INTERNATIONAL DIRECTORY OF PRODUCTION WIRE BONDERS
Company Name
Address
b Phone > Fax
Year Founded
Executives
Model
x Introduced
v Bonding Area (X, Y)
in mm (inches)
CM=Consult Manufacturer
£ Bond Pitch
Capability
T Type
M Method
z Bond Placement
Repeatability
H Material Handling
Capability
V Footprint
Width by Depth, mm
and (inches)
Primary Applications
Secondary Applications
S Significant Features
[web site]
Technical Contact
b Phone > Fax
Additional Offices
Notes: All shown information was furnished by the respective manufacturers. All bonders listed are designated automated by their manufacturer, and Chip Scale Review assumes no liability for errors or
omissions to this table. Due to space constraints, not all models are listed. For detailed information consult each manufacturer’s web site. Issue advertisers are designated with bold type.
ASM Pacific Technology Ltd.
2, Yishun Avenue 7
Singapore 768924
b +65.67526311
> +65.67582287
1975
Patrick Lam See Pong
£ ±3µm@3 sigma
T CM
M CM
z CM
H CM
V 702 x 820mm
ICs
CM
Eagle60-LD wire bonder
x 2003
v CM
£ ±5µm@3 sigma
T CM
M CM
z CM
H CM
V 702 x 820mm
Photonics
Laser diodes
Twin Eagle wire bonder
x 2003
v CM
£ ±3.5µm@3 sigma
T CM
M CM
z CM
H CM
V CM
ICs
CM
S Dual wire/size/type
capability
Hummingbird
£ ±3.5µm@3 sigma
T CM
M CM
z CM
H CM
V CM
Wafer-level stud
bumps
S High UPH, Cu stud
bump ready
No Data
No Data
No Data
No Data
Tsunami ESEC 3100
x 2003
v 52 x 70mm
£ 35µm
H Leadframe
substrates and
flat boats, J-boat
option
V 850 x 960mm
ICs
MCM/other modules
H Leadframes,
substrates,
reel-to-reel
V 850 x 1000mm
ICs
Smart Card modules
H Auer boat,
leadframe,
substrate, reel-toreel, manual
V 580 x 1000mm
Hybrids
MCMs/other modules
H Auer boat,
leadframe,
substrate, reel-toreel, manual
V 580 x 1000mm
MCMs/other modules
Fiberoptics
H Auer boat,
leadframe,
substrate, reel-toreel, manual
V 580 x 1000mm
Discretes
Hybrids
H Auer boat, leadframe, substrate,
J-boat, reel-toreel, manual
V 620 x 1255mm
Discretes
Hybrids
H Auer boat, leadframe, substrate,
J-boat, reel-toreel, manual
V 620 x 1255mm
Hybrids
MCMs/other modules
Eagle60
ultra high-speed wire bonder
x 2002
v CM
wafer-level stud bumps
x 2003
v CM
DIAS Automation (HK) Ltd.
