Plastic Packages for Integrated Circuits
Package Outline Drawing
Y40.17x19
40 I/O 17.0mm x 19.0mm x 3.55mm HDA MODULE
Rev 3, 4/17
PIN 1 INDICATOR
DATUM A
17.00 BSC
A
SEE DETAIL A
B
1716 1514 13121110 9 8 7 6 5 4 3 2 1
TERMINAL #A1
INDEX AREA
9.00
18.50 ±0.15
0.10 M C A B
19.00 BSC
0.10 C 2X
8.00
0.30 REF
0.10 C 2X
0.30 REF
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
DATUM B
0.20 REF
16.50 ±0.15
0.10 M C A B
TOP VIEW
BOTTOM VIEW
3.55 ±0.5
0.10 C
0.08 C
SIDE VIEW
SEATING
C PLANE
2
1.00 BSC
0.20 REF
0.025 MAX
0.20 REF
3
20 x 0.60 ±0.05
3
20 x 0.60 ±0.05
0.10 M C A B
0.05 M C
1.00 BSC
2
TERMINAL TYP
DETAIL A
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. REPRESENTS THE BASIC LAND GRID PITCH.
3. THE TOTAL NUMBER OF I/O (EXCLUDING DUMMY PADS)
4. UNLESS OTHERWISE SPECIFIED, TOLERANCE: DECIMAL ±0.10
5. DIMENSIONING AND TOLERANCING PER ASME Y14.M-2009
6. THE CONFIGURATION OF THE PIN#1 IDENTIFIER IS OPTIONAL, BUT MUST BE
LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE
EITHER A MOLD OR MARK FEATURE.
Plastic Packages for Integrated Circuits
0.60
2.50
5.10
2X 1.60
0.60
2X 0.60
1.50
1.60
5.10
7.60
1.00
0.60
1.00
4X 1.60
4X
0.80
0.80
1.40
3.30
1.10
1.60
0.60
2.00
0.60
2.00
0.60
2.975
1.35
0.60
4.90
2.70
3.00
8.20
1.50
8.20
1.80
3.05
2.00
3.50
0.70
1.30
3.00
0.70
4.80
5.80
10.00
SIZE DETAILS FOR THE 16 EXPOSED DAPS
BOTTOM VIEW
Plastic Packages for Integrated Circuits
0.60
2.50
5.10
2X 1.60
0.60
2X 0.60
1.50
1.60
5.10
7.60
1.00
0.60
1.00
4X 1.60
1.40
0.80
3.30
1.10
4X
0.80
1.60
2.00
0.60
0.60
2.00
0.60
2.975
1.35
0.60
4.90
2.70
1.50
3.00
8.20
8.20
1.80
2.00
3.05
0.70
1.30
3.00
3.50
0.70
5.80
4.80
10.00
SIZE DETAILS FOR THE 16 EXPOSED DAPS
TOP VIEW
6.700
6.850
7.050
8.200
8.500
5.300
5.700
2.300
2.700
3.300
3.700
4.300
4.700
1.300
1.700
0.700
0.300
0.700
0.300
1.300
2.300
1.700
2.700
6.700
6.300
5.700
5.300
4.700
4.300
3.700
3.300
8.500
8.300
7.700
9.500
9.300
8.700
0.000
Plastic Packages for Integrated Circuits
8.300
7.700
7.300
9.500
9.300
8.700
8.300
7.700
6.700
6.300
5.700
7.300
5.300
4.700
4.300
5.550
5.350
3.700
3.600
3.400
3.300
2.700
1.650
1.450
0.044
0.000
0.400
0.556
1.000
1.400
2.000
2.675
3.275
0.000
0.300
1.000
2.900
3.100
4.025
5.000
5.200
4.625
5.900
5.900
7.100
6.150
7.775
7.300
7.450
7.650
9.200
7.900
9.500
7.575
8.500
9.200
RECOMMENDED SOLDER MASK DEFINED PCB LAND PATTERN (SHEET 1 OF 2)
TOP VIEW
8.500
8.200
6.350
6.550
4.700
3.000
1.600
1.400
1.000
0.200
0.000
1.100
1.600
2.800
2.700
4.400
3.500
3.000
5.100
4.900
5.400
5.350
6.300
5.550
8.500
8.300
7.600
7.400
9.500
6.000
5.200
2.200
0.433
0.633
0.000
1.133
1.333
2.550
2.900
6.300
7.300
Plastic Packages for Integrated Circuits
7.100
6.750
5.533
5.333
7.300
3.767
5.300
5.700
3.700
3.567
3.300
1.700
2.300
2.000
1.700
1.100
0.900
0.300
1.300
0.000
0.000
0.300
0.900
2.500
3.500
3.700
0.000
2.900
4.700
5.300
6.300
6.900
6.700
5.200
RECOMMENDED SOLDER MASK DEFINED PCB LAND PATTERN (SHEET 2 OF 2)
TOP VIEW
9.500
9.280
8.720
8.280
7.720
7.285
8.180
8.500
7.070
5.280
5.720
6.740
6.830
1.285
1.715
2.285
2.715
3.285
3.715
4.285
4.720
0.285
0.715
3.285
2.715
2.285
1.715
1.285
0.715
0.285
0.000
6.285
5.715
5.285
4.285
4.715
3.715
6.720
8.500
8.280
7.715
Plastic Packages for Integrated Circuits
9.500
8.720
8.285
7.720
7.260
6.715
6.285
5.715
5.285
4.715
4.285
3.715
3.285
2.715
5.590
5.310
3.640
3.360
1.690
1.410
0.024
1.040
1.980
2.860
3.140
4.960
5.240
0.000
1.120
2.680
4.420
5.380
5.940
6.320
0.980
1.420
0.000
0.260
0.420
0.536
8.280
0.000
RECOMMENDED STENCIL PATTERN (90% PASTE TO PAD) (SHEET 1 OF 2)
TOP VIEW
7.060
5.970
5.230
2.160
0.673
0.393
1.093
1.373
2.533
2.860
6.330
7.270
7.730
8.270
Plastic Packages for Integrated Circuits
7.270
6.733
5.730
5.573
5.293
5.270
3.807
3.730
3.527
2.270
2.040
1.730
1.070
0.930
0.000
3.270
1.730
1.270
0.270
0.270
0.870
2.530
2.690
3.260
3.470
3.740
4.040
4.610
5.160
5.930
7.420
7.680
1.585
1.370
1.015
0.230
1.630
4.660
2.940
2.770
5.340
6.660
6.330
6.940
8.260
9.170
RECOMMENDED STENCIL PATTERN (90% PASTE TO PAD) (SHEET 2 OF 2)
TOP VIEW