO3AS1 ANTISTATIC PVDF N/A WAND HANDLE ONLY NO31 DELRIN® ACETAL N/A WAND HANDLE ONLY NO3T3PKAS1 ANTISATIC PVDF / ANTISTATIC PEEK STRAIGHT INCLUDES T3PKAS1 TIP NO3T3PK1 DELRIN® ACETAL / NATURAL PEEK STRAIGHT INCLUDES T3PK1 TIP NO3T3PKAS‐005 ANTISATIC PVDF / ANTISTATIC PEEK OFFSET INCLUDES MODIFIED T3PKAS1 TIP NO3T3PK‐001 DELRIN® ACETAL / NATURAL PEEK OFFSET INCLUDES MODIFIED T3PK1 TIP NO3T3PKASU‐001 ANTISATIC PVDF / ANTISTATIC PEEK OFFSET INCLUDES UHMW MODIFIED T3PKAS1 TIP NO3T3PKAS‐008 ANTISATIC PVDF / ANTISTATIC PEEK OFFSET INCLUDES THIN WAFER MODIFIED T3PKAS1 TIP NOP191‐003 PEEK / STAINESS STEEL / QUARTZ OFFSET INCLUDES ADAPTER AND QUARTZ TIP NOP191‐006 PEEK / STAINESS STEEL / QUARTZ STRAIGHT INCLUDES ADAPTER AND QUARTZ TIP NO3T450PKAS1 ANTISTATIC PVDF / ANTISTATIC PEEK STRAIGHT IINCLUDES NCLUDES T450PKAS1 TIP NO3T450PK1 ANTISTATIC PVDF / NATURAL PEEK STRAIGHT INCLUDES NCLUDES T450PK1 TIP 450mm— NO3T450PKAS1 / NO3T450PK1 © 2015‐2016 H‐Square
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NO3T3PKAS1 / NO3T3PK1—300mm Standard Vacuum Wand Assembly NO3T3PKAS‐005 (ESD PEEK) / NO3T3PK‐001 (Natl’ PEEK) / NO3T3PKASU‐001 (UHMW)/ NO3T3PKAS‐008 (Thin) ‐ 300mm (vacuum pocket can be mounted UP or DOWN) 300mm NOP191‐003 (Offset) / NOP191‐006 (Straight) RTP Quartz 300mm Vacuum Wand Assembly © 2015‐2016 H‐Square Catalog15‐16.1 99 www.h‐square.com VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND HANDLES HOLDERS CORDS TIPS ACCESSORIES PAGE 96‐100 PAGE 101‐105 PAGE 106‐109 PAGE 110‐128 PAGE 129‐135 DIE HANDLING PRODUCTS PAGE 136‐141 Pistol Grip Vacuum Wand Handle Ergonomically designed pistol grip style vacuum wands allow for maximum comfort during extended wafer handling sessions or for handling heavy substrates. This design is compa ble with H‐Square 300mm, 450mm and common 200mm PEEK Press‐Fit design vacuum ps. Conduc ve PVDF material provides for ESD safety. Recommended shut off holder HSU3‐002 should be installed at the leading edge of the operators worksta on.
NO3AS‐001 MODEL MATERIAL VALVE ASSEMBLY NO3AS‐001 ANTISTATIC PVDF NORMALLY OPEN WAND HANDLE ONLY NO3T3PKAS‐001 ANTISTATIC PVDF NORMALLY OPEN INCLUDES 300mm T3PKAS1 TIP NO3T3PKAS‐001 NO3AS‐001 shown with 200mm T693PKAS3 p © 2015‐2016 H‐Square
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300mm / 450mm Normally Open Wand Shutoff Holders Table mount and table top vacuum wand holders depress the normally open valve bu on during wand inser on, thus automa cally shu ng off the vacuum and providing for a clean and safe storage of the vacuum wand installa on. HSU3 models can be directly mounted to horizontal or ver cal surfaces using two #6 flat head fasteners. The material is white polypropylene. They are shipped with a double sided cleanroom tape to aid in ini al installa on. The weighted HSU3PT models are designed to be table top and can be easily moved to a comfortable posi on on the work surface. The pedestal is white polypropylene and the table base is white epoxy coated steel with press‐fit silicone elastomer O‐ring feet to keep is stable and prevent sliding on work surfaces. COMPATIBLE WAND HANDLES NO3AS1 NO31 NO3T3PKAS1 NO3T3PK1 NO3T450PKAS1 NO3T450PK1 HSU3 HSU3PT MODEL STYLE MATERIAL VALVE HSU3 WALL / MACHINE MOUNT WHITE POLYPROPYLENE HSU3PT TABLE TOP PEDESTAL WHITE POLYPROPYLENE / EPOXY COATED STEEL NORMALLY OPEN NORMALLY OPEN Pistol Grip Vacuum Wand Holder Table mount and table edge vacuum wand holders for NO3AS‐001 pistol grip vacuum wand handles. The pistol grip normally open valve is depressed during wand inser on. COMPATIBLE WAND HANDLES NO3AS1‐001 HSU3‐002 MODEL HSU3‐002 MATERIAL BLACK ABS HSU3PT‐001 BLACK ABS / WHITE EPOXY COATED STEEL VALVE NORMALLY OPEN NORMALLY OPEN HSU3PT‐001 © 2015‐2016 H‐Square Catalog15‐16.1 101 www.h‐square.com VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND HANDLES HOLDERS CORDS TIPS ACCESSORIES PAGE 96‐100 PAGE 101‐105 PAGE 106‐109 PAGE 110‐128 PAGE 129‐135 DIE HANDLING PRODUCTS PAGE 136‐141 HSU Series Normally Open Universal Wand Shutoff Holders Table mount and table top vacuum wand holders depress the normally open valve bu on during wand inser on, thus automa cally shu ng off the vacuum and providing for a clean and safe storage of the vacuum wand installa on. HSU models can be directly mounted to horizontal or ver cal surfaces using two #6 flat head fasteners. The material is white polypropylene. They are shipped with a double sided cleanroom tape to aid in ini al installa on. The weighted HSUPT models are designed to be table top and can be easily moved to a comfortable posi on on the work surface. The pedestal is white polypropylene and the table base is white epoxy coated steel with press‐fit silicone elastomer O‐ring feet to keep is stable and prevent sliding on work surfaces. The HSUL combines the “HSU” holder with a table‐L‐bracket. MODEL MATERIAL VALVE COMPATIBLE WAND HANDLES HSU WHITE POLYPROPYLENE NORMALLY OPEN NOASPF2 HSUPT WHITE POLYPROPYLENE / EPOXY COATED STEEL NORMALLY OPEN NOSASPF2 HSUL WHITE POLYPROPYLENE / 316 STAINLESS STEEL NORMALLY OPEN NOASQ2 NOSASQ2 NOPPF1 NOSPPF1 NOPQ1 NOSPQ1 NOQ1 NOSQ1 HSU NOTQ NOSTQ NOP191 SQ21557‐3 HSUL HSUPT © 2015‐2016 H‐Square
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HAW Series Non Shut‐Off Holder Table mount and table top vacuum wand holders accommodate all wands except Teflon. It is designed primarily for Normally Closed (NC) wands and those with shut‐off side switches. Vacuum wand holders provide for a clean and safe storage of the vacuum wand installa on. HAW models can be directly mounted to horizontal or ver cal surfaces using two #6 flat head fasteners. The material is white polypropylene. They are shipped with a double sided cleanroom tape to aid in ini al installa on. The weighted HAWPT models are designed to be table top and can be easily moved to a comfortable posi on on the work surface. The pedestal is white polypropylene and the table base is white epoxy coated steel with press‐fit silicone elastomer O‐ring feet to keep is stable and prevent sliding on work surfaces. The HAWL combines the HAW holder with a stainless steel table‐L‐bracket. COMPATIBLE WAND HANDLES MODEL MATERIAL VALVE NOSPPF1 HAW WHITE POLYPROPYLENE NCASPF2 HAWPT WHITE POLYPROPYLENE / EPOXY COATED STEEL NORMALLY CLOSED / SHUT OFF SWITCH NCPPF1 HAWL WHITE POLYPROPYLENE / 316 STAINLESS STEEL NORMALLY CLOSED / SHUT OFF SWITCH NORMALLY CLOSED / SHUT OFF SWITCH NOSASQ2 NOSPQ1 NCASQ2 NOSQ1 NCP191 HAW HAWL © 2015‐2016 H‐Square HAWPT Catalog15‐16.1 103 www.h‐square.com VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND HANDLES HOLDERS CORDS TIPS ACCESSORIES PAGE 96‐100 PAGE 101‐105 PAGE 106‐109 PAGE 110‐128 PAGE 129‐135 DIE HANDLING PRODUCTS PAGE 136‐141 HSD Series Normally Open Down Size Wand Shutoff Holders Table mount and table top vacuum wand holders depress the down size normally open valve bu on during wand inser on, thus automa cally shu ng off the vacuum and providing for a clean and safe storage of the vacuum wand installa on. MODEL MATERIAL VALVE HSD WHITE POLYPROPYLENE HSDPT WHITE POLYPROPYLENE / EPOXY COATED STEEL NORMALLY OPEN HSDL WHITE POLYPROPYLENE / 316 STAINLESS STEEL NORMALLY OPEN COMPATIBLE WAND HANDLES DSNOQ1 DSNOSQ1 HSD NORMALLY OPEN HSDPT HSDL Holder Accessory—RP Pedestals Loose pedestal base holders that can be mounted to HRM rack mounts. HRMP8 is suggested when choosing RP units. HSDRP HSD Series Shutoff Holder HSURP HSU Series Shutoff Holder HAWRP HAW Series Non Shutoff Holder © 2015‐2016 H‐Square
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Holder Accessory—TLB Series Table‐L‐Bracket This product allows many H‐Square holders to be mounted from the underside of a bench top such that wand ps will be at or below, the level of the bench top. This reduces the risk of damage and contamina on that can result from inadvertent contact by operators. It is constructed of 16 gauge, electro‐polished type 316 stainless steel, and includes 3 sets of pre‐drilled moun ng holes for user provided #10 screws. The front side is drilled and tapped (#6‐32 TPI) to accept “HSU”, “HSD” and “HAW” holders. Jam nuts are recommended to prevent loosening of holder a achment. TLB Stainless Steel L Bracket Holder Accessory—TC Series Table Clamp These products allow the installa on of many H‐Square holders without need for bench modifica ons (e.g., drilled & tapped holes). They consist of a hard clear anodized 6061 T‐6 aluminum alloy channel drilled and tapped to accept H‐Square holders. TC‐2N and TC‐
3N have a single thumbscrew. TC clamps are compa ble with HSD, HAW, HSU, and HSU3 wand holders. TC‐2N 1.5” Width Range: 0.38”‐1.5” table TC‐3N 1.5” Width Range: 1.38”‐2.5” table © 2015‐2016 H‐Square Catalog15‐16.1 105 www.h‐square.com VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND HANDLES HOLDERS CORDS TIPS ACCESSORIES PAGE 96‐100 PAGE 101‐105 PAGE 106‐109 PAGE 110‐128 PAGE 129‐135 DIE HANDLING PRODUCTS PAGE 136‐141 Vacuum Coil Cords and Vacuum Tubing Vacuum wands need some form of connec ve vacuum tubing. Coiled vacuum cords offer a combina on of operator com‐
fort, installa on ease and durability. Coil cords help to prevent tubing from res ng on bench tops and floors. Coil cords are compa ble with suspension applica ons. H‐Square coil cords are manufactured from tough, resilient, chemical re‐
sistant polyurethane, which can be used over a broad temperature range of ‐65° F to +210°F. Although designed primarily for vacuum, H‐Square cords can be applied in pressure applica ons and are compa ble with many fluids including air, nitrogen, oil and water. Maximum recommended vacuum ra ng is 27 in Hg; maximum pressure ra ng is 80 P.S.I. A variety of coil cords are available to fill user requirements for inside/outside diameter, total length and pull back ten‐
sion. Sta c dissipa ve cords are available for sta c sensi ve applica ons. For special applica ons, H‐Square offers the heavy‐duty standard and an ‐sta c Polyurethane tubing in straight bulk form. All coil cords are designed to fit on typical barbed hose fi ngs used on H‐Square wands. Heavy‐duty cords and tubing are o en used in pressure applica ons in con‐
CC4SDS A small diameter wire embedded an ‐sta c coil cord for use with die and package handling vacuum wands. CC‐6 A lightweight, low tension coil cord recommended for Down‐Sized wands and other precision applica ons. CC‐7 A heavy‐duty coil cord used for general vacuum wand handling, suspension and pressure applica ons CC‐9 A lightweight, low tension coil cord recommended for Down‐Sized wands and other precision applica ons. CC‐9AS2 Similar to the CC‐9, but with sta c dissipa ve characteris cs CC9AS2S Similar to the CC‐9AS2, but with a stainless steel spring inserted to prevent kinking. CC9ESD Similar to CC9AS2S but with integrated CTA12 grounding cord and vacuum wand handle fi ng CC9SDS Similar to the CC‐9AS2, but with a wire embedded in cord to enhance conduc vity. CC‐11 A heavy duty coil cord used for general vacuum wand handling, suspension and pressure applica ons CC‐11AS2 An ‐sta c, heavy duty coil used for general vacuum wand handling, suspension and pressure applica ons. CC11AS2S Similar to the CC‐11AS2, but with a stainless steel spring inserted to prevent kinking CC11ESD Similar to CC11AS2S but with integrated CTA12 grounding cord and vacuum wand handle fi ng CC11SDS Similar to the CC‐11AS2, but with a wire embedded in cord to enhance conduc vity. PT A heavy‐duty straight tubing used for vacuum and pressure applica ons, sold per foot PTAS2502 Sta c dissipa ve, heavy‐duty straight tubing used for vacuum and pressure applica ons, sold per foot TT A clear, heavy wall elastomeric Tygon tubing used for vacuum and pressure applica ons, sold per foot PTAS1322 A sta c dissipa ve, small diameter straight tubing for use with Die and Package handling vacuum wands SRTAS A lightweight, highly flexible straight silicone rubber tubing. Includes spring throughout length and O.D. sheath to prevent crimping. ESD protec on. Includes integrated grounding adapter CTA12 © 2015‐2016 H‐Square
