energies Article Aluminum–Titanium Alloy Back Contact Reducing Production Cost of Silicon Thin-Film Solar Cells Hsin-Yu Wu 1 , Chia-Hsun Hsu 2 , Shui-Yang Lien 2, * and Yeu-Long Jiang 1 1 2 * Graduate Institute of Optoelectronic Engineering and Department of Electrical Engineering, National Chung Hsing University, Taichung 40227, Taiwan; [email protected] (H.-Y.W.); [email protected] (Y.-L.J.) Department of Materials Science and Engineering, Da-Yeh University, Changhua 51591, Taiwan; [email protected] Correspondence: [email protected]; Tel.: +886-404-851-1888 (ext. 1760) Academic Editor: Senthilarasu Sundaram Received: 12 August 2016; Accepted: 16 November 2016; Published: 22 November 2016 Abstract: In this study, metal films are fabricated by using an in-line reactive direct current magnetron sputtering system. The aluminum–titanium (AlTi) back contacts are prepared by changing the pressure from 10 mTorr to 25 mTorr. The optical, electrical and structural properties of the metal back contacts are investigated. The solar cells with the AlTi had lower contact resistance than those with the silver (Ag) back contact, resulting in a higher fill factor. The AlTi contact can achieve a solar cell conversion efficiency as high as that obtained from the Ag contact. These findings encourage the potential adoption of AlTi films as an alternative back contact to silver for silicon thin-film solar cells. Keywords: silicon thin-film solar cells; aluminum–titanium (AlTi) alloy; contact resistance 1. Introduction Silicon thin-film solar cells have received much attention, and appear to be promising alternatives to crystalline silicon solar cells, which are dominant in photovoltaic power generation. The main benefits of silicon thin-film solar cells over crystalline silicon solar cells are cost-effective fabrication, compatibility with various flexible substrates, reliable large-area module encapsulation, low temperature coefficient, very low weight per unit power and aesthetic design for building integrated photovoltaic applications [1–3]. To achieve silicon thin-film solar cells with high short circuit currents and conversion efficiencies, the incident light has to be efficiently scattered and diffracted. Conventional solar cells normally achieve light trapping with three methods, a textured front surface, a highly reflective rear reflector and an antireflection coating [4–6]. Silver (Ag) is the conventional metal for back reflectors, but its drawbacks are high price, low adhesion and agglomeration behavior [7–9]. Therefore, researchers are searching for a cheaper alternative. Aluminum (Al) is a good candidate owing to its low price and good adhesion [10], but it has lower reflectance and conductivity than Ag. Metallic impurities such as titanium (Ti), chromium and vanadium can be added to the Al films to improve the thermal stability, conductivity and ohmic contact [11–14]. For this purpose, aluminum–titanium (AlTi) film, which is 1/100 of the cost of Ag, is proposed as a back contact for p-i-n silicon thin-film solar cells. The AlTi thin films are prepared by a direct current (DC) magnetron sputter system. The effects of sputtering pressure on the optical and electrical properties of AlTi films are investigated. Finally, the performance of the solar cells with the AlTi back contact is compared to the device with the traditional Ag contact. Energies 2016, 9, 975; doi:10.3390/en9110975 www.mdpi.com/journal/energies Energies 2016, 9, 975 Energies 2016, 9, 975 2 of 6 2 of 6 2. Experimental 2. ExperimentalDetails Details The AlTi AlTi and and Ag Ag films films were were prepared prepared on on glass glass substrates substrates by by an an in-line in-line reactive reactive DC DC magnetron magnetron The sputtering system UHV Technology Technology