Elite Material Co., Ltd.
Technical Data
http:\\www.emctw.com
Lead-free , Halogen-free Material
EM-285 / EM-285B
● Superior
● FR-4
process friendly and suitable for sequential lamination
● Lower
● Low
Df
moisture absorption and excellent CAF resistance
● Halogen,
● For
thermal resistance for lead-free process
antimony and red phosphorus free
LCD, memory module and mobile device application
Basic Laminate Property
Item
IPC-TM-650
Test condition
Unit
Typical Value
Glass transition temp.
2.4.24
TMA
℃
150
CTE, X-, Y-axis
2.4.24
Pre-Tg, TMA
ppm/℃
16/ 16
CTE, Z-axis
2.4.24
Alpha 1, TMA
ppm/℃
50
Alpha 2, TMA
ppm/℃
250
Z-axis Expansion
2.4.24
50~260℃, TMA
%
3.0
Decomposition temp.
2.4.24.26
TGA
℃
360
Clad
___
Pass Visual
Etched
___
Pass Visual
E-1/105+D-24/23
%
0.08
as received
lb/in
6.5
after thermal stress
as received
lb/in
lb/in
6.5
8.5
after thermal stress
lb/in
8.5
___
4.8
___
4.3
___
0.007
___
0.011
Thermal stress
10sec 288℃
2.4.13.1
Water absorption
2.6.2.1
0.5 oz
2.4.8
1.0 oz
2.4.8
Peel strength
Permittivity
(RC 50%)
1 MHz
Loss tangent
(RC 50%)
1 MHz
1 GHz
2.5.5.9
C-24/23/50
2.5.5.9
C-24/23/50
Volume resistivity
2.5.17.1
C-96/35/90
MΩ-cm
>1010
Surface resistivity
2.5.17.1
C-96/35/90
MΩ
as received
as received
A&E-24/125
MPa
MPa
>109
640~680
460~500
V-0
1 GHz
Warp
2.4.4
Fill
Flame resistance
UL-94
Specification Sheet : IPC-4101C / 128
Flexural strength
___
Rev: 2012 Jul.