Materials Declaration Form
IPC
Form Type *
Sectionals *
1752
Version
Distribute
2
Subsectionals *
Material Info
A-D
* : Required Field
Manufacturing Info
Supplier Information
Company Name *
Contact Name *
Contact Phone *
Authorized Representative *
STMicroelectronics
Refer to " Supplier Comment" section
Refer to " Supplier Comment" section
LAURENT TOSI
2015-12-04
Response Date *
Refer to " Supplier Comment" section
Refer to " Supplier Comment" section
Contact Title
Contact Email *
Representative Title
MMS MD CHAMPION
Representative Email *
[email protected]
Representative Phone *
33 442 685 795
Supplier Comment
Online Technical Support - STMicroelectronics : http://www.st.com/web/en/support/online_tech_support.html
Uncertainty Statement
While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and 'as available'
basis. STMicroelectronics disclaims all warranties, express or implied related to this document and its contents, including but not limited to implied warranties of completeness,
truth, accuracy, merchantability, fitness for a particular purpose and non-infringement. ST shall have no responsibility and assumes no liability for any cost, loss or damage of any
kind which could arise, directly or indirectly, from the use or inability to use this document and/or its contents.
Legal Statement
Supplier Acceptance *
Legal Statement
Signature Not
Verified
Digitally signed
by Laurent Tosi
Date: 2015.12.04
18:54:27 +01:00
true
Legal Declaration *
Standard
Supplier certifies that it gathered the provided information and such information is true and correct to the best of its knowledge and
belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the
compliance of its products. Company acknowledges that Supplier may have relied on information provided by others in completing this
form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not
independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications
regarding their contributions to the part(s), and those certifications are at least as omprehensive as the certification in this paragraph. If
the Company and the Supplier enter into a written agreement with respect to the identified part(s), the terms and conditions of
that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of
the Supplier’s liability and the Company’s remedies for issues that arise regarding information the Supplier provides in this form.
Product
Mfr Item Number
Mfr Item Name
Version
Mfr Site
Date
STM32L476RGT6
B15W*415XXX4
A
9988
2015-12-04
Amount
UoM
Unit type
ST ECOPACK Grade
356.84
mg
Each
ECOPACK® 2
J-STD-020 MSL Rating
Classification Temp
Nbr of Reflow Cycles
3
260
3
bulk Solder Termination
Terminal Plating
Terminal Base Alloy
Not Applicable ; if coating is used
or other bulk termaination
Tin (Sn), matte
Copper Alloy
Package Designator
Size
Nbr of instances
Shape
QFP
10x10x1.4
64
L bend
Manufacturing information
Comment
Package : 5W LQFP 64 10x10x1.4 1 0051434
Comment
QueryList : ROHS directive 2011/65/EU _ July 2011
Query
Response
Product(s) meets EU RoHS requirement without any exemptions
true
Product(s) meets EU RoHS requirements except lead in solder and this usage may qualify under the lead in solder '7b' exemption (other selected exemptions may apply)
false
Product(s) meets EU RoHS requirements by application of the selected exemption(s)
Product(s) does not meet EU RoHS requirements and is not under exemptions
Product(s) is obsolete, no information is available
Product(s) is unknown, no information is available
Description
Exemption Id.
false
false
false
false
QueryList : REACH-15th June 2015
Query
Response
true
The product does not contain REACH Substances Of Very High Concern above the limits per the definition within REACH
CategoryLevel_Name
CategoryLevel_Threshold
amount in product (mg)
Application
ppm in product
Material Composition Declaration
B15W*415XXX4
Mfr Item Name
Homogeneous Material
Material Group
Mass
UoM
Die or Dies
Other inorganic materials
16.506
mg
Level
Substance Category
Substance
CAS
Exempt
356.8404
6000000.0
Mass
UoM
999998.0
Concentration in
Concentration in
homogeneous
product (ppm)
material (ppm)
supplier
die
Silicon (Si)
7440-21-3
14.731
mg
892463
41282
Die or Dies
supplier
metallization
Aluminium (Al)
7429-90-5
0.027
mg
1636
76
Die or Dies
supplier
metallization
Copper (Cu)
7440-50-8
0.242
mg
14661
678
Die or Dies
supplier
metallization
Tantalum (Ta)
7440-25-7
1.283
mg
77729
3595
Die or Dies
supplier
metallization
Cobalt (Co)
7440-48-4
0.001
mg
61
3
Die or Dies
supplier
metallization
Titanium (Ti)
7440-32-6
0.003
mg
182
8
Die or Dies
supplier
metallization
Tungsten (W)
7440-33-7
0.002
mg
121
6
Die or Dies
supplier
passivation
Silicon Nitride (SiN)
68034-42-4
0.061
mg
3696
171
Die or Dies
supplier
passivation
Silicon Oxide(SiO2)
7631-86-9
0.156
mg
9451
437
Supplier
Glue
Silver
7440-22-4
1.419
mg
707965
3976
Supplier
Glue
Highly cross-linked polymer
Proprietary
0.585
mg
292035
1640
Supplier
Moulding Compound
Epoxy Resin
Proprietary
24.554
mg
102748
68808
Mold Compound_EME-G700E_Sumitomo
Supplier
Moulding Compound
Phenol Resin
Proprietary
18.415
mg
77061
51606
Mold Compound_EME-G700E_Sumitomo
Supplier
Moulding Compound
Silica(Amorphous)A
60676-86-0
170.096
mg
711792
476673
Mold Compound_EME-G700E_Sumitomo
Supplier
Moulding Compound
Silica(Amorphous)B
7631-86-9
24.554
mg
102748
68808
Mold Compound_EME-G700E_Sumitomo
Supplier
Moulding Compound
Carbon Black
1333-86-4
1.350
mg
5651
3784
Supplier
Bonding wire
Copper
7440-50-8
0.411
mg
970149
1152
Supplier
Bonding wire
Palladium
7440-05-3
0.013
mg
29851
35
Die Attach Epoxy_Ablebond 3230_Henkel
Other inorganic materials
2.004
mg
Die Attach Epoxy_Ablebond 3230_Henkel
Mold Compound_EME-G700E_Sumitomo
Other inorganic materials
Wire_PD coat Cu Wire CLR-1A_TanakaOther inorganic materials
238.969
0.424
mg
mg
Wire_PD coat Cu Wire CLR-1A_Tanaka
Plating anode_Pure Tin_Nuonengda Other inorganic materials
1.438
mg
Supplier
Connection coating
Tin
7440-31-5
1.438
mg
1000000
4029
Leadframe_C194+Ag_Mitsui
97.500
mg
Supplier
Alloy
Copper
7440-50-8
94.653
mg
970800
265253
Leadframe_C194+Ag_Mitsui
Supplier
Alloy
Iron
7439-89-6
2.126
mg
21800
5956
Leadframe_C194+Ag_Mitsui
Supplier
Alloy
Phosphorus
7723-14-0
0.029
mg
300
82
Leadframe_C194+Ag_Mitsui
Supplier
Alloy
Zinc
7440-66-6
0.137
mg
1400
383
Leadframe_C194+Ag_Mitsui
Supplier
Alloy
Silver
7440-22-4
0.556
mg
5700
1557
Other inorganic materials