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CC‐xx and CC‐xxAS2 CCxxSDS CCxxAS2S CCxxESD SRTAS CUT STRAIGHT TUBING —ORDERED PER FOOT PT, PTAS2502, TT, PTAS1322 Grounding Adapter CTA06 Conduc ve nickel plated brass inline adapter with lug for grounding wire. Adapts .13”‐.16” I.D. tubing to .06” I.D. For use with “CC‐4AS2” or “PTAS1322”. Grounding Adapter CTA12 Conduc ve nickel plated brass inline adapter with lug for grounding wire. Adapts .13”‐.16” I.D. tubing for 1/8” I.D. tubing. Use with “CC‐
© 2015‐2016 H‐Square Catalog15‐16.1 107 www.h‐square.com VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND HANDLES HOLDERS CORDS TIPS ACCESSORIES PAGE 96‐100 PAGE 101‐105 PAGE 106‐109 PAGE 110‐128 PAGE 129‐135 DIE HANDLING PRODUCTS PAGE 136‐141 MODEL WORKING LENGTH MAX EXT INSIDE DIAM OUTSIDE DIAM COIL OD COIL LENGTH TOTAL WEIGHT MATERIAL COLOR CC4SDS 9”‐36” 54” 0.06” 0.13” 0.8” 3.4” 0.5oz POLYURETHANE DARK GRAY CC‐6 11”‐60” 72” 0.13” 0.20” 1.2” 5.6” 1.3oz POLYURETHANE BLACK CC‐7 12”‐48” 60” 0.14” 0.25” 1.3” 7.0” 2.0oz POLYURETHANE WHITE CC‐9 14”‐96” 120” 0.13” 0.20” 1.1” 8.4” 2.9oz POLYURETHANE BLACK CC‐9AS2 14”‐96” 120” 0.13” 0.23” 1.1” 8.1” 2.5oz POLYURETHANE GRAY CC‐9AS2S 14”‐96” 120” 0.13” 0.23” 1.1” 8.1” 2.5oz POLYURETHANE GRAY CC9ESD 14”‐96” 120” 0.13” 0.23” 1.1” 8.1” 2.5oz POLYURETHANE GRAY CC9SDS 14”‐96” 120” 0.13” 0.23” 1.1” 8.1” 2.5oz POLYURETHANE DARK GREY CC‐11 16”‐72” 96” 0.14” 0.25” 1.3” 10.5” 2.7oz POLYURETHANE WHITE CC‐11AS2 16”‐72” 96” 0.14” 0.25” 1.3” 10.5” 2.7oz POLYURETHANE GRAY CC‐11AS2S 16”‐72” 96” 0.14” 0.25” 1.3” 10.5” 2.7oz POLYURETHANE GRAY CC11ESD 16”‐72” 96” 0.14” 0.25” 1.3” 10.5” 2.7oz POLYURETHANE GRAY CC11SDS 16”‐72” 96” 0.14” 0.25” 1.3” 10.5” 2.7oz POLYURETHANE DARK GRAY PT N/A N/A 0.14” 0.25” N/A PER/FT N/A POLYURETHANE WHITE PTAS1322 9”‐36” N/A 0.06” 0.13” N/A PER/FT N/A POLYURETHANE GRAY PTAS2502 N/A N/A 0.14” 0.25” N/A PER/FT N/A POLYURETHANE GRAY TT N/A N/A 0.16” 0.28” N/A PER/FT N/A TYGON CLEAR SRTAS 72” N/A 0.10” 0.19” N/A N/A N/A SILICONE CLEAR © 2015‐2016 H‐Square
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Vacuum Wand Installa on Techniques Correctly installed vacuum coil cords are designed make vacuum wand installa ons less dangerous in the work area (operators can easily trip on the Tygon straight tubing as it drapes on to the floor around their wafer handling work‐
sta ons). Coil cords will also keep the cord tubing off the ground keeping the fab and work area cleaner. Vacuum coil cords should be installed within the first 3” of the front of the worksta on. Facili es personnel should run a vacuum line all the way to the front of the worksta on where the coil cord is then installed. By design, the short 6” length tubing should be installed towards the facili es connec on and the 16” length towards the wand handle. This will make the vacuum wand installa on hang straight down at the edge of the worksta on. It will then allow the vacuum wand to be free of ge ng caught on operators, carts, chairs and will make the vacuum wand a one handed tool for the operator to use—increasing operator control and dexterity. Installing the vacuum coil cord too far underneath the worksta on or backwards, will force the operator to use two hands to use the vacuum wand installa on. ESD Safety – The use of Tygon straight tubing eliminates the ground path poten al for the vacuum wand. By design, a PEEK vacuum p should be paired with an ESD safe vacuum wand handle (like NOASPF2 or NOASQ2) and a conduc ve or dissipa ve coil cord of the an sta c design (CC11SDS or CC9SDS are recommended). Vacuum wand coil cords should then be connected to a ground source. Introduc on of a properly grounded vacuum wand installa on will provide ESD safety and make the vacuum wand a ract less par cles (which keeps it cleaner). Quick‐Disconnect assembly for connec ng coil cord or straight tubing to house vacuum lines. Automa c shut‐off mechanism is in the “CQDM” por‐
on of the quick‐disconnect. CQDM Quick Disconnect coupling, metal, female connec on HBQDM Quick Disconnect hose barb, metal, male connec on © 2015‐2016 H‐Square Catalog15‐16.1 109 www.h‐square.com VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND HANDLES HOLDERS CORDS TIPS ACCESSORIES PAGE 96‐100 PAGE 101‐105 PAGE 106‐109 PAGE 110‐128 PAGE 129‐135 DIE HANDLING PRODUCTS PAGE 136‐141 An sta c PEEK T691PKAS Thin, one‐piece molded Press‐Fit ps for general handling of up to 4” wafers. Molded from rigid Carbon‐filled PEEK for strength and ESD protec on. Designed for Press‐Fit wand handles like NOASPF2. P/N: T691PKAS (straight) T691PKAS2R (Right handed operator) T691PKAS2L (Le handed operator) T691PKAS‐S (with stops) T691PKAS1U (10° up bend) T691PKAS1D (10° down bend) T691PKAS‐001 (20°down bend) T691PKAS3U (30° up bend) T691PKAS3D (30 down) Example : Bent Angle Version ↓ An sta c PEEK T692PKAS Thin, one‐piece molded Press‐Fit ps for general handling of up to 6” wafers. Molded from rigid Carbon‐filled PEEK for strength and ESD protec on. Designed for Press‐Fit wand handles like NOASPF2. P/N: T692PKAS (straight) T692PKAS2R (Right handed operator) T692PKAS2L (Le handed operator) T692PKAS‐S (with stops) T692PKAS1U (10° up bend) T692PKAS1D (10° down bend) T692PKAS3U (30° up bend) T692PKAS3D (30° down bend) Example : Bent Angle Version ↓ © 2015‐2016 H‐Square
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An sta c PEEK T693PKAS3 Thin, one‐piece molded Press‐Fit ps for general handling of up to 8” wafers. Molded from rigid carbon filled PEEK for strength and ESD pro‐
tec on. 3 bend allows vacuum area of p to hold closer to the center of large wafers for be er leverage and increased holding strength. P/N: T693PKAS (straight) T693PKAS3 (straight with 3° bend)‐ recommended T693PKAS2R (Right handed operator) T693PKAS2L (Le handed operator) T693PKAS‐S (with stops) T693PKAS1U (10° up bend) T693PKAS1D (10° down bend) T693PKAS‐001 (20°down bend) T693PKAS‐003 (30° up bend) T693PKAS‐002 (30° down) Example : Bent Angle Version ↓ An sta c PEEK T694PKAS Thin, one‐piece molded Press‐Fit ps for general handling of up to 6” wafers. Molded from rigid carbon filled PEEK for strength and ESD pro‐
tec on. May be used directly with Universal PEEK and An ‐Sta c, Press‐
Fit wands or with the appropriate adapter on all Quick‐Lock wands. 3° bend allows vacuum area of p to hold closer to the center of large wa‐
fers for be er leverage and increased holding strength. P/N: T694PKAS (straight) T694PKAS‐S (with stops) T694PKAS‐001 (30° down bend) T694PKAS‐002 (20° right bend) T694PKAS3U (30° up bend) © 2015‐2016 H‐Square Example : Bent Angle Version ↓ Catalog15‐16.1 111 www.h‐square.com VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND HANDLES HOLDERS CORDS TIPS ACCESSORIES PAGE 96‐100 PAGE 101‐105 PAGE 106‐109 PAGE 110‐128 PAGE 129‐135 DIE HANDLING PRODUCTS PAGE 136‐141 An sta c PEEK T791PKAS—Thin Wafer Handling / Compound Semi Wafers Thin, one‐piece molded Press‐Fit ps for general handling. Thin sub‐
strates (0.005” ‐ .015” thick) with smaller diameters, e.g., 2”‐3”. Molded from rigid carbon filled PEEK for strength and ESD protec on. Tip is de‐
signed for thin wafer handling or fragile substrates like GaAs, SiGe, Ge, InP and other Compound Semiconductor substrates. P/N: T791PKAS (straight) T791PKAS‐001 (30° down bend) T791PKAS1D (10° down bend) T791PKAS2D (20° down bend) T791PKAS3D (30° down bend) T791PKAS3U (30° up bend) T791PKAS2R (20° right bend) Example : Bent Angle Version ↓ An sta c PEEK T792PKAS—Thin Wafer Handling / Compound Semi Wafers Thin, one‐piece molded Press‐Fit ps for general handling. Thin sub‐
strates (0.005” ‐ .015” thick) with medium diameters, e.g., 4”‐6”. Molded from rigid carbon filled PEEK for strength and ESD protec on. Recommended vacuum wand handle is NOASPF2. Tip is designed for thin wafer handling or fragile substrates like GaAs, SiGe, Ge, InP and other Compound Semiconductor substrates. P/N: T792PKAS (straight) T792PKAS2D (20° down bend) T792PKAS2R (20° right bend) T792PKAS3D (30° down bend) Example : Bent Angle Version ↓ © 2015‐2016 H‐Square
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An sta c PEEK T794PKAS—Thin Wafer Handling / Compound Semi Wafers Thin, one‐piece molded Press‐Fit ps for general handling. Thin sub‐
strates (0.005” ‐ .015”) with large diameters, e.g., 4”‐6”. Molded from rigid carbon filled PEEK for strength and ESD protec on. Rec‐
ommended vacuum wand handle is NOASPF2. Tip is designed for thin wafer handling or fragile substrates like GaAs, SiGe, Ge, InP and other Compound Semiconductor substrates. P/N: T794PKAS (straight) T794PKAS3D‐001 (30° down bend) Example : Bent Angle Version ↓ An sta c PEEK T693PKAS3‐001—Thin Wafer Handling / Compound Semi Wafers Thin, one‐piece molded Press‐Fit ps for general handling. Thin or Compound Semiconductor substrates (0.005” ‐ .030”) with large di‐
ameters, e.g., 6”‐8”. Molded from rigid carbon filled PEEK for strength and ESD protec on. Recommended vacuum wand handle is NOASPF2. Tip is designed for thin wafer handling or fragile sub‐
strates like GaAs, SiGe, Ge, InP and other Compound Semiconductor substrates. P/N: T693PKAS3‐001 (straight) T693PKAS2D‐001 (20° down bend) T693PKAS3D‐001 (30° down bend) Example : Bent Angle Version ↓ © 2015‐2016 H‐Square Catalog15‐16.1 113 www.h‐square.com VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND HANDLES HOLDERS CORDS TIPS ACCESSORIES PAGE 96‐100 PAGE 101‐105 PAGE 106‐109 PAGE 110‐128 PAGE 129‐135 DIE HANDLING PRODUCTS PAGE 136‐141 An sta c PEEK SQ21203‐5—Extended Reach 200mm PEEK Tips Thin, one‐piece molded Press‐Fit ps for general handling. Same as T693PKAS3 but extended from 4.6” to longer lengths. Molded from rigid carbon filled PEEK for strength and ESD protec on. Recommended vacuum wand handle is NOASPF2. P/N: SQ21203‐5 (straight 6.3”) T693PKAS3‐008 (straight 8.3”) T693PKAS2D‐005 (20° bent down 6.4”) Contact H‐Square for addi onal lengths SQ21203‐5 An sta c PEEK Inser on Preven on PEEK ps One‐piece molded Press‐Fit ps for general handling. Same as T693PKAS3 but includes bump on the backside of the p to prevent operators from inser ng ps between wafers in a standard pitch casse e. Molded from rigid carbon filled PEEK for strength and ESD protec on. Recommended vacuum wand handle is NOASPF2. . P/N: T693PKAS3‐007 (T693PKAS3 with bump) SQ20870‐1 (T693PKAS with bump) T692PKAS‐006 (T692PKAS with bump) T693PKAS2D‐006 (T693PKAS2D with bump 20° degrees DOWN) T693PKAS3‐007 An sta c PEEK T590PKAS Thin, one‐piece molded Press‐Fit ps for general handling of 2” to 3” wafers and small light‐weight pieces of wafers or small substrates. Molded from rigid carbon filled PEEK for strength and ESD protec‐
on. P/N: T590PKAS © 2015‐2016 H‐Square
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An sta c PEEK T695PKAS Similar to T693PKAS3, but with larger surface area for increased se‐