Co., Co., Ltd., Ltd., Hsinchu, Hsinchu, Taiwan). Taiwan). The The composition composition of of the the AlTi AlTi sputtering system (LJ (LJ UHV −77 Torr; − target was 99 wt% Al and 1 wt% Ti. The base pressure of the deposition chamber was 5 × 10 target was 99 wt% Al and 1 wt% Ti. The base pressure of the deposition chamber was 5 × 10 Torr; the DC DC power power was was 200 200 W; W; the the argon argon (Ar) (Ar) gas gas flow flow rate rate was was 20 20 sccm, sccm, and and the the substrate substrate was was at at room room the temperature. The to 25 25 mTorr on the the temperature. The dependence dependence of of the the sputtering sputtering pressure pressure changing changing from from 10 10 mTorr mTorr to mTorr on properties of the sputtered AlTi films was investigated. The structure of the a-Si:H thin-film solar properties of the sputtered AlTi films was investigated. The structure of the a-Si:H thin-film solar cell was wasglass/fluorine-doped glass/fluorine-dopedtin tindioxide dioxide (SnO 2:F)/p-a-Si:H/i-a-Si:H/n-a-Si:H/(gallium, Al)-doped cell (SnO 2 :F)/p-a-Si:H/i-a-Si:H/n-a-Si:H/(gallium, Al)-doped zinc oxide oxide(GAZO)/metal (GAZO)/metal back contact. The GAZO was deposited by radiofrequency (RF) zinc back contact. The GAZO was deposited by radiofrequency (RF) magnetron magnetron sputtering with a thickness of 80 nm. The p-, iand n-a-Si:H layers, with a total thickness sputtering with a thickness of 80 nm. The p-, i- and n-a-Si:H layers, with a total thickness of 288 nm, of 288deposited nm, were by deposited by a plasma-enhanced chemical vapor deposition. Theresistance contact resistance were a plasma-enhanced chemical vapor deposition. The contact between between back contact and GAZO was measured using the transmission line model (TLM) back contact and GAZO was measured using the transmission line model (TLM) method method [15–17]. [15–17]. The optical of reflectance of the films with was an measured with an spectrophotometer ultraviolet-visible The optical reflectance the films was measured ultraviolet-visible spectrophotometer (UV-VIS, Hong-Ming Co., Ltd., Taipei, Taiwan). The refractive (UV-VIS, Hong-Ming Technology Co., Ltd.,Technology Taipei, Taiwan). The refractive index was determined index was determined by a spectroscopy ellipsometry. The electrical resistivity was measured using by a spectroscopy ellipsometry. The electrical resistivity was measured using a four-point probe a four-point probe method. The cross-section microstructure of the solar cells was examined by a method. The cross-section microstructure of the solar cells was examined by a scanning electron scanning electron (SEM, JEOL Tokyo, Finally, the microscopy (SEM, microscopy JEOL Ltd., Tokyo, Japan).Ltd., Finally, the Japan). current-voltage (I-V)current-voltage characteristics (I-V) and characteristics and external quantum efficiency (EQE) of the devices were measured by a solar external quantum efficiency (EQE) of the devices were measured by a solar simulator under AM1.5G 2 ) conditions. simulator under AM1.5G (100 mW/cm2) conditions. (100 mW/cm 3. Results Resultsand andDiscussion Discussion of of thethe AlTi films prepared at different pressures. The Figure 1a 1a shows showsthe theoptical opticalreflectance reflectance AlTi films prepared at different pressures. reflectance of the filmsfilms decreases as the increases from from 10 mTorr to 25to mTorr. The The reflectance of AlTi the AlTi decreases aspressure the pressure increases 10 mTorr 25 mTorr. average reflectance at wavelengths of 400–800 nmnm at at 1010 mTorr The average reflectance at wavelengths of 400–800 mTorrisis89.8%, 89.8%,which whichisis about about 7% lower the Ag Ag film. film. The reflectance in the the short short wavelengths wavelengths should have insignificant effects than