1
Fujitsu Lead-free Package
Semiconductor Group
LSI Packaging Division
Fujitsu LSI PACKAGING DIVISION
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Fujitsu Limited
2
History of Fujitsu Lead-free Package
Development Activities
Lead-free Package Development to Commence
[ April 1998 Completed ]
Customers Application Trend Research
[ Sept 1998 Completed ]
Lead-free BGA Mass Production
[ April 2000 Partially started ]
Lead-free QFP Mass Production
[ Oct 2000 Partially started ]
Target For All LSI Products ultimately lead-free [ Dec 2002 ]
Fujitsu LSI PACKAGING DIVISION
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3
Lead-free Package Definition
Fujitsu Lead Free Package Specification
Ecologically friendly package with lead being eliminated from its terminal-use
material and improved heat resistivity.
Heat Resistivity
260ºC (250ºC) x 2 Reflows
Terminal Material
BGA = Sn-37Pb (Non Lead-free) Æ Sn-3.0Ag-0.5Cu (Lead-free)
BGA
When compared with non lead-free:
1. A bit dull in color; less lustrous
2. Similar wettability
3. Similar on-board reliability
4. Similar solder combination mounting
Fujitsu LSI PACKAGING DIVISION
Solder ball
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4
Lead-free Package Definition
Fujitsu Lead Free Package Specification
Ecologically friendly package with lead being eliminated from its terminal-use
material and improved heat resistivity.
Heat Resistivity
260 ºC (250ºC )x 2 Reflows
Terminal Material
QFP = Sn-10Pb (Non lead-free ) Æ Sn-2.0Bi (Lead-free)
QFP
When compared with non lead-free:
1. A bit dull in color; less lustrous
2. Similar wettability
3. Similar on-board reliability
4. Similar solder combination mounting
Fujitsu LSI PACKAGING DIVISION
Solder plating
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5
Lead-free Temperature Profile
* Package Surface Temp.
(a) Temp. inc. gradient : Av.
H
Rank
1~4ºC/sec
(b) Preliminary heating : 150~190ºC,120~180sec
(c)Temp. inc. gradient
(d) Peak Temp
(d') Actual heating
260 ºC (240 ºC)
255 ºC (235 ºC)
(e)Cooling
220 ºC
: Av. 1~4ºC/sec
: 260ºC max.
255ºCup 10 sec max.
: 230ºCup 40 sec max.
: 225ºC up 60sec max.
: 220ºC up 80sec max.
: Natural Cooling or
Forced Cooling
190 ºC
150 ºC
(b)
(c)
(d)
(e)
RT
( ): Non lead free=R Rank
(a)
Fujitsu LSI PACKAGING DIVISION
(d')
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6
Lead-free Temperature Profile
* Package Surface Temp.
(a) Temp. inc. gradient : Av.
M Rank
1~ 4ºC/sec
(b) Preliminary heating : 150~190ºC,120~180sec
(c)Temp. inc. gradient
(d) Peak Temp
260 ºC (240 ºC)
(d') Actual heating
255 ºC (235 ºC)
(e)Cooling
220 ºC
: Av. 1~ 4ºC/sec
: 250ºC max.
245ºCup 10 sec max.
: 230ºCup 40 sec max.
: 225ºC up 60sec max.
: 220ºCup 80sec max.
: Natural Cooling or
Forced Cooling
190 ºC
150 ºC
(b)
(c)
(d)
(e)
RT
( ): Non lead free=R Rank
(a)
Fujitsu LSI PACKAGING DIVISION
(d')
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7
Discrimination of Lead-free Products
Part Number : Add E1 at the end
( Ex ) MBLM29LV160TE90PBT-JJ
Marking
MB29LV160TE90PBT-JJE1
: Add “E1” at the end
Attach lead-free sticker to mark on aluminum-laminated bag and on inner box
( Inner Box )
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8
Pb-Free Plan & Status
Package
CY2002
CY2001
CY2003
QFP
LQFP
QFP/SOP
TQFP
Mass-Production
SSOP
TSOP
PBGA
Mass-Production
FBGA
Mass-Production
TAB-BGA
Eval.
EBGA
Eval.
MP June ～
FCBGA
Eval.
MP June ～
LGA
FLGA
Mass-Production
BCC
BCC
Mass-Production
WLP
Super CSP
BGA
Fujitsu LSI PACKAGING DIVISION
Eval.
MP April ～
2002.Dec.
