TSLP-2-19, -20
Package Outline
Top view
Bottom view
0.31 +0.01
-0.02
0.6 ±0.05
2
1±0.05
0.65 ±0.05
0.05 MAX.
1
0.25 ±0.035 1)
0.5 ±0.035 1)
Pin 1
marking
1) Dimension applies to plated terminals
Foot Print
0.35
0.28
0.38
0.93
0.3
1
Copper
0.28
0.45
0.35
0.6
Solder mask
Stencil apertures
Marking Layout
Type code
12
Pin 1 marking
Tape and Reel
Reel ø180 mm: 15.000 Pieces/Reel
Reels/Box:
1
0.4
8
Pin 1
marking
1.16
4
0.76
Package Information
Published by Infineon Technologies AG