that of the thesolar solarcell cellperformance, performance, since be nearly absorbed reaching rear on the since the the lightlight will will be nearly absorbed before before reaching the rearthe contact. contact. long wavelengths the AlTi have a reflectance around 85%–88%, For long For wavelengths (650–800 (650–800 nm), the nm), AlTi films havefilms a reflectance of aroundof 85%–88%, while the while Ag film has a reflectance of around 97%.reflectance The lowerof reflectance of the films at higher Ag filmthe has a reflectance of around 97%. The lower the AlTi films at AlTi higher pressure can pressure can be explained by more collision among sputtered atoms and argon ions, lowering be explained by more collision among sputtered atoms and argon ions, lowering the density of the density of films the sputtered [18]. This is also reflected by the measurement of the refractive index, sputtered [18]. Thisfilms is also reflected by the measurement of the refractive index, as shown in as shown Figure 1b. The AlTi filmhas at 10 has the highest refractive index value, Figure 1b. in The AlTi film at 10 mTorr themTorr highest refractive index value, indicating thatindicating it has the that it has thestructure. densest film structure. densest film 100 1.6 90 1.4 Refractive index Reflection (%) 80 70 60 50 40 30 20 10 0 400 Pressure (mTorr) Average R (%) Ag 10 15 20 25 97.5 89.8 88.9 87 84.9 500 600 Ag 10 15 20 25 700 Wavelength (nm) 1.2 1.0 0.8 Ag 10 15 20 25 0.6 0.4 0.2 800 0.0 400 500 600 700 800 Wavelength (nm) (a) (b) Figure 1. (a) Optical reflection and (b) refractive index of aluminum–titanium (AlTi) films prepared Figure 1. (a) Optical reflection and (b) refractive index of aluminum–titanium (AlTi) films prepared with different pressures. with different pressures. Figure 22 shows films prepared with different pressures. It can that showsthe theresistivity resistivityofofAlTi AlTi films prepared with different pressures. It be canseen be seen −6 Ω-cm −6 −6 Ω-cm −6 the resistivity of the AlTi films increases from 7.94 × 10 to 11.8 × 10 with the pressure that the resistivity of the AlTi films increases from 7.94 × 10 Ω-cm to 11.8 × 10 Ω-cm with the pressure increasing from 10 mTorr to 25 mTorr. The AlTi film with a pressure of 10 mTorr has a Energies 2016, 9, 975 3 of 6 Energies 2016, 9, x 3 of 6 increasing from 10 mTorr to 25 mTorr. The AlTi film with a pressure of 10 mTorr has a minimum minimum electrical resistivity, can alsotobe its dense structure. In comparison, the electrical resistivity, and this canand alsothis be linked itslinked densetostructure. In comparison, the resistivity −6 -cm. Overall, the AlTi and Ag films have low resistivity at a − 6 resistivity of the Ag film is 4.13 10 of the Ag film is 4.13 × 10 Ω-cm. Overall, the AlTi and Ag films have low resistivity at a level −6 Ω-cm, level of 10−6 so Ω-cm, their bulk resistance make an insignificant contribution the device total of 10 theirso bulk resistance shouldshould make an insignificant contribution to thetototal device series resistance. series resistance. -6 Resistivity (10 ohm-cm) 15 12 9 6 3 0 Ag 10 20 15 25 Pressure (mtorr) Figure 2.2.Resistivity pressures. Figure ResistivityofofAlTi AlTifilms filmsprepared prepared at at different different pressures. contact quality between the and metal and semiconductor is important when TheThe contact quality between the metal semiconductor device isdevice important when considering considering an electrode material. In this work, the back electrode is covered on the GAZO, so the an electrode material. In this work, the back electrode is covered on the GAZO, so the contact resistance contact resistance c between these two by layers is the determined by using method with the Rc between these twoRlayers is determined using TLM