curity. Thin, one‐piece molded Press‐Fit ps for general handling of up to 8” wafers. Molded from rigid carbon filled PEEK for strength and ESD protec on. May be used directly with Universal PEEK and An ‐Sta c, Press‐Fit wands or with the appropriate adapter on all Quick‐Lock Wands. P/N: T695PKAS (straight) T695PKAS2D‐001 (20° down bend) T695PKAS3D‐001 (30° down bend) T695PKAS45D‐001 (45°down bend) T695PKAS3D‐002 (30° down bend) T695PKAS3U‐001 (30° up bend) Example : Bent Angle Version ↓ An sta c PEEK / Natural PEEK T3PKAS1—300mm General handling vacuum ps for 300mm wafers. Machined from rigid PEEK for strength and ESD protec on (on an sta c “AS” carbon loaded version). Some models are available as a wand/ p assembly—see page 86‐87. P/N: T3PKAS1 (An sta c PEEK Standard) T3PKAS1‐001 (An sta c Thin Wafer) T3PK1 (Natural PEEK Standard) T3PKASU (An sta c PEEK with UHMW Tape Surface) T3PKU (Natural PEEK with UHMW Tape Surface) T3PKAS1 / T3PK1 Standard T3PKASU / T3PKU with UHMW Tape 402724 Replacement Universal Tip Adapter—ESD safe PVDF T3PKAS1‐001 Thin Wafer © 2015‐2016 H‐Square Catalog15‐16.1 115 www.h‐square.com VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND HANDLES HOLDERS CORDS TIPS ACCESSORIES PAGE 96‐100 PAGE 101‐105 PAGE 106‐109 PAGE 110‐128 PAGE 129‐135 DIE HANDLING PRODUCTS PAGE 136‐141 MISC1400 Series Thin Wafer Hoop Tip Vacuum Wand Assemblies Custom product an sta c normally open, hoop style vacuum wand assemblies for handling of thin wafers to / from backend wafer handling opera ons including wafer pack‐out jar shipper loading and unloading. Thin wafers are support‐
ed by unique extended wafer support p. Most assemblies ship with p, adapter, wand handle, coil cord and shutoff holder complete. Please contact your H‐Square representa ve for more informa on. MISC1400‐006 200mm Thin wafer packout vacuum wand "hoop" assembly, straight. Hardened aluminum end effec‐
tor with PFA Teflon coa ng. Wand (NOASPF2 modi‐
fied), p and adapter; (HSUPT holder and CC11SDSD coil cord sold separate) straight version. Outside hoop diameter—6.0” (152.4mm) MISC1400‐008 200mm Thin Wafer Packout vacuum wand "hoop" assembly, horizontal offset. Hardened aluminum end effector with PFA Teflon coa ng. Wand (NOASPF2 modified), p and adapter; (HSUPT holder and CC11SDSD coil cord sold separate) straight version. Outside hoop diameter—
6.0” (152.4mm) MISC1400‐004 Thin Wafer Packout vacuum wand "hoop" assem‐
bly, 300mm and 200mm complete set; horizontal offset design. Hardened aluminum end effector with PFA Teflon coa ng. Tip, adapter, wand (NO3AS1), coil cord (CC11SDS) and holder (HSU3PT) included. Outside hoop diameter—
6.0” (152.4mm) © 2015‐2016 H‐Square
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MISC1400‐005 Thin wafer packout vacuum wand "hoop" assembly, 200mm and 150mm complete set; horizontal offset design. Hardened aluminum end effector with PFA Teflon coa ng. Tip, adapter, wand (NO3AS1), coil cord (CC11SDS) and holder (HSU3PT) included. Outside hoop diameter—
5.0” (127mm) MISC1400‐011 Thin wafer packout vacuum wand "hoop" assembly, 300mm and 200mm complete set; horizontal offset design. Hardened aluminum end effector with PFA Teflon coa ng. Tip, adapter, wand (NO3AS1), coil cord (CC11SDS) and holder (HSU3PT) included. Outside hoop diameter—
6.0” (152.4mm) NO3T3‐001 Series Thin Wafer U Shaped 300mm Vacuum Wand Assembly Custom Product an sta c normally open, custom “U” shaped vacuum wand assembly for handling of thin 300mm wafers. Thin wafers are supported underneath by unique anodized aluminum wafer support p. Assembly ships with p, adapt‐
er, wand handle, coil cord and shutoff holder complete. Please contact your H‐Square representa ve for more infor‐
ma on. © 2015‐2016 H‐Square Catalog15‐16.1 117 www.h‐square.com VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND HANDLES HOLDERS CORDS TIPS ACCESSORIES PAGE 96‐100 PAGE 101‐105 PAGE 106‐109 PAGE 110‐128 PAGE 129‐135 DIE HANDLING PRODUCTS PAGE 136‐141 An sta c PEEK / UHMW T696PK—UHMW Contact Pad PEEK Tip Thin, one‐piece molded Press‐Fit ps for general wafer handling of 100mm‐200mm wafers. Same as T693PKAS3 but with added UHMW Polyethylene vacuum pocket. Thin laser cut UHMW pad is bonded to PEEK with cleanroom approved adhesive. UMHM surface reduces scratching and contamina on as process contamina on does not adhere to the surface. Excellent for double sided polished wafer handling applica ons. Molded from rigid carbon filled PEEK for strength and ESD protec on. Recommended vacuum wand handle is NOASPF2. P/N: T696PK (straight) T696PK‐001 (30° down bend) Example : Bent Angle Version ↓ An sta c PEEK / UHMW T691PK—UHMW Contact Pad PEEK Tip Thin, one‐piece molded Press‐Fit ps for general wafer han‐
dling of 75mm‐100mm wafers. Same as T691PKAS but with added UHMW Polyethylene vacuum pocket. Thin laser cut UHMW pad is bonded to PEEK with cleanroom approved adhe‐
sive. UMHM surface reduces scratching and contamina on as process contamina on does not adhere to the surface. Excel‐
lent for double sided polished wafer handling applica ons. Molded from rigid carbon filled PEEK for strength and ESD pro‐
tec on. Recommended vacuum wand handle is NOASPF2. .P/N: T691PK‐002 (straight) T691PK‐001 (20° down bend) Example : Bent Angle Version ↓ © 2015‐2016 H‐Square
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An sta c PEEK T75072PKAS A special applica on p for general handling of fragile wafers, such as Gallium Arse‐
nide, of up to 4”. Grooved pocket provides excellent adhesion to wafers with mini‐
mum distor on. Knife‐edge p allows removal of wafer from flat surfaces such as plat‐
ens and susceptors. Machined from rigid carbon filled PEEK for strength and ESD pro‐
tec on. Recommended vacuum wand handle is NOASQ2. P/N: T75072PKAS An sta c PEEK T75010PKAS A popular p for general handling of up to 5” wafers. Machined from rigid carbon filled PEEK for strength and ESD protec on. Recommended vacuum wand handle is NOASQ2. P/N: T75010PKAS An sta c PEEK T75083PKAS A popular open pocket p for general handling of up to 6” wafers. Can be used in some applica ons to separate wafers from adjacent surface. Secondary angle allows posi ve handling in the event of front edge damage. Machined from rigid carbon filled PEEK for strength and ESD protec on. Recommended vacuum wand handle is NOASQ2. P/N: T75083PKAS Natural PEEK T75028PK Popular p for general handling of up to 6” wafers. Grooved pocket provides excellent adhesion to wafer with minimum distor on. Less contact area than T75026, but slightly be er wafer adhesion due to shape. Machined from rigid natural PEEK for strength and durability. Recommended vacuum wand handle is NOPQ1. P/N: T75028PK © 2015‐2016 H‐Square Catalog15‐16.1 119 www.h‐square.com VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND HANDLES HOLDERS CORDS TIPS ACCESSORIES PAGE 96‐100 PAGE 101‐105 PAGE 106‐109 PAGE 110‐128 PAGE 129‐135 DIE HANDLING PRODUCTS PAGE 136‐141 An sta c PEEK T75050PKAS A very rigid p for general handling of up to 8” wafers. Large support area minimizes vacuum induced distor on. Shallow pocket allows fast, posi ve pick up. Can be used in some applica ons to separate wafers from adjacent surface. Secondary angle allows posi ve han‐
dling in the event of front edge damage. Consider Full Hard tube for larger wafers. Machined from rigid carbon filled PEEK for strength and ESD protec on. Recommended vacuum wand handle is NOASQ2. P/N: T75050PKAS An sta c PEEK T75051PKAS A rigid, knife‐edged p for loading/unloading of wafers up to 8” from platens and susceptors. Large support area minimizes vacuum induced distor on. Shallow pocket allows fast posi ve pick up. Consider Full Hard tube for larger wafers. Machined from rigid carbon filled PEEK for strength and ESD protec on. Recommended vacuum wand handle is NOASQ2. P/N: T75051PKAS An sta c PEEK TLP25PKAS A thin circular p (2.5” diameter) designed for maximum rota onal holding power. Compared to other ps of comparable size, this p reduces the rota onal slippage by a factor of 2.5 to 3 mes. The thin leading edge (0.065”) allows easy access between casse es held wafers. Recommended for use on 8” and larger wafers. Ma‐
chined from rigid carbon filled PEEK for strength and ESD protec‐
on. Recommended vacuum wand handle is NOASQ2. P/N: TLP25PKAS © 2015‐2016 H‐Square
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Quartz T75025Q For general handling of up to 5” wafers. 25° angle knife edge. Larger vacuum pocket as compared to T75024Q. Includes combina on Invar/stainless steel tube cemented to p. Recommended for use with Quick‐Lock wands. P/N: T75025Q Quartz T75082Q A quartz p for handling 5” to 8” wafers in higher tempera‐
ture applica ons. Large support area minimizes vacuum distor on. Invar/Stainless steel tube. Recommended for use with Quick‐Lock wands. P/N: T75082Q Quartz— Robo c End Effector T75069Q Special applica on p for use with Eaton‐Axcelis robo c handing systems such as those used in rapid thermal processing. Based on “T75037” p. Center tube conducts vacuum to p; outer rods maintain alignment. Provides clean, reliable han‐
dling of hot wafers. P/N: T75069Q Quartz / Vespel® T75033QV Designed for high temperature applica ons. Wafer holding area is made of quartz, which is con nuously usable to 1425°C. Vespel® pick up withstands 480°C on a short‐term basis. Vespel® surrounds quartz to protect it from damage. Knife‐edged spatula facili es pick up of wafers from flat surfaces. Ideal for removing wafers from epitaxial reactors and other high temperature processes. Recommended for use with Quick‐Lock wands. P/N: T75033QV (Length 3.9”) © 2015‐2016 H‐Square Catalog15‐16.1 121 www.h‐square.com VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND HANDLES HOLDERS CORDS TIPS ACCESSORIES PAGE 96‐100 PAGE 101‐105 PAGE 106‐109 PAGE 110‐128 PAGE 129‐135 DIE HANDLING PRODUCTS PAGE 136‐141 Vespel® T37505V Long, narrow p popular for general handling of up to 4” wafers. Rec‐
ommended for use with Quick‐Lock wands. P/N: T37505V Vespel® T75070V A narrow, knife‐edged p for loading/unloading wafers up to 4” from stages offering limited access. Vacuum pocket side has minimal angle to allow wand to remain rela vely parallel to wafer and stage. Recom‐
mended for use with Quick‐Lock wands. P/N: T75070V Vespel® T75096V A broad, knife‐edged p for leading/unloading of wafers up to 4” for platens and susceptors. Recommended for use with Quick‐Lock wands. P/N: T75096V Vespel® T75071V A narrow, knife‐edged p for loading/unloading wafers up to 6” from stages offering limited access. Vacuum pocket side has minimal angle to allow wand to remain rela vely parallel to wafer and stage. Rec‐
ommended for use with Quick‐Lock wands. P/N: T75071V © 2015‐2016 H‐Square
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Vespel® T75048V For general handling of wafers up to 3” especially thin of fragile types such as gallium arsenide. Grooved pocket provides excellent adhesion to wafers with minimum distor on. Recommended for use with Quick‐Lock wands. P/N: T75048V Vespel® T75055V A knife‐edged p for loading/unloading of wafers up to 6” from platens and susceptors. Slightly thicker and more durable than T75049. P/N: T75055V Vespel® T75044V Very rigid, durable, knife‐edged p for loading/unloading of wafers up to 6” from platens and susceptors. Recommended for use with Quick‐Lock wands. P/N: T75044V Vespel® T75049V A knife‐edged p for loading/unloading of wafers up to 4” from platens and sus‐
