Space-saving model ideal
for non-destructive thermal emission analysis!
THEMOS
R
Thermal emission microscope C10614-02
The THEMOS mini thermal emission microscope is a single function, space-saving thermal
emission image analysis system equipped with an InSbHS camera. The THEMOS mini detects
heat generated inside a semiconductor device and displays it as an image superimposed on the
pattern image to allow rapid localization of defects.
Probing of wafer samples is quick and smooth when the THEMOS mini is used with an infrared objective lens having a long
working distance. The THEMOS mini is ideal as an entry model for thermal emission analysis such as in macro observation of
semiconductor materials and PC boards as well as for micro observation of semiconductor devices.
F eat u res
High-sensitivity thermal emission analysis using InSbHS camera
An InSbHS camera having high sensitivity in the 3.7 μm to 5.2 μm wavelength
range is installed as the detector. Due to ultra-miniaturization and higher
integration of semiconductor devices and the lowered operating voltages, the
intensity of infrared light emitted from failure locations becomes increasingly weak
and difficult to detect. This is not a problem on the InSbHS camera since it offers
higher infrared sensitivity compared to other types of infrared cameras and so can
also detect even more subtle changes in temperature.
Optimally designed IR optical system
A combination of the InSbHS camera and an optimally designed IR optical system
delivers powerful detection of thermal emissions. Each of the objective lenses is
designed compact for easy mounting in lens turrets while maintaining a high
numerical aperture (NA).
Thermal emission analysis from backside
The InSbHS camera used has high sensitivity at wavelengths from 3.7 μm to 5.2 μ
m where light transmits through silicon substrates. This means no special
preparation is required for observation and analysis from the backside of devices.
Observation of wafer samples up to 200 mm
Standard features include a 200 mm wafer chuck. The position of each probe
needle can also be set manually.
A pplication
Short-circuit of metal wirings
Abnormality of contact holes
Microplasma leakage in oxide layer
Oxide layer breakdown
TFT-LCD leakage / Organic EL leakage localization
Observation of temperature abnormalities in devices
under development process
Temperature mapping of devices and PC boards
Thermal emission analysis image through the backside
Grinding
Thermal
emissions
Back side
(mirror polishing)
Lead frame
Plastic mold
Hot spot
Bias
Si substrate
Pattern being measured
Thermal emission microscope
THEMOS
S pecification
M acro an al ysi s (Op ti o n )
The newly developed 0.29× infrared
objective lens suppresses the Narcissus
effect specific to infrared lenses. This
means pattern images can now be
captured over a wide field-of-view.
Detector
0.29×
Detector
Effective number of pixels
Field of view 0.8×
Cooling method
Noise equivalent temperature
Field-of-view comparison between 0.29× and 0.8× infrared objective lenses
0.8×
InSbHS camera (C9985-05)
640 × 512
12 mm × 9.6 mm
Stirling cycle cooling
< 25 mK at 25 ˚C (20 mK typ.)
difference (NETD)
Optics
0.29×
THEMOS mini Standard lens
Product number
N.A.
WD (mm)
Objective lens MWIR 0.8×
A10159-02
0.13
22
Objective lens MWIR 4×
A10159-03
0.52
25
Objective lens MWIR 8×
A10159-06
0.75
15
M Plan Apo 5×(for probing)
-
0.14
34
Product name
Field-of-view 0.8×
THEMOS mini Optional lens
Product number
N.A.
WD(mm)
Macro lens MWIR 0.24x for THEMOS mini
A10159-07
0.038
55
Macro lens MWIR 0.29x for THEMOS mini
A10159-11
0.048
12
Product name
Option
Thermal lock-in unit (C10565-21)
Lock-in analysis can be performed in combination with a thermal
lock-in unit. This suppresses heat diffusion and also eliminates
external noise, allowing accurate analysis with even higher sensitivity and resolution.
Temperature measurement software (U11389-01)
This software displays absolute temperatures during thermal emission
image analysis. The absolute temperature display lets you monitor the
operating temperature of device. So, comparing it with the design value
and feeding the results back to the actual design in its initial stage
shortens the design verification task and also improves product reliability. Moreover, temperature fluctuations that may occur depending on the
usage environment can also be monitored.
Absolute temperatures can be easily displayed just by adding the
U11389-01 absolute temperature display software to the THEMOS
mini. An accurate absolute temperature distribution within the
field-of-view can be displayed regardless of the emissivity by correcting
for the difference in emissivity resulting from each material pattern.
200 mm manual chuck
Wafer sizes
Probing method
Probe head platen
Chuck operation
Up to 200 mm
Vacuum held manipulator (Option)
Fixed type
Manual
Utility
Line voltage
Power consumption
Vacuum
Compressed air
AC 100 V to AC 240 V (50 Hz / 60 Hz)
Approx. 300 VA
Approx. 80 kPa or more
0.5 MPa to 0.7 MPa
Dimensions / Weight
External dimensions and weight Width × depth × height, weight
THEMOS mini main unit 880 mm (W) × 840 mm (D) × 1993 mm (H), Approx. 450 kg
PC desk
1000 mm (W) × 700 mm (D) × 800 mm (H), Approx. 65 kg
THEMOS is a registered trademark of Hamamatsu Photonics K.K.
Product and software package names noted in this documentation are trademarks or registered trademarks of their respective manufacturers.
Subject to local technical requirements and regulations, availability of products included in this promotional material may vary. Please consult your local sales representative.
Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions.
Specifications and external appearance are subject to change without notice.
© 2016 Hamamatsu Photonics K.K.
HAMAMATSU PHOTONICS K.K.
www.hamamatsu.com
HAMAMATSU PHOTONICS K.K., Systems Division
812 Joko-cho, Higashi-ku, Hamamatsu City, 431-3196, Japan, Telephone: (81)53-431-0124, Fax: (81)53-435-1574, E-mail: [email protected]
U.S.A.: Hamamatsu Corporation: 360 Foothill Road, Bridgewater, NJ 08807, U.S.A., Telephone: (1)908-231-0960, Fax: (1)908-231-1218 E-mail: [email protected]
Germany: Hamamatsu Photonics Deutschland GmbH.: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49)8152-375-0, Fax: (49)8152-265-8 E-mail: [email protected]
France: Hamamatsu Photonics France S.A.R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: (33)1 69 53 71 00, Fax: (33)1 69 53 71 10 E-mail: [email protected]
United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court,10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, UK, Telephone: (44)1707-294888, Fax: (44)1707-325777 E-mail: [email protected]
North Europe: Hamamatsu Photonics Norden AB: Torshamnsgatan 35 16440 Kista, Sweden, Telephone: (46)8-509-031-00, Fax: (46)8-509-031-01 E-mail: [email protected]
Italy: Hamamatsu Photonics Italia S.r.l.: Strada della Moia, 1 int. 6, 20020 Arese (Milano), Italy, Telephone: (39)02-935-81-733, Fax: (39)02-935-81-741 E-mail: [email protected]
China: Hamamatsu Photonics (China) Co., Ltd.: 1201 Tower B, Jiaming Center, 27 Dongsanhuan Beilu, Chaoyang District, 100020 Beijing, China, Telephone: (86)10-6586-6006, Fax: (86)10-6586-2866 E-mail: [email protected]
Taiwan: Hamamatsu Photonics Taiwan Co., Ltd.: 8F-3, No.158, Section2, Gongdao 5th Road, East District, Hsinchu, 300, Taiwan R.O.C. Telephone: (886)03-659-0080, Fax: (886)07-811-7238 E-mail: [email protected]
Cat. No. SSMS0056E01
SEP/2016 HPK
Created in Japan