TOMEI DIAMOND
TOMEI DIAMOND
Corporate Guidance
Prospecting Future Technology in Diamonds ...
While it is a jewel of irresistible brilliance, Diamond reigns over every earthly substance with the
fruit of 4.6 billion year-long dynamism: excellent properties in hardness, heat conductivity,
electrical insulation and corrosion resistance.
Such properties present many possibilities and offer great roles that diamond can play in various
sectors of the industry: a new material for the 21st century indispensable to the industry, for
machining ceramic and carbide materials and for electronic device material.
Ever since we succeeded in the commercial production of diamond for the first time in Japan in
1961 we have been searching possibilities for a greater future we prospect in these tiny but pretty
particles of diamond.
Tomei Diamond for a Global Service
Oyama Plant, our production site for the diamond products
The Oyama plant is situated in Oyama, Tochigi (Japan), a city that is located about 80 km off
from Tokyo and is accessed by a 45-minutes ride in Shinkansen. The city has grown and long
has been flourishing as a hub in a northern Tokyo suburb at an important position for traffic
where two major national highways intersect, one running south to north (Route 4) and the
other west to east (Route 50). This is a very good place for us to steadily supply our
customers in Japan and worldwide our diamond, indispensable material to the support
nowadays advanced technology industry. Our researches are going on night and day with up
to date equipment in order to supply quality diamond of various kinds and grades that
customers need.
New Crystallization
You may know that diamond and graphite both are carbon
crystals, so you may have wondered why diamond is colorless
and transparent with the highest hardness in all the substance,
while graphite is black and soft, even to be good for making
pencil leads.
It is because the crystals have different structures. The model of
graphite crystal structure on the right (top) shows that carbon
atoms are arranged in a layer of planar hexagonal honeycomb
lattice. Since the bond between adjacent carbon atoms in each
lattice is very strong, so much than that between neighboring
planes that the stack, when a thrust is given in the direction of the
planes causes a slippage between them, resulting in a deformation
or chipping.
The layer boundaries also block the passage of visible light to
give a black appearance.
Diamond, on the other hand, has a three-dimensional structure, in
which adjacent carbon atoms are firmly bonded to each other
with four hands to form a tetragonal arrangement with each atom
at the center of gravity. The strong bonds give extreme resistance
to deformation or high hardness.
The diamond crystal does not absorb visible light waves and so
develops no color.
The hardest substance on the earth means that you can cut or
grind every other substance with it, and gives expansive
possibilities of applications to the industry.
To give a few familiar examples diamond is used as or in a cutter
for glasses, pavement and ceramic tiles, and dentist’
s drills.
Diamond has been and is working to the support of your everyday
life by processing various materials including stones, plastics,
ceramics and nonferrous metals, as a hidden hero at various
occasions from work sites through the processing of IC materials
sites, although you may not notice it in the everyday life.
Diamond was for the first time synthesized by human in 1955,
creating a high pressure and high temperature condition within a
reaction cell that is close to that deep in the ground.
Synthetic diamond consumption is increasing every year with the
technology development and as applications expand, and
accounts for the most part of diamond consumption in the
industry these days.
model of graphite crystal structure
model of diamond crystal structure
mesh sizes diamond
Diamond Abrasives Production
Diamond Sintering Process
Diamond Powder
Carbide Substrate
Diamond Synthesis Process
Steels
Hard Alloy
Materials
Ceramics
Materials
Graphite Metal
Forming
Mixing
Reaction Assembly
Machining
Firing
Firing
Die
Punch
Reaction Assembly
HP, HT Reaction
(6GPa, 1400℃)
Conversion to Diamond
Chemical Treatment
Cutting
Density Separation
Sieving
Shape
Separation
Polishing
Elutriation
Sieving
Metal Coating
Sintered Diamond Tips
Sintered Diamond (Polycrystalline Diamond(PCD))
Micron-Sized Diamond
Coated Diamond
Diamond Particles
Mesh-Sized Diamond
Profile of Tomei's Diamond Abrasives
for Wide-Ranging Tool Applications
We are ready to serve our customers with a lot of grades of synthetic diamond by shapes,
colors, coatings, etc. to meet their highest demands to satisfaction.