ceptors. Recommended for use with Quick‐Lock wands. P/N: T75049V Vespel® T75072V A special applica on p for general handling of fragile wafers, such as Gallium Arsenide, of up to 4”. Grooved pocket provides excellent adhesion to wafers with minimum distor on. Knife‐edge p allows removal of wafer from flat surfaces such as platens and susceptors. Recommended for use with Quick‐Lock wands. P/N: T75072V © 2015‐2016 H‐Square Catalog15‐16.1 123 www.h‐square.com VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND HANDLES HOLDERS CORDS TIPS ACCESSORIES PAGE 96‐100 PAGE 101‐105 PAGE 106‐109 PAGE 110‐128 PAGE 129‐135 DIE HANDLING PRODUCTS PAGE 136‐141 Vespel® T75096V A broad, knife‐edged p for leading/unloading of wafers up to 4” for platens and susceptors. Recommended for use with Quick‐Lock wands. P/N: T75096V Vespel® T75010V A popular p for general handling of up to 5” wafers. Recommended for use with Quick‐Lock wands. P/N: T75010V Vespel® T75065V A broad, knife‐edged p for loading/unloading of up to 6” wafers from platens and susceptors. Recommended for use with Quick‐Lock wands. P/N: T75065V Vespel® T75042V Popular open pocket p for general handling of up to 8” wafers. Consid‐
er Full Hard tube for larger wafers. P/N: T75042V Vespel® T75040V A popular open pocket p for general handling of up to 6” wafers. Can be used in some applica ons to separate wafers from adjacent surface. Secondary angle allows posi ve handling in the event of front edge damage. P/N: T75040V © 2015‐2016 H‐Square
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Vespel® T75026V Popular p for general handling of up to 6” wafers. Grooved pocket provides excellent adhesion to wafer with minimum distor on. P/N: T75026V Vespel® T75028V Popular p for general handling of up to 6” wafers. Grooved pocket provides excellent adhesion to wafer with minimum distor on. Less contact area than T75026, but slightly be er wafer adhesion due to shape. P/N: T75028V Vespel® T75050V A very rigid p for general handling of up to 8” wafers. Large support area minimizes vacuum induced distor on. Shallow pocket allows fast, posi ve pick up. Can be used in some applica ons to separate wafers from adjacent surface. Secondary angle allows posi ve han‐
dling in the event of front edge damage. Consider Full Hard tube for larger wafers. P/N: T75050V Vespel® T75051V A rigid, knife‐edged p for loading/unloading of wafers up to 8” from platens and susceptors. Large support area minimizes vacuum in‐
duced distor on. Shallow pocket allows fast posi ve pick up. Consid‐
er Full Hard tube for larger wafers. P/N: T75051V © 2015‐2016 H‐Square Catalog15‐16.1 125 www.h‐square.com VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND HANDLES HOLDERS CORDS TIPS ACCESSORIES PAGE 96‐100 PAGE 101‐105 PAGE 106‐109 PAGE 110‐128 PAGE 129‐135 DIE HANDLING PRODUCTS PAGE 136‐141 Torlon® T37504TOR Long, narrow p for general handling of up to 4” wafers. Backside relief to reduce thickness. Recommended for use with Quick‐Lock wands. Machined from Torlon® for high temperature and dimensional stability. P/N: T37504TOR Torlon® T75048TOR For general handling of wafers up to 3” especially thin of fragile types such as gallium arsenide. Grooved pocket provides excellent adhesion to wafers with minimum distor on. Recommended for use with Quick‐Lock wands. Machined from Torlon® for high temperature and dimensional stability. P/N: T75048TOR Torlon® T75072TOR A special applica on p for general handling of fragile wafers, such as Gallium Arsenide, of up to 4”. Grooved pocket provides excellent adhesion to wafers with minimum distor on. Knife‐edge p allows removal of wafer from flat surfaces such as platens and susceptors. Recommended for use with Quick‐Lock wands. Machined from Torlon® for high temperature and dimensional stability. P/N: T75072TOR Torlon® T75010TOR A popular p for general handling of up to 5” wafers. Recommended for use with Quick‐Lock wands. Machined from Torlon® for high temperature and di‐
mensional stability. P/N: T75010TOR © 2015‐2016 H‐Square
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Torlon® T75049TOR A knife‐edged p for loading/unloading of wafers up to 4” from platens and susceptors. Recommended for use with Quick‐Lock wands. Machined from Torlon® for high temperature and dimensional stability. P/N: T75049TOR Torlon® T75028TOR Popular p for general handling of up to 6” wafers. Grooved pocket provides excellent adhesion to wafer with minimum distor on. Less contact area than T75026, but slightly be er wafer adhesion due to shape. P/N: T75028TOR Torlon® T75040TOR A popular open pocket p for general handling of up to 6” wafers. Can be used in some applica ons to separate wafers from adjacent sur‐
face. Secondary angle allows posi ve handling in the event of front edge damage. P/N: T75040TOR Torlon® T75051TOR A rigid, knife‐edged p for loading/unloading of wafers up to 8” from platens and susceptors. Large support area minimizes vacuum induced distor on. Shallow pocket allows fast posi ve pick up. Consider Full Hard tube for larger wafers. Recommended for use with Quick‐Lock wands. Machined from Torlon® for high temperature and dimensional stability. P/N: T75051TOR © 2015‐2016 H‐Square Catalog15‐16.1 127 www.h‐square.com Semitron 420® SQ22902‐2 A popular heavy substrate handling p for handling of 150mm and 200mm aluminum titanium carbide wafers . Also can be used in some heavy sapphire or glass handling applica ons. Material is sta c dissipa ve at 106‐109 surface resis vity. Compa ble with Heavy Substrate 3/16” tubing and Heavy Substrate NOP191 se‐
ries wand handle. P/N: SQ22902‐2 Heavy Substrate Vacuum Wand Handle These products are specially designed to be used with heavy substrates including photo plates, flat panel displays and read/write head disks. Tips are substan ally thicker and more rigid than common wafer handling ps. Tubes are 3/16” diameter electro polished stainless steel (ST19xx series), and are twice the size of standard tubes. Wands are specially modified to accept the 3/16” diameter tubes and have a set screw to secure connec on. Wands are available in ESD safe PVDF and natural PEEK materials. MODEL MATERIAL VALVE SQ21557‐3 ANTISTATIC PVDF NORMALLY OPEN NOP191 PEEK NORMALLY OPEN NCP191 PEEK NORMALLY CLOSED Heavy Substrate Vacuum Wand Tubing Tubes are 3/16” diameter electro‐polished stainless steel, and are twice the size of standard tubes. Wands are specially modified to accept the 3/16” diameter tubes. Note: These ps/tubes are not compa ble with standard H‐Square vacuum wands with .094” tubes, nor with Press‐Fit wands and adapters. See heavy substrate handling wands NOP191 on Page 84. ST191 1” offset 3/16” tubing for NOP191 ST192 1.5” offset 3/16” tubing for NOP191 ST193 straight 2.9” x 3/16” tubing for NOP191 ST194 straight 4.4” x 3/16” tubing for NOP191 © 2015‐2016 H‐Square
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SP‐X Susceptor Pencil A useful aid loading/unloading wafer from barrel‐type susceptors, which feature annular reliefs in the inner circumfer‐
ence of he pocket. Handle is Delrin®, outrigger is stainless steel tube. Tips are high temperature plas c and must be or‐
dered separately from pencil in packages of four. SP (Pencil handle, no outrigger) SP‐3 (Pencil with outrigger for 3” wafers, no ps) SP‐4 (Pencil with outrigger for 4” wafer, no ps) SP‐6 (Pencil with outrigger for 6” wafers, no ps) SPT‐TOR (Tips—four (4) Torlon®) SPT‐V (Tips—four (4) Vespel® Tips) © 2015‐2016 H‐Square Catalog15‐16.1 129 www.h‐square.com VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND HANDLES HOLDERS CORDS TIPS ACCESSORIES PAGE 96‐100 PAGE 101‐105 PAGE 106‐109 PAGE 110‐128 PAGE 129‐135 DIE HANDLING PRODUCTS PAGE 136‐141 AT090 A Delrin® adapter required to a ach “SCHN”, “BCHN”, “SNHN”, “BNHD” hub needles to standard .094” diame‐
ter stainless steel wand tubes. One end has a 2° degree taper for the hub needle. The opposite end presses on‐
to .094” diameter tubing. AH375Q and AHAS716Q Adapter for Conven onal and Down‐Sized Quick‐Lock wands. These screw on adapters are required to a ach SCHN”, “BCHN”, “BNHN”, and “BNHD” hub needles. Mate‐
rial matches wand types being used: AH375Q is Delrin®; AHAS716Q is an sta c PVDF AST26Q A Delrin® adapter required to a ach 100% Quartz ps and molded plas c ps that feature .26”diameter tubes to any Conven onal or Down‐Sized Quick‐Lock wand. One end features two internal Viton® O‐rings similar to Press‐Fit wands. AAS26Q2 Converts Quick‐Lock wand to Press‐Fit wand. Compa ble with PEEK (NOPQ1, NOSPQ1) & an ‐sta c (NOSASQ2, NOASQ2, NCASQ2) wands. For use with all molded PEEK Press‐Fit ps and all 100% quartz ps. Material is conduc ve PVDF with 7/16‐28 UNEF threads on opposite end. AASPFST AASPFLLHNF Adapter used on NCASPF2 and NOASPF2 wand. Converts a Press‐Fit wand to .094” diameter stainless steel tubing used for conven onal vacuum wand ps. Material is con‐
Adapter which combines the Luer‐Lock (LLHNF) with the AASPFST. This adapter converts all Press‐Fit wands to accommodate all hub needles for Die & Package © 2015‐2016 H‐Square
130 Va c u u m Wa n d C o m p o n e nt s A C C E S O R I E S
THF Fi ng connects vacuum wands to coil cords. Nickel‐plated Brass. Used on all wands (except Teflon wands). NST Nickel‐plated brass Used on Die & Package Handling Wands. A060 This nickel‐plated brass adapter reduces the internal thread of all Conven onal and Down‐Sized wands from 1/16‐27 NPT to #10‐32TPI. It must replace the standard “THF” barbed house fi ng in any of these wand models when “HB06”, “HB12”, “SHB”, or “SHB‐90” op onal fi ngs are installed. HB12 A nickel‐plated barbed hose fi ng compa ble with 1/8” I.D. resilient tubing. Threaded end is #10‐32. Requires replace‐
ment of “THF” fi ng with “A060” in all Conven onal and Down‐Sized wands. May be used with “PTAS2502”, “CC‐6”, “CC‐7”, “CC‐9”, “CC‐9AS2”, “CC‐11”, and “CC‐11AS2” coil cords. © 2015‐2016 H‐Square THF‐P Fi ng connects vacuum wand to coil cord. Plas c (Polypropylene). Used on Teflon wands LLHNF Luer‐Lock fi ng. Chrome over nickel‐plated brass. Used on Die & Package Handling wands. HB06 A nickel‐plated barbed hose fi ng compa ble with 1/16” I.D. resilient tubing such as “PTAS1322”, “CC‐4”, AND “CC‐4AS2” coil cords. Threaded end is #10‐32. Requires replacement of “THF” fi ng with “A060” all Conven onal and Down‐Sized wands SHB A brass swivel fi ng for use with 1/8” I.D. resilient tub‐
ing. Helps to prevent cord fouling in applica ons where wand rota on occurs. Threaded end is #10‐32. Requires replacement of “THF” fi ng with “A060” in all Conven‐
onal and Down‐Sized wands. May be used with “CC‐