(28 x 32)
(28 x 32)
[asmpacific.com]
Jerry Dellheim, Vice President
of Strategic Marketing
[email protected]
b 408.451.0800
[diasautomation.com]
Unit A7, 3/F, Merit Ind. Bldg. 94
Tokwawan Rd., Kowloon
Hong Kong SAR, China
1975
Mr. W.S. Leung
ESEC
Hinterbergstrasse 32
CH-6330 Cham
Switzerland
b +41.41.749.5111
1968
Asuri S. Raghavan
T Thermosonic
M Ball
z ±2.5µm@3 sigma
(2.0 x 2.7)
(33.5 x 37.8)
£ 60µm
ESEC 3088iP
x 2000
v 52 x 64mm
T Thermosonic
M Ball
z ±3.5µm@3 sigma
(2.0 x 2.5)
F&K Delvotec
Bondtechnik GmbH
Daimlerstr. 5-7
85521 Ottobrunn
Germany
b +49.89.62995.0
> +49.89.62995.100
1978
Dr. Farhad Farassat
6200HS
£ 60µm@3 sigma
x 2002
v 200 x 150mm
T Ultrasonic
M Ball
z ±9µm@3 sigma
gold ball bonder
with 20µm wire
(8 x 6)
6400HS
£ 60µm@3 sigma
x 2002
v 200 x 150mm
T Ultrasonic
M Wedge
z ±15µm@3 sigma
fine wire bonder
with 20µm wire
(8 x 6)
6600HS
£ 190µm@3 sigma
x 2002
v 200 x 150mm
T Ultrasonic
M Wedge
z ±15µm@3 sigma
fine wire bonder
with 100µm wire
(8 x 6)
66000
£ 190µm@3 sigma
x 2003
v 100 x 100mm
T Ultrasonic
M Wedge
z ±15µm@3 sigma
5th generation heavy wirebonder
(4 x 4)
with 100µm wire
66000
£ 190µm@3 sigma
x 2003
v 200 x 200mm
T Ultrasonic
M Wedge
z ±15µm@3 sigma
large area heavy wirebonder
(8 x 8)
with 100µm wire
[esec.com]
Peter Buehlmann,
Technical Manager, ESEC USA
[email protected]
b 480.893.6990
(33.7 x 39.4)
(22.8 x 29.4)
(22.8 x 29.4)
[fkdelvotec.com]
Desmond Bradley, International
Sales & Marketing Manager
[email protected]
b +49.89.62995.120
N. American HQ:
F&K Delvotec Inc.
27182 Burbank Ave.
Foothill Ranch, CA 92610
b 949.595.2200
> 929.595.2207
F&K Delvotec Bondtechnik
GmbH & Co. KG, Singapore
F&K Delvotec Bondtechnik
GmbH & Co. KG Braunau,
Austria
(22.8 x 29.4)
(24.4 x 49.4)
(24.4 x 49.4)
Chip Scale Review March 2004 [ChipScaleReview.com]
Chip Scale Review • March 2004 • [ChipScaleReview.com]
31
INTERNATIONAL DIRECTORY OF PRODUCTION WIRE BONDERS
Company Name
Address
b Phone > Fax
Year Founded
Executives
Model
x Introduced
v Bonding Area (X, Y)
in mm (inches)
£ Bond Pitch
BondJet 715
x 2002
v 254 x 178mm
£ <40µm
T Thermo, Ultrasonic
M Wedge
z 3µm@3 sigma
H Auer boat, leadframe,
substrate, J-boat, reelto-reel, manual
V 920 x 1402mm
CM
CM
£ <40µm
H Auer boat, leadframe,
substrate, J-boat, reelto-reel, manual
V 920 x 1402mm
CM
CM
T Thermo, Ultrasonic
M Heavy wire wedge
z 10µm@3 sigma
H Auer boat, leadframe,
substrate, J-boat, reelto-reel, manual
V 750 x 1247mm
CM
CM
No Data
No Data
No Data
Maxµm plus
£ <35µm
T CM
M Ball
z CM
H Flat boat, tape
BGA, manual
V 883 x 856mm
ICs
CM
£ <43µm min. bonded ball
H CM
V 974 x 974mm
SO and high-density
matrix packages
Low I/O count
packages
CM=Consult Manufacturer
Hesse & Knipps GmbH
Vattmannstrasse 6
D-33100 Paderborn
Germany
b +49.52.51.1560.0
> +49.52.51.1560.97
1978
Dr. Hans J. Hesse,
Hans-Ulrich Knipps
(10 x 7)
BondJet 815
x 2002
v 312 x 178mm
(12.3 x 7)
BondJet 910
x 2003
v 406 x 500mm
(16 x 19.7)
Kaijo Corp.
Capability
T Type
M Method
z Bond Placement
Repeatability
T Thermo, Ultrasonic
M Wedge
z CM
£ N/A (heavy wire)
H Material Handling
Capability
V Footprint
Width by Depth, mm
and (inches)
Primary Applications
Secondary Applications
S Significant Features
(36.2 x 49)
(36.2 x 49)
[web site]
Technical Contact
b Phone > Fax
Additional Offices
[hesse-knipps.com]
Roberto Gilardoni,
Technical Coordinator
[email protected]
b +49.52.51.1560.31
N. American HQ:
Hesse & Knipps Inc.