method withthe theTLM following equation [19]: following equation [19]: R ·d (1) Rt = 2Rc + SH ∙ (1) =2 + W where Rt denotes the total resistance between any two contacts (of width W) separated by a distance d, denotes total resistance any two contacts (of widthfrom W) separated byinterception. a distance Rt the andwhere RSH is sheetthe resistance of the between GAZO film. Rc can be obtained the y-axis d, and R SH is the sheet resistance of the GAZO film. R c can be obtained from the y-axis interception. Figure 3 shows Rc as a function of the sputtering pressure, where Rc increases with the increasing −3 Ω) using Figure The 3 shows Rc as R a cfunction of the sputtering Rcthan increases with×the pressure. minimum at 10 mTorr is 3.0 × 10−3 pressure, is lower that (7.84 10increasing Ω, which where −3 −3 pressure. The Rc at 10 mTorr 3.0 × 10 ,with which lowerfunction than that(Φ) (7.84 10 metal Ω) using Ag/GAZO. The minimum contact resistance can beisassociated theiswork of×the films Ag/GAZO. The contact resistance can be associated with the work function () of the metal films andEnergies the adhesion at the contact interface. As the metal films are responsible for collecting electrons 2016, 9, x 3 of 6 the adhesion at theacontact interface.close As the films than are responsible foraffinity collecting electrons in aand device, they require work function to metal or smaller the electron of the GAZO in a device, they require a work function close to or smaller than the electron affinity of the GAZO films [19]. The Ag (Φ resistivity, = 4.26 eV) and andthis AlTican (Φalso = 4.28 eV) films all available work functions minimum electrical be linked to itsare dense structure.with In comparison, the films [19]. The Ag ( = 4.26 eV) and−6 AlTi ( = 4.28 eV) films are all available with work functions lower than GAZO 4.45iseV) to achieve the n-type ohmic contact. Consequently, the resistivity adhesion factor, resistivity of the(Φ Ag=film 4.13 10 -cm. Overall, the AlTi and Ag films have low at a lower than−6GAZO ( = 4.45 eV) to achieve the n-type ohmic contact. Consequently, the adhesion levelthan of 10 so their bulk resistance should for make insignificant contribution to the total rather the Ω-cm, work function, might be the reason thean lower contact resistance of the AlTi film factor, rather than the work function, might be the reason for the lower contact resistance of the device series compared to theresistance. Ag film. AlTi film compared to the Ag film. -6 -3 Resistivity (10 (10 ohm-cm) Contact resistance ohm) 15 7 12 6 9 5 4 6 3 32 1 0 Ag 0 Ag 10 10 20 15 25 25 Pressure15(mtorr) 20 Pressure (mtorr) Figure 3. Contact resistance for metal/GAZO functionpressures. of sputtering pressure. Figure 2. Resistivity of AlTi filmsinterface preparedasatadifferent Figure 3. Contact resistance for metal/GAZO interface as a function of sputtering pressure. The 4contact betweenof the metal cells and with semiconductor device is important when Figure shows quality the I-V curves the solar AlTi back contacts prepared at different Figure 4 shows the I-V curves of the solar cells with AlTi back contacts prepared at different considering an electrode material. In this work, the back electrode is covered on the GAZO, so the pressures. Table 1 summarizes the photovoltaic parameters of the solar cells such as open-circuit pressures. Table 1 summarizes the photovoltaic parameters of the solar cells such as open-circuit contact resistance Rc between these two layers is factor determinedand by conversion using the TLM method(η). with voltage (V oc efficiency Thethe oc voltage (V),ocshort-circuit ), short-circuitcurrent currentdensity density(J(Jscsc),), fill fill factor (FF) (FF) and conversion efficiency (η). The VV oc following values do notequation change[19]: significantly for all the AlTi and Ag films. Jsc and FF both decrease with the =2 + ∙ (1) where Rt denotes the total resistance between any two contacts (of width W) separated by a distance d, and RSH is the sheet resistance of the GAZO film. Rc can be obtained from the y-axis interception. Energies 2016, 9, 975 Energies 2016, 9, 975 Energies 2016, 9, 975 4 of 6 4 of 6 4 of 6 voltage (Voc), short-circuit current density (Jsc), fill factor (FF) and conversion efficiency (η). The Voc values not change significantly for all the and Ag films. sc and FF both decrease with the voltagedo (Voc ), short-circuit current density (Jsc),AlTi fill factor (FF) and Jconversion efficiency (η). The Voc increasing pressure, due totothe reduced reflectance and increasedresistivity, resistivity,respectively. respectively.The The cell increasing pressure, due the reduced reflectance and increased cell values do not change significantly for all the AlTi and Ag films. Jsc and FF both decrease with the with the AlTi deposited at 10 mTorr has the highest conversion efficiency of 8.15% with V = 0.84 with the AlTi deposited mTorr has the highest conversion efficiency of 8.15% with Voc oc =The 0.84cell V, V, increasing pressure, dueatto10the reduced reflectance and increased resistivity, respectively. 2 2 and Jsc Jwith =sc 13.7 mA/cm == 10 0.71. Thishas conversion efficiency value evenhigher higher than that of0.84 the cell = 13.7 mA/cm and FF FFat This conversion efficiency value isiseven than that cell the AlTi deposited mTorr the highest conversion efficiency of 8.15% with Vocof=the V, with the Ag film, owing to the greater FF compensating for the lower J . with the Ag film, owing to the greater FF compensating lower J sc . sc Jsc = 13.7 mA/cm2 and FF = 0.71. This conversion efficiency value is even higher than that of the cell with the Ag film, owing to the greater FF compensating for the lower Jsc. 2 2 Current density (mA/cm Current density (mA/cm ) ) 15 15 12 12 9 Ag 10 Ag 15 10 20 15 25 20 25 9 6 6 3 3 0 0.0 0 0.0 0.2 0.4 0.6 0.8 1.0 0.8 1.0 Voltage (V) 0.2 0.4 0.6 Voltage Figure 4. 4. I-V AlTi back(V) contactsprepared preparedatatdifferent differentpressures. pressures. Figure I-Vcurves curvesofofp-i-n p-i-nsolar solar cells cells with with AlTi back contacts Figure 4. I-V curves of p-i-n solar cells with AlTi back contacts prepared at different pressures. Table 1. 1.Performance at different differentpressures. pressures.FF: FF:fill fillfactor. factor. Table Performanceofofp-i-n p-i-nsolar solar cells cells prepared at Table 1. Performance of p-i-n Vsolar cellsJscprepared oc (V) (mA/cm2at ) different ηpressures. (%) Roc FF: (Ω) fill factor. Pressure (mTorr) FF V oc (V) Pressure (mTorr) Jsc (mA/cm2 ) Ref. Ag oc (V) Pressure (mTorr) 0.84 V0.84 Ag 10 0.84 Ref. Ag 0.84 10 0.84 15 0.84 15 10 0.840.84 20 20 15 0.840.84 0.84 25 25 0.840.84 20 0.84 25 0.84 13.93 2) Jsc (mA/cm 13.93 13.70 13.93 13.70 13.31 13.70 13.31 13.05 13.05 13.31 12.68 12.68 13.05 12.68 FF 0.68 FF 0.68 0.71 0.68 0.71 0.71 0.71 0.71 0.71 0.71 0.71 0.69 0.69 0.71 0.69 η (%) Roc (Ω) η8.03 (%) R106.0 oc (Ω) 8.158.03 74.0 106.0 8.038.15 106.074.0 7.99 82.3 8.157.99 74.0 82.3 7.827.82 88.4 88.4 7.99 82.3 7.387.38 99.1 99.1 7.82 88.4 7.38 99.1 External Quantum Efficiency External Quantum Efficiency (%) (%) Figure 5 shows the EQE curves of the p-i-n silicon thin-film solar cells with AlTi back contacts Figure 5 shows the EQE curves of the p-i-n silicon thin-film solar cells with AlTi back contacts prepared at 5different pressures. The EQE values similar in the solar short-wavelength region Figure shows the EQE curves of the p-i-n are thin-film cells with AlTi back(400–550 contacts prepared atalldifferent pressures. The EQE values areissilicon similar in the short-wavelength region (400–550 nm) nm) in