6”,“CC‐7”, “CC‐9”, “CC‐9AS2”, “CC‐11”, and “CC‐11AS2” coil cords. Catalog15‐16.1 131 www.h‐square.com VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND HANDLES HOLDERS CORDS TIPS ACCESSORIES PAGE 96‐100 PAGE 101‐105 PAGE 106‐109 PAGE 110‐128 PAGE 129‐135 DIE HANDLING PRODUCTS PAGE 136‐141 Vacuum Wand System Metal Quick Disconnect Quick‐Disconnect assembly for connec ng coil cord or straight tubing to house vacuum lines. Automa c shut‐off mechanism is in the “CQDM” por on of the quick‐disconnect. An sta c conduc ve. HBQDM Metal Quick Disconnect, Male CQDM Metal Quick Disconnect, Female Grounding Adapter CTA06 Conduc ve nickel plated brass inline adapter with lug for grounding wire. Adapts .13”‐.16” I.D. tubing to .06” I.D. For use with “CC‐4x” or “PTAS1322”. 6” grounding wire included. CTA06 Grounding Adapter/ Size Change Grounding Adapter CTA12 Conduc ve nickel plated brass inline adapter with lug for grounding wire. Adapts .13”‐.16” I.D. tubing to .13”‐.16 tubing. Use with “CC‐9x”, “CC‐11x” and “PTAS2502” tubing. 6” grounding wire included. CTA12 Grounding Adapter Flex Coupling Vacuum Wand Tubing Assembly Flexible couplings are installed between Conven onal wand ps using .094” diameter tubing and Quick‐Lock or Slip‐Fit wands. May also be used with Universal PEEK Press‐Fit wands by using an “AASPFST” adapter. A short Polyurethane tube provides a resilient coupling. Flex couplings can aid in rapid pick up of wafers, especially for new operators, as it helps the p to self‐align with the wafer surface. Offset couplings are useful for applica ons where wafers are being removed from a flat platen or susceptor with knife‐edged wand p, allowing the wand to remain separated from platen while giving the operator a “spatula‐like” feel to get between wafer and plate. May be requested as a special order basis for quartz and stainless steel ps featuring .094” diameter tubing. FCOQ Offset Angle FCQ Straight FCQ FCOQ © 2015‐2016 H‐Square
132 Va c u u m Wa n d C o m p o n e nt s A C C E S O R I E S
Replacement 0.094” Diameter Stainless Steel Wand Tubing Standard tubing provided with Conven onal and Quick‐Lock wands is 2.5 inches long, .094” diameter with .016” wall, annealed, type 316 stainless steel. Annealed tubing is so to allow operators to easily form it to desired opera ng angles. Standard tubing for Conven onal Quick‐Lock wands and Teflon Slip‐Fit wands is knurled. Specify wand type when order‐
ing. Order tube models are available for special applica ons. “FH” full hard tubing is .094” diameter with .010” wall, type 316 stainless steel tubing that has been heat‐treated. Significantly more force is required to bend this tubing. It is used where tubes should remain straight, or where they will be formed coated with PFA. Encapsula on can reduce metallic material transfer to wafers in the event of tubing contact. ST‐2.5KQ ST2.5KQC ST‐2.5KFH ST‐2.5KFHC ST‐4KQ ST‐6KFH ST‐6KQ ST‐9KQ ST‐12KQ ST‐18KQ 2.5” length standard tubing PFA Teflon® coated ST‐2.5KQ Full hard version of ST‐2.5KQ PFA Teflon® coated ST‐2.5KFH Annealed, 4” long w/knurl Full hard, 6” w/knurl Annealed, 6” long w/knurl Annealed, 9” long w/knurl Annealed, 12” long w/knurl Annealed, 18” long w/knurl Available extended lengths at 4”, 6”, 9”, 12” and 18” use the exis ng wand handle and fi ngs. Custom lengths and bent angle versions are available through your H‐Square representa ve. Heavy Substrate Vacuum Wand Tubing Tubes are 3/16” diameter electro‐polished stainless steel, and are twice the size of standard tubes. Wands are specially modified to accept the 3/16” diameter tubes. Note: These ps/tubes are not compa ble with standard H‐Square vacuum wands with .094” tubes, nor with Press‐Fit wands and adapters. See heavy substrate handling wands NOP191 on Page 84. ST191 1” offset 3/16” tubing for NOP191 ST192 1.5” offset 3/16” tubing for NOP191 ST193 straight 2.9” x 3/16” tubing for NOP191 ST194 straight 4.4” x 3/16” tubing for NOP191 © 2015‐2016 H‐Square Catalog15‐16.1 133 www.h‐square.com VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND HANDLES HOLDERS CORDS TIPS ACCESSORIES PAGE 96‐100 PAGE 101‐105 PAGE 106‐109 PAGE 110‐128 PAGE 129‐135 DIE HANDLING PRODUCTS PAGE 136‐141 VTG– Vacuum Test Gauge This mul ple func on tool provides a fast, accurate means to measure system vacuum level, vacuum wand leakage and p leakage for ps up to 200mm in size (for 300mm, see VTG‐001). It incorporates a vacuum gauge, Delrin housing and tubing adapter stored within the gauge. (Use included adapter to test Press‐Fit wands). VTG‐001 300mm version VTG‐002 450mm version SCR‐KEY Allen Wrench for Vacuum Tips A black oxide coated, hardened steel set screw key for #2‐56 hex head set screws commonly used in vacuum wand ps. The key is .035” across the flats. SCR‐KEY Tool © 2015‐2016 H‐Square
134 Va c u u m Wa n d C o m p o n e nt s A C C E S O R I E S
Replacement Vacuum Wand Handle Parts Wand Handle Replacement Replacement Replacement Replacement Bu on, Valve and Spring Vacuum Line Connec on Fi ng Lock Ferrell SST Tubing (Assembly) NOPQ1 BPVPNO THF LFP ST‐2.5KQ NOSPQ1 BPVPNO THF LFP ST‐2.5KQ NCPPF1 BPVPNC THF NOPPF1 BPVPNO THF NOSPPF1 BPVPNO THF NCP191 BPVPNC THF ST19x Series NOP191 BPVPNO THF ST19x Series NCASQ2 BPVPASNC THF ST‐2.5KQ NOASQ2 BPVPASNO THF ST‐2.5KQ NOSASQ2 BPVPASNO THF NCASPF2 BPVPASNC THF NOASPF2 BPVPASNO THF NOSASPF2 BPVPASNO THF NCQ1 BPVPNC THF LF ST‐2.5KQ NOQ1 BPVPNO THF LF ST‐2.5KQ NOSQ1 BPVPNO THF LF ST‐2.5KQ NCTQ THF‐P LFT ST‐2.5KQ NOTQ THF‐P LFT ST‐2.5KQ NOSTQ THF‐P LFT ST‐2.5KQ DSNCQ1 BDSVNC THF LF ST‐2.5KQ DSNOQ1 BDSVNO THF LF ST‐2.5KQ DSNOSQ1 BDSVNO THF LF ST‐2.5KQ DPNOAS2LA BPVPASNO A060, HB06 DPNOAS2NA BPVPASNO A060, HB06 DPNOAS2LB BPVPASNO A060, HB12 DPNOAS2NB BPVPASNO A060, HB12 DPNOSAS2LA BPVPASNO A060, HB06 DPNOSAS2NA BPVPASNO A060, HB06 DPNOSAS2LB BPVPASNO A060, HB12 DPNOSAS2NB BPVPASNO A060, HB12 NO31 BPVPNO3 THF NO3AS1 BPVPNO3AS THF © 2015‐2016 H‐Square Catalog15‐16.1 135 www.h‐square.com VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND HANDLES HOLDERS CORDS TIPS ACCESSORIES PAGE 96‐100 PAGE 101‐105 PAGE 106‐109 PAGE 110‐128 PAGE 129‐135 DIE HANDLING PRODUCTS PAGE 136‐141 Sta c Dissipa ve Vacuum Wand Die and Package Systems The below “EXAMPLE” drawing reflects a complete system for die and package handling that will not require a resistor to be installed in the vacuum wands or coil cord tubing, or p. The wand handle is a carbon filled PVDF. The sta c dissipa ve vacuum cups have a resistance of 10^8 to 10^10 ohms. The coil cord has a stainless steel wire inserted throughout its length to provide a path to ground. The balance of the system is metal and only at the end of the coil cord is a ground required. The charge decay meets the requirements in Method 4046 Federal Test Method Standard 101B, and MIL‐
B81705B. NOTE: All wands, hub needles, cups, adapters, holders, and cords must be ordered separately. H‐Square die and package wands and portable Freedom Wands are available with normally open (NO) valves. Wand types are available with vacuum slide switches to turn the vacuum off when not in use or more tradi onally a shut off holder is used to turn off the vacuum when not in use (see HSU series wand holders –page 90). Recommended Die and Package Devices (Size variable) CUP/TIP (Size Variable) HUB NEEDLE DPNOAS2LA HANDLE CC4SDS CORD HSU HOLDER © 2015‐2016 H‐Square
136 Die and Package Handling V A C U U M
W A N D S
Die and Package Vacuum Wand Handle The latest and most popular die and package vacuum wand handles. Designed to be used with hub needles and ps or cups. The NST design allows the operator to adjust the hub needle at any angle for comfort and control. The Luer‐Lock design locks the hub needle mo onless in one of four angles. The conduc ve PVDF versions provide safety from ESD events and eliminate par cle a rac on caused by sta c charges. Luer Lock Series Die and Package Wand Handle (pictured with HB12 large 1/4” hose barb) MODEL NST Series Die and Package Wand Handle (pictured with HB06 small 1/16” hose barb) MATERIAL VALVE NEEDLE FITTING COIL CORD FITTING Slide Switch DPNOAS2LA ANTISTATIC PVDF NORMALLY OPEN LUER LOCK HB06 1/16” (CC‐4xx Coil) DPNOAS2LB ANTISTATIC PVDF NORMALLY OPEN LUER LOCK HB12 1/4” (CC‐9xx Coil) DPNOSA2LA ANTISTATIC PVDF NORMALLY OPEN LUER LOCK HB06 1/16” (CC‐4xx Coil) YES DPNOSAS2LB ANTISTATIC PVDF NORMALLY OPEN LUER LOCK HB12 1/4” (CC‐9xx Coil) YES DPNOAS2NA ANTISTATIC PVDF NORMALLY OPEN NST HB06 1/16” (CC‐4xx Coil) DPNOAS2NB ANTISTATIC PVDF NORMALLY OPEN NST HB12 1/4” (CC‐9xx Coil) DPNOSAS2NA ANTISTATIC PVDF NORMALLY OPEN NST HB06 1/16” (CC‐4xx Coil) YES DPNOSAS2NB ANTISTATIC PVDF NORMALLY OPEN NST HB12 1/4” (CC‐9xx Coil) YES Small Device Die and Package Pick and Place Vacuum Wand Handle (SDPPS) Designed for pick and place of small chips and components. Separate p and vacuum actuator enables user to operate vacuum ON/OFF switch with one hand while keeping pick‐up hand steady. Pencil‐style p holder designed for a comfortable and natural feel. Sta c dissipa ve system made completely from ESD‐safe materials to protect devices. Suitable for use with Gel‐Pak® carrier systems and other small component trays. Use sta c –dissipa ve cups and hub needles (see next page) to ensure ESD protec on. SDPPS Die handling two‐handed vacuum wand assembly (cups, ps and hub needles sold separately) © 2015‐2016 H‐Square Catalog15‐16.1 137 www.h‐square.com Die and Package Auto Shutoff FWTTA1 Table Top Portable Freedom Wand™ A custom version of the standard FWTTA1 pla orm. The FWTTA1‐AC‐005 has all the standard features of the FWTTA1 but includes DPNOAS2LA wand, CC‐4SDS coil cord, CTA06 grounding adapter, two (2) bent BCHN hub needles (BCHN‐16S and BCHN‐18), and two (2) vacuum cups (VCAS125 and MBNCSD‐12) to make a complete die and package Freedom Wand™ starter package. FWTTA1‐AC‐005 Die and Package Freedom Wand USA (100‐120 VAC) Class 1 Cleanroom Cer fied US Patent No. 5,217,273 Die and Package FWCR Portable Cordless Freedom Wand™ Compact (Rechargeable) Ships with: AASPFLLHNF Luer‐adapter, FWCR base unit, charging stand, power supply/cord, BCHN‐16 hub needle, SCHN‐
16 hub needle, VCC‐020 Vespel p, VCAS125 and VCAS246 vinyl vacuum cups. FWCR4‐AC USA (100‐120 VAC) FWCR4‐E EUROPE (220‐240 VAC) FWCR4‐UK UK (220‐240 VAC) Replacement Filter Assembly: FWCR2FA US Patent No. 5,217,273 Class 1 Cleanroom Cer fied © 2015‐2016 H‐Square
138 Die and Package Handling P O R T A B L E
V A C U U M
W A N D S
MINIPAW‐AS An sta c Small Portable Vacuum Pick Up Luer Lock Series Die and Package FEATURES: An ‐sta c polypropylene adapter. Includes metal hub needle (BCHN‐16). Black neoprene vacuum bulb, 3/8” diameter. Vacuum 3” – 6” hg. (varies with cup size). APPLICATIONS: Vacuum pick‐up of small to large I.C.’s, substrates and surface mount devices, etc. Size of devices .200 to 3.00 sq. inches. Operator should use ground strap to insure sta c discharge. NOTE: H‐Square silicon rubber cup series “SRC‐X” can also be used for non‐an ‐
