AIDA Infrastructure for very
forward calorimeters
Mechanical Design adapted to the
existing electronic
Designers:
Eric David
Adrien Varlez
In collaboration with:
François-Xavier Nuiry
1
Tungsten commissioning
• Main supplier: Cime Bocuse (Plansee)
• We should try other suppliers
Proposal:
Magnetism
Tungsten min
W 99.97%
Densimet
W min 90%
Inermet
W min 90%
Paramagnetic
ferromagnetic
Paramagnetic
Ni + Fe
Ni + Cu (0%Fe)
Other components
ρ
19.3
from 17 to 18.8
from 17 to 18.0
Ability to machine
Hard
Nearly like steel
Good machinability
Cost / Kg
~770€(standard plate)
~15510 € for 30 plates
Cost after machining
At CERN
Cost after machining
At Cime Bocuse
3500€ for 1 machined plate
45000€ for 30 machined plates
3492€ for 4 machined plates
2
Requirements
•
A=3.5±0.5mm
B=0.32±0.015mm
C=2, 1, or 0.5 ±0.05mm
D=not really important
Impossible with this electronic
60
3
What we can do:
C=2mm
 We work with an offset of 5.5mm
C=1mm
 We work with an offset of 4.5mm
A=3.5
A=3.5
Distance before next
tungsten
Distance before next
tungsten
BEAM
Tungsten plate
125*145
C=2
C=5.5
Tungsten plate
125*145
C=1
C=4.5
4
What we can do with C=2mm:
 We work with an offset of 5.5mm
Electronic board
Electronic board
Electronic board
~10.5
~10.5
~10.5
~2.5
~2.5
~2.5
Sensor
Sensor
Sensor
A=3.5
BEAM
Tungsten plate
125*145
C=2
C=5.5
No sensor In
this gap
C=5.5
C=5.5
No sensor In
this gap
C=5.5
C=5.5
No sensor In
this gap
C=5.5
C=5.5
No sensor In
this gap
5
What we can do with C=2mm:
 We work with an offset of 5.5mm
Electronic board
Electronic board
Electronic board
Electronic board
~10.5
~10.5
~10.5
~2.5
~2.5
~2.5
Sensor
Sensor
A=3.5
BEAM
Sensor
Tungsten plate
125*145
C=2
C=5.5
No sensor In
this gap
C=5.5
C=5.5
No sensor In
this gap
C=5.5
C=5.5
C=5.5
No sensor In
this gap
C=5.5
No sensor In
this gap
C=5.5
6
What we can do with C=1mm:
 We work with an offset of 4.5mm
Electronic board
Electronic board
Electronic board
~10.5
~10.5
~10.5
A=3.5
~2.5
~2.5
~2.5
Sensor
Sensor
Sensor
BEAM
C=1
Tungsten plate
125*145
C=4.5
No sensor In
this gap
C=4.5
No sensor In
this gap
C=4.5
C=4.5
C=4.5
No sensor In
this gap
C=4.5
C=4.5
C=4.5
C=4.5
No sensor In
No sensor In
this gap
this gap
7
New mechanical design
• Multi-parts structure ST0362847
Able to work with C=2mm and 1mm
Not for the C=0.5mm version
212mm
220mm
78mm
255mm
192mm
240mm
368mm
Former design
200mm
Main structure:
New design= new dimensions
8
The existing electronic board, in the permaglass
frame
Permaglass
frame
PCB Board
9
The existing electronic board, in the permaglass frame
10
The holder of the tungsten
Tungsten
Permaglass
frame
11
Tungsten holder:
Some details
12
Next Step...
13
What we’ve already realised in the past:
For the same application:
Rigid circuits
Flexible read out electronics (Kapton)
Silicon sensor
Flexible part
Connector for
the read out
Top view
Rigid part (PCB)
14