Diamond provides various possibilities
with its outstanding properties
Nuclear Radiation
Resistivity
Sensor arrays for X-,γ-rays and
particle beam
Radiation ‒resistant element
Radiation sensor
Transparency
IRV
Photoresistor
Photoelectric sensors
Piezoresistance
Light Element
Construction
Optical windows
Lens protective film
Light Emitting Diode
Laser
High-temperature pressure sensor
Ultrasound diaphragm
X-ray permeable window
X-ray mask
Wide Band Gap
High dielectric voltage diode
IRV-NP
Heat-resistant element
High Energy
O
c
i
Beam
p
P t
n s
Color Center
ro ic
Resistivity
ro tie
variable wavelength
t
a
p
r
solid- state lasers
er l
Low Dielectricity
ec pe
Optical memory element
l
ti
High electron mobility
o
E r
es
semiconductor
P
HF element
High Thermal
Conductivity
Biocompatibility
VLSI substrates
Surgical knife,
dentist’
dentist’
s tool materials
T
Prherm
op al
Low Expansibility
er
tie
Short wavelength radiation
s
optical elements
IRV-3
Corrosion
Resistance
l
Environment-resistant
icaies sensors,
m
container, pipes
t
e
Choper Chemical
Resistance
Pr
Chemical-resistant
sensors,
container, pipes
Heat Resistance
Very heat resistant material
in inert atmosphere
High Rigidity
Diamond tools
IRV-3NEP
Ac
Pr ous
op tic
ert
ies
al
nices
a
ch rti
Merope
Wear Resistance
Protective coating for
P
High Speed of Sound
Ultrasound generator/
transmitter element
Ultrasound diaphragm
magnetic storage medium
Low Friction coefficient
HF Transmissibility
Parts of high-precision machinery
surface acoustic-wave
element for mobile
wireless communicator
IRV-3CPS
IMS-15
IMS
IMG
IRM
Here are a few examples of how diamond
and CBN abrasives are used:
Tools using diamond and CBN
metal-bond wheel
machinery, metal working
hard alloy working
camera and watch making
glass and ceramic industries
electronics industy
resin-bond wheel
vitrified bond wheel
as separate particles
and held in a tool body
segment wheel
stone, ceramics and construction materials
electroplated wheel
jig and other tools grinding, semiconductor polishing
electronics industry and metal working
diamond wire saw
sapphire, silicon, SiC and quartz working
diamond drill bit
mining, engineering, construction, boring, etc.
diamond core drill
mining, engineering; glass, fire bricks and concrete working
others
abrasive paste preparation, hard alloy works and die polishing
Nanometer diamond
particles are used in/for
Tools with sintered diamond or
CBN are used in/for:
Tools with sintered
diamond or
CBN are used in/for:
grinding of non-ferrous and ferrous metals, wood, ceramics,
plastics, hard-grinding materials, and as die and other
wear-resistant part materials
Diamond and CBN Tools Production in Japan (2013)
Diamond Slicing Blades 6%
Diamond Others 7%
Diamond griding Wheels 33%
Diamond dressers 7%
Diamond Segmented Tools 9%
CBN Tools Total 26%
Diamond Turning &Milling 12%
Transition in Production of Diamond and CBN Tools in Japan
（M.Yen）
110,000
100,000
90,000
80,000
70,000
60,000
50,000
40,000
2007
2008
2009
2010
2011
(source: "Statistics on Diamond and CBN Tools", IDAJ)
2012
2013
Diamond and CBN Abrasive Products
Diamond Particles: Micrographs and Size Distribution
IRM 8-16 (Avg. Size: 9.2 µm)
rel. freq. (%)
MD500 (Avg. Size: 500 nm)
cumul. freq. (%)
rel. freq. (%)
cumul. freq. (%)
20
100
25
100
16
80
20
80
12
60
15
60
8
40
10
40
4
20
5
20
0
0.1
0
10
100
0
1000
0
0.001
0.01
0.1
Particle Size (µm)
0
10.0
1.0
Particle Size (µm)
CBN Abrasive Products
CBN (cubic boron nitride), second hardest substance after diamond, effectively cuts and grinds ferrous materials,
which erode diamond.