sta c applica ons. MINIPAW‐AS Portable Die Handling Bulb with Hub Needle (vacuum cups ordered separately) PAW‐AS An sta c Portable Vacuum Pump FEATURES: Includes metal hub needle (BCHN‐16) large vacuum bulb (red PVC), 2.00” dia. Vacuum 5” – 8” hg. (varies with cup size). APPLICATIONS Vacuum pick‐up of small to large I.C.’s, substrates and surface mount devices, etc. Size of devices .200 to 3.00 sq. inches. Operator should use ground strap to insure sta c discharge. PAW‐AS Portable Die Handling Bulb with Hub Needle (Vacuum cups ordered separately) Freedom Wand Pencil™ An ‐Sta c Self‐Contained Vacuum Pencil Aluminum and sta c‐dissipa ve plas c body. Includes two sta c‐dissipa ve vacuum cups (BNCSD‐25 and BNCSD‐38). Includes two short hub needles (NOT sold separately) Weighs less than one ounce. Easily picks up 50 grams (varies with cup size) APPLICATIONS: Vacuum pick‐up of small to large I.C.’s Size of devices .200 to 3.00 sq. inches. Operator should use ground strap to insure sta c discharge. FWP Portable Die Handling Bulb Pen (with hub needles and cups included) © 2015‐2016 H‐Square Catalog15‐16.1 139 www.h‐square.com VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND VACUUM WAND HANDLES HOLDERS CORDS TIPS ACCESSORIES PAGE 96‐100 PAGE 101‐105 PAGE 106‐109 PAGE 110‐128 PAGE 129‐135 DIE HANDLING PRODUCTS PAGE 136‐141 Conduc ve Vacuum Cups and Tips MODEL VCC‐010 VCC‐015 VCC‐020 VCC‐040 VCC‐060 VCC‐12 VCC‐19 VCC‐25 VCC‐31 VCC‐38 VCAS125 VCAS160 VCAS196 VCAS199 VCAS246 VCAS260 VCAS39 VCAS44 VCAS58 MPCSD‐06 MBNCSD‐12 BNCSD‐25 BNCSD‐38 BNCSD‐50 BNCSD‐62 BNCSD‐75 MATERIAL DIA. "D" HEIGHT "H" Compa ble Hub Needle(s) An ‐Sta c Vespel An ‐Sta c Vespel An ‐Sta c Vespel An ‐Sta c Vespel An ‐Sta c Vespel An ‐Sta c Vespel An ‐Sta c Vespel An ‐Sta c Vespel An ‐Sta c Vespel An ‐Sta c Vespel An ‐Sta c Vinyl An ‐Sta c Vinyl An ‐Sta c Vinyl An ‐Sta c Vinyl An ‐Sta c Vinyl An ‐Sta c Vinyl An ‐Sta c Vinyl An ‐Sta c Vinyl An ‐Sta c Vinyl Polyurethane Nitrile (Buna "N") Nitrile (Buna "N") Nitrile (Buna "N") Nitrile (Buna "N") Nitrile (Buna "N") Nitrile (Buna "N") .010” (0.25mm) .015” (0.38mm) .020” (0.50mm) .040” (1.01mm) .060 (1.52mm) .12” (3.04mm) .19” (4.82mm) .25” (6.35mm) .31” (7.87mm) .38” (9.65mm) .125” (3.17mm) .160” (4.06mm) .196” (4.97mm) .199” (5.05mm) .246” (6.24mm) .260” (6.60mm) .39” (9.90mm) .44” (11.17mm) .58” (14.73mm) .06” (1.52mm) .12” (3.04mm) .25” (6.35mm) .38” (9.65mm) .50“ (12.70mm) .62” (15.74mm) .75” (19.05mm) .60” .57” .56” .50” .50” .37” .37” .37” .37” .37” .20” .20” .40” .20” .25” .20” .60” .50” .50” .15” .12” .31” .31” .31” .31” .31” *BCHN‐16(S0, *SCHN‐16(S) *BCHN‐16(S0, *SCHN‐16(S) *BCHN‐16(S0, *SCHN‐16(S) *BCHN‐16(S0, *SCHN‐16(S) *BCHN‐16(S0, *SCHN‐16(S) *BCHN‐16(S0, *SCHN‐16(S) *BCHN‐16(S0, *SCHN‐16(S) *BCHN‐16(S0, *SCHN‐16(S) *BCHN‐16(S0, *SCHN‐16(S) *BCHN‐16(S0, *SCHN‐16(S) *BCHN‐16(S0, *SCHN‐16(S) *BCHN‐16(S0, *SCHN‐16(S) *BCHN‐16(S0, *SCHN‐16(S) *BCHN‐16(S0, *SCHN‐16(S) *BCHN‐16(S0, *SCHN‐16(S) *BCHN‐16(S0, *SCHN‐16(S) *BCHN‐16(S0, *SCHN‐16(S) NST direct connect—No hub needle used NST direct connect—No hub needle used BCHN‐21, SCHN‐21 BCHN‐18, BCHN‐18S, SCHN‐18 BCHN‐18, BCHN‐18S, SCHN‐18 BCHN‐18, BCHN‐18S, SCHN‐18 BCHN‐18, BCHN‐18S, SCHN‐18 BCHN‐18, BCHN‐18S, SCHN‐18 BCHN‐18, BCHN‐18S, SCHN‐18 MATERIAL DIA. "D" HEIGHT "H" Compa ble Hub Needle(s) SILICONE RUBBER SILICONE RUBBER SILICONE RUBBER TEFLON TEFLON TEFLON TEFLON TEFLON TEFLON TEFLON TEFLON .12" (3.04mm) .25" (6.35mm) .38" (9.65mm) .043” (1.09mm) .024” (0.60mm) .19" (4.82mm) .25" (6.35mm) .31" (7.87mm) .38" (9.65mm) .44" (11.17mm) .50" (12.70mm) .12" .31" .31" .62” .62” .37" .37" .37" .37" .37" .37" BCHN‐18S, BCHN‐18, SCHN‐18 BCHN‐16S, BCHN‐16, SCHN‐16 BNHN‐15, SNHN‐15 BCHN‐16S, BCHN‐16, SCHN‐16, BNHN‐15, SNHN‐16 PRE‐MOUNTED ON PLASTIC HUB NEEDLE PRE‐MOUNTED ON PLASTIC HUB NEEDLE BNHN‐15, SNHN‐15 BNHN‐15, SNHN‐15 BNHN‐15, SNHN‐15 BNHN‐15, SNHN‐15 BNHN‐15, SNHN‐15 BNHN‐15, SNHN‐15 Non‐Conduc ve Vacuum Cups and Tips MODEL MSRC‐12 SRC‐25 SRC‐38 BNHD‐19 BNHD‐24 TC‐19 TC‐25 TC‐31 TC‐38 TC‐44 TC‐50 © 2015‐2016 H‐Square
140 Die and Package Handling H u b
N e e d l e s
T i p s
&
C u p s
VCC Series Die Handling An sta c Tips Precision machined conduc ve and high temperature Ves‐
pel® rigid vacuum ps for handling of small devices. Note that the VCC ps should always be used with a vacuum source which is supplying CFM as the VCC does not conform to the part like a elastomer cup. VCAS Series Die Handling An sta c Cups Precision molded an sta c vinyl so elastomer vacuum cups for handling of small devices. An sta c vinyl cups are long las ng and low outgassing. BNCSD Series Die Handling An sta c Cups Precision molded an sta c nitrile Buna‐N so elastomer vacuum cups for handling of small devices. An sta c nitrile pro‐
vides an sta c protec on at an economical price. MSRC and SRC Series Die Handling Cups Precision molded high temperature (250° C) Silicone® rubber so elastomer vacuum cups for handling of small devices. An sta c nitrile provides an sta c protec on at an economical price. BNHD and TC Series Die Handling Tips Precision machined high temperature and chemical re‐
sistant PTFE Teflon® rigid vacuum ps for handling of small devices. Note that the TC ps should always be used with a vacuum source which is supplying CFM as the TC does not conform to the part like a elastomer cup. BNHD ps are Teflon® ps mounted on plas c hub needles. TC‐25 Hub Needles Metal and plas c hub needles. Luer lock or NST fi ng compa ble. Bent angle and straight versions available. Plas c Hub Needles (for TC Series) All Metal An sta c Hub Needles Standard Bent Standard Straight Short Bent Short Straight BCHN‐16 , SCHN‐16, BCHN‐18S, SCHN‐16S 16 Gauge 0.065” OD 0.045” ID BCHN‐18, SCHN‐18 18 Gauge 0.050” OD 0.033” ID BCHN‐21, SCHN‐21 21 Gauge 0.032” OD 0.020” ID © 2015‐2016 H‐Square Plas c Straight Plas c Bent BNHN‐15, SNHN‐15 15 Gauge 0.072” OD 0.052” ID BNHN = Bent SNHN = Straight Catalog15‐16.1 141 www.h‐square.com Metals and minerals commonly used in H‐Square products:  Aluminum Type 6063: used for metal casse e side plates  Maximum con nuous usable temperature: 450°C (842°F). Recommended not to exceed 350° C.  Aluminum Type 6061: used for vacuum ps, metal casse e side plates, mock wafers, machined parts and table clamps.  Maximum con nuous usable temperature: 450°C (842°F). Recommended not to exceed 350° C.  Brass: used for vacuum fi ngs and nickel‐plated thumb screws.  Maximum con nuous temperature: 800°C (1472°F).  Cold Rolled Steel Type 1018: used for table bases.  Maximum con nuous temperature: 840° (1544°F).  Copper: used for wire, pla ng and brazing compounds.  Maximum con nuous temperature: 800°C (1472°F).  Invar: FeNi36 (64FeNi) used for quartz ps and stainless steel tubing interface.  Maximum con nuous temperature: 1425°C (2600°F).  Quartz (Op cal Quality): used for quartz ps.  Maximum con nuous temperature: 1425°C (2600°F).  Sauereisen® : high temperature cement: used to bond Invar/stainless steel tubes to hybrid quartz ps.  Maximum con nuous temperature: 982°C (1800°F).  Silver Solder: Used for bonding Invar to stainless steel tubing, flex‐coupling assemblies, fixed ferrules and stainless ps.  Maximum con nuous temperature: 500°C (932°F).  Stainless Steel Type 302 & 304: used for fasteners, fi ngs, tubing and springs.  Maximum con nuous temperature: 900°C (1650°F).  Stainless Steel Type 303: used for machined ps and precision sha ing.  Maximum con nuous temperature: 900°C (1650°F).  Stainless Steel Type 316: used for metal casse es, vacuum wand/ p tubing, mask pick bars and mechanical plas c casse e handles.  Maximum con nuous temperature: 900°C (1650°F).  Stainless Steel Type 321: used for nonstandard tubing applica ons.  Maximum con nuous temperature: 900°C (1650°F).  Stainless Steel Type 440C: used for heat treated rods for notch aligner and robo c ps.  Maximum con nuous temperature: 900°C (1650°F). © 2015‐2016 H‐Square
142 Appendix A M A T E R I A L S
Plas cs and fibers commonly used in H‐Square products  ABS (Acrylonitril‐Butadiene‐Styrene): used for aligner adjustment knobs, vacuum wand holders  Maximum con nuous temperature: 70°C (160°F).  Conduc ve PEEK (Polyetheretherketone): Carbon fiber (CF) filled PEEK used for conduc ve an ‐sta c molded and machined ps and machined parts. NOT COMPATABLE WITH FUMING NITRIC AND SULPHURIC ACIDS  Maximum con nuous temperature: 245°C (470°F).  Delrin® (Homopolymer Acetal): Used for stages, vacuum wand handles, pick handles, vacuum ps, susceptor pencils, flat‐finder roller cores and mechanical parts. Not compa ble with: acidic and basic reagents with ph> 10.  Maximum con nuous temperature: 85°C (185°F).  EPR (Ethylene Propylene Elastomer): Used for o‐rings.  Service Temperature range: ‐35° to 140°C (‐31° to 284°F).  Kalrez® :perfluoroelastomer o‐ring material. Used for MCP and mask handling applica ons. Excep onal cleanliness, chemical and heat resistance.  Service Temperature: 327° C  Kevlar® (Aramid Fiber): Used as reinforcing agent for automa c flat‐finders, WP, WPP drive belts. Not compa ble with ultraviolet light.  Maximum con nuous temperature: Use base plas c matrix material temperature ra ng.  Lexan® (Polycarbonate): Used for vacuum wand ps, side shields, casse e side walls. Not compa ble with: Acids, bases, solvents and hydrocarbons.  Maximum con nuous temperature: 120°C (250°F).  Neoprene (Chloroprene Elastomer): Used for rubber vacuum cups and o‐rings.  Service Temperature range: ‐55°C to 140°C (‐67° to 284°F).  Nitrile (Buna “N”): Used for ESD protected vacuum cups. Resistant to most non‐aroma c petroleum‐based fluids and gases.  Service Temperature range: 54° to 107°C (‐65° to +225°F).  Nylon (Polyamide): Used for tapered hubs for vacuum cup needle ps, Flat‐Finder reduc on gears and for assembly spacers. Not compa ble with: acidic and basic reagents with ph> 4, ultraviolet light, or phenols.  Maximum con nuous temperature: 65°C (150°F).  PEEK (Polyetheretherketone): Used for vacuum wands, ps, adapters, grippers, casse e side walls  Maximum con nuous temperature: 245°C (470°F).  PE (Polyethylene): Used for flexible hub needle ps, vacuum ps, casse e side walls and storage bags.  Maximum con nuous temperature: 120° (250°F). © 2015‐2016 H‐Square Catalog15‐16.1 143 www.h‐square.com  PP (Polypropylene): Used for vacuum wand holders, fi ngs, mask pick handles and casse e stands. conduc ve pol‐
ypropylene contains carbon fibers and is used for conduc ve handles, plas c flat‐finders, transfers, grippers, pre‐
senters, escalators, and stages.  Maximum con nuous temperature: 120°C (250°F).  PPS (Polyvinylene Sulfide): Used for heavy substrate ps and horizontal wafer transfer machine parts.  Maximum con nuous usable temperature: 220°C (425°F). Good chemical resistance.  PS (Polystyrene, High Impact): Used for Flat‐Finder and Notch‐Finder motor enclosures. Not compa ble with: Ali‐
pha c, chlorinated or aroma c hydrocarbons, or their deriva ves or ultraviolet light.  Maximum con nuous temperature: 70°C (158°F).  PTE (Polyolefin Thermoplas c Elastomer): Used for “heat‐shrink” tubing on notch aligner rods, wiring harnesses, conduc ve vacuum wands and plas c storage bags. Not compa ble with: Halocarbons and nonpolar hydrocarbons.  Maximum con nuous temperature: 135°C (275°F).  PVC (PolyVinylChloride): Used for coil cord holders, molded wand holders and vacuum cords. Not compa ble with: Chlorinated or aroma c hydrocarbons or acids with ph> 4.  PVDF (Polyvinylidene Fluoride): Used for wand handles, transfer rods and other an ‐sta c applica ons.  Maximum con nuous usable temperature: 140°C (285°F).  SEMITRON ESD 225® (Polyoxymethylene Copolymer – POM): Used for wand handles and other an ‐sta c appli‐
cants. Mechanical performance to 107°C (225°F). Resis vity in 10^10 – 10^12 range. Good chemical resistance.  Mel ng point: 160° to 170° (320° to 342°F).  Silicon Rubber (Silicone Elastomers): Used for Rubber Cups, O‐rings and Bellow Cups.  Service Temperature range: ‐75° to 250°C (‐103° to 482°F).  Teflon® PTFE (Polytetrafluoroethylene): Used for casse es, vacuum wands, slide switches, spatula p adapters and wafer supports for aligners and metal casse es.  Maximum con nuous temperature: 288°C (550°F).  Torlon® (Polyamide‐imide): Used for vacuum wand ps, susceptor pencil ps and special high temperature mechan‐
ical parts.  Maximum con nuous temperature: 260°C (500°F).  Tygon® (Flexible PVC Polyvinylchloride): Different Colors are used for Port‐A‐Wand (PAW) bulb (blue), vacuum tub‐
ing (clear), WP, WPP and Flat‐Finder feet (black). Not compa ble with: Chlorinated or aroma c hydrocarbons or acids with a ph>4.  Service temperature range: ‐45° to 74°C (‐49° to 165°F).  UHMW (Ultra High Molecular Weight Polyethylene): Used as bearing material in horizontal wafer transfer ma‐
chines, vacuum wand ps, casse e side walls. Good chemical resistance.  Maximum con nuous usable temperature: 93°C (200°F) © 2015‐2016 H‐Square
144 Appendix A M A T E R I A L S
