LGA Package
12-Lead (2mm × 2mm × 0.75mm)
11
PAD “A1”
CORNER
7
12
10
4
SEE NOTES
1
b
D
F
D1
X
6
Y
E
aaa Z
DETAIL C
DETAIL C
DETAIL B
PACKAGE TOP VIEW
Z
// bbb Z
2×
0.2500
0.0000
0.2500
DIMENSIONS
PACKAGE
OUTLINE
0.25 ±0.05
0.7500
2.50 ±0.05
0.75
0.75
0.70 ±0.05
0.2500
0.0000
0.2500
0.7500
2.50 ±0.05
SUGGESTED PCB LAYOUT
TOP VIEW
MIN
0.66
0.02
0.22
0.16
0.50
NOM
0.75
0.03
0.25
2.00
2.00
0.50
1.50
0.50
0.75
0.75
0.20
0.55
PACKAGE BOTTOM VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
DETAIL A
SYMBOL
A
A1
b
D
E
e
F
G
D1
E1
H1
H2
aaa
bbb
ccc
ddd
eee
fff
5
G
e/2
e
12b
eee M Z X Y
fff M Z
DETAIL B
e
E1
H1
H2
3
4
7
Z
SUBSTRATE
MOLD
CAP
SEE NOTES
0.250
6
e
A1
PIN 1 NOTCH
0.25 × 45°
ccc M Z X Y
aaa Z
DETAIL A
b
ccc M Z X Y
A
12×
2×
ddd Z
(Reference LTC DWG # 05-08-1530 Rev Ø)
MAX
0.84
0.04
0.28
0.40
2. ALL DIMENSIONS ARE IN MILLIMETERS
3
METAL FEATURES UNDER THE SOLDER MASK OPENING NOT SHOWN
SO AS NOT TO OBSCURE THESE TERMINIALS AND HEAT FEATURES
4
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE
LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER
MAY BE EITHER A MOLD OR MARKED FEATURE
NOTES
5. PRIMARY DATUM -Z- IS SEATING PLANE
6
7
0.24
0.60
0.10
0.10
0.08
0.10
0.15
0.08
TOTAL NUMBER OF LGA PADS: 12
THE EXPOSED HEAT FEATURE MAY HAVE OPTIONAL CORNER RADII
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTXXXXXX
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
LGA 12 0316 REV Ø