Technical Data 4368
Effective May 2017
Supersedes June 2009
HCP0605
High current power inductors
Applications
•
•
•
•
•
•
•
•
Surface Mount Device
Environmental data
•
Product features
•
•
•
•
•
•
High current carrying capacity, high permeability
Magnetically shielded, low EMI
Frequency range up to 1 MHz
5.3 mm x 6.1 mm footprint surface mount
package in a 4.95 mm height
Iron powder core material
Halogen free, lead free, RoHS compliant
Voltage Regulator Module (VRM)
Multi-phase regulators
Desktop and server VRMs and EVRDs
Point-of-load (POL) modules
Notebook regulators
Data networking and storage systems
Graphics cards
Battery power systems
•
•
Storage temperature range (component):
-40 °C to +125 °C
Operating temperature range: -40 °C to +125 °C
(ambient plus self-temperature rise)
Solder reflow temperature:
J-STD-020 (latest revision) compliant
Pb HF
FREE
HALOGEN

Technical Data 4368
Effective May 2017

Product Specifications
5
Part Number
HCP0605-R10-R
OCL1
FLL2
µH ± 15%
0.095
µH Minimum
0.06
Irms3
(A)
53
1 Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.10 Vrms, 0.0 Adc
2 Full Load Inductance (FLL) Test Parameters: 100 kHz, 0.1 Vrms, Isat
3 Irms: DC current for an approximate ΔT rise of 40 °C without core loss. Derating is
necessary for AC currents. PCB layout, trace thickness and width, air-flow and proximity of other
heat generating components will affect the temperature rise. It is recommended the part
temperature not exceed +125 °C under worst case operating conditions verified in the end
application.
Isat4
(A) @25 °C
20
DCR mΩ@ 20 °C
Maximum
0.40
K-factor4
120.5
4 Isat: Peak current for approximately 30% rolloff at +25 °C.
5 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI, Bp-p: (Gauss),
K: (K-factor from table), L: (inductance in μH), ΔI (peak-to-peak ripple current in amps).
6 Part Number Definition: HCP0605-xxx-R
• HCP0605 = Product code and size
• xxx= Inductance value in μH, R = decimal point.
• “-R” suffix = RoHS compliant
Dimensions - mm
T op V iew
F ro nt V iew
B otto m V iew
R eco m m e nded P ad Layout
S ch em atic
1.0 min
1
1
H C P 0 605
xxx
w w llyy R
4 .7 3
± 0 .22
5 .8 5
± 0 .25
2
1.6 0 (2x)
2
1 .8 0
± 0 .25
5 .1 0
± 0 .20
Part Marking: HCP0605
6.5
2.4 0 (2x)
(2 x)
xxx = Inductance value. in uH, (R = Decimal point)
wwllyy = Date code
R = Revision level
Packaging information - mm
1.5 dia
4.0
2.0
A
1.5 dia
7.5
6.2
5.0
HCP0605
xxx
wwllyy R
5.35
Section A-A
User direction of feed
Supplied in tape-and-reel packaging, 1000 parts per reel, 13” diameter reel.
2
www.eaton.com/electronics
A
12.0
1.75
16.0
± 0.3
HCP0605 High current power
inductors
Technical Data 4368
Effective May 2017
Temperature rise vs. total loss
80
T em p eratu re R ise (°C )
70
60
50
40
30
20
10
0
0
0.3
0.6
0.9
1.2
1.5
1.8
T otal Loss (W )
Core loss vs Bp-p
1000
1M H z
500kH z
300kH z
200kH z
100kH z
100
C ore Loss (W )
10
1
0.1
0.01
0.001
0.0001
0.00001
10
100
1000
10000
Bp- p (G au ss)
Inductance characteristics
% of O C L v s ID C
100%
90%
80%
% of OCL
70%
60%
50%
40%
30%
20%
10%
0%
0
5
10
15
20
25
30
35
ID C (Am p s )
www.eaton.com/electronics
3
HCP0605
High current power inductors
Technical Data 4368
Effective May 2017
Solder Reflow Profile
TP
TC -5°C
Temperature
TL
25°C
Preheat
A
T smax
Table 1 - Standard SnPb Solder (Tc)
tP
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
t
Volume
mm3
<350
235°C
220°C
Package
Thickness
<2.5mm
_2.5mm
>
Volume
mm3
_350
>
220°C
220°C
Table 2 - Lead (Pb) Free Solder (T c)
Tsmin
Package
Thickness
<1.6mm
1.6 – 2.5mm
>2.5mm
ts
Time 25°C to Peak
Volume
mm3
<350
260°C
260°C
250°C
Volume
mm3
350 - 2000
260°C
250°C
245°C
Volume
mm3
>2000
260°C
245°C
245°C
Time
Reference JDEC J-STD-020
Profile Feature
Preheat and Soak
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
Standard SnPb Solder
100°C
Lead (Pb) Free Solder
150°C
150°C
200°C
60-120 Seconds
60-120 Seconds
3°C/ Second Max.
3°C/ Second Max.
183°C
60-150 Seconds
217°C
60-150 Seconds
Table 1
Table 2
20 Seconds**
30 Seconds**
6°C/ Second Max.
6°C/ Second Max.
6 Minutes Max.
8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2017 Eaton
All Rights Reserved
Printed in USA
Publication No. 4368 EE-PCN16018
May 2017
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.