100%
MP April ～
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9
Thermal Performance Grouping　Grouping
(Non Lead-free)
Group
BGA
QFP / SOP
A:260Cmax
SCSP Small-FBGA PBGA BCC
B:250Cmax Large-FBGA SMCP
SOP TSOP TQFP
QFP LQFP
C:240Cmax
HQFP
Method
FLGA EBGA TBGA SMCP*
Item
BGA
Package Material
・Substrate Material
・Die Paste Material
・Encapsulation Resin
QFP / SOP
・Die stage Structure
・Die stage Dimension
Package Structure
Result
(Lead-free)
Group
・Die Paste Material
・Encapsulation Resin
Non Lead-free
Lead-free
240C
250C
260C
240C
250C
260C
A:260Cmax
〇
〇
〇
〇
〇
〇
B:250Cmax
〇
〇
×
〇
〇
〇
C:240Cmax
〇
×
×
〇
〇
×
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Evaluation Summary (Sn-Bi)
Heat
Resistivity
Moisture
Resistivity
Wettability
TSOP
260ºC
A
A
SOP
260 ~ 280ºC
A
A
TQFP
260ºC
A
A
LQFP
250 ~ 260ºC
A
A
QFP
250 ~ 260ºC
A
A
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11
BGA Ball Evaluaion
Disadvantage
Composition
Advantage
Sn-Ag-Cu
Better Mounting Reliability than
Sn-Pb/Sn-Pb
High Melting Point (220ºC)
Sn-Ag-Bi-Cu
Lower Melting point than Sn-Ag-Cu
Lower Mounting Reliability by
Bi content increase
Ball share Strength
Share StrengthｇＦ）
1000
Package：FBGA224(0.8mmP)
Ball Diameter.：φ0.5mm
Aging　：　125ºC Storage
・・・Sn-Ag-Cu
・・・Sn-Ag-BiCu
0H
168H
Fujitsu LSI PACKAGING DIVISION
336H
504H
1000H
・・・Sn-Pb
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12
Reflow Peak Temperature& Solder-joint
＊Jointable at 230ºC
【Condition】
Ball material : Sn-3.5Ag-0.75Cu
Peak Temperature
210ºC typical
Peak Temperature
220ºC typical
Paste material : Sn-3.5Ag-0.75Cu
Reflow method : IR/Hot air
Peak Temp : Joint Temp
Peak Temperature
Peak Temperature
230ºC typical
220ºC typical
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13
On-Board Thermal Cycle
Sample : FBGA224(0,8mm pitch) Ball Diameter:φ0,5mm
Substrate : 110mmX110mmX0.8mm t ,4-layers , Land Diameter:φ0.3mm(NSMD)
Test Condition : -25ºC (9min)~RT(1min)~125ºC (9min)
TC cycles
10000
Average
1000
1300
Fujitsu LSI PACKAGING DIVISION
1800
1700
7.5Bi-0.5Cu
Sn-2Ag-
3Bi-1.1Cu
Sn-3.3Ag-
1.2Cu
Sn-3.4Ag-
Sn-Pb
100
1100
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14
Plating Material Evaluation
Note : Each Metallic Additives Ratio is 2~3%
Plating Material
Whisker
Wettability
Joint
strength
Cost
Ｓｎ－Ｐｂ
◎
◎
◎
◎
Ｓｎ－Ｂｉ
○
○
◎
○
Ｓｎ－Ａｇ
△
△
◎
△＊
Ｓｎ－Ｃｕ
△＊
△
◎
○
Ｓｎ－Ｚｎ
△＊
○＊
○
△
Ｓｎ
△
△
◎
◎
Test Condition
50℃Aging
Legend
Fujitsu LSI PACKAGING DIVISION
◎：Reference
○：Not
Observed
△：Observed
Meniscograph
Peel Strength
(Zero-Crosstime) (Thermal Cycle)
◎：Reference
○：Moderate
Long
△：Long
◎：Reference
○：Weak
Material
Cost
◎：Reference
○： Moderate
Expensive
△：Expensive
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15
Zero-Cross Time
Sample Size : 3.30xo.46xo.25t Dipping Speed :10mm/sec Dipping Depth : 1mm
Test Condition-1
Solder : Sn-Ag-Bi-Cu
Solder Temperature : 230ºC
Flux : RA type
Test Condition-2
Solder : Sn-Ag--Cu
Solder Temperature : 230ºC
Flux : RA type
5
3
2
1
0
0h
24h
48h
72h
170℃ｴｰ ｼﾞﾝｸﾞ
4
3
2
1
0
96h
24h
48h
72h
170℃ｴｰ ｼﾞﾝｸﾞ
S n-B i/42材
S n-P b/42材
3
2
1
0h
1h
2h
4h
ｽ ﾁｰ ﾑ ｴｰ ｼﾞﾝｸﾞ
2B i/42材
10P b/42材
6h
8h
2B i/C u材
10P b/C u材
Fujitsu LSI PACKAGING DIVISION
1
S n-B i/42材
S n-P b/C u材
24h
48h
72h
170℃ｴｰ ｼﾞﾝｸﾞ
S n-B i/42材
S n-P b/42材
96h
S n-B i/C u材
S n-P b/C u材
5
4
3
2
1
4
3
2
1
0
0
0
2
0h
ｾ ﾞﾛｸﾛｽ ﾀｲﾑ (sec)
ｾ ﾞﾛｸﾛｽ ﾀｲﾑ (sec)
4
3
96h
5
5
4
0
0h
S n-B i/C u材
S n-P b/C u材
S n-B i/42材
S n-P b/42材
ｾ ﾞﾛｸﾛｽ ﾀｲﾑ (sec)
5
ｾ ﾞﾛｸﾛｽ ﾀｲﾑ (sec)
4
ｾ ﾞﾛｸﾛｽ ﾀｲﾑ (sec)
ｾ ﾞﾛｸﾛｽ ﾀｲﾑ (sec)
5
Test Condition-3
Solder : Sn-Pb(Reference)
Solder Temperature : 220ºC
Flux : RA type
0h
1h
2h
4h
ｽ ﾁｰ ﾑ ｴｰ ｼﾞﾝｸﾞ
2B i/42材
10P b/42材
6h
8h
2B i/C u材
10P b/C u材
0h
1h
2h
4h
ｽ ﾁｰ ﾑ ｴｰ ｼﾞﾝｸﾞ
2B i/42材
10P b/42材
6h
8h
2B i/C u材
10P b/C u材
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16
Crosssection of Connection(Sn-Bi Plating)
Package : QFP208(0.5mm pitch)
A ) Paste : Eutectic Solder
B ) Paste : Sn-Ag-Cu
Fujitsu LSI PACKAGING DIVISION
Lead Frame : 42-Alloy
Lead Frame : 42-Alloy
Reflow Temperature :230ºC
Reflow Temperature :240ºC
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17
Example of Lead-free Whisker
Sample A : Sn-Cu (42Alloy)
Sample A : Sn-Cu (42Alloy)
Sample A: Sn-Cu (42Alloy)
Sample B: Sn-Ag (42Alloy)
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Target of Mountability
Improvement of Package Heat Resistivity
Quality Assurerance of Soldering Mountability
Terminal
QFP
Solder Paste
Sn-Pb
(PWB)
BGA
Terminal
(PWB)
Fujitsu LSI PACKAGING DIVISION
Mounting Paste
(Customer)
Terminal Material
(maker)
Current
Melting
Point
183ºC
Sn-Pb
Tentative
Solder Paste
Sn-Bi
Sn-Ag-Cu
Sn-Ag-Cu
Future
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Melting
Point
220ºC
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19
Ball Adhesive Strength
Package : FBGA224(16mmx16mm)
Solder Ball Diameter : φ0.45mm
A : Eutectic Ball ＋ Eutectic Paste
B : Sn-Ag-Cu Ball ＋ Eutectic Paste
C : Sn-Ag-Cu Ball ＋ Sn-Ag-Cu Paste
D : Sn-Ag-Cu Ball ＋ Sn-Ag-Bi-Cu Paste
［mN］
10K
Min
Ave
Max
5K
Max
Ave
Min
0
Pull
Share
A
Share
Pull
B
Pull
Share
C
Share
Pull
D
(Damage Mode)
Share : A~D=Normal(Solder Part sliced)
Pull : A=Normal(Solder torn) B,C,D=Interface Delamination
Fujitsu
2000.9.1
LSI PACKAGING DIVISION
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20
Solder Combination Evaluation(Thermal Cycle)
Board
: FR-4,110mm x 110mm x 0.8mmt
Package : FBGA (6 x 8 mm)/ FBGA (16 x 16 mm)
TC condition : -25ºC ~ RT ~ 125ºC
Non fail cycles
6k cycles
Ball Material
Paste Material
FBGA (16 x 16 mm)
FBGA (6 x 8mm)
6k cycles
Sn-Pb
Sn-Pb
Sn-Ag-Cu Sn-Ag-Cu
Sn-Ag-Cu
Sn-Pb
Sn-Ag-Cu Sn-Ag-Bi-Cu
Fujitsu LSI PACKAGING DIVISION
Sn-Pb
Sn-Pb
Sn-Ag-Cu Sn-Ag-Cu
Sn-Ag-Cu
Sn-Pb
Sn-Ag-Cu Sn-Ag-Bi-Cu
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21
Solder Combination Evaluation(Drop Test)
Sample
: Mobile Phone Board (weight : 150g)
Package : FBGA (6 x 8 mm)/ FBGA (16 x 16 mm)
Condition : 1.5m height, 1set - 6-directions
FBGA (6 x 8 mm)
Non fail set count
20 sets
Ball Material
Paste Material
FBGA (16 x 16 mm)
20 sets
Sn-Pb
Sn-Pb
Sn-Ag-Cu Sn-Ag-Cu
Sn-Ag-Cu
Sn-Pb
Sn-Ag-Cu Sn-Ag-Bi-Cu
Fujitsu LSI PACKAGING DIVISION
Sn-Pb
Sn-Pb
Sn-Ag-Cu Sn-Ag-Cu
Sn-Ag-Cu
Sn-Pb
Sn-Ag-Cu Sn-Ag-Bi-Cu
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22
Solder Combination Evaluation (Bending Cycle Test)
Sample
: Mobile Phone Board (weight : 150g)
Package : FBGA (6 x 8 mm) / FBGA (16 x 16 mm)
Condition : Span 90 mm, Bend 3.0mm
Non fail cycles
FBGA (6 x 8mm)
FBGA (16 x 16 mm)
10k
Ball Material
Paste Material
Sn-Pb
Sn-Pb
Sn-Ag-Cu Sn-Ag-Cu
Sn-Ag-Cu
Sn-Pb
Sn-Ag-Cu Sn-Ag-Bi-Cu
Fujitsu LSI PACKAGING DIVISION
Sn-Pb
Sn-Pb
Sn-Ag-Cu Sn-Ag-Cu
Sn-Ag-Cu
Sn-Pb
Sn-Ag-Cu Sn-Ag-Bi-Cu
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23
Solder Combination Evaluation(Connection View)
Package : QFP208(0.5mm pitch)
A) Plating : Sn-Pb
Paste : Eutectic Solder
LF : 42-Alloy
B) Plating : Sn-Pb
Paste : Eutectic Solder
LF : Cu-Alloy
C) Plating : Sn-Bi
Paste : Eutectic Solder
LF : 42-Alloy
D) Plating : Sn-Bi
Paste : Eutectic Solder
LF : Cu-Alloy
E) Plating : Sn-Bi
Paste : Sn-Ag-Cu
LF : 42-Alloy
F) Plating : Sn-Bi
Paste :Sn-Ag-Cu
LF : Cu-Alloy
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Solder Combination Evaluation(Thermal Cycle)
Board
: FR-4,110mm x 110mm x 0.8mmt
Package
: QFP208 (0.5mm pitch)
TC condition : -25ºC ~ RT ~ 125ºC
Non fail cycles
42 Alloy
Cu Alloy
5k
Plating Material : Sn-Pb Sn-Pb
Sn-Bi
Sn-Bi
Paste Material
: Eutectic Sn-Ag-Cu Eutectic Sn-Ag-Cu
Fujitsu LSI PACKAGING DIVISION
Sn-Pb
Sn-Pb
Sn-Bi
Sn-Bi
Eutectic Sn-Ag-Cu Eutectic Sn-Ag-Cu
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25
Solder Combination Evaluation(Drop Test)
Sample : Box-shaped(Weight : 150g)
Package : A=TSOP-86 B=LQFP-100 C=TQFP-120 D=QFP-208
E=CSOP-48 F=LQFP-120 G=LQFP-256
Solder Combination : 1=Sn-Bi plating/Sn-Pb paste 2=Sn-Bi plating/Sn-Bi-Cu paste
Test Condition : Height=1.5m 1set=Landing on 4different surfaces
Fe-Ni Lead Frame
Non fail set count
Cu Lead Frame
6-sets
Solder
Package
6-sets
1
2
A
2
1
B
Fujitsu LSI PACKAGING DIVISION
1
2
C
1
2
D
Solder
Package
1
2
E
1
2
F
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1
2
G
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26
Solder Combination Evaluation(Drop Test)
Sample : Box-shaped(Weight : 150g)
Package : A=TSOP-86 B=LQFP-100 C=TQFP-120 D=QFP-208
E=CSOP-48 F=LQFP-120 G=LQFP-256
Solder Conbination : 1=Sn-Bi plating/Sn-Pb paste 2=Sn-Bi plating/Sn-Bi-Cu paste
Test Condition : 20G,10~2000Hz(1cycle=4minutes) x,y,z girection(1 round)
Cu Lead Frame
Fe-Ni Lead Frame
Non fail rounds
6-rounds
Solder
Package
6-rounds
1
2
A
2
1
B
Fujitsu LSI PACKAGING DIVISION
1
2
C
1
2
D
Solder
Package
1
2
E
1
2
F
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1
2
G
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27
Conclusion of Fujitsu Lead-free Package
1. Heat resistivity = 260ºC (250ºC)x 2 Reflows
2. Terminal materials
BGA = Sn-Ag-Cu (Ball)
QFP = Sn-Bi (Plating)
3. Discrimination of products by:
Parts number, marking, Lead-Free Sticker
4. Solder combinations work just as well with non leadfree version
5. Completed by Dec 2002 (Target)
Fujitsu LSI PACKAGING DIVISION
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