2305 Paragon Dr.
San Jose, CA 95131
b 408.436.9300
> 408.436.2822
Joseph S. Bubel,
VP, Sales and Marketing
[email protected]
(29.5 x 49.1)
No Data
[kaijo.co.jp]
Hamura City, Tokyo, Japan
1948
Ryuzou Ohrui
Kulicke & Soffa Industries
2101 Blair Mill Road
Willow Grove, PA 19090
b 215.784.6000
> 215.784.6002
1951
C. Scott Kulicke
ultra high speed ball bonder
x 2004
v 56 x 66mm
(2.2 x 2.6)
NuTek wire bonder
x 2002
v 56 x 66mm
(2.2 x 2.6)
Orthodyne Electronics
16700 Red Hill Ave.
Irvine, CA 92606
b 949.660.0440
> 949.660.0444
1962
Gregg Kelly
£ CM
T Ultrasonic
M Wedge
z CM
H Various (OEM)
V 680 x 1308mm
Hybrids
MCMs/other modules
7200 dual-head semiconductor
£ CM
T Ultrasonic
M Wedge (small)
z CM
H Leadframe
V 1735 x 1280mm
Discretes
ICs
3700 small wire wedge bonder
x 2003
v 250 x 150mm
£ CM
T Ultrasonic
M Wedge
z CM
H Various (OEM)
V 680 x 1308mm
Hybrids
MCMs/other modules
5070-V
£ 50mm@3 sigma
H Auer boat, leadframe,
substrate, J-boat,
manuat, other
SMEMA compatible
V 1219 x 813mm
MCMs/other modules
Hybrids
H Auer boat, leadframe,
substrate, J-boat,
manuat, other
SMEMA compatible
V 800 x 800mm
MCMs/other modules
MEMS, MOEMS, Opto
H Leadframe,
substrate, carrier
V 700 x 700mm
ICs
MCMs
(9.8 x 5.9)
x 2002
v 70 x 70mm
(2.7 x 2.7)
(9.8 x 5.9)
2230 Oak Ridge Way
Vista, CA 92083
b 760.931.3600
> 760.931.3444
1995
Kevin Conlon
automatic wedge bonder
x April 2003
v 300 x 127mm
(12 x 5)
8000
x July 2003
v 300 x 150mm
(12 x 6)
1930 S. Alma School Rd.
Suite D-107
Mesa, AZ 85210
b 480.831.7988
> 480.831.9480
T Thermosonic
M Wedge
z ±5µm@3 sigma
(26.7 x 51.5)
(68.3 x 50.3)
(26.7 x 51.5)
UTC-1000
x 2002
v 55 x 65mm
(2.1 x 2.5)
£ <70mm inline @3
sigma (app-dependent)
T Thermosonic
M Ball
z ±2.5µm@3 sigma
[bonders.com]
Jeffrey King
[email protected]
£ 45µm@3 sigma
T Thermosonic
M Ball
z ±2.5µm@3 sigma
(31.5 x 31.5)
(27.5 x 27.5)
1959
Sadashi Iida
32
[orthodyne.com]
Siegbert Haumann,
Product Manager
[email protected]
Bill Larkin,
VP–Sales & Marketing
[email protected]
(48 x 32)
high speed ball bonder
Shinkawa USA Inc.
(38 x 38)
3600 large wire bonder
x 2002
v 250 x 150mm
wedge bonder
Palomar Technologies
size; 60µm inline pitch @3s
T CM
M Ball
z CM
(42 x 33.7)
[kns.com]
Mark Sullivan,
Marketing Director
[email protected]
b 215.784.6795
Chip Scale Review March 2004 [ChipScaleReview.com]
Chip Scale Review • March 2004 • [ChipScaleReview.com]
[shinkawa.com]
Doug Day
[email protected]