SiNA® /MAiA®
The modular inline system for PECVD anti-reflection coating and passivation layers
High performance at lowest cost
Industrially proven high-throughput PECVD reactor
Over 700 systems and ~60 GW installed capacity
Best cost of ownership – optimum of process quality and costs
Modular platform system for high flexibility in throughput and technology
High capacity up to 140 MW – throughput scalable up to 3,400 wafers/h
Best footprint utilization (best TpT/m2)
SiNA® – Leading inline anti-reflective coating system
Standard solution for sunny side SiN anti-reflective coating
High uptime ≥ 94%
Best yield – continuous material flow due to continuously operating coating process
Profit from the experience of 530 shipped machines and ~40 GW production capacity
Qualified for PERC and PERT cell concepts
MAiA® – Multiple Application inline Apparatus for various coating processes
Standard solution for rear side AIOx + SiN passivation
High uptime ≥ 93%
Deposit different dielectric layers without vacuum breakage in one run
Profit from the experience of 180 shipped machines and ~20 GW production capacity
Qualified for PERC and PERT cell concepts
Increase cell efficiency through PERC upgrade with MAiA® system
Easy upgrade of standard Al-BSF cell lines to PERC technology
Two process steps and equipments only
Stay competitive with significant cell quality increase
– Mono PERC cell efficiency: >21% (~1.0% efficiency gain)  +15 W module power increase
– Multi PERC cell efficiency: > 19.5% (~0.7% efficiency gain)  +10 W module power increase
Lowest additional production costs ensure profitability and short ROI
Minimize your risk – benefit from 10 years PERC experience and 20 GW installed PERC capacity
Saw damage
etching &
texturing
Phosphorous
doping
Emitter
diffusion
Phosphor
glass (PSG)
etching
Anti-reflection
coating,
passivation
Screen
printing
Contact
firing
Cell tester
& sorter
Standard AI-BSF process
Leading PECVD coating platform
PECVD process
Amorphous hydrogenated silicon nitride (SiN)
layers applied by Plasma Enhanced Chemical
Vapour Deposition (PECVD) are well suited as
anti-reflection
and
passivation
layers
on
crystalline silicon solar cells. These layers
reduce the ratio of reflection on the wafer surface
resulting
in
better
sunlight
utilization
and
passivate defects on the silicon surface as well
as in the crystal structure of the silicon bulk
material by hydrogenation from the SiN layer. This
leads to an improvement of the electrical properties of
the silicon and thus to a considerable increase of the
light conversion efficiency of the solar cell.
SiNA®
Front side SiN deposition
MAiA®2in1
Rear side AIOx + SiN deposition
MAiA®3in1
Front side SiN +
rear side AIOx + SiN deposition
Emitter
diffusion
Phosphor
glass (PSG)
etching
Anti-reflection coating,
rear and front side
passivation (Al2O3, SiNx)
Screen
print
Laser
ablation
Contact
firing
PERC process
SiNA® - Industrially proven single application system
Meyer Burger belongs to the leading suppliers of PECVD equipment in the photovoltaic
industry and has been working in this field for a very long time. SiNA® is an industrially
proven PECVD reactor which has been designed especially for coating solar cells. The system is based on an
inline concept where the wafer transport is effected by flat carriers. The highly productive microwave plasma
sources provide a very homogeneous plasma with a high ratio of chemically active agents. Due to excellent
coating results and long-term process stability, SiNA® systems feature a high uptime and low cost of
ownership.
MAiA® - Flexible multi application system
Some novel solar cell concepts require further and new
coating techniques. An upgrade of the existing standard
line is the most efficient approach to meet this demand.
Meyer Burger accommodates this demand for flexibly
configurable coating equipment with the MAiA®
platform. MAiA® is a development of the proven
anti-reflection coating equipment SiNA® and is
capable of coating both front and back side of the
wafers with materials like silicon nitride, silicon oxide
or aluminium oxide within one machine and in one run.
MAiA® coating system
with two process chambers
Standard Al-BSF
cell line
+
MB PERC solution
MAiA
Laser
=
PERC cell line
PERC is an upgrade technology for standard Al-BSF solar cells which
increases efficiencies by using aluminum oxide (AIOx) passivation
and a silicon nitrate capping layer to improve the transformation of
solar energy into electric energy.
SiNA® and MAiA® systems are combined with evaluated PERC
baseline recipes which are supported and optimized during machine
ramp-up. Compared to other solutions, no additional wet bench or
heating step is required.
The Meyer Burger approach offers a solution using existing
equipment to guarantee high-quality solar cells and excellent
customer profitability and to prepare for changes in the market
environment.
Saw damage
etching &
texturing
Phosphorous
doping
Phosphor
glass (PSG)
etching
Emitter
diffusion
Anti-reflection
coating,
passivation
Screen
printing
Cell tester
& sorter
Contact
firing
Standard AI-BSF process
Emitter
diffusion
Phosphor
glass (PSG)
etching
Anti-reflection coating,
rear and front side
passivation (Al2O3, SiNx)
Contact
firing
Screen
print
Laser
ablation
PERC process
Technical data at a glance
Application
SiNA® 3400
MAiA®2in1 3400
MAiA®3in1 3400
Silcon nitride (SiN) deposition
Silcon nitride (SiN) +
aluminum oxide (AIOx) deposition
Silcon nitride (SiN) +
aluminum oxide (AIOx) deposition
Module configuration
L
6PM
U
L
T
6PM
U
L
≥ 94%
Uptime
4PM
T
6PM
6PM
U
≥ 93%
≥ 99.5% (99.9% / 99.6%)
Yield – (mech./optical)
6 SiN
No. of plasma sources
2 AlOx + 6 SiN
Wafer / tray [pcs]
Wafer specification
4PM
≤ 3,400
Gross TpT [wph]
2 AlO x + 6 SiN + 6 SiN
24 (6 x 4)
All common available wafer sizes can be processed, the number of wafers per tray and system throughput may thus
vary accordingly. Nominal wafer size 6" (156 - 157 ±1 mm)
General platform module functionality
Chamber valve
(Atmospheric gate)
Shown on the right side: SiNA® 3400
for silicon nitride deposition.
Unload module
(cooling zone)
Buffer module OUT
(cooling zone)
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10
7
8
6
Process module
(plasma zone)
5
4
3
GUI (Graphic User
Interface)
H
G
1. Evacuate
2. Heat-up
3. Transfer
Buffer module IN
(pre-heating zone)
Load module
(pre-heating)
1. Pre-heat
2. Transfer
Process
1. Cool down
2. Transfer
1. Venting
2. Cool down
3. Unload
We reserve the right to make changes reflecting technical progress (02/2017)
Chamber valve
(atmospheric gate)
F
Example layout MAiA® 2in1 3400
Length 11.95 m
Width
5.08 m
Height 3.00 m
E
D


C
B
General
tolerances
DIN ISO 2768-mK
A
Edges DIN ISO 13715
Meyer Burger (Germany) AG, [email protected], www.meyerburger.com
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CONFIDENTIAL
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Meyer Burger AG. Any reproduktion, disclosure or
distribution of this document and it's contents to
third parties without written consent of
Meyer Burger AG is prohibited.
All rights reserved.
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