ISBN
ISBN-V
ISBN-R
ISBN-V2
Diamond and CBN Abrasive Powder Products
Diamond Powders
IRM
micron sizes
IRM - NP
IRM - NP30
IRM - CPS
IRM -Ti2
IRM - F
IMM - H
IMM - HNP30
IMM -HTi2
HM
TED-MⅡ
IMM-HE
CBN Powders
MD
submicron
sizes
micron sizes
ISBN - M
ISBN - MNP
ISBN - MTi2
ISBN
ISBN - NP
ISBN - R
ISBN - RNP
ISBN - V
ISBN - VNP
PM
TMS
mesh sizes
IMS -10
IMS -15
IMS - 20
ISBN - V2
IMS - 25
ISBN - E
IMS - H
ISBN - P
IMS
IMG
IMG- NP
IMG- NP30
mesh sizes above, Ti coated
TED
TED - II
mesh sizes
TED - S
IRV
IRV- NP
IRV- NP30
IRV- NEP
IRV - 3
IRV-3NP
IRV-3NP30
IRV-3NEP
mesh sizes above, Ti coated
Uses, such as:
with micron size diamond:
dicing blades
coated mesh size:
diamond wheels
with micron size diamond:
pastes
mesh size diamond:
electroplated mounted wheels
with micron size diamond:
diamond wires
mesh size CBN:
cup-type wheel
Poly Crystalline Diamond and Poly Crystalline CBN Products
PCD
TDC grades
EM・EⅡM・HM・SM・GM・98FⅡM・FM・VM・WC series
cut shapes (of the above grade materials)
special products with increased/decreased abrasive/
overall thickness (cone and IDD grades)
IDC grades
E III M・HM
cut shapes (of the above grade materials)
PCBN grades
TBC grades
350・GX90・GX80・GX60・FX50・GX40
cut shapes (of the above grade materials)
special products with increased/decreased abrasive/
overall thickness
Uses, such as;
TDC - HM
CNGA120408
TDC - V60M
CNMX120408
TDC - CONE
lathe center
TDC-H specialty product
(workrest)
IDC - HM
Tipsaw for woodworking
TDC - G
drill
TBC - GX60
TPGW110304
TBC-GX40
CNGA120408-2
TBC - GX90
TPGN110308
Established Quality Assurance Syetem
As Japan's longest experienced diamond abrasive
manufacturer we have been performing an
established secure quality assurance , so that
Tomei industrial diamond products meet severe
and various demands in precision of every
customer .
Company Profile
Name
President
Establishment
Location
： Tomei Diamond Company, Ltd.
： Hiroaki Ishizuka
： April, 1953
： Head Office／Akasaka-mitsuke Kitayama Building 8th floor
9-18 Akasaka 3-chome, Minato-ku
Tokyo 107-0052, Japan
Oyama Plant／5-1 Joto 4-chome, Oyama, Tochigi 323-0807, Japan
(2 km north of Japan Railway Oyama Station on
Tohoku Trunk Line and Utsunomiya Line)
Line of Business
： Production, processing and sale of diamonds for industry and gem uses
Capital
： JPY 200,000,000
Banks
： Mizuho Bank , The Bank of Yokohama , The Bank of Tokyo-Mitsubishi UFJ
Mitsubishi UFJ Trust and Banking Corporation ,
The Ashikaga Bank , Sumitomo Mitsui Banking Corporation , Shoko Chukin Bank
Account closing day ： March 31st
Number of employees ： 170
Plant scale
： Land 25,500 m2 / Building sites 15,400 m2
Brief History of Group Companies
1961, May:
The Ishizuka Research Institute (IRI, represented by Mr. Hiroshi Ishizuka)succeeded
in Japan’
s first synthesis of diamond. He was also the pioneer researcher in the
technology of producing high purity metal of zirconium,titanium and silicon.
IRI started the mass production of its synthetic diamond.
1962, March:
IRI succeeded in the development of a large scale diamond synthesis apparatus,
1966, July:
in order to steadily supply economical diamonds and meet the increasing
demands in Japan in the period of rapidly growing economy.
1972, March:
Tomei Diamond Company was established; IRI licensed to produce and sell
industrial diamond products.
1984, July:
Osaka Tomei Diamond was established, in order to promote the sales of diamond
to western Japan.
1985,January:
For the promotion of production and sales business a second Tomei Diamond
was established and licensed to produce diamonds and sell to the first, which was
to specialize its sales.
1988, April:
Tomei Corporation of America (TCA) was established in NJ, USA., in order
specially to meet the demands in entire America.
2004, April:
Tomei Dia International was established for export business, which was
separated and transferred from the first Tomei Diamond.
2009,December: Tomei Diamond Company, first and second, Osaka Tomei Diamond and Tomei Dia
International were merged together and inherited the name“Tomei Diamond
Company, Ltd”.
2010, April:
Tomei Diamond (2009) was merged with IRI. The whole entity was then renamed
Tomei Diamond Company, Ltd. (current).
2012, May:
We got approved by Business Innovation Plan of Tokyo Metropolitan Government.
Sales department
Oyama plant
Akasaka-Mitsuke KITAYAMA Bldg. 8th Fl.,
4-chome, 5-1, Joto, Oyama, Tochigi
3-chome, 9-18, Akasaka, Minato-ku, Tokyo
323-0807, JAPAN
107-0052, JAPAN
Tel.(+81)285-22-5821 Fax.(+81)285-22-5827
Tel.(+81)3-3585-7981 Fax.(+81)3-3585-3282
[email protected]
2014.04