 Urethane (Polyurethane Elastomer): Used for vacuum coil cords and tubing, flex‐couplings, flat‐finder roller sheaths and drive belts.  Service temperature range: ‐56° to 107°C (‐49° to 165°F).  Vespel ® (Polyimide): Used for vacuum wand ps, susceptor pencil ps, special stops and grippers for mechanical picks, li blades and metal casse e stops. Conduc ve Vespel contains graphite powder and is used for Conduc ve Cups.  Maximum con nuous temperature: 288°C (550°F).  Short exposure temperature (in free oxygen environment): 482°C (900°F).  Vinyl (Sta c‐Dissipa ve Compound): Used for sta c‐dissipa ve vacuum cups. Resis vity in 10^8 – 10^9 range.  Service temperature range: 21° to 49°C (70° to 120°F).  Viton® (Fluorocarbon Elastomer): Used for O‐rings.  Service temperature range: ‐35° to 225°C (‐31° to 437°F). Pla ng and finishes commonly found on H‐Square products  Anodize, Hard Black/ Anodize, Hard Clear: used on casse es, aligners, stages, picks, casse e handles, mock alumi‐
num wafers and machined aluminum parts.  Maximum con nuous usable temperature: Depends on base aluminum temperature ra ng; however, tem‐
peratures above 230°C (446°F) or atmospheres containing chlorine or ammonia may cause color changes.  Anodize (Sulfuric): Used on colored mock aluminum wafers  Maximum con nuous usable temperature: Depends on base aluminum temperature ra ng; however, tem‐
peratures above 230°C (446°F) or atmospheres containing chlorine or ammonia may cause color changes.  Chrome Type 1 – Class 2 (Spec #: QQ‐C‐320B): used on stainless steel spatula vacuum wand ps.  Maximum con nuous usable temperature: 900°C (1650°F).  Electro‐less Nickel Class 1 (Spec #: MIL‐C‐26074C): used on metal casse es.  Maximum con nuous usable temperature: lower of base material or 200°C (392°F).  Electro polishing: Used on stainless steel vacuum wand ps, casse e handle plates, mask pick bars, suspension hold‐
er tubes.  Maximum con nuous usable temperature: depends upon base material temperature ra ng.  Teflon®‐P (PFA PerFluoroAlkoxy) Teflon® plas c coa ng: used on stainless steel vacuum wand ps and metal cas‐
se es.  Maximum con nuous usable temperature: 260°C (550°F).  Short exposure temperature: 300°C (575°F).  Flouropolymer Plas c Coa ng: used on vacuum wand tubes and coated steel table bases. © 2015‐2016 H‐Square Catalog15‐16.1 145 www.h‐square.com Periodic cleaning of your H‐Square product is highly recommended. Frequency of cleaning requirement is dependent upon usage. INSPECTION: Aligner rollers: Check roller for marks, cuts, par cles and contamina on. Damaged rollers should be immediately replaced. See owners manual or contact H‐Square for replacement rollers. EZ Guide aligner models feature a quick disconnect roller assembly for ease of cleaning or roller replacement. Vacuum ps: Check vacuum p surface for marks, cuts, par cles and contamina on. Vacuum ps are a consumable and should be replaced on a periodic basis or when the surface of the p has been scratched or damaged. A vacuum test gauge (VTG‐001; figure 1 below) should be used to check vacuum wand installa ons performance issues. 22”‐24” Hg vacuum level at the p is recommended in most wafer handling applica ons. Other H‐Square products: Check product surface for damage, par cles or contamina on. Clean as required. CLEANING: General Cleaning (all H‐Square products): Cleaning should be done with either DI water or with a suitable cleanroom solvent like a small percentage mixture of DI and IPA. Isopropyl Alcohol (IPA or (CH3)2 CHOH ) with polyester clean room wipe, or similar, is commonly used in associa on with the wipe‐down and cleaning of the tool / system and all its exterior components. This should be done on an as required basis to keep the tool clean. For more thorough cleaning, some H‐Square products can be disassembled and the wafer contact surfaces, can be ultrasonic cleaned, either in DI water or with a cleaning surfactant, immediately followed by a DI water rinse. It is always recommended to air dry parts a er cleaning (example: under a laminar flow hood in a maintenance bay/area). Note: Always follow fab safety protocol when handling chemicals. Refer directly to the MSDS in an emergency situa on. Figure 1: VTG vacuum test gauge for PM of vacuum wand installa ons © 2015‐2016 H‐Square
146 Appendix B C A R E
&
M A I N T E N A N C E
LUBRICATION: Some mechanical assemblies use lubrica on on an occasional basis. It is recommended that on a quarterly basis the linear guide rails be thoroughly cleaned with IPA and lubricated with a very light applica on of linear bearing oil, a synthe c Teflon® lubricant, or Krytox® clean room lubricant. The system should be mechanically cycled a few mes to distribute the lubricant. Any excess lubricant should be wiped off with a dry clean room wipe. Note: Do not apply lubrica on to motors, drive belts, aligner rollers, any surface that could come in contact with a substrate. It is also recommended that you do not lubricate the bearings/ slider sha s on an H‐Square WT series wafer transfer. The UWMW bearings are self lubrica ng. IPA WIPE DOWN METHODS: In general, cleaning should be done from the cleanest area to the dir est area. To minimize cross contamina on, cleaning should also be done from top to bo om. Surfaces within arm’s reach can be cleaned using wipers and solu ons (such as 70% isopropyl alcohol (IPA) or a disinfectant) appropriate to the environment. Wipers should be “low‐lin ng” — that is, wipers should not leave par cles and fibers behind when they are used to clean surfaces. In an ISO Class 5 area, a non‐
woven polyester/cellulose wiper can be used. However, in areas where a more stringent environment is necessary, a knit polyester wiper is suggested. Wipers can be purchased either pre‐we ed with 70% IPA or they can be we ed at the me of use with the solu on of choice. Be sure wipers are not dripping with solu on — an overly wet wiper can disperse contaminants, can increase the chances of the solu on itself becoming a contamina on source, or poten ally short out electro‐mechanical devices. Wipers should be folded so that the en re surface of the wiper can be used. Typically wipers are quarter folded, and then refolded a er every wipe of the surface, to contain and remove the contamina on. In this manner, there are eight different surfaces of the wiper exposed and able to be used for wiping. Wiping should be done in overlapping linear strokes from clean to dirty or dry to wet. A er all eight surfaces have been used, the wiper (and its captured contamina on) should be discarded in an appropriate container. Swabs we ed with a cleaning solu on, IPA, or sterile water can be used to address very ght areas. FACTORY SERVICE, ADVICE AND REPAIRS: For specific cleaning recommenda ons, spare part ordering, or troubleshoo ng an H‐Square product, please contact your local H‐Square representa ve or email the factory at: info@h‐square.com Note: products should not be send to H‐Square without an RMA tracking number. © 2015‐2016 H‐Square Catalog15‐16.1 147 Americas www.h‐square.com At H‐Square, mee ng your expecta ons is never enough. Our mission is to exceed expecta ons in all areas of customer responsiveness. Our commitment to excellence begins the first me we speak with you and that commitment never changes. Let H‐Square's knowledgeable team show you first‐hand why we're turning total customer sa sfac on into long term customer loyalty. California Nevada Canada Mexico South America H‐SQUARE CORPORATION 3100 Patrick Henry Dr Santa Clara, CA 95054 (408) 982‐9108 (408) 982‐9183 Fax h p://www.h‐square.com/ Bre Hofmann Bud Barclay bhofmann@h‐square.com bbarclay@h‐square.com Pennsylvania Delaware (West) New York Maryland Washington DC New Jersey HARRINGTON PURE E&S 4029 South Warner Road Lafaye e Hill, PA 19444 (610) 730‐0920 www.es‐technologies.com/ Jay Conway jconway@es‐technologies.com (East) New York New Jersey Vermont Connec cut HARRINGTON PURE E&S 88 Dove Street Albany, NY 12210 (518) 573‐3239 www.es‐technologies.com/ John Pirozzi jpirozzi@es‐technologies.com Massachuse s New Hampshire Rhode Island Maine HARRINGTON PURE E&S 180 Middlesex St Chelmsford, MA 01863 (978) 453‐2323 (978) 453‐1166 Fax www.es‐technologies.com/ Marc Savoie Don Emden msavoie@es‐technologies.com demden@es‐technologies.com North Carolina Florida Virginia South Carolina Alabama Mississippi Tennessee Georgia HARRINGTON PURE E&S 112 Kellyridge Drive Apex, NC 27502 (919) 665‐7997 (978) 453‐1166 Fax www.es‐technologies.com/ Dave Freedman dfreedman@es‐technologies.com © 2015‐2016 H‐Square
148 Appendix C S A L E S
A N D
S E R V I C E
Idaho Utah Montana Colorado BALD MOUNTAIN SALES 137 Sioux Drive Hailey, Idaho 83333 (208) 315‐1993 Ron Barclay Denise DeCoster [email protected] Minnesota Wisconsin Iowa North Dakota South Dakota PETERSON‐NORA SALES 625 5th Street North S llwater, MN 55082 (651) 351‐9040 (651) 351‐9050 Fax Marty Nora [email protected] Illinois Indiana Kentucky Ohio Michigan Missouri H‐SQUARE CORPORATION 3100 Patrick Henry Dr Santa Clara, CA 95054 (408) 982‐9108 (408) 982‐9183 Fax h p://www.h‐square.com/ Bre Hofmann Bud Barclay bhofmann@h‐square.com bbarclay@h‐square.com Arizona New Mexico JACK KRIEGEL & ASSOCIATES 1374 W. Seashore Drive Gilbert, AZ 85233‐6154 (480) 813‐4600 (480) 813‐4607 Fax Jack Kriegel [email protected] North Texas Arkansas Louisiana Oklahoma NETMERCURY 13438 Floyd Circle Dallas, TX 75243 (972) 783‐1501 (972) 783‐1574 Fax Ed Dahir [email protected] South Texas NETMERCURY 3912 Ga s School Rd Round Rock, TX 78644 (512) 989‐0600 (512) 989‐0622 Fax Mark Lariviere [email protected] Oregon Washington INNERSKIL Rick O’Malley [email protected] [email protected] 11880 SW Riverview Ln Wilsonville, OR 97070 (503) 863‐6270 (503) 582‐1909 Fax © 2015‐2016 H‐Square Catalog15‐16.1 149 Asia www.h‐square.com Steve Ha South Korea K‐PROSS #931 Charmant Officetel 1165 Pungdukchon Dong Youngin City Gyeonggi‐Do 448‐515 Korea 82‐31‐262‐8405 82‐31‐262‐8404 Fax Japan NAGASE Techno‐Engineering Co. Hitomi Watanabe 887 Nippa‐cho, Kouhoku‐ku, Yokohama Kanagawa 223‐0057 Japan 81‐45‐541‐0208 81‐45‐541‐0237 Fax h p://www.nagase‐nte.co.jp/ Taiwan EVER TEAM INTERNATIONAL 15F‐1, No. 287, Sec. 2 Kuang Fu Road Hsin‐Chu City, 300 Taiwan, R.O.C. 886‐3‐572‐9545 886‐3‐572‐8726 Fax h p://www.everteam.com.tw/ Hunter Lin Mike Hung China & Hong Kong CROSS‐TECH EQUIPMENT CO. LTD Nick Zhang Suite 902, No. 3, Magnolia Green R&D Centers Square, Lane 251 Universi es SongHuaJiang Road, Shanghai, 200093, China Mobile: 1391685 5175 Tel: 021‐5603 5615 h p://www.crosstech.com.cn Malaysia (North) EVER TEAM TECHNOLOGIES 17‐1‐3, Bayan Point Medan Kampong Relau 11900 Bayan Lepas, Penang Malaysia 604‐644‐5302 604‐644‐5108 Fax Tock Yit Choong steveha@k‐pross.co.kr [email protected] [email protected] [email protected] [email protected] [email protected] © 2015‐2016 H‐Square
150 Appendix C S A L E S
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S E R V I C E
China EVER TEAM INTERNATIONAL