cases, as the short-wavelength light nearly completely absorbed before reaching the prepared at different pressures. The EQE values are similar in the short-wavelength region (400–550 in back all cases, as the light is nearly completely absorbed reaching the back contact. Theshort-wavelength in the long-wavelength with thebefore increasing deposition nm) in all cases, asEQE the short-wavelength light isregion nearly decreases completely absorbed before reaching the contact. The EQE in the long-wavelength region decreases with the increasing deposition pressure. pressure. The cell with the Ag back contact has the highest long-wavelength EQE response, due to back contact. The EQE in the long-wavelength region decreases with the increasing deposition The cell withreflectance. the Ag back contact has the highest long-wavelength EQE response, due to the higher the higher Comparing the best AlTi film (at 10 mTorr) to the Ag film, the lower EQE of pressure. The cell with the Ag back contact has the highest long-wavelength EQE response, due to reflectance. Comparing best AlTi film (at loss 10 mTorr) to the Ag film, the lower EQE of back the AlTi back contact the only leads tothe a 1.6% in Jsc.(at Therefore, into combination thethe IVAlTi result, the higher reflectance. Comparing best AlTi film 10 mTorr) the Ag film,with the lower EQE of contact only leads to a 1.6% loss in J . Therefore, in combination with the IV result, the present study the present study shows that the reduction in the contact resistance is more helpful than the sc a 1.6% loss in Jsc. Therefore, in combination with the IV result, the AlTi back contact only leads to shows that the study reduction in surface the resistance is more helpful thancell the improvement in the back improvement in theshows back for theresistance solar The AlTi back the present thatcontact thereflectance reduction in increasing the contact isefficiency. more helpful than the contacts demonstrate high potential for application in thin-film solar cells. surface reflectance for increasing the solar cell efficiency. The AlTi back contacts demonstrate high improvement in the back surface reflectance for increasing the solar cell efficiency. The AlTi back potential for application in thin-film solar cells. contacts demonstrate high potential for application in thin-film solar cells. 80 70 80 60 70 50 60 40 50 30 40 20 30 10 20 0 10 400 0 400 Ag 10 Ag 15 10 20 15 25 20 25 500 600 Wavelength (nm) 500 600 700 800 700 800 Wavelength Figure 5. External quantum efficiency (EQE) curves of(nm) p-i-n solar cells with Ag and AlTi films prepared at different pressures. Figure 5. External quantum efficiency (EQE) curves of p-i-n cells Ag with Ag andfilms AlTiprepared films Figure 5. External quantum efficiency (EQE) curves of p-i-n solar solar cells with and AlTi prepared at different pressures. at different pressures. Energies 2016, 9, 975 Energies 2016, 9, 975 5 of 6 5 of 6 Figure 6 illustrates the cross-section cross-section SEM SEM image image of of the the solar solar cells cells with with the the AlTi AlTi back back contact. contact. The textured SnO SnO22:F, :F, in in order orderto toscatter scatterlight lighttotoincrease increasethe thelight lighttraveling traveling path absorber, path in in thethe absorber, is is observed. The thicknesses therough roughSnO SnO thickfilm filmand anda-Si:H a-Si:Hdevice deviceare are800 800nm nmand and 280 280 nm, nm, observed. The thicknesses ofofthe 2:F thick 2 :F respectively. The The interfaces interfaces in in the the solar solar cells cells closely closely follow follow the the surface surface profile profile of of the SnO22:F :F layer. layer. The thin, ofof about 8080 nmnm is clearly seen on on the the a-Si:H, andand the thin, crystalline crystallineGAZO GAZOlayer layerwith witha athickness thickness about is clearly seen a-Si:H, AlTi film film is covered at theattop. the back could lead voids cracks the valleys the AlTi is covered theSputtering top. Sputtering the contact back contact couldtolead toor voids or at cracks at the or mountains of the textured butsurface, those are notthose observable the interface. confirms valleys or mountains of thesurface, textured but are notat observable at This the result interface. This that good adhesion coverage of and the AlTi film lead to good contact properties betweenproperties AlTi and result confirms thatand good adhesion coverage of the AlTi film lead to good contact GAZO films. between AlTi and GAZO films. Figure 6. Cross-section scanning electron microscopy (SEM) image of p-i-n silicon thin-film solar cell with AlTi AlTi back back contact. contact. 4. Conclusions Conclusions the back contact of p-i-n silicon thin-film solar cells are In this study, low-cost AlTi films as the prepared. The films achieved a high average reflectance 90% in the wavelength range of 400–800 prepared. The films achieved a high average reflectance of of 90% in the wavelength range of 400–800 nm, − 6 −6 nm, and a low resistivity of × 7.910× 10 Ω-cm Ω-cmcould couldbebeobtained. obtained.The Theoptimal optimal AlTi AlTi back back contact contact has a and a low resistivity of 7.9 short-circuit current current density densityof of13.7 13.7mA/cm mA/cm22, which is slightly slightly lower lower than than the the13.93 13.93mA/cm mA/cm22 obtained short-circuit the Ag Agback backcontact. contact.However, However,the the AlTi back contact a factor fill factor of 0.71, which is higher from the AlTi back contact hashas a fill of 0.71, which is higher than than0.68 thefor 0.68 Agcontact. back contact. theback AlTicontact back contact performs as back the Ag back the thefor Agthe back Thus, Thus, the AlTi performs as well as as well the Ag contact. contact. In conclusion, AlTi metalare alloys are a promising alternative to Agasmetal as contact a back contact for In conclusion, AlTi metal alloys a promising alternative to Ag metal a back for silicon silicon thin-film solar cells. The AlTi back can contact can low achieve low high cost and high efficiency. Future thin-film solar cells. The AlTi back contact achieve cost and efficiency. Future work will work willthe examine the use AlTi for high-efficiency Si-based tandem examine use of AlTi forof high-efficiency Si-based tandem solar cells. solar cells. Acknowledgments: Acknowledgments: This work is sponsored by the Ministry of Science and Technology of the Republic of China under under contract contract No. Nos.105-2632-E-212-001105-2632-E-212-001-and and104-2221-E-212-002-MY3. 104-2221-E-212-002-MY3. Author Contributions: Hsin-Yu Wu and Shui-Yang Lien designed the experiments; Hsin-Yu Wu performed the Author Contributions: Hsin-YuHsin-Yu Wu andWu, Shui-Yang LienHsu, designed the experiments; Hsin-Yu Wu performed experiments and measurements; Chia-Hsun Shui-Yang Lien and Yeu-Long Jiang analyzed the the experiments and measurements; Hsin-Yu Wu, Chia-Hsun Hsu, Shui-Yang Lien and Yeu-Long Jiang results; Hsin-Yu Wu and Chia-Hsun Hsu wrote the paper. analyzed the results; Hsin-Yu Wu and Chia-Hsun Hsu wrote the paper. Conflicts of Interest: The authors declare no conflict of interest. Conflicts of Interest: The authors declare no conflict of interest. References References 1. 1. 2. 2. Liu, H.; Huang, Q.; Hou, G.; Jiao, B.; Wang, G.; Zhang, W.; Zhang, D.; Zhao, Y.; Zhang, X. Cost-effective Liu, H.;honeycomb Huang, Q.; textured Hou, G.;back Jiao,reflector B.; Wang, Zhang, W.; Zhang, Zhao, Y.; Zhang, X. Sol. Cost-effective hollow forG.; flexible thin film solar D.; cells. Sol. Energy Mater. 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