Room#2203, Building 1 Tianshan Commercial Bldg, Tianshan Road, No.789 Chang Ning District, Shanghai, China 200051 86‐21‐6252‐0638 86‐21‐6252‐4809 Fax Alex Tseng Jimmy Guo Mark Tang [email protected] [email protected] [email protected] China SHANGHAI XIYU ELECTRONICS Room 309, No. 333 Jinxiang Rd Pudong New Zone Shanghai 201206 China 86‐24‐2536‐2266, x613 86‐24‐2581‐6079 Fax Li Jianfeng [email protected] Singapore Thailand Malaysia (South) POWER TEAM TECHNOLOGIES Blk 5004 Ang Mo Kio Ave 5 #2 TECHplace II Singapore 569872 65‐6348‐6380 65‐6348‐6381 Fax h p://www.p .com.sg/ KC Chong kcchong@p .com.sg Philippines PULSE INTEGRATED TECHNOLOGY Verna Montano verna@pulse‐technology.com 601 Common Goal Tower Aaron Mercado aaron.mercado@pulse‐technology.com Industry St., Cor Finance St. Madrigal Business Park Alabang, Mun nlupa City, Philippines 63‐2‐809‐3716 63‐2‐809‐3121 Fax h p://www.pulse‐technology.com/ Australia New Zealand M.M.R.C. PTY LTD. Suite 126 19 ‐29 Milton Parade Malvern, Vic, 3144 Australia Postal Address: P.O. Box 4 Ashburton, Vic 3147 Australia (613) 9885‐1752 (613) 9885‐2603 Fax h p://mmrc.com.au/ © 2015‐2016 H‐Square Michael Young [email protected] Catalog15‐16.1 151 Europe www.h‐square.com The Netherlands Norway Northern Germany Sweden Greece Turkey Russia Denmark Finland Poland S.P.S. B.V. Midden Engweg 41 3882 TS Pu en The Netherlands 31‐341‐360‐590 31‐341‐360‐589 Fax www.sps‐europe.com Rein de Groot Jola Hilhorst Cor Rozema Cris an de Groot info@sps‐europe.com Belgium Portugal Spain S.P.S. bvba Steenweg op Withof 5 2960 Sint Job In't Goor Belgium 32‐344‐00895 32‐344‐05181 Fax www.sps‐europe.com Eric Jager eric.jager@sps‐europe.com France S.P.S. FRANCE ZAC du Pont a Lune es 9, rue du Pont a Lune es F‐69390 Vourles France 33‐4‐72‐31‐78‐35 33‐4‐78‐05‐13‐45 Fax www.sps‐europe.com Eric Puchois Pierrick Four eric.puchois@sps‐europe.com pierrick.four@sps‐europe.com Germany Austria Switzerland Czech Republic Slovakia Croa a Hungary Romania Bulgaria S.P.S. VERTRIEBS GmbH Weisbergerstr. 3 85053 Ingolstadt Germany 49‐841‐37053‐0 49‐841‐37053‐22 Fax www.sps‐europe.com Roland Scheuerer Michael Eckel roland.scheuerer@sps‐europe.com michael.eckel@sps‐europe.com © 2015‐2016 H‐Square
152 Appendix C S A L E S
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S E R V I C E
Italy S.P.S. Via Verdi 18/b 27021 Bereguardo (PV) Italy 39‐0382‐920739 39‐0382‐920738 Fax www.sps‐europe.com Massimo Gambini massimo.gambini@sps‐europe.com United Kingdom Ireland India Dubai S.P.S. LTD. Aghmhor Annex Whitmuir Selkirk TD7 4PZ United Kingdom 44‐1750‐725712 44‐1750‐21401 Fax www.sps‐europe.com Peter Summers peter.summers@sps‐europe.com Israel M.Y.G. TECH. CO., LTD. 22/1, Yitsak Rabin St. Modiin 71700 Israel 972‐8‐9760620 972‐8‐9760621 Fax h p://www.myg‐tech.co.il/ Moshe Gabai mosheg@myg‐tech.co.il © 2015‐2016 H‐Square Catalog15‐16.1 153 Index www.h‐square.com 402724 2851‐2B 2851‐2HC 2851‐3B 2851‐3EN 2851‐3HC 2851‐3PFA 2851‐4B 2851‐4EN 2851‐4HC 2851‐4PFA 2851‐5B 2851‐5EN 2851‐5HC 2851‐5PFA 2851‐6B 2851‐6EN 2851‐6HC 2851‐6PFA 2851‐8B 2851‐8EN 2851‐8HC 2851‐8PFA A000‐1078 A000‐723 A000‐754‐1 A000‐754‐2 A000‐754‐3 A060 AAS26Q2 AASPFLLHNF AASPFST AETWFA4AC AETWFA6 AETWFA6AC‐002 AETWFA8 AETWNA6 AETWNA8 AETWNA8AC‐001 AFEZ‐3 AFEZ‐4 page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page 115 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 23 23, 27 22,26 22.26 22,26 131 130 130 130 42 42 42 42 42 42 42 27 27 AFEZ‐5 AFEZ‐6 AFEZ‐8 AFO AH375Q AHAS716Q ANFEZQ6 SQ22143‐3 ANFEZQ8 ANFEZQ8AC‐005 AST26Q AT090 AVT4 (base unit)* AVT6 (base unit)* AVT8 (base unit)* AVTKIT‐4 AVTKIT‐6 AVTKIT‐8 AWM3 AWM4 AWM6 AWM8 AWT2HL4 AWT2HL6 AWT4HL8 BCHN‐16 BCHN‐16S BCHN‐18 BCHN‐18S BCHN‐21 BDSVNC BDSVNO BDVNC BDVNO BNCSD‐25 BNCSD‐38 BNCSD‐50 BNCSD‐62 BNCSD‐75 BNHD‐19 BNHD‐24 BNHN‐15 BPVPASNC page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page 27 27 27 47 130 130 23 23 31 130 130 36 36 36 36 36 36 32 32 32 32 38 38 38 141 141 141 141 141 135 135 135 135 140 140 140 140 140 141 141 141 135 BPVPASNO BPVPNC BPVPNO BPVPNO3AS CA CC‐11 CC‐11AS2 CC11AS2S CC11ESD CC11ESD1 CC11SDS CC4SDS CC‐6 CC‐7 CC‐9 CC‐9AS2 CC9AS2S CC9ESD CC9ESD1 CC9SDS CH‐2 CH‐3 CH‐4 CH‐5 CH‐6 CH‐8 CHMC456 CHMCL456 CHMCLDH8 CMAD3‐001 CMAD4‐001 CMAD5‐001 CMAD6 CMAD6‐001 CMAD6‐004 CMAD8 CMAD8‐001 CMAD8‐003 CPA6 CPA6‐003 CPAD8 CPAD8‐004 CPH6 CPV6 CQDM page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page 135 135 135 135 108 108 108 108 108 108 108 108 108 108 108 108 108 108 108 108 62 62 62 62 62 62 62 62 63 63 63 63 63 63 63 63 63 63 64 64 64 64 64 64 109, 132 © 2015‐2016 H‐Square
154 Index CS‐6S CS‐8S CTA06 CTA12 DPNOAS2LA DPNOAS2LB DPNOAS2NA DPNOAS2NB DPNOSAS2LA DPNOSAS2LB DPNOSAS2NA DPNOSAS2NB DSNCQ1 DSNOQ1 DSNOSQ1 ETAS1‐3‐001 ETAS1‐4 ETAS1‐5 ETAS1‐6 ETAS1‐8 ETAS1‐8‐007 ETAS8‐003 FCOQ FCQ FFTB1‐2 FFTB1‐3 FFTB1‐4 FFTB1‐5 FFTB1‐6 FFTB1‐8 FFTBAS‐456 FOMH FOMH450 FS‐002 FWA3AS2 FWA450AS FWAHAS2 FWCR2 FWCR2FA FWCR3 FWCR‐4 FWP FWTTA1 page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page © 2015‐2016 H‐Square 46 46 107 107 137 137 137 137 137 137 137 137 97 97 97 43 43 43 43 43 43 43 132 132 30 30 30 30 30 30 28 47 47 46 87 86 87 91 91 91 91, 138 139 88 FWTTA1‐AC‐004 FWTTA1‐AC‐005 H2B‐12 H2B‐4 H2B‐6 H2B‐8 H2BST‐12 H2BST‐4 H2BST‐6 H2BST‐8 HAW HAWL HAWPT HAWRP HB06 HB12 HBH‐001 HBQDM H‐H2BST HL‐2 HL‐3 HL‐4 HL‐6 HL‐8 HMP1 HMP3 HMP4 HSD HSDL HSDPT HSDRP HSU HSU3 HSU3‐002 HSU3PT HSU3PT‐001 HSUL HSUPT HSURP ISM56‐001 ISM567 LCT1AS12 LCT1AS12‐AC‐003 LCT1AS4 LCT1AS6 page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page 88, 138 89 84 84 84 84 84 84 84 84 103 103 103 104 131 131 85 109, 132 85 44 44 44 44 44 73,80 73, 80 73, 80 104 104 104 104 102 101 101 101 101 102 102 104 80 80 35 35 35 35 LCT1AS8 LF LFP LFT LLHNF LN LNP LNT MBNCSD‐12 MC12‐13HC MC12‐25EN1 MC12‐25HC1 MC1‐4B MC1‐4EN MC1‐4HC MC1‐4PFA MC1‐5B MC1‐5EN MC1‐5HC MC1‐5PFA MC1‐6B MC1‐6EN MC1‐6HC MC1‐6PFA MC18‐25HC MC1‐8B MC1‐8EN MC1‐8HC MC1‐8PFA MC1HV4 MC1HV6 MCF6EN (SQ21140‐2) MCF6HC (SQ21140‐1) MCF8B MCF8EN MCF8EN‐001 MCF8EN‐002 MCF8EN‐003 MCF8HC MCF8HV MCF8PFA MCP‐12‐001 MCP‐2‐002 page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page 35 135 135 135 131 135 135 135 140 52 52 52 51 51 51 51 51 51 51 51 51 51 51 51 52 51 51 51 51 56 56 54 54 54 54 54 54 54 54 54 54 71 71 Catalog15‐16.1 155 Index www.h‐square.com MCP‐3‐001 MCP‐4‐008 MCP‐6‐019 MCP‐8‐014 MFEZ3 MFEZ4 MFEZ6 MFEZ6‐001 MFEZ8 MINIPAW‐AS MISC1400‐004 MISC1400‐005 MISC1400‐006 MISC1400‐008 MISC1400‐011 MISC2500‐007 MISC2500‐015 MPCSD‐06 MPH151DW‐005 MPH151DW90‐005 MPH163VO90‐001 MPH172DW‐003 MPH172DW90‐001 MPH3‐63AS‐001 MPH3‐72AS‐001 MPH3‐92‐001 MPS1‐001 MPS1‐002 MPS1‐14‐001 MPS1‐50‐014 MPS1‐71‐001 MPS3‐63AS‐002 MPV1‐005 MPV1‐5‐002 MSRC‐12 MW‐12‐NHC MW‐12‐NNP MW‐18‐HC MW‐18NNP MW‐2HC MW‐2NP MW‐3HC MW‐3NP MW‐4HC MW‐4NP page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page 71 71 71 71 29 29 29 29 29 139 116 117 116 116 117 82 82 140 77 77 77 77 77 78 78 78 76 76 76 76 76 79 78 78 140 66 66 66 66 66 66 66 66 66 66 MW‐5HC MW‐5NP MW‐6HC MW‐6NP MW‐8‐FHC MW‐8‐FNP MW‐8‐NHC MW‐8‐NNP NCASPF2 NCASQ2 NCP191 NCPPF1 NCQ1 NCTQ NFBMT18 NFEZQ6 (SQ22143‐2) NFEZQ6‐002 NFEZQ8 NFEZQ8‐005 NFEZQ8‐008 NFNRM NFNRQ NO31 NO3AS‐001 NO3AS1 NO3T3‐001 NO3T3PK‐001 NO3T3PK1 NO3T3PKAS‐001 NO3T3PKAS‐005 NO3T3PKAS‐008 NO3T3PKAS1 NO3T3PKASU‐001 NO3T450PK1 NO3T450PKAS1 NOASPF2 NOASQ2 NOP191 NOP191‐003 NOP191‐006 NOPPF1 NOPQ1 NOQ1 NOSASPF2 NOSASQ2 page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page 66 66 66 66 66 66 66 66 96 96 97,128 96 97 97 24 25 25 25 25 25 24 25 98 100 98 117 98 98 98 98 98 98 98 98 98 96 96 97 98 98 96 96 97 96 96 NOSPPF1 NOSPQ1 NOSQ1 NOSTQ NOTQ NRA6 NRA8 NST ODP‐12‐001 ODP‐12‐003 ODP‐18‐001 ODP‐3 ODP‐3‐001 ODP‐3‐003 ODP‐3‐004 ODP‐3‐005 ODP‐3‐006 ODP‐4 ODP‐4‐001 ODP‐4‐005 ODP‐4‐006 ODP‐4‐008 ODP‐5 ODP‐5‐001 ODP‐5‐002 ODP‐6 ODP‐6‐002 ODP‐6‐003 ODP‐6‐004 ODP‐6‐005 ODP‐6‐008 ODP‐6‐009 ODP‐6‐010 ODP‐6‐011 ODP‐8 ODP‐8‐001 ODP‐8‐002 ODP‐8‐003 ODP‐8‐004 ODP‐8‐006 ODP‐8‐007 ODP‐8‐009 ODP‐8‐010 ODP‐8‐011 ODP‐8‐016 page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page 96 96 97 97 97 24 24 131 72 73 72 72 72 72 72 73 73 72 72 72 73 73 72 72 72 72 73 72 72 73 72 72 72 73 72 73 72 73 73 72 72 73 73 73 72 © 2015‐2016 H‐Square
156 Index ODP‐8‐017 PAW PAW‐AS PRA8 PRS4 PRS5/6 PT PTAS1322 PTAS2502 SCHN‐16 SCHN‐16S SCHN‐18 SCHN‐21 SCR‐KEY SDPPS SHB SMIFMAN6 SMIFMAN8 SMIFPO8 SMIFPO6 SMIFPO8‐E‐002 SNHN‐15 SP SP‐3 SP‐4 SP‐6 SPT‐TOR SPT‐V SQ20870‐1 SQ21203‐5 SQ21408‐1 SQ21408‐10 SQ21408‐3 SQ21457‐25 SQ21457‐4 SQ21457‐6 SQ21457‐9 SQ21518‐1 SQ21518‐16 SQ21518‐32 SQ21518‐40 SQ21541‐10 SQ21541‐13 SQ21541‐2 SQ21557‐3 page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page © 2015‐2016 H‐Square 73 139 139 30 30 30 108 108 108 141 141 141 141 134 137 131 48,83 49,83 49 48,82 49,82 141 129 129 129 129 129 129 114 114 80 80 80 76 78 77 76 79 79 79 70 43 43 43 128 SQ21733‐10 SQ21733‐11 SQ21733‐8 SQ21733‐9 SQ22143‐2 SQ22143‐3 SQ22386‐2 SQ22758‐1 SQ22766‐17E SQ22766‐1HC SQ22766‐23EN SQ22766‐23HC SQ22766‐24EN SQ22766‐24HC SQ22766‐25EN SQ22766‐25HC SQ22766‐26P SQ22766‐2EN SQ22766‐31 SQ22766‐37HC SQ22766‐39HC SQ22766‐4E SQ22902‐2 SQ22949‐1 SQ22949‐16 SQ22949‐2 SQ22949‐3 SQ22949‐4 SRC‐25 SRC‐38 SRTAS SSC100 SSC125 SSC150 SSC150‐001 SSC200 SSC200‐004 SSC200‐008 SSC300 SSC50‐001 SSC75‐002 ST‐12KQ ST‐18KQ ST191 page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page 23 25 23 25 25 23 24 61 55 55 55 55 55 55 55 55 55 55 55 55 55 55 128 89 89 89 89 89 140 140 108 53 53 53 53 53 53 53 53 53 53 133 133 128 ST192 ST193 ST194 ST‐2.5KFH ST‐2.5KFHC ST‐2.5KQ ST‐2.5KQC ST‐2.5LFSS ST‐4KQ ST‐6KFH ST‐6KQ ST‐9KQ T37504TOR T37505V T3PK1 T3PKAS1 T450PK1 T450PKAS1 T590PKAS T691PK‐002 T691PKAS T691PKAS1D T691PKAS1U T691PKAS2D T691PKAS2L T691PKAS2R T691PKAS3D T691PKAS3U T691PKAS‐S T692PKAS T692PKAS‐006 T692PKAS1D T692PKAS1U T692PKAS2L T692PKAS2R T692PKAS3D T692PKAS3U T692PKAS‐S T693PKAS T693PKAS‐002 T693PKAS‐003 T693PKAS1D T693PKAS1U T693PKAS2D page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page 128, 133 128, 133 128, 133 133 133 133 133 133 133 133 133 133 126 122 115 115 98 98 114 118 110 110 110 110 110 110 110 110 110 110 114 110 110 110 110 110 110 110 111 111 111 111 111 111 Catalog15‐16.1 157 Index www.h‐square.com T693PKAS2D‐001 T693PKAS2D‐005 T693PKAS2D‐006 T693PKAS2L T693PKAS2R T693PKAS2U T693PKAS3 T693PKAS3‐001 T693PKAS3‐007 T693PKAS3‐008 T693PKAS3D‐001 T693PKAS3S T693PKAS‐S T694PKAS T694PKAS‐001 T694PKAS‐002 T694PKAS3U T694PKAS‐S T695PKAS T695PKAS2D‐001 T695PKAS3D‐001 T695PKAS3D‐002 T695PKAS3U‐001 T695PKAS45D‐001 T696PK T696PK‐001 T75010PKAS T75010TOR T75010V T75025Q T75026V T75028PK T75028TOR T75028V T75033QV T75040TOR T75040V T75042V T75044V T75048TOR T75049TOR T75049V T75050PKAS T75050V T75051PKAS page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page 113 114 114 111 111 111 111 113 114 114 113 111 111 111 111 111 111 111 115 115 115 115 115 115 118 118 119 126 124 121 125 119 127 125 121 127 124 124 123 126 127 123 120 125 120 T75051TOR T75051V T75055V T75065V T75069Q T75070V T75071V T75072PKAS T75072TOR T75072V T75082Q T75083PKAS T75096V T791PKAS T791PKAS‐001 T791PKAS1D T791PKAS2D T791PKAS2R T791PKAS3D T791PKAS3U T792PKAS T792PKAS2D T792PKAS2R T792PKAS3D T794PKAS T794PKAS3D‐001 TC‐19 TC‐25 TC‐2N TC‐31 TC‐38 TC‐3N TC‐44 TC‐50 THF THF‐P TLB TLP25PKAS TT VCAS125 VCAS160 VCAS196 VCAS199 page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page 127 125 123 124 121 122 122 119 126 123 121 119 122 112 112 112 112 112 112 112 112 112 112 112 113 113 140 140 105 140 140 105 140 140 131 131 105 120 106 140 140 140 140 VCAS246 VCAS260 VCAS39 VCAS44 VCAS58 VCC‐010 VCC‐015 VCC‐020 VCC‐040 VCC‐060 VCC‐12 VCC‐19 VCC‐25 VCC‐31 VCC‐38 VTG‐001 VTG‐002 WB5L1‐456 WB5L1‐8 WP18 WP4 WP5 WP6 WPR WPR4‐KIT WPR6‐KIT WPR8‐KIT WS300M WT28HAS WT28HLAS WT2HAS (WT2HAS‐001) WT3456AS WT3HAS WT4HAS WT4HLAS WT5HAS WT5HLAS WT6HAS WT6HLAS page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page page © 2015‐